JPS6280373U - - Google Patents

Info

Publication number
JPS6280373U
JPS6280373U JP17228885U JP17228885U JPS6280373U JP S6280373 U JPS6280373 U JP S6280373U JP 17228885 U JP17228885 U JP 17228885U JP 17228885 U JP17228885 U JP 17228885U JP S6280373 U JPS6280373 U JP S6280373U
Authority
JP
Japan
Prior art keywords
adhesive
soldered
component
wiring board
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17228885U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP17228885U priority Critical patent/JPS6280373U/ja
Publication of JPS6280373U publication Critical patent/JPS6280373U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Coils Or Transformers For Communication (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Details Of Resistors (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図Ａ，Ｂは本考案の一実施例による表面実
装用電子部品の実装状態を示す図であつて、同図
Ａは正面図、同図Ｂは平面図、第２図Ａ，Ｂは従
来の表面実装用電子部品の実装状態を示す図であ
つて、同図Ａは正面図、同図Ｂは平面図である。 １……電子部品、２……端子リード、３……溝
部、３ａ……開口部、４……プリント配線基板、
５……導体ランド、６……接着剤、７……ハンダ
付け部分。 1A and 1B are diagrams showing the mounting state of a surface-mounted electronic component according to an embodiment of the present invention, in which FIG. 1A is a front view, FIG. 1B is a top view, and FIGS. FIG. 2 is a diagram showing a mounting state of a conventional surface-mounted electronic component, in which FIG. 1A is a front view and FIG. 2B is a plan view. 1...Electronic component, 2...Terminal lead, 3...Groove, 3a...Opening, 4...Printed wiring board,
5... Conductor land, 6... Adhesive, 7... Soldering part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント配線基板の表面に接着剤で仮固定され
た状態でハンダ付けされる表面実装型電子部品に
おいて、その接着面にハンダ付け部分の無い方向
に抜ける溝部を形成したことを特徴とする表面実
装用電子部品。 A surface mount type electronic component that is temporarily fixed to the surface of a printed wiring board with an adhesive and then soldered, characterized in that a groove is formed on the adhesive surface of the component to allow the part to pass through in the direction away from the soldered part. electronic components.
JP17228885U 1985-11-11 1985-11-11 Pending JPS6280373U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17228885U JPS6280373U (en) 1985-11-11 1985-11-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17228885U JPS6280373U (en) 1985-11-11 1985-11-11

Publications (1)

Publication Number Publication Date
JPS6280373U true JPS6280373U (en) 1987-05-22

Family

ID=31108694

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17228885U Pending JPS6280373U (en) 1985-11-11 1985-11-11

Country Status (1)

Country Link
JP (1) JPS6280373U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58140192A (en) * 1982-02-15 1983-08-19 松下電工株式会社 Small electronic part bonding structure to printed board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58140192A (en) * 1982-02-15 1983-08-19 松下電工株式会社 Small electronic part bonding structure to printed board

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