JPS6088575U - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPS6088575U JPS6088575U JP18038883U JP18038883U JPS6088575U JP S6088575 U JPS6088575 U JP S6088575U JP 18038883 U JP18038883 U JP 18038883U JP 18038883 U JP18038883 U JP 18038883U JP S6088575 U JPS6088575 U JP S6088575U
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- printed board
- circuit board
- printed circuit
- width
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図ａは従来のプリント基板の断面図、第１図すは第
１図ａのプリント基板におけるランド部の平面図、第２
図は従来のプリント基板のランド上の半田に触針を当て
る状態を示す断面図、第３図は従来のプリント基板にお
けるガス抜き穴の部分を示す平面図、第４図ａはこの考
案のプリント基板の一実施例の平面図、第４図すは第４
図ａの断面図、第５図はこの考案のプリント基板におけ
る半田の流れの原理を示す図、第６図ａないし第６図ｄ
および第７図ないし第１２図はそれぞれこの考案のプリ
ント基板の他の実施例を示す平面図である。
１１・・・・・・チップ形電子部品、ｌｌａ、ｌｌｂ・
・・・・・電極、１２ ａｔ １２ ｂ・・・・・・
第１のランド、１２Ｃ・・・・・・第２のランド、１３
．１７・・・・・・レジスト、１４・・・・・・透孔、
１５・・・・・・基板、１６，１９・・・・・・パター
ン、１８・・・・・・銅箔端部。
第４図
第６図Figure 1a is a sectional view of a conventional printed circuit board, Figure 1 is a plan view of the land portion of the printed circuit board in Figure 1a, and Figure 2 is a cross-sectional view of a conventional printed circuit board.
The figure is a cross-sectional view showing a state in which a stylus is applied to the solder on the land of a conventional printed circuit board, FIG. 3 is a plan view showing the gas vent hole part of a conventional printed circuit board, and FIG. FIG. 4 is a plan view of an embodiment of the substrate.
Figure 5 is a cross-sectional view of Figure a, Figure 5 is a diagram showing the principle of solder flow in the printed circuit board of this invention, Figures 6 a to 6 d
7 to 12 are plan views showing other embodiments of the printed circuit board of this invention. 11... Chip type electronic components, lla, llb.
...electrode, 12 at 12 b...
First land, 12C...Second land, 13
．． 17...Resist, 14...Through hole,
15... Board, 16, 19... Pattern, 18... Copper foil end. Figure 4 Figure 6
Claims (1)
パターンを形成するとともに、この第１のパターンに隣
接して連なる第２のパターンを形成し、上記第１のパタ
ーンと第２のパターンが連なる接点部分の幅を上記第１
のパターンおよび第２のパターンの幅よりも狭く形成し
たことを特徴とするプリント基板。A first pattern for soldering a chip-shaped electronic component on a substrate is formed, and a second pattern is formed adjacent to and continuous with the first pattern, and the first pattern and the second pattern are connected to each other. The width of the contact part where
A printed circuit board characterized in that the width of the pattern is narrower than that of the pattern and the second pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18038883U JPS6088575U (en) | 1983-11-22 | 1983-11-22 | Printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18038883U JPS6088575U (en) | 1983-11-22 | 1983-11-22 | Printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6088575U true JPS6088575U (en) | 1985-06-18 |
Family
ID=30391138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18038883U Pending JPS6088575U (en) | 1983-11-22 | 1983-11-22 | Printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6088575U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01205497A (en) * | 1988-02-10 | 1989-08-17 | Toyo Commun Equip Co Ltd | Printed wiring pattern |
-
1983
- 1983-11-22 JP JP18038883U patent/JPS6088575U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01205497A (en) * | 1988-02-10 | 1989-08-17 | Toyo Commun Equip Co Ltd | Printed wiring pattern |
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