JPS6280373U - - Google Patents
Info
- Publication number
- JPS6280373U JPS6280373U JP17228885U JP17228885U JPS6280373U JP S6280373 U JPS6280373 U JP S6280373U JP 17228885 U JP17228885 U JP 17228885U JP 17228885 U JP17228885 U JP 17228885U JP S6280373 U JPS6280373 U JP S6280373U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- soldered
- component
- wiring board
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Coils Or Transformers For Communication (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第1図A,Bは本考案の一実施例による表面実
装用電子部品の実装状態を示す図であつて、同図
Aは正面図、同図Bは平面図、第2図A,Bは従
来の表面実装用電子部品の実装状態を示す図であ
つて、同図Aは正面図、同図Bは平面図である。
1……電子部品、2……端子リード、3……溝
部、3a……開口部、4……プリント配線基板、
5……導体ランド、6……接着剤、7……ハンダ
付け部分。
1A and 1B are diagrams showing the mounting state of a surface-mounted electronic component according to an embodiment of the present invention, in which FIG. 1A is a front view, FIG. 1B is a top view, and FIGS. FIG. 2 is a diagram showing a mounting state of a conventional surface-mounted electronic component, in which FIG. 1A is a front view and FIG. 2B is a plan view. 1...Electronic component, 2...Terminal lead, 3...Groove, 3a...Opening, 4...Printed wiring board,
5... Conductor land, 6... Adhesive, 7... Soldering part.
Claims (1)
た状態でハンダ付けされる表面実装型電子部品に
おいて、その接着面にハンダ付け部分の無い方向
に抜ける溝部を形成したことを特徴とする表面実
装用電子部品。 A surface mount type electronic component that is temporarily fixed to the surface of a printed wiring board with an adhesive and then soldered, characterized in that a groove is formed on the adhesive surface of the component to allow the part to pass through in the direction away from the soldered part. electronic components.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17228885U JPS6280373U (en) | 1985-11-11 | 1985-11-11 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17228885U JPS6280373U (en) | 1985-11-11 | 1985-11-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6280373U true JPS6280373U (en) | 1987-05-22 |
Family
ID=31108694
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17228885U Pending JPS6280373U (en) | 1985-11-11 | 1985-11-11 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6280373U (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58140192A (en) * | 1982-02-15 | 1983-08-19 | 松下電工株式会社 | Small electronic part bonding structure to printed board |
-
1985
- 1985-11-11 JP JP17228885U patent/JPS6280373U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58140192A (en) * | 1982-02-15 | 1983-08-19 | 松下電工株式会社 | Small electronic part bonding structure to printed board |
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