WO2020090385A1 - Attachment structure for mounted component - Google Patents

Attachment structure for mounted component Download PDF

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Publication number
WO2020090385A1
WO2020090385A1 PCT/JP2019/039752 JP2019039752W WO2020090385A1 WO 2020090385 A1 WO2020090385 A1 WO 2020090385A1 JP 2019039752 W JP2019039752 W JP 2019039752W WO 2020090385 A1 WO2020090385 A1 WO 2020090385A1
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WO
WIPO (PCT)
Prior art keywords
land pattern
opening
plate portion
mark
terminal
Prior art date
Application number
PCT/JP2019/039752
Other languages
French (fr)
Japanese (ja)
Inventor
大樹 小林
康雄 大森
Original Assignee
株式会社オートネットワーク技術研究所
住友電装株式会社
住友電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 株式会社オートネットワーク技術研究所, 住友電装株式会社, 住友電気工業株式会社 filed Critical 株式会社オートネットワーク技術研究所
Publication of WO2020090385A1 publication Critical patent/WO2020090385A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

Definitions

  • the present disclosure relates to a mounting structure for mounting components.
  • the optical appearance inspection method of Patent Document 1 is a method of inspecting a soldered portion on a printed board on which mounting components are mounted by soldering.
  • illumination is applied from above the printed circuit board on which the mounting components are mounted, and the reflected light is captured by an appearance inspection machine to form an image. From the acquired image, the visual inspection machine visually inspects the surface quality of the fillet formed on the solder between the mounting component and the land pattern to verify the quality of soldering.
  • Patent Document 1 it is possible to judge whether or not the position of the mounted component is proper based on the formation position of the land pattern.
  • This inspection method can be used with the land pattern as a mark when, for example, the size of the mounted component or solder fillet is smaller than the land pattern, or when the land pattern protrudes around the mounted component on the board or from the solder fillet. It is possible to judge whether the positions of the parts are proper.
  • the land pattern is covered so as to be hidden by the mounting component, there is no index for specifying the position of the mounting component with respect to the land pattern, and thus it becomes impossible to inspect whether or not the position of the mounting component is proper.
  • the mounting structure of the mounting component of the present disclosure is A mounting target member provided with a land pattern, A mounting component that is soldered to the land pattern and mounted on the attachment target member, Equipped with The attachment target member is provided with a mark, The mounted component is provided with an opening through which the mark can be visually recognized from the side opposite to the attachment target member in a state in which the mounted component is arranged on the land pattern.
  • a mounting component mounting structure capable of inspecting whether the position of a mounting component with respect to a land pattern is proper.
  • FIG. 1 is a perspective view showing a flexible conductive path of the first embodiment.
  • FIG. 2 is an enlarged plan view showing a strip portion of the flexible printed wiring board.
  • FIG. 3 is a perspective view of the terminal.
  • FIG. 4 is a bottom view of the terminal.
  • FIG. 5 is a sectional view taken along the line AA of FIG.
  • FIG. 6 is a plan view of the terminal.
  • FIG. 7 is a plan view showing a terminal of the flexible conductive path and its periphery in an enlarged manner.
  • FIG. 8 is a sectional view taken along line BB of FIG.
  • FIG. 9 is a sectional view taken along line CC of FIG.
  • FIG. 10 is a perspective view showing the electronic device of the second embodiment.
  • FIG. 11 is an enlarged plan view showing a mark on the circuit board and its periphery.
  • FIG. 12 is an enlarged plan view showing the terminals of the electronic device and the periphery thereof.
  • FIG. 13 is a sectional view taken along the line DD of FIG.
  • FIG. 14 is a sectional view taken along line EE of FIG.
  • FIG. 15 is a side sectional view showing a flexible conductive path of another embodiment.
  • the mounting structure of the mounting component of the present disclosure is (1) An attachment target member provided with a land pattern and a mounting component that is soldered to the land pattern and mounted on the attachment target member are provided, and a mark is provided on the attachment target member.
  • the mounted component is provided with an opening through which the mark can be visually recognized from the side opposite to the attachment target member in a state in which the mounted component is arranged on the land pattern.
  • the mounted component is provided with an opening through which the mark provided on the attachment target member can be visually recognized from the side opposite to the attachment target member in the state of being arranged on the land pattern.
