JPS6343494U - - Google Patents
Info
- Publication number
- JPS6343494U JPS6343494U JP13575086U JP13575086U JPS6343494U JP S6343494 U JPS6343494 U JP S6343494U JP 13575086 U JP13575086 U JP 13575086U JP 13575086 U JP13575086 U JP 13575086U JP S6343494 U JPS6343494 U JP S6343494U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- hybrid integrated
- integrated circuit
- circuit device
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図ａ，ｂは本考案の一実施例の斜視図およ
び模式的断面図、第２図ａ，ｂは従来の混成集積
回路装置の一例の斜視図および模式的断面図であ
る。
１……導体、２……回路基板、３……電子部品
、４……外部リード、５……樹脂ケース、６……
封止樹脂、７……アース端子、８……金属箔、９
……はんだ。
1A and 1B are a perspective view and a schematic sectional view of an embodiment of the present invention, and FIGS. 2A and 2B are a perspective view and a schematic sectional view of an example of a conventional hybrid integrated circuit device. 1... Conductor, 2... Circuit board, 3... Electronic component, 4... External lead, 5... Resin case, 6...
Sealing resin, 7... Earth terminal, 8... Metal foil, 9
...Solder.
Claims (1)
板が樹脂ケースに樹脂で封止された混成集積回路
装置において、回路基板裏面は全面導体印刷され
、又樹脂ケース表面は接着材で金属箔が接着され
、回路基板裏面導体とケース表面に接着された金
属箔が混成集積回路装置のアースラインに各々接
続されていることをを特徴とする混成集積回路装
置。 In a hybrid integrated circuit device in which a circuit board with electronic components and external leads is sealed in a resin case with a resin, the back of the circuit board is printed with a conductor all over, and the surface of the resin case is bonded with metal foil using an adhesive. A hybrid integrated circuit device, characterized in that a conductor on the back surface of the circuit board and a metal foil bonded to the surface of the case are each connected to a ground line of the hybrid integrated circuit device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13575086U JPS6343494U (en) | 1986-09-03 | 1986-09-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13575086U JPS6343494U (en) | 1986-09-03 | 1986-09-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6343494U true JPS6343494U (en) | 1988-03-23 |
Family
ID=31038236
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13575086U Pending JPS6343494U (en) | 1986-09-03 | 1986-09-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6343494U (en) |
-
1986
- 1986-09-03 JP JP13575086U patent/JPS6343494U/ja active Pending
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