JPS5812966U - flexible printed wiring board - Google Patents
flexible printed wiring boardInfo
- Publication number
- JPS5812966U JPS5812966U JP10707881U JP10707881U JPS5812966U JP S5812966 U JPS5812966 U JP S5812966U JP 10707881 U JP10707881 U JP 10707881U JP 10707881 U JP10707881 U JP 10707881U JP S5812966 U JPS5812966 U JP S5812966U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- flexible printed
- abstract
- solder resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の第１の実施例を示す可撓性印刷配線板
の部分平面図、第２図は第１図の■−■線断面図、第３
図及び第４図は夫々第１の実施例の変形例を示す第１図
と同様な部分平面図、第５図は本考案の第２の実施例を
示す可撓性印刷配線板の部分平面図、第６図及び第７図
は夫々本考案による印刷配線板の使用形態を示す部分断
面図である。
なお図面に用いた符号において、１・・・・・・可撓性
印刷配線板、２・・・・・・基板、３・・・・・・銅箔
パターン、４・・・・・・半田レジスト、６・・・・・
・切離し線、７・・・・・・レジスト無塗布領域である
。FIG. 1 is a partial plan view of a flexible printed wiring board showing the first embodiment of the present invention, FIG. 2 is a sectional view taken along the line ■-■ in FIG.
4 and 4 are partial plan views similar to FIG. 1 showing modifications of the first embodiment, respectively, and FIG. 5 is a partial plan view of a flexible printed wiring board showing a second embodiment of the present invention. 6 and 7 are partial cross-sectional views showing how the printed wiring board according to the present invention is used. In addition, in the symbols used in the drawings, 1...flexible printed wiring board, 2...substrate, 3...copper foil pattern, 4...solder Resist, 6...
- Separation line, 7...Resist-free area.
Claims (1)
ック間の切離し線または折曲げ線に沿って半田レジスト
を塗布しない領域を設けたことを特徴とする可撓性印刷
配線板。1. A flexible printed wiring board having a plurality of circuit blocks, characterized in that an area where no solder resist is applied is provided along a separation line or a bending line between each block of the flexible printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10707881U JPS5812966U (en) | 1981-07-17 | 1981-07-17 | flexible printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10707881U JPS5812966U (en) | 1981-07-17 | 1981-07-17 | flexible printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5812966U true JPS5812966U (en) | 1983-01-27 |
| JPS6348143Y2 JPS6348143Y2 (en) | 1988-12-12 |
Family
ID=29901527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10707881U Granted JPS5812966U (en) | 1981-07-17 | 1981-07-17 | flexible printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5812966U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH054536U (en) * | 1991-07-04 | 1993-01-22 | 日本メクトロン株式会社 | Flexible circuit board with reinforcing plate |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4883370A (en) * | 1972-02-10 | 1973-11-07 |
-
1981
- 1981-07-17 JP JP10707881U patent/JPS5812966U/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4883370A (en) * | 1972-02-10 | 1973-11-07 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH054536U (en) * | 1991-07-04 | 1993-01-22 | 日本メクトロン株式会社 | Flexible circuit board with reinforcing plate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6348143Y2 (en) | 1988-12-12 |
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