  • the mounting component may include a fixing portion that is soldered to the land pattern.
  • the fillet along the edge of the fixing portion may be located in the opening region of the opening when viewed from the side opposite to the attachment target member.
  • the mounting structure for mounting components has a structure in which the fillet along the edge of the fixed portion is located within the opening region of the opening when viewed from the side opposite to the mounting target member. The fillet can be seen through the opening.
  • the mounting structure of the mounted component can check whether or not the solder is properly wet and spread between the land pattern and the fixing portion by looking at the fillet through the opening.
  • the mounting component may include a square tube portion in which at least a portion of the bottom plate portion and at least a portion of the top plate portion face each other.
  • the bottom plate portion may be soldered to the land pattern.
  • the opening may be formed in the top plate portion. Since the mounted component includes the rectangular tube portion, strength and rigidity can be secured.
  • the member to be attached may be a flexible printed wiring board having an insulating sheet and the land pattern exposed from the insulating sheet.
  • the mark may be formed by cutting out a part of the insulating sheet.
  • the mark can be easily formed by cutting out a part of the insulating sheet. Further, the mark is less likely to be deformed than in the case where the mark has a projection shape, and the member to be attached can be downsized.
  • Example 1 will be described with reference to FIGS. 1 to 9.
  • the lower side of the paper surface is defined as the front and the upper side of the paper surface is defined as the rear side in FIGS.
  • the directions shown in FIGS. 8, 9, 13, and 14 are defined as the upper and lower directions as they are.
  • the directions shown in FIGS. 2, 7, 9, 11, 12, and 14 are defined as left and right.
  • the flexible conductive path 10 includes a flexible printed wiring board (hereinafter, simply referred to as a wiring board) 20 and terminals (conductive parts) 40 mounted on the wiring board 20.
  • the flexible conductive path 10 is assembled in, for example, a vertically separable connector housing (not shown) to form a connector (not shown).
  • the flexible printed wiring board 20 corresponds to an example of the "member to be attached" of the present invention.
  • the terminal 40 corresponds to an example of the "mounting component" of the present invention.
  • the wiring board 20 includes a plurality of strip-shaped electric wires 21 and an insulating sheet 22 that covers the electric wires 21.
  • the electric wire 21 is formed of, for example, a copper foil.
  • the insulating sheet 22 is a sheet made of insulating resin.
  • the wiring board 20 is composed of a wiring body 31 and a plurality of strip-shaped portions 32.
  • the wiring body 31 is configured such that a part of the plurality of electric wires 21 is integrally covered with the insulating sheet 22.
  • the strip portions 32 are arranged in parallel at a predetermined interval at one end of the wiring body 31.
  • a land pattern 33 is provided at the tip of the band-shaped portion 32.
  • the land pattern 33 is the tip of the electric wire 21 and is formed so as to be exposed from the insulating sheet 22.
  • the strip-shaped portion 32 has an upper surface on the tip side of the insulating sheet 22 removed, and the land pattern 33 is exposed upward.
  • a taper portion 34 is formed at the tip of the strip portion 32 so that the taper portion 34 becomes higher toward the front.
  • the wiring board 20 is provided with a mark 35.
  • the mark 35 is used when inspecting whether or not the position of the terminal 40 with respect to the land pattern 33 is proper in a state where the terminal 40 is connected to the land pattern 33.
  • the mark 35 is an index for grasping the position of the terminal 40 with respect to the land pattern 33.
  • the mark 35 is formed by cutting out a part of the insulating sheet 22 (the tip of the strip portion 32).
  • the mark 35 has a shape that is recessed rearward at the center position in the left-right direction at the tip of the band-shaped portion 32. As shown in FIG. 2, the mark 35 is recessed in a wedge shape when viewed from above and below. In this way, the mark 35 can be easily formed by cutting out a part of the insulating sheet 22. Further, the mark 35 is less likely to be deformed than in the case where it has a projection shape, and the wiring board 20 can be downsized.
  • the terminal 40 is a so-called female terminal fitting, and is a mounted component formed by pressing or bending a conductive metal plate.
  • the terminal 40 has an elongated tubular shape as a whole, and includes a top plate portion 41 and a bottom plate portion 42.
  • the top plate portion 41 is formed in a long plate shape and is formed over the entire longitudinal direction of the terminal 40.
