JPS60119773U - printed wiring board - Google Patents
printed wiring boardInfo
- Publication number
- JPS60119773U JPS60119773U JP794984U JP794984U JPS60119773U JP S60119773 U JPS60119773 U JP S60119773U JP 794984 U JP794984 U JP 794984U JP 794984 U JP794984 U JP 794984U JP S60119773 U JPS60119773 U JP S60119773U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- land
- hole
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図Ａ及び第１図Ｂは従来のプリント配線基板の一例
及び他の例の断面図、第２図Ａ、第２図Ｂ、第２図Ｃは
この考案の一実施例の説明に用いる平面図、第３図はこ
の考案一実施例の平面図及び断面図、第４区はこの考案
の一実施例の説明に用いる断面図、第５図及び第６図は
この考案の効果の説明に用いる断面図である。
２．１０・・・・・・ランド、３，１１・・・・・・取
り付は孔、４，１４・・・・・・リード線、５，１５・
・・・・・半田。
第３図
第４図Figures 1A and 1B are cross-sectional views of one example and another example of a conventional printed wiring board, and Figures 2A, 2B, and 2C are used to explain one embodiment of this invention. 3 is a plan view and a sectional view of an embodiment of this invention, Section 4 is a sectional view used to explain an embodiment of this invention, and FIGS. 5 and 6 are explanations of the effects of this invention. FIG. 2.10...Land, 3,11...Mounting hole, 4,14...Lead wire, 5,15...
·····solder. Figure 3 Figure 4
Claims (1)
リント配線基板において、 上記部品取り付は孔が上記ランド内でその中心部に対し
て偏倚した位置に形成され、この部品取り付は孔に挿入
されるリード線が上記取り付は孔°゛と上記ランドの周
縁部との距離が最大となる方向で且つ上記絶）１双基板
となす角が４５度以下となるように折り曲けられ、上記
ランド及び上記リード線が半田付けされるようにしたこ
とを特徴とするプリント配線基板。[Claim for Utility Model Registration] In a printed wiring board in which a land and a hole for mounting a component are formed on an insulating substrate, the hole for mounting the component is formed at a position offset from the center of the land. The lead wire inserted into the hole should be mounted in the direction where the distance between the hole and the periphery of the land is maximum, and the angle it makes with the two boards above should be 45 degrees. A printed wiring board characterized in that it is bent as follows, and the land and the lead wire are soldered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP794984U JPS60119773U (en) | 1984-01-24 | 1984-01-24 | printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP794984U JPS60119773U (en) | 1984-01-24 | 1984-01-24 | printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60119773U true JPS60119773U (en) | 1985-08-13 |
Family
ID=30486776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP794984U Pending JPS60119773U (en) | 1984-01-24 | 1984-01-24 | printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60119773U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5120163B2 (en) * | 1971-12-06 | 1976-06-23 | ||
| JPS5131068B1 (en) * | 1970-08-03 | 1976-09-04 |
-
1984
- 1984-01-24 JP JP794984U patent/JPS60119773U/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5131068B1 (en) * | 1970-08-03 | 1976-09-04 | ||
| JPS5120163B2 (en) * | 1971-12-06 | 1976-06-23 |
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