JPS609234U - electronic components - Google Patents

electronic components

Info

Publication number
JPS609234U
JPS609234U JP10258883U JP10258883U JPS609234U JP S609234 U JPS609234 U JP S609234U JP 10258883 U JP10258883 U JP 10258883U JP 10258883 U JP10258883 U JP 10258883U JP S609234 U JPS609234 U JP S609234U
Authority
JP
Japan
Prior art keywords
leads
electronic components
coating layer
lengths
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10258883U
Other languages
Japanese (ja)
Inventor
筧　二郎
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP10258883U priority Critical patent/JPS609234U/en
Publication of JPS609234U publication Critical patent/JPS609234U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は電子部品の一例を示す一部透視平面図第２図は
半田ブリッジを生じた電子部品の平面図第３図はリード
の断面図、第４区は断面形状による半田の付着状況を説
明するリードの断面図、第５図は本考案の一実施例を示
す平面図、第６図及び第７図は本考案の他の実施例を示
す平面図であ。　　る。 ２・・・・・・部品本体、６・・・・・・半田被覆層、
７・・・・・・す、　　−ド。Fig. 1 is a partially perspective plan view showing an example of an electronic component. Fig. 2 is a plan view of an electronic component with solder bridges. Fig. 3 is a cross-sectional view of a lead. Section 4 shows the solder adhesion situation depending on the cross-sectional shape. FIG. 5 is a plan view showing one embodiment of the present invention, and FIGS. 6 and 7 are plan views showing other embodiments of the present invention. Ru. 2... Part body, 6... Solder coating layer,
7...su, -do.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 部品本体より複数のリードを平行前ダ１ルで同一方向に
導出しかつ、リードにディップ法による半田被覆層を形
成したものにおいて、隣接するリードの長さを異ならせ
たことを特徴とする電子部品。An electronic device characterized in that a plurality of leads are led out in the same direction from the main body of the component using a parallel front handle, and a solder coating layer is formed on the leads by a dipping method, and the lengths of adjacent leads are made different. parts.
JP10258883U 1983-06-29 1983-06-29 electronic components Pending JPS609234U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10258883U JPS609234U (en) 1983-06-29 1983-06-29 electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10258883U JPS609234U (en) 1983-06-29 1983-06-29 electronic components

Publications (1)

Publication Number Publication Date
JPS609234U true JPS609234U (en) 1985-01-22

Family

ID=30241736

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10258883U Pending JPS609234U (en) 1983-06-29 1983-06-29 electronic components

Country Status (1)

Country Link
JP (1) JPS609234U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63244658A (en) * 1987-03-30 1988-10-12 Mitsubishi Electric Corp Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63244658A (en) * 1987-03-30 1988-10-12 Mitsubishi Electric Corp Semiconductor device

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