  • the bottom plate portion 42 has a long plate shape whose length in the longitudinal direction is shorter than that of the top plate portion 41, and is arranged so as to face one end side of the top plate portion 41.
  • the bottom plate portion 42 is soldered to the land pattern 33 when the terminal 40 is attached to the wiring board 20.
  • the bottom plate portion 42 corresponds to an example of the “fixed portion” of the present invention.
  • the terminal 40 includes a box portion 43, a square tube portion 44, and a connecting portion 45.
  • the box portion 43 has an elongated tubular shape as a whole.
  • the box portion 43 accommodates, for example, an elastic contact piece (not shown) that elastically clamps the tab of the mating connector that fits into the terminal 40, and a receiving portion (not shown).
  • the rectangular tube portion 44 is configured such that the bottom plate portion 42 and a part of the top plate portion 41 face each other.
  • the rectangular tube portion 44 is configured by a portion on one end side of the top plate portion 41 (on the right side of the paper surface in FIGS. 4 to 6), a bottom plate portion 42, and a pair of side plate portions 46.
  • the pair of side plate portions 46 are long plates extending from the pair of edge portions on one end side of the top plate portion 41 so as to be orthogonal to the top plate portion 41, respectively.
  • the bottom plate portion 42 is configured by a pair of plate portions 42A as shown in FIGS. 3 and 4.
  • the pair of plate portions 42A are long plates that extend from the edge portions of the pair of side plate portions 46 on the opposite side to the top plate portion 41 so as to be orthogonal to the pair of side plate portions 46, respectively.
  • the pair of plate portions 42A are adjacent to each other so as to form one long plate.
  • the terminal 40 can secure strength and rigidity by including such a square tube portion 44. In particular, even if the flexible conductive path 10 is a small component such as the terminal 40, the strength and rigidity can be easily ensured by providing the square tube portion 44.
  • the connecting portion 45 connects the box portion 43 and the square tube portion 44, as shown in FIGS. 3 to 6.
  • the connecting portion 45 has a substantially U-shaped cut surface orthogonal to the longitudinal direction of the terminal 40.
  • the terminal 40 has an opening 47 formed in a top plate portion 41, as shown in FIGS. 4 to 6.
  • the opening 47 is a circular through hole that penetrates the top plate portion 41 in the plate thickness direction.
  • the opening portion 47 has a diameter of about half the length of the top plate portion 41 in the lateral direction.
  • the opening 47 is formed at a position straddling the rectangular tube portion 44 and the connecting portion 45.
  • the opening 47 is formed at a position that overlaps with the edge of the bottom plate 42 on the side of the box 43 (referred to as edge 48) in the plate thickness direction of the top plate 41.
  • edge 48 the central portion of the edge portion 48 is located within the opening region of the opening portion 47 when viewed in the plate thickness direction of the top plate portion 41.
  • the terminal 40 is mounted on the wiring board 20, as shown in FIGS. 7 to 9. Specifically, the terminal 40 is joined to the land pattern 33 of the wiring board 20 by soldering.
  • the rectangular tube portion 44 covers the land pattern 33 from above, as shown in FIGS. 2 and 7.
  • the tip portion of the bottom plate portion 42 (referred to as the tip portion 49) is located slightly forward of the rear end portion of the land pattern 33 (referred to as the rear end portion 36).
  • the edge portion 48 of the bottom plate portion 42 is located slightly rearward of the rear end of the mark 35.
  • the mark 35 is located below the opening 47. That is, the mark 35 is located in the opening region of the opening 47 when viewed from the upper side (the side opposite to the wiring board 20).
  • the terminal 40 can visually recognize the mark 35 from the upper side through the opening 47 when the terminal 40 is arranged at an appropriate position on the land pattern 33.
  • the solder 50 is interposed between the land pattern 33 and the bottom plate portion 42.
  • the solder 50 wets and spreads between the land pattern 33 and the bottom plate portion 42.
  • a fillet F is formed on the solder 50 below the edge portion 48 of the bottom plate portion 42.
  • the flexible conductive path 10 configured as described above, it is possible to confirm whether the terminal 40 is properly attached to the land pattern 33 by utilizing the opening 47 formed in the top plate portion 41.
