JPH054536U - Flexible circuit board with reinforcing plate - Google Patents
Flexible circuit board with reinforcing plateInfo
- Publication number
- JPH054536U JPH054536U JP5994691U JP5994691U JPH054536U JP H054536 U JPH054536 U JP H054536U JP 5994691 U JP5994691 U JP 5994691U JP 5994691 U JP5994691 U JP 5994691U JP H054536 U JPH054536 U JP H054536U
- Authority
- JP
- Japan
- Prior art keywords
- flexible circuit
- circuit board
- reinforcing plate
- board sheet
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
(57)【要約】 （修正有）
【目的】 可撓性回路基板にチップ部品等の回路部品を
搭載する場合にこの可撓性回路基板に裏打ち材として補
強板を設けた補強板付可撓性回路基板を製作する場合、
回路部品の実装後に個々の可撓性回路基板を補強板から
容易に分離できるようにした補強板付可撓性回路基板を
提供する。
【構成】 可撓性回路基板１を所要の数で区画形成した
一枚の可撓性回路基板シ−ト４と、この可撓性回路基板
シ−トに相互の位置決め穴３を用いて貼付けられた補強
板とを有し、これらの可撓性回路基板シ−ト及び補強板
には折曲げ操作により個々の可撓性回路基板を分離する
為のスリット２，７を設けた補強板付可撓性回路基板に
於いて、可撓性回路基板シ−トに設けたスリットはその
端部に切れ込み８，９を備えるように構成したもの。
(57) [Summary] (Modified) [Purpose] Flexibility with a reinforcing plate provided with a reinforcing plate as a backing material on the flexible circuit board when mounting circuit parts such as chips on the flexible circuit board. When making a circuit board,
Provided is a flexible circuit board with a reinforcing plate, which allows individual flexible circuit boards to be easily separated from the reinforcing plate after mounting circuit components. [Structure] One flexible circuit board sheet 4 in which a required number of flexible circuit boards 1 are formed, and affixed to the flexible circuit board sheet by using mutual positioning holes 3 The flexible circuit board sheet and the reinforcing plate may have a reinforcing plate provided with slits 2 and 7 for separating the individual flexible circuit boards by bending operation. In the flexible circuit board, the slits provided in the flexible circuit board sheet are configured such that the slits 8 and 9 are provided at the ends thereof.
Description
【０００１】[0001]
本考案は、可撓性回路基板にチップ部品等の回路部品を搭載する場合にこの可 撓性回路基板に裏打ち材として補強板を設けた補強板付可撓性回路基板に関し、 特には回路部品の実装後に個々の可撓性回路基板を補強板から容易に分離できる ように構成した補強板付可撓性回路基板の構造に関する。 The present invention relates to a flexible circuit board with a reinforcing plate in which a circuit board such as a chip component is mounted on the flexible circuit board, and a reinforcing plate is provided as a backing material on the flexible circuit board. The present invention relates to a structure of a flexible circuit board with a reinforcing plate, which is configured so that individual flexible circuit boards can be easily separated from the reinforcing plate after mounting.
【０００２】[0002]
可撓性回路基板に対してチップ部品等の回路部品を搭載する場合には、可撓性 回路基板の裏打ち材として紙フェノ−ル樹脂板やガラスエポキシ樹脂板等からな る補強板を使用するものがあり、このような構造の場合には回路部品の実装後に 可撓性回路基板を補強板から分離できるようにする為、補強板には分離部に沿っ てミシン目やＶカット溝を設けるようにしたものがある。 When mounting circuit components such as chips on a flexible circuit board, use a reinforcing plate made of paper phenol resin plate or glass epoxy resin plate as the backing material for the flexible circuit board. In such a structure, a perforation or a V-cut groove is provided along the separation part in the reinforcing plate so that the flexible circuit board can be separated from the reinforcing plate after the circuit components are mounted. There is something like this.
