JPS58147273U - Solder plated printed wiring board - Google Patents
Solder plated printed wiring boardInfo
- Publication number
- JPS58147273U JPS58147273U JP4314282U JP4314282U JPS58147273U JP S58147273 U JPS58147273 U JP S58147273U JP 4314282 U JP4314282 U JP 4314282U JP 4314282 U JP4314282 U JP 4314282U JP S58147273 U JPS58147273 U JP S58147273U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- solder plated
- plated printed
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図ａ、 ｂ、 ｃはそれぞれ従来のハンダメッ
キプリント配線基板にハンンダ付けを行った時の状態を
示す断面図、第２図ａ、 ｂは本考案のハンダメッキ
プリント配線基板の製造過程を示す断面図である。
符号の説明１・・・・・・プリント配線基板、２・・・
・・・回路パターン、３・・・・・・ハンダメッキ、４
ａ・・・用第ルジスト層、４ｂ・・・・・・第２レジス
ト層。Figures 1a, b, and c are cross-sectional views showing the state of soldering on a conventional solder-plated printed wiring board, respectively, and Figures 2a and b show the manufacturing process of the solder-plated printed wiring board of the present invention. FIG. Explanation of symbols 1...Printed wiring board, 2...
...Circuit pattern, 3...Solder plating, 4
a... second resist layer; 4b... second resist layer;
Claims (1)
板において、該プリント配線基板上に多重塗布レジスト
を形成したことを特徴とするハングメッキプリント配線
基板。1. A hang-plated printed wiring board on which a circuit pattern is solder-plated, characterized in that a multi-coating resist is formed on the printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4314282U JPS58147273U (en) | 1982-03-29 | 1982-03-29 | Solder plated printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4314282U JPS58147273U (en) | 1982-03-29 | 1982-03-29 | Solder plated printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58147273U true JPS58147273U (en) | 1983-10-03 |
Family
ID=30054242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4314282U Pending JPS58147273U (en) | 1982-03-29 | 1982-03-29 | Solder plated printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58147273U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5273381A (en) * | 1975-12-17 | 1977-06-20 | Sumitomo Electric Industries | Flexible printed circuit |
-
1982
- 1982-03-29 JP JP4314282U patent/JPS58147273U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5273381A (en) * | 1975-12-17 | 1977-06-20 | Sumitomo Electric Industries | Flexible printed circuit |
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