JPS6292682U - - Google Patents
Info
- Publication number
- JPS6292682U JPS6292682U JP18565285U JP18565285U JPS6292682U JP S6292682 U JPS6292682 U JP S6292682U JP 18565285 U JP18565285 U JP 18565285U JP 18565285 U JP18565285 U JP 18565285U JP S6292682 U JPS6292682 U JP S6292682U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- dual inline
- inline package
- lead terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000009977 dual effect Effects 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はこの考案のデユアルインラインパツケ
ージＩＣを示す斜視図、第２図はこの考案の一実
施例を示す立面図、第３図及び第４図は従来の構
造を示す図である。
１はデユアルインラインパツケージＩＣの容器
、２はリード端子、３は印刷配線板、４は半田接
続部。尚、各図中同一符号は同一又は相当部分を
示す。
FIG. 1 is a perspective view showing a dual in-line package IC of this invention, FIG. 2 is an elevational view showing an embodiment of this invention, and FIGS. 3 and 4 are views showing a conventional structure. 1 is a dual inline package IC container, 2 is a lead terminal, 3 is a printed wiring board, and 4 is a solder connection part. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
る印刷配線板において、 デユアルインラインパツケージＩＣの各リード
端子を２個所で折り曲げ、上記各リード端子の先
端部分が当該デユアルインラインパツケージＩＣ
の容器の底面より下方にあつて上記先端部分の方
向が上記底面に平行になるようにして、印刷配線
板上の電子部品取付けランドに半田付けすること
を特徴とする印刷配線板。[Claim for Utility Model Registration] In a printed wiring board to which a dual inline package IC is mounted, each lead terminal of the dual inline package IC is bent at two places, and the tip of each lead terminal is connected to the dual inline package IC.
1. A printed wiring board, wherein the printed wiring board is soldered to an electronic component mounting land on the printed wiring board such that the tip portion is located below the bottom surface of the container and the direction of the tip portion is parallel to the bottom surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18565285U JPS6292682U (en) | 1985-12-02 | 1985-12-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18565285U JPS6292682U (en) | 1985-12-02 | 1985-12-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6292682U true JPS6292682U (en) | 1987-06-13 |
Family
ID=31134480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18565285U Pending JPS6292682U (en) | 1985-12-02 | 1985-12-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6292682U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014053344A (en) * | 2012-09-05 | 2014-03-20 | Renesas Electronics Corp | Electronic apparatus and semiconductor device |
-
1985
- 1985-12-02 JP JP18565285U patent/JPS6292682U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014053344A (en) * | 2012-09-05 | 2014-03-20 | Renesas Electronics Corp | Electronic apparatus and semiconductor device |