JPS58140192A - Small electronic part bonding structure to printed board - Google Patents
Small electronic part bonding structure to printed boardInfo
- Publication number
- JPS58140192A JPS58140192A JP2301182A JP2301182A JPS58140192A JP S58140192 A JPS58140192 A JP S58140192A JP 2301182 A JP2301182 A JP 2301182A JP 2301182 A JP2301182 A JP 2301182A JP S58140192 A JPS58140192 A JP S58140192A
- Authority
- JP
- Japan
- Prior art keywords
- small electronic
- adhesive
- printed board
- electronic part
- bonding structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は俊着剤によるブリシト基鈑への小型電子部品接
着４１１ｆｉＫ関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to bonding 411fiK of small electronic components to a Brisito board using an adhesive.
従来、小型の電子Ｓ品をプリシト基機４Ｃｌｅ着剤Ｖこ
で強力Ｋｍ膚しようとする場合には、＃着剤０捧の接着
力を向上させたり、電子部品の材質および表面粗度のｖ
！４整による接着力の向上が考えられていたが、〕スト
高となつ几り、十分な振着効来が倚られないという問題
があった。Conventionally, when trying to attach a small electronic product to a strong surface using a 4C adhesive, it was necessary to improve the adhesive strength of the adhesive, or to improve the material and surface roughness of the electronic component.
! It was thought that the adhesive strength could be improved by adjusting the length of the ball, but there were problems with the strike being too high and the swinging effect being insufficient.
本発明は上記の点に鑑みて為されたものであって、その
目的とするところは経費が余シかからす７しかも確実に
接着力を大きくすることのできるウリシト基槍への小型
電子部品接着構造を提供するにある。The present invention has been made in view of the above-mentioned points, and its purpose is to provide a small electronic component to a urethane base that can increase the cost and reliably increase the adhesive strength. Provides an adhesive structure.
以下、木＠＃ｉを図示の実施例に基づいて詳述する。The tree @#i will be described in detail below based on the illustrated embodiment.
（υは小型の電子部品であって、電子部品（υの裏面に
は溝（２）が形成されである。この１１１（２１の形状
はｇ／ＩＪ８図（＆）乃至（切に示すように、縦断面が
四角形状。(υ is a small electronic component, and a groove (2) is formed on the back side of the electronic component (υ). , the longitudinal section is rectangular.
三角形状、千円形状９台形状のいずれであっても良く、
またこれらの形状に必ずしも限定されるものではなく、
史に同図（６）のように溝（２〕内周面に粗面部（８）
を形成し几ものでも良い。電子部品（υは第１図のよう
にプ；リシト基板（４）に接着剤（３〕にて接着される
ものであり、このとき接着剤（３）は電子部品（ＩＪの
＃（２〕内周面に行き渡らせて裏面が平たんな電子部品
に較べて接着剤（３）と接する面を太きくしである。利
用できる電子部品（υとしてはチッラ型の抵抗コシ４シ
サー、二二℃−ルド形トうシジスター、４イオード、バ
ッグージその他フェースポジディジタ用電子部品などが
考えられる。第１図において電子部品（υをプリシト基
＊ （４）に接着したときＫｒ！、電子部品（υの両電
極（５１（６）は銅箔バターシ回路部（７ンに捩続して
るる。It may be triangular, 1,000 yen shape, 9 trapezoid shape,
Also, it is not necessarily limited to these shapes,
In history, as shown in the same figure (6), there is a groove (2) and a rough surface part (8) on the inner peripheral surface.
It is also possible to form a solid one. The electronic component (υ is the one that is bonded to the printed circuit board (4) with adhesive (3) as shown in Figure 1. At this time, the adhesive (3) is attached to the electronic component (# (2) of IJ). The surface in contact with the adhesive (3) is thicker than that of electronic components that spread over the inner circumferential surface and have a flat back surface.The electronic components that can be used (υ are Chilla-type resistors with a thickness of 4 cm, 22°C) Possible examples include electronic components for face-positivity digital devices such as 4-diode, baggage, and other electronic components for face-position digital devices. Both electrodes (51 (6) are screwed to the copper foil Batashi circuit section (7).
本発明ｒｉ叙述のように、小型電子部品の裏面にＳｔ−
形成し、溝内周面に接着剤を行き渡らせて電子部品とウ
リシト基板とを接着剤にて接着したので、小型電子郡品
傭に襞する！ＩＲ着剤の接着面積が大きくなって接着能
力を向上させることができ。As described in the present invention, St-
After forming the groove, the adhesive was spread over the inner circumferential surface of the groove and the electronic component and the substrate were bonded together with the adhesive, so it was folded into a small electronic component! The adhesion area of the IR adhesive becomes larger and the adhesion ability can be improved.
しかも溝を形成するだけで良いので安価に出来るという
利点がある。Moreover, since it is only necessary to form the groove, it has the advantage that it can be done at low cost.
第１図は末＃Ｉ明の実施例の正面図、第２図は同上の電
子部品の拡大斜視図、第８図（ａ）乃至（Ｃ）は同上の
各種電子部品を示す図であって、（υは電子部品、ＩＩ
Ｊｒｉ溝、（３）は接着剤、（４）はウリシト基板であ
る。
代理人 弁理士 石 １）長 七FIG. 1 is a front view of an embodiment of the latest model, FIG. 2 is an enlarged perspective view of the same electronic components, and FIGS. 8(a) to (C) are views showing various electronic components of the same. , (υ is an electronic component, II
Jri groove, (3) is adhesive, and (4) is Urishite substrate. Agent Patent Attorney Ishi 1) Choshichi
Claims (1)
を着剤を行き渡らせて電子部品とブリシト基機と倉按ｊ
ｉＦ剤にて接着して成ること全特徴とするブリシト蒸機
への小型電子部品接着構造。(υ Form a groove on the back surface of the small electronic component, and
Spread the adhesive evenly on electronic parts, bristo base machines, and warehouses.
A structure for bonding small electronic parts to a Burishito steamer, which is characterized by being bonded with an iF agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2301182A JPS58140192A (en) | 1982-02-15 | 1982-02-15 | Small electronic part bonding structure to printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2301182A JPS58140192A (en) | 1982-02-15 | 1982-02-15 | Small electronic part bonding structure to printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58140192A true JPS58140192A (en) | 1983-08-19 |
Family
ID=12098546
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2301182A Pending JPS58140192A (en) | 1982-02-15 | 1982-02-15 | Small electronic part bonding structure to printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58140192A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61129360U (en) * | 1985-01-30 | 1986-08-13 | ||
| JPS6280373U (en) * | 1985-11-11 | 1987-05-22 |
-
1982
- 1982-02-15 JP JP2301182A patent/JPS58140192A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61129360U (en) * | 1985-01-30 | 1986-08-13 | ||
| JPH0314054Y2 (en) * | 1985-01-30 | 1991-03-28 | ||
| JPS6280373U (en) * | 1985-11-11 | 1987-05-22 |
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