  • the terminal 40 is provided with the opening 47 through which the mark 35 provided on the wiring board 20 can be viewed from the upper side (the side opposite to the wiring board 20) when the terminal 40 is arranged on the land pattern 33. Has been. Therefore, the flexible conductive path 10 can grasp the position of the terminal 40 with respect to the land pattern 33 by using the mark 35 as an index by looking at the mark 35 through the opening 47.
  • the terminal 40 has a mark 35 in the opening region of the opening 47 when viewed from above in a state where the tip 49 of the bottom plate 42 is located near the rear end 36 of the land pattern 33 (see FIGS. 2 and 7). When it can be confirmed that the terminal 40 is located (the state shown in FIG. 7), it can be determined that the position of the terminal 40 with respect to the land pattern 33 is proper.
  • the flexible conductive path 10 can confirm whether the spread of the solder 50 between the land pattern 33 and the bottom plate portion 42 is proper by utilizing the opening 47 formed in the top plate portion 41. Specifically, the wet spread of the solder 50 can be determined by checking the position of the fillet F. For example, in a state where the fillet F is along the edge portion 48 of the bottom plate portion 42 (a state in which the fillet F is located below), the solder 50 between the land pattern 33 and the bottom plate portion 42 gets wet from the inside to the edge portion 48 of the bottom plate portion 42. It is supposed to be spreading. Since the flexible conductive path 10 according to the first exemplary embodiment shown in FIG.
  • the fillet F along the edge portion 48 of the bottom plate portion 42 is located in the opening region of the opening portion 47 when viewed from above,
  • the fillet F can be visually recognized from the upper side through the opening 47. Therefore, by looking at the fillet F through the opening 47 in the flexible conductive path 10, it can be determined that the solder 50 has spread properly between the land pattern 33 and the bottom plate portion 42.
  • the mark 35 provided on the wiring board 20 in the state of being arranged on the land pattern 33 can be visually recognized from the side opposite to the wiring board 20.
  • a section 47 is provided. Therefore, the flexible conductive path 10 can grasp the position of the terminal 40 with respect to the land pattern 33 by using the mark 35 as an index by looking at the mark 35 through the opening 47. Therefore, the flexible conductive path 10 can be inspected for proper position of the terminal 40 with respect to the land pattern 33.
  • the terminal 40 also includes a bottom plate portion 42 that is soldered to the land pattern 33.
  • the fillet F along the edge portion 48 of the bottom plate portion 42 is located in the opening region of the opening portion 47.
  • the fillet F along the edge portion 48 of the bottom plate portion 42 is located in the opening region of the opening portion 47 when viewed from the side opposite to the wiring board 20, The fillet F can be viewed through the opening 47 from the side opposite to the wiring board 20.
  • the flexible conductive path 10 can be inspected by seeing the fillet F through the opening 47 to see if the solder 50 is properly wet and spread between the land pattern 33 and the bottom plate portion 42.
  • the terminal 40 includes a rectangular tube portion 44 in which the bottom plate portion 42 and a part of the top plate portion 41 are opposed to each other.
  • the bottom plate portion 42 is soldered to the land pattern 33.
  • An opening 47 is formed in the top plate portion 41. According to this, since the terminal 40 is provided with the rectangular tube portion 44, strength and rigidity can be secured.
  • the wiring board 20 also includes an insulating sheet 22 and a land pattern 33 exposed from the insulating sheet 22.
  • the mark 35 is formed by cutting out a part of the insulating sheet 22. According to this, the mark 35 can be easily formed by notching a part of the insulating sheet 22. Further, the mark 35 is less likely to be deformed than in the case where it has a projection shape, and the wiring board 20 can be downsized.
  • FIGS. 10 to 14 a second embodiment in which the mounting structure for mounting components according to the present disclosure is embodied will be described with reference to FIGS. 10 to 14.
  • the structure of the mounting target member for mounting the terminal 40 is different from that of the first embodiment. Since the other configurations are the same as those in the first embodiment, the same reference numerals are given to the same configurations, and the description of the structure, operation, and effect is omitted.
  • the electronic device 210 includes a circuit board 220 and terminals 40 mounted on the circuit board 220.
  • the circuit board 220 corresponds to an example of the “member to be attached” of the present invention.
  • the electronic device 210 is assembled in, for example, a vertically separable connector housing (not shown) to form a connector (not shown).
