JPS5918457U - printed wiring board - Google Patents
printed wiring boardInfo
- Publication number
- JPS5918457U JPS5918457U JP11205082U JP11205082U JPS5918457U JP S5918457 U JPS5918457 U JP S5918457U JP 11205082 U JP11205082 U JP 11205082U JP 11205082 U JP11205082 U JP 11205082U JP S5918457 U JPS5918457 U JP S5918457U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- electronic component
- conductor land
- insertion hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図a、 bは、従来の印刷配線板を示す要部の断
面図及び平面図、第2図a、 bは、この考案に係る
印刷配線板の一実施例を示す要部の断面図及び平面図で
ある。
20・・・・・・印刷配線板、21・・・・・・絶縁基
板、22゜23、 24. 25・・・・・・導体ラン
ド、26.27・°。
・・・他の導電体パターン、28.29・・・・・・部
品。Figures 1a and b are sectional views and plan views of the main parts of a conventional printed wiring board, and Figures 2a and b are sectional views of the main parts of an embodiment of the printed wiring board according to this invention. and a plan view. 20...Printed wiring board, 21...Insulating substrate, 22°23, 24. 25...Conductor land, 26.27°. ...Other conductor patterns, 28.29...Parts.
Claims (1)
形成し該電子部品を導体ランドに半田付けしてなる印刷
配線板において、前記導体ランドを前記部品挿入孔に挿
入される前記電子部品のリード線が折り曲げられる方向
にのみ形成したことを特徴とする印刷配線板。In a printed wiring board in which a conductor land is formed around a component insertion hole into which an electronic component is inserted and the electronic component is soldered to the conductor land, the electronic component is inserted into the component insertion hole with the conductor land. A printed wiring board characterized in that the lead wires are formed only in the direction in which they are bent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11205082U JPS5918457U (en) | 1982-07-23 | 1982-07-23 | printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11205082U JPS5918457U (en) | 1982-07-23 | 1982-07-23 | printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5918457U true JPS5918457U (en) | 1984-02-04 |
| JPH0211798Y2 JPH0211798Y2 (en) | 1990-04-03 |
Family
ID=30259903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11205082U Granted JPS5918457U (en) | 1982-07-23 | 1982-07-23 | printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5918457U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015008187A (en) * | 2013-06-25 | 2015-01-15 | パナソニック株式会社 | Print circuit board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4911905U (en) * | 1972-05-08 | 1974-01-31 | ||
| JPS5258457U (en) * | 1975-10-24 | 1977-04-27 |
-
1982
- 1982-07-23 JP JP11205082U patent/JPS5918457U/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4911905U (en) * | 1972-05-08 | 1974-01-31 | ||
| JPS5258457U (en) * | 1975-10-24 | 1977-04-27 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015008187A (en) * | 2013-06-25 | 2015-01-15 | パナソニック株式会社 | Print circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0211798Y2 (en) | 1990-04-03 |
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