【０００３】 図４はその一例を示すものであって、１は補強板を示し、その補強板１の所要 部位には可撓性回路基板２０が貼着されており、この可撓性回路基板２０に回路 部品を実装した段階で可撓性回路基板２０を補強板１から分離できるようにする 為に、可撓性回路基板２０の外周部位に位置する補強板１の部分とその補強板１ の周辺部位には例えば細長状に打抜いた適数条のスリット２を設けるような構造 がある。FIG. 4 shows an example thereof. Reference numeral 1 denotes a reinforcing plate, and a flexible circuit board 20 is attached to a required portion of the reinforcing plate 1. In order to allow the flexible circuit board 20 to be separated from the reinforcing plate 1 when the circuit components are mounted on the flexible circuit board 20, the portion of the reinforcing plate 1 located on the outer peripheral portion of the flexible circuit board 20 and the reinforcing plate 1 thereof. There is a structure in which a proper number of slits 2 punched in an elongated shape are provided in the peripheral portion of the.
【０００４】 このような構造では、補強板１に設けた適数個の位置決め穴３を利用して所要 枚の可撓性回路基板２０を適当な治具を使用して一枚毎に補強板１の所定箇所に 貼着し、また各可撓性回路基板２０に対する回路部品の実装も上記位置決め穴３ を用いて例えば自動的に処理し、そして回路部品の実装後には補強板１のスリッ ト２の部分で折曲げる等の手段で補強板付の可撓性回路基板２０を個々に分離す ることができる。In such a structure, a required number of flexible circuit boards 20 are utilized by using an appropriate number of positioning holes 3 provided in the reinforcing plate 1 and a reinforcing plate is used for each reinforcing plate. 1 is attached to a predetermined portion of the flexible circuit board 20, and the mounting of the circuit component on each flexible circuit board 20 is automatically performed, for example, by using the positioning hole 3, and the slit of the reinforcing plate 1 is mounted after the mounting of the circuit component. The flexible circuit board 20 with the reinforcing plate can be individually separated by a means such as bending at the second portion.
【０００５】 しかし、上記の如き補強板付可撓性回路基板の製作手法では、可撓性回路基板 ２０に形成する回路配線パタ−ンが微細になると、補強板１の所定位置に対する 各々の可撓性回路基板２０の貼付け精度を確保することが非常に困難となる場合 がある。However, in the method of manufacturing a flexible circuit board with a reinforcing plate as described above, when the circuit wiring pattern formed on the flexible circuit board 20 becomes fine, each flexible plate 1 is flexed with respect to a predetermined position. It may be very difficult to ensure the attachment accuracy of the flexible circuit board 20.
【０００６】 そこで、図５のように、複数の可撓性回路基板を区画形成した可撓性回路基板 シ−ト２１を製作し、補強板１の位置決め穴３に対応させてこの可撓性回路基板 シ−ト２１にも位置決め穴２２を設けることにより、補強板１に対する貼付けを 両位置決め穴３、２２を用いて処理し、また部品実装もその位置決め穴２２を用 いて行う手法もある。Therefore, as shown in FIG. 5, a flexible circuit board sheet 21 in which a plurality of flexible circuit boards are formed by partitioning is manufactured, and the flexible circuit board sheet 21 is made to correspond to the positioning holes 3 of the reinforcing plate 1 and this flexible circuit board sheet 21 is formed. There is also a method in which the positioning holes 22 are provided in the circuit board sheet 21 so that the attachment to the reinforcing plate 1 is processed using the positioning holes 3 and 22, and the component mounting is also performed using the positioning holes 22.