  • the circuit board 220 is a rigid rigid board having a rectangular flat plate shape, for example.
  • the circuit board 220 is made of an insulating material and has a plurality of land patterns 233, which are conductor wiring patterns, formed on the upper surface thereof.
  • the land patterns 233 are arranged in parallel along an end 223 on one side of the circuit board 220 at a predetermined interval.
  • the land pattern 233 is formed of, for example, copper foil.
  • the circuit board 220 is provided with a mark 235.
  • the mark 235 serves as an index for grasping the position of the terminal 40 with respect to the land pattern 233.
  • the mark 235 is, for example, a triangular figure, and is printed on the upper surface of the circuit board 220.
  • the mark 235 is formed on the upper surface of the circuit board 220 at a position adjacent to the end of the land pattern 233 on the end 223 side (a position between the end 223 and the land pattern 233).
  • the terminal 40 has the same configuration as the terminal 40 of the first embodiment, and is mounted on the circuit board 220 as shown in FIGS. 12 to 14. Specifically, the bottom plate portion 42 is joined to the land pattern 233 of the circuit board 220 by soldering. As shown in FIGS. 11 and 12, the rectangular tube portion 44 covers the land pattern 233 from above.
  • the tip 49 of the bottom plate 42 is located slightly forward of the rear end of the land pattern 233 (referred to as the rear end 236).
  • the edge portion 48 of the bottom plate portion 42 is located slightly rearward of the rear end of the mark 235.
  • the mark 235 is located below the opening 47. That is, as shown in FIGS. 12 to 14, the mark 235 is located in the opening region of the opening 47 when viewed from the upper side (the side opposite to the circuit board 220). As a result, the terminal 40 can visually recognize the mark 235 from the upper side through the opening 47 in the state where the terminal 40 is arranged on the land pattern 233.
  • the solder 50 is interposed between the land pattern 233 and the bottom plate portion 42, as shown in FIGS. 13 and 14.
  • the solder 50 wets and spreads between the land pattern 233 and the bottom plate portion 42.
  • a fillet F is formed on the solder 50 below the edge portion 48 of the bottom plate portion 42.
  • the electronic device 210 uses the opening 47 formed in the top plate portion 41 to check whether the terminal 40 is properly attached to the land pattern 233. You can By looking at the mark 235 through the opening 47, the electronic device 210 can grasp the position of the terminal 40 with respect to the land pattern 233 using the mark 235 as an index.
  • the terminal 40 has a mark 235 in the opening area of the opening 47 when viewed from above, with the tip 49 of the bottom plate 42 positioned near the rear end 236 of the land pattern 233 (see FIGS. 11 and 12). If it can be confirmed that the terminal 40 is located (the state shown in FIG. 12), it can be determined that the position of the terminal 40 with respect to the land pattern 233 is appropriate.
  • the electronic device 210 can confirm whether or not the wet spread of the solder 50 between the land pattern 233 and the bottom plate portion 42 is appropriate by utilizing the opening 47 formed in the top plate portion 41.
  • the electronic device 210 of the second embodiment shown in FIG. 13 has a configuration in which the fillet F along the edge portion 48 of the bottom plate portion 42 is located within the opening region of the opening portion 47 when viewed from above, The fillet F can be visually recognized from the opening 47. Therefore, by looking at the fillet F through the opening 47, the electronic device 210 can determine that the solder 50 is properly wet and spread between the land pattern 233 and the bottom plate portion 42.
  • the opening 47 of the top plate portion 41 is formed at a position that straddles the rectangular tube portion 44 and the connecting portion 45, but may be at another position.
  • the opening 347 of the flexible conductive path 310 shown in FIG. 15A is formed in the connecting portion 45.
  • the opening 347 is formed at a position adjacent to the square tube portion 44 in the top plate portion 41 that constitutes the connecting portion 45.
  • the flexible conductive path 310 can visually recognize the mark 35 and the fillet F from the upper side through the opening 347.
  • the terminal 40 has the square tubular portion 44 configured to include the entire bottom plate portion 42, but the square tubular portion 44 includes only a part of the bottom plate portion 42. May be configured.
  • the terminal 440 of the flexible conductive path 410 shown in FIG. 15B includes a portion on one end side of the top plate portion 41 (on the right side of the paper in FIG. 15B) and one end side of the bottom plate portion 442 (see FIG. ), The left side of the drawing) and a pair of side plate portions 46.
