JPS5972763U - Land of printed circuit pattern - Google Patents
Land of printed circuit patternInfo
- Publication number
- JPS5972763U JPS5972763U JP16767882U JP16767882U JPS5972763U JP S5972763 U JPS5972763 U JP S5972763U JP 16767882 U JP16767882 U JP 16767882U JP 16767882 U JP16767882 U JP 16767882U JP S5972763 U JPS5972763 U JP S5972763U
- Authority
- JP
- Japan
- Prior art keywords
- land
- printed circuit
- circuit pattern
- terminal hole
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のプリント回路パターンのランドの平面図
、第２図は第１図の■−■線の断面図、第３図は従来の
プリント回路パターンのランドに部品リード線を半田付
けする状態を示す断面図、第４区はこの考案のプリント
回路パターンのランドの一実施例の平面図、第５図は第
４図のＩＶ−ＩＶ線の断面図、第６図はこの考案のプリ
ント回路パターンのランドに部品リード線を半田付けす
る状態を示す断面図、第７図および第８図はそれぞれこ
の考案のプリント回路パターンのランドの他の実施例の
平面図である。
１１・・・・・・基板、１２・・・・・・端子穴、１３
・・・・・・部品リード線、１４””銅箔ランド、１５
・・・レジスト、１６・・・半田。Figure 1 is a plan view of a land of a conventional printed circuit pattern, Figure 2 is a sectional view taken along the line ■-■ in Figure 1, and Figure 3 is a diagram showing how component lead wires are soldered to lands of a conventional printed circuit pattern. Section 4 is a plan view of one embodiment of the land of the printed circuit pattern of this invention, Fig. 5 is a sectional view taken along line IV-IV of Fig. 4, and Fig. 6 is a printed circuit diagram of this invention. 7 and 8 are plan views of other embodiments of the printed circuit pattern lands of this invention, respectively. 11... Board, 12... Terminal hole, 13
・・・・・・Component lead wire, 14”” Copper foil land, 15
...Resist, 16...Solder.
Claims (1)
レジストのうちの少なくともレジストを偏位させて形成
し、上記端子穴に部品リード線を挿入し、この部品リー
ド線を上記レジストの偏位の方向に折り曲げるとともに
この折り曲げた部分の全長に亘って上記銅箔ランドとの
間に半田接合を形成してなることを特徴とするプリント
回路パターンのランド。At least one of the copper foil land and the resist is offset with respect to a terminal hole formed at a predetermined position on the board, a component lead wire is inserted into the terminal hole, and the component lead wire is inserted into the terminal hole formed at a predetermined position on the board. 1. A land of a printed circuit pattern, characterized in that the land is bent in the same direction and a solder joint is formed between the land and the copper foil land over the entire length of the bent portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16767882U JPS5972763U (en) | 1982-11-05 | 1982-11-05 | Land of printed circuit pattern |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16767882U JPS5972763U (en) | 1982-11-05 | 1982-11-05 | Land of printed circuit pattern |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5972763U true JPS5972763U (en) | 1984-05-17 |
Family
ID=30366781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16767882U Pending JPS5972763U (en) | 1982-11-05 | 1982-11-05 | Land of printed circuit pattern |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5972763U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5131068B1 (en) * | 1970-08-03 | 1976-09-04 | ||
| JPS5134654B2 (en) * | 1972-01-20 | 1976-09-28 |
-
1982
- 1982-11-05 JP JP16767882U patent/JPS5972763U/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5131068B1 (en) * | 1970-08-03 | 1976-09-04 | ||
| JPS5134654B2 (en) * | 1972-01-20 | 1976-09-28 |
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