【０００７】 このような可撓性回路基板シ−ト２１の場合には、部品実装後の個々の可撓性 回路基板を最終的な形状に分離できるように、補強板１のスリット２の形成ライ ンに沿い且つそれらスリット２の不連続部分に対応している可撓性回路基板シ− ト２１の部位に細長い穴又はスリット２３を形成できる。しかし、この構造でも 回路部品実装後に個々の可撓性回路基板を最終的な形状に分離する為には少なく とも一回の打抜き処理を要するという不都合があった。In the case of such a flexible circuit board sheet 21, the slits 2 of the reinforcing plate 1 are formed so that individual flexible circuit boards after component mounting can be separated into final shapes. Elongated holes or slits 23 can be formed along the line and in the portions of the flexible circuit board sheet 21 corresponding to the discontinuities of the slits 2. However, even with this structure, there is a disadvantage that at least one punching process is required to separate the individual flexible circuit boards into the final shape after mounting the circuit components.
【０００８】[0008]
そこで、本考案は、補強板に貼付けられ且つ所要の回路部品を実装した可撓性 回路基板を打抜き処理の必要なく最終製品形状に容易に分離できるように案出し た補強板付可撓性回路基板を提供するものである。 Therefore, the present invention has been devised so that the flexible circuit board attached to the reinforcing plate and having the necessary circuit components mounted thereon can be easily separated into the final product shape without the need for punching. Is provided.
【０００９】 その為に、本考案による補強板付可撓性回路基板は、複数の可撓性回路基板を 区画形成した一枚の可撓性回路基板シ−トと、この可撓性回路基板シ−トに相互 の位置決め穴を用いて貼付けられた補強板とを有し、これらの可撓性回路基板シ −ト及び補強板には折曲げ操作により個々の可撓性回路基板を分離する為のスリ ットを設けた補強板付可撓性回路基板に於いて、上記可撓性回路基板シ−トに設 けた上記スリットはその端部に切れ込みを備えるように構成したものである。Therefore, the flexible circuit board with a reinforcing plate according to the present invention includes one flexible circuit board sheet in which a plurality of flexible circuit boards are partitioned and formed, and the flexible circuit board sheet. -Reinforcement plate attached using mutual positioning holes on the sheet, and the flexible circuit board sheet and the reinforcement plate for separating the individual flexible circuit boards by bending operation. In the flexible circuit board with a reinforcing plate provided with the slit, the slit provided in the flexible circuit board sheet is configured so as to have a notch at its end.
【００１０】[0010]
図１は本考案による補強板付可撓性回路基板の概念的な部分平面構成図を示す ものであって、補強板１は図５でも説明した如く可撓性回路基板シ−トを貼付け て最終的に個々の可撓性回路基板製品に分離できるようにする為に区画形成した 多数のスリット２を有する従来の如き割り基板の構造に構成され、その周辺部の 適宜箇所には適数個の位置決め穴３を備えている。 FIG. 1 is a conceptual partial plan view of a flexible circuit board with a reinforcing plate according to the present invention. The reinforcing plate 1 is formed by attaching a flexible circuit board sheet as described in FIG. The structure of the conventional split board has a large number of slits 2 that are divided and formed so that it can be separated into individual flexible circuit board products. A positioning hole 3 is provided.
【００１１】 可撓性回路基板シ−ト４は、必要な可撓性回路基板をこのシ−ト４に所要数備 えるように上記補強板１との関連に於いて適宜区画形成されており、補強板１の 位置決め穴３と対応する箇所には所要の位置決め穴５を有する。また、補強板１ に形成したスリット２のラインに沿ってそれらのスリット２の位置でつなぎ部分 を有する形態でこの可撓性回路基板シ−ト４にも分離用のスリット７を多数形成 してある。これらのスリット７は、その端部がＶ字状の切れ込み８となるように 形成され、後述するように個々の可撓性回路基板製品を容易に分離できるように 構成されている。The flexible circuit board sheet 4 is appropriately partitioned and formed in relation to the reinforcing plate 1 so that a required number of flexible circuit boards can be provided on the sheet 4. The reinforcing plate 1 has a required positioning hole 5 at a position corresponding to the positioning hole 3. Further, a large number of separating slits 7 are formed in the flexible circuit board sheet 4 in a form having connecting portions at the positions of the slits 2 formed along the line of the slits 2 formed in the reinforcing plate 1. is there. These slits 7 are formed so that the ends thereof form V-shaped cuts 8 and are configured so that individual flexible circuit board products can be easily separated, as will be described later.
【００１２】 補強板１と上記可撓性回路基板シ−ト４とは、上記両スリット２、７及びそれ ぞれ区画形成された各可撓性回路基板が所定位置に正確に配置されるようにそれ らの位置決め穴３、５を用いて図１の如く相互に貼付けられた後、区画形成され た個々の可撓性回路基板に対しては上記位置決め穴５を利用してチップ部品等の 所要の回路部品が自動実装等の手段で搭載される。そして、回路部品実装後には 図１の如く補強板１をスリット２の部分で折曲げて引き裂くような力Ｆを加える ことにより、従来の如き打抜き処理を要することなく、補強板１の不要な部分の 切除と同時に可撓性回路基板シ−ト４に於けるスリット７の切れ込み８の箇所か らこのシ−ト４を破断させて補強板付の個々の可撓性回路基板製品を分離させる ことができる。The reinforcing plate 1 and the flexible circuit board sheet 4 are arranged so that the slits 2 and 7 and the respective flexible circuit boards partitioned and formed are accurately arranged at predetermined positions. 1 are attached to each other by using the positioning holes 3 and 5 as shown in FIG. Required circuit components are mounted by means such as automatic mounting. After mounting the circuit components, by applying a force F that bends and tears the reinforcing plate 1 at the slit 2 portion as shown in FIG. At the same time as the cutting, the sheet 4 can be broken from the slit 8 of the slit 7 in the flexible circuit board sheet 4 to separate the individual flexible circuit board products with the reinforcing plate. it can.
【００１３】 上記の如き可撓性回路基板シ−ト４の破断は、そのべ−ス部材及びカバ−フィ ルムとしてポリイミドフィルム等を用いた場合に効果的であり、可撓性回路基板 シ−ト４のこのような破断を更に容易にする手段としては、図２に示す如く可撓 性回路基板シ−ト４に形成した各スリット７に於けるＶ字状の切れ込み８で挟ま れた区域には銅箔等のない細長い除去部１０を設け、この銅箔除去部１０の両側 に銅箔部４Ａ及び細長い捨てパタ−ン４Ｂを配置する形態が好ましい。The breakage of the flexible circuit board sheet 4 as described above is effective when a polyimide film or the like is used as the base member and the cover film. As a means for further facilitating such breakage of the sheet 4, as shown in FIG. 2, a region sandwiched by V-shaped notches 8 in each slit 7 formed in the flexible circuit board sheet 4. It is preferable that a stripped portion 10 without a copper foil or the like is provided on both sides of the copper foil portion 4 and the copper foil portion 4A and the stripped pattern 4B are disposed on both sides of the stripped portion 10.
【００１４】 また、可撓性回路基板シ−ト４の破断部を更にきれいに形成させるには、図３ の如く銅箔除去部１０に向かい且つ例えば捨てパタ−ン４Ｂの端縁に沿うように 一方を真直に形成した切れ込み９を備えるのが好適である。Further, in order to form the breakage portion of the flexible circuit board sheet 4 more neatly, as shown in FIG. 3, it is directed toward the copper foil removing portion 10 and along the edge of the discard pattern 4B, for example. It is preferable to provide the notch 9 in which one is formed straight.
【００１５】[0015]
本考案の補強板付可撓性回路基板は、補強板に対する可撓性回路基板シ−トの 貼付け位置合わせ処理及びその可撓性回路基板個々に対する回路部品の実装処理 を従来と同様に高い精度で行うことができる。 The flexible circuit board with a reinforcing plate of the present invention performs the positioning process of attaching the flexible circuit board sheet to the reinforcing plate and the mounting process of the circuit component on each of the flexible circuit boards with the same high precision as in the past. It can be carried out.
【００１６】 そして、回路部品の実装後には補強板と可撓性回路基板シ−トとに関連させて 形成したスリット部位に折曲げ操作を加えることにより、従来の如き打抜き処理 を必要とすることなく、補強板付の個々の可撓性回路基板製品を可撓性回路基板 シ−トのスリットに於ける切れ込みの部位から破断させて容易に分離できる。Then, after mounting the circuit components, a bending operation is applied to a slit portion formed in association with the reinforcing plate and the flexible circuit board sheet, thereby requiring a conventional punching process. Instead, the individual flexible circuit board products with the reinforcing plate can be easily separated from each other by breaking the cut portions in the slits of the flexible circuit board sheet.
【図１】本考案の補強板付可撓性回路基板を構成する為
の補強板と可撓性回路基板シ−トとの概念的な平面配置
図FIG. 1 is a conceptual plan layout view of a reinforcing plate and a flexible circuit board sheet for forming a flexible circuit board with a reinforcing plate of the present invention.
【図２】本考案に従って可撓性回路基板シ−トに形成し
たスリットの端部形状を部分的に拡大して示す説明図FIG. 2 is an explanatory view showing a partially enlarged shape of an end of a slit formed in a flexible circuit board sheet according to the present invention.
【図３】同じく可撓性回路基板シ−トのスリットの他の
端部形状を示す説明図FIG. 3 is an explanatory view showing the other end shape of the slit of the flexible circuit board sheet.
【図４】従来例による補強板と可撓性回路基板との貼付
け態様説明図FIG. 4 is an explanatory view of a pasting mode of a reinforcing plate and a flexible circuit board according to a conventional example.
【図５】同じく従来例による補強板と可撓性回路基板シ
−トとの貼付け態様説明図FIG. 5 is an explanatory view of a pasting mode of a reinforcing plate and a flexible circuit board sheet according to a conventional example.
１ 補強板 ２ スリット ３ 位置決め穴 ４ 可撓性回路基板シ−ト ５ 位置決め穴 ７ スリット ８ 切れ込み ９ 切れ込み 1 Reinforcement plate 2 Slit 3 Positioning hole 4 Flexible circuit board sheet 5 Positioning hole 7 Slit 8 Notch 9 Notch
Claims (1)
枚の可撓性回路基板シ−トと、この可撓性回路基板シ−
トに相互の位置決め穴を用いて貼付けられた補強板とを
有し、これらの可撓性回路基板シ−ト及び補強板には折
曲げ操作により個々の可撓性回路基板を分離する為のス
リットを設けた補強板付可撓性回路基板に於いて、上記
可撓性回路基板シ−トに設けた上記スリットはその端部
に切れ込みを備えるように構成した補強板付可撓性回路
基板。[Claims for utility model registration] 1. A flexible circuit board sheet in which a plurality of flexible circuit boards are partitioned and formed, and the flexible circuit board sheet.
And a reinforcing plate adhered to each other by using mutual positioning holes. The flexible circuit board sheet and the reinforcing plate are for separating the individual flexible circuit boards by a bending operation. In a flexible circuit board with a reinforcing plate provided with slits, the slit provided in the flexible circuit board sheet is configured so that a slit is provided at an end thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991059946U JP2581729Y2 (en) | 1991-07-04 | 1991-07-04 | Flexible circuit board with reinforcing plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991059946U JP2581729Y2 (en) | 1991-07-04 | 1991-07-04 | Flexible circuit board with reinforcing plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH054536U true JPH054536U (en) | 1993-01-22 |
| JP2581729Y2 JP2581729Y2 (en) | 1998-09-24 |
Family
ID=13127826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1991059946U Expired - Lifetime JP2581729Y2 (en) | 1991-07-04 | 1991-07-04 | Flexible circuit board with reinforcing plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2581729Y2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005032223A1 (en) * | 2003-09-29 | 2005-04-07 | Sanyang Electro Mechanics Co., Ltd. | Integrated structure for a flexible printed circuit boards and manufacturing method for the same |
| JP2006203118A (en) * | 2005-01-24 | 2006-08-03 | Sumitomo Bakelite Co Ltd | Flexible printed wiring board |
| JP2007012713A (en) * | 2005-06-28 | 2007-01-18 | Nitto Denko Corp | Wiring circuit board holding sheet |
| JP2007287963A (en) * | 2006-04-18 | 2007-11-01 | Nippon Mektron Ltd | Hybrid multilayer circuit board and its manufacturing method |
| JP2009216776A (en) * | 2008-03-07 | 2009-09-24 | Mitsubishi Electric Corp | Display device and method of measuring connection strength of display device |
| TWI382802B (en) * | 2005-08-23 | 2013-01-11 | Nippon Mektron Kk | Mixed multi - layer circuit substrate and manufacturing method thereof |
| WO2020090385A1 (en) * | 2018-10-30 | 2020-05-07 | 株式会社オートネットワーク技術研究所 | Attachment structure for mounted component |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56107078A (en) * | 1980-01-31 | 1981-08-25 | Seiren Co Ltd | Processing of knitted fabric |
| JPS5812966U (en) * | 1981-07-17 | 1983-01-27 | ソニー株式会社 | flexible printed wiring board |
| JPS6129774A (en) * | 1984-05-24 | 1986-02-10 | アクシス・エス・ピ−・エイ | Method and device for measuring resistance |
| JPS6211258A (en) * | 1985-07-08 | 1987-01-20 | Nec Corp | Gaas semiconductor integrated circuit |
| JPS62142867U (en) * | 1986-03-01 | 1987-09-09 | ||
| JPS63119264U (en) * | 1987-01-28 | 1988-08-02 |
-
1991
- 1991-07-04 JP JP1991059946U patent/JP2581729Y2/en not_active Expired - Lifetime
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56107078A (en) * | 1980-01-31 | 1981-08-25 | Seiren Co Ltd | Processing of knitted fabric |
| JPS5812966U (en) * | 1981-07-17 | 1983-01-27 | ソニー株式会社 | flexible printed wiring board |
| JPS6129774A (en) * | 1984-05-24 | 1986-02-10 | アクシス・エス・ピ−・エイ | Method and device for measuring resistance |
| JPS6211258A (en) * | 1985-07-08 | 1987-01-20 | Nec Corp | Gaas semiconductor integrated circuit |
| JPS62142867U (en) * | 1986-03-01 | 1987-09-09 | ||
| JPS63119264U (en) * | 1987-01-28 | 1988-08-02 |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005032223A1 (en) * | 2003-09-29 | 2005-04-07 | Sanyang Electro Mechanics Co., Ltd. | Integrated structure for a flexible printed circuit boards and manufacturing method for the same |
| JP2006203118A (en) * | 2005-01-24 | 2006-08-03 | Sumitomo Bakelite Co Ltd | Flexible printed wiring board |
| JP2007012713A (en) * | 2005-06-28 | 2007-01-18 | Nitto Denko Corp | Wiring circuit board holding sheet |
| JP4549939B2 (en) * | 2005-06-28 | 2010-09-22 | 日東電工株式会社 | Wiring circuit board holding sheet |
| TWI382802B (en) * | 2005-08-23 | 2013-01-11 | Nippon Mektron Kk | Mixed multi - layer circuit substrate and manufacturing method thereof |
| JP2007287963A (en) * | 2006-04-18 | 2007-11-01 | Nippon Mektron Ltd | Hybrid multilayer circuit board and its manufacturing method |
| JP2009216776A (en) * | 2008-03-07 | 2009-09-24 | Mitsubishi Electric Corp | Display device and method of measuring connection strength of display device |
| WO2020090385A1 (en) * | 2018-10-30 | 2020-05-07 | 株式会社オートネットワーク技術研究所 | Attachment structure for mounted component |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2581729Y2 (en) | 1998-09-24 |
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