  • the terminal 40 includes the square tube portion 44, but the square tube portion 44 may not be provided.
  • the terminal 540 of the flexible conductive path 510 shown in FIG. 15C includes a bottom plate portion 542 that does not form a rectangular tube portion.
  • the terminal 540 has an opening 547 formed in a connecting portion 545 that connects the box portion 543 and the bottom plate portion 542.
  • the flexible conductive path 510 can visually recognize the mark 35 and the fillet F from the upper side through the opening 547.
  • the top plate portion 641 may be soldered like the terminal 640 of the flexible conductive path 610 shown in FIG.
  • An opening 647 is formed in the top plate portion 641.
  • the flexible conductive path 610 can visually recognize the mark 35 and the fillet F from the upper side through the opening 647.
  • the flexible printed wiring board 20 is illustrated as the member to which the terminal 40 is attached, but it may be a flexible printed board.
  • a wedge-shaped recessed portion is illustrated, but other configurations such as a protrusion protruding forward and upward, a recess depressed downward, and a through hole may be used. May be.
  • a triangular figure printed on the upper surface of the circuit board 220 is illustrated, but other shapes such as a dot shape may be used.
  • the mark 235 may be a figure configured with a color different from the color of the upper surface of the circuit board 220 so that the shape and position thereof can be specified. Further, the mark 235 may be a plated portion.
  • the opening 47 is a circular through hole that penetrates the top plate portion 41, but it may have another shape and the size thereof can be arbitrarily determined.
  • the mounted component may be a component (electronic component such as semiconductor) other than the terminal 40.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

Provided is an attachment structure for a mounted component. The attachment structure makes it possible to inspect whether the mounted component is properly positioned on a land pattern. According to the present invention, a flexible conduction path (10) comprises: a flexible printed circuit board (20) that has a land pattern (33) provided thereon; and a terminal (40) that is soldered onto the land pattern (33) of the flexible printed circuit board (20). A marker (35) is provided to the flexible printed circuit board (20). An opening part (47) that makes it possible to see the marker (35) from the side opposite the flexible printed circuit board (20) when the terminal (40) has been arranged on the land pattern (33) is provided in the terminal (40).

Description

実装部品の取付け構造Mounting structure for mounted parts
　本開示は、実装部品の取付け構造に関するものである。 The present disclosure relates to a mounting structure for mounting components.
　特許文献１の光学式外観検査方法は、実装部品が半田付けにより実装されたブリント基板に対して、半田付け部分を検査する方法である。この検査方法は、実装部品を実装したプリント基板の上方から照明を当て、反射した光を外観検査機によって取り込み、画像化する。外観検査機は、取得した画像から、実装部品とランドパターンとの間の半田に形成されるフィレットの表面性状を外観検査して、半田付けの良否を検証する。 The optical appearance inspection method of Patent Document 1 is a method of inspecting a soldered portion on a printed board on which mounting components are mounted by soldering. In this inspection method, illumination is applied from above the printed circuit board on which the mounting components are mounted, and the reflected light is captured by an appearance inspection machine to form an image. From the acquired image, the visual inspection machine visually inspects the surface quality of the fillet formed on the solder between the mounting component and the land pattern to verify the quality of soldering.
特開２０１１－９１１４４号公報JP, 2011-91144, A
　特許文献１の検査方法によれば、実装部品の位置が適正か否かランドパターンの形成位置に基づいて判断することができる。この検査方法は、例えば、実装部品や半田フィレットのサイズがランドパターンよりも小さい場合や、基板上において実装部品の周囲や半田フィレットからランドパターンがはみ出るような場合などでは、ランドパターンを目印に実装部品の位置が適正かどうかを判断することができる。しかしながら、ランドパターンが実装部品によって隠されるように覆われる場合、ランドパターンに対する実装部品の位置を特定するための指標がないため、実装部品の位置が適正か否かを検査することができなくなる。 According to the inspection method of Patent Document 1, it is possible to judge whether or not the position of the mounted component is proper based on the formation position of the land pattern. This inspection method can be used with the land pattern as a mark when, for example, the size of the mounted component or solder fillet is smaller than the land pattern, or when the land pattern protrudes around the mounted component on the board or from the solder fillet. It is possible to judge whether the positions of the parts are proper. However, when the land pattern is covered so as to be hidden by the mounting component, there is no index for specifying the position of the mounting component with respect to the land pattern, and thus it becomes impossible to inspect whether or not the position of the mounting component is proper.
　そこで、ランドパターンに対する実装部品の位置が適正か検査し得る実装部品の取付け構造を提供することを目的とする。 Therefore, it is an object of the present invention to provide a mounting component mounting structure capable of inspecting whether the position of the mounting component with respect to the land pattern is proper.
　本開示の実装部品の取付け構造は、
　ランドパターンが設けられた取付対象部材と、
　前記ランドパターンに半田付けされ、前記取付対象部材に実装される実装部品と、
を備え、
　前記取付対象部材には、目印が設けられており、
　前記実装部品には、前記ランドパターン上に配置された状態において、前記取付対象部材とは反対側から前記目印を視認可能な開口部が設けられている。 The mounting structure of the mounting component of the present disclosure is
A mounting target member provided with a land pattern,
A mounting component that is soldered to the land pattern and mounted on the attachment target member,
Equipped with
The attachment target member is provided with a mark,
The mounted component is provided with an opening through which the mark can be visually recognized from the side opposite to the attachment target member in a state in which the mounted component is arranged on the land pattern.
　本開示によれば、ランドパターンに対する実装部品の位置が適正か検査し得る実装部品の取付け構造を提供することが可能となる。 According to the present disclosure, it becomes possible to provide a mounting component mounting structure capable of inspecting whether the position of a mounting component with respect to a land pattern is proper.
図１は、実施例１のフレキシブル導電路を示す斜視図である。FIG. 1 is a perspective view showing a flexible conductive path of the first embodiment. 図２は、フレキシブルプリント配線板の帯状部を拡大して示す平面図である。FIG. 2 is an enlarged plan view showing a strip portion of the flexible printed wiring board. 図３は、端子の斜視図である。FIG. 3 is a perspective view of the terminal. 図４は、端子の底面図である。FIG. 4 is a bottom view of the terminal. 図５は、図４のＡ－Ａ線断面図である。FIG. 5 is a sectional view taken along the line AA of FIG. 図６は、端子の平面図である。FIG. 6 is a plan view of the terminal. 図７は、フレキシブル導電路の端子及びその周辺を拡大して示す平面図である。FIG. 7 is a plan view showing a terminal of the flexible conductive path and its periphery in an enlarged manner. 図８は、図７のＢ－Ｂ線断面図である。FIG. 8 is a sectional view taken along line BB of FIG. 図９は、図８のＣ－Ｃ線断面図である。FIG. 9 is a sectional view taken along line CC of FIG. 図１０は、実施例２の電子装置を示す斜視図である。FIG. 10 is a perspective view showing the electronic device of the second embodiment. 図１１は、回路基板の目印及びその周辺を拡大して示す平面図である。FIG. 11 is an enlarged plan view showing a mark on the circuit board and its periphery. 図１２は、電子装置の端子及びその周辺を拡大して示す平面図である。FIG. 12 is an enlarged plan view showing the terminals of the electronic device and the periphery thereof. 図１３は、図１２のＤ－Ｄ線断面図である。FIG. 13 is a sectional view taken along the line DD of FIG. 図１４は、図１３のＥ－Ｅ線断面図である。FIG. 14 is a sectional view taken along line EE of FIG. 図１５は、他の実施例のフレキシブル導電路を示す側断面図である。FIG. 15 is a side sectional view showing a flexible conductive path of another embodiment.
［本開示の実施形態の説明］
　最初に本開示の実施態様を列記して説明する。
　本開示の実装部品の取付け構造は、
　（１）ランドパターンが設けられた取付対象部材と、前記ランドパターンに半田付けされ、前記取付対象部材に実装される実装部品と、を備え、前記取付対象部材には、目印が設けられており、前記実装部品には、前記ランドパターン上に配置された状態において、前記取付対象部材とは反対側から前記目印を視認可能な開口部が設けられている。
　実装部品に、ランドパターン上に配置された状態において、取付対象部材に設けられた目印を取付対象部材とは反対側から視認可能な開口部が設けられている。そのため、この実装部品の取付け構造は、開口部を介して目印を見ることで、目印を指標にして実装部品のランドパターンに対する位置を把握することができる。したがって、実装部品の取付け構造は、ランドパターンに対する実装部品の位置が適正か検査することができる。
　（２）前記実装部品が、前記ランドパターンに半田付けされる固着部を具備してもよい。前記取付対象部材とは反対側から見て、前記固着部の縁部に沿ったフィレットが、前記開口部の開口領域内に位置してもよい。実装部品の取付け構造は、取付対象部材とは反対側から見て、固着部の縁部に沿ったフィレットが、開口部の開口領域内に位置する構成であるため、取付対象部材とは反対側から開口部を介してフィレットを視認することができる。固着部の縁部にフィレットが沿う状態では、ランドパターンと固着部との間の半田が、内側から固着部の縁部まで濡れ広がっていることが想定される。そのため、実装部品の取付け構造は、開口部を介してフィレットを見ることで、半田がランドパターンと固着部との間で適正に濡れ広がっているか否か検査することができる。 [Description of Embodiments of the Present Disclosure]
First, embodiments of the present disclosure will be listed and described.
The mounting structure of the mounting component of the present disclosure is
(1) An attachment target member provided with a land pattern and a mounting component that is soldered to the land pattern and mounted on the attachment target member are provided, and a mark is provided on the attachment target member. The mounted component is provided with an opening through which the mark can be visually recognized from the side opposite to the attachment target member in a state in which the mounted component is arranged on the land pattern.
The mounted component is provided with an opening through which the mark provided on the attachment target member can be visually recognized from the side opposite to the attachment target member in the state of being arranged on the land pattern. Therefore, in this mounting structure for mounting components, the position of the mounting component with respect to the land pattern can be grasped by using the mark as an index by looking at the mark through the opening. Therefore, the mounting structure of the mounted component can be inspected for proper position of the mounted component with respect to the land pattern.
(2) The mounting component may include a fixing portion that is soldered to the land pattern. The fillet along the edge of the fixing portion may be located in the opening region of the opening when viewed from the side opposite to the attachment target member. The mounting structure for mounting components has a structure in which the fillet along the edge of the fixed portion is located within the opening region of the opening when viewed from the side opposite to the mounting target member. The fillet can be seen through the opening. When the fillet extends along the edge of the fixed portion, it is assumed that the solder between the land pattern and the fixed portion wets and spreads from the inside to the edge of the fixed portion. Therefore, the mounting structure of the mounted component can check whether or not the solder is properly wet and spread between the land pattern and the fixing portion by looking at the fillet through the opening.
　（３）前記実装部品が、底板部の少なくとも一部と天板部の少なくとも一部とを対向させた形態の角筒部を具備してもよい。前記底板部は、前記ランドパターンに半田付けされてもよい。前記天板部には、前記開口部が形成されてもよい。実装部品は、角筒部を具備することで、強度及び剛性を確保することができる。 (3) The mounting component may include a square tube portion in which at least a portion of the bottom plate portion and at least a portion of the top plate portion face each other. The bottom plate portion may be soldered to the land pattern. The opening may be formed in the top plate portion. Since the mounted component includes the rectangular tube portion, strength and rigidity can be secured.
　（４）前記取付対象部材が、絶縁シートと、前記絶縁シートから露出する前記ランドパターンと、を有するフレキシブルプリント配線板でもよい。前記目印は、前記絶縁シートの一部を切り欠くことで形成されてもよい。目印は、絶縁シートの一部を切り欠く加工によって、簡単に形成することができる。また、目印は、突起状である場合に比べ、変形し難く、取付対象部材の小型化を図ることができる。 (4) The member to be attached may be a flexible printed wiring board having an insulating sheet and the land pattern exposed from the insulating sheet. The mark may be formed by cutting out a part of the insulating sheet. The mark can be easily formed by cutting out a part of the insulating sheet. Further, the mark is less likely to be deformed than in the case where the mark has a projection shape, and the member to be attached can be downsized.
［本開示の実施形態の詳細］
　本開示の実装部品の取付け構造の具体例を、以下に図面を参照しつつ説明する。なお、本発明はこの例示に限定されるものではなく、特許請求の範囲によって示され、特許請求の範囲と均等の意味および範囲内でのすべての変更が含まれることが意図される。 [Details of the embodiment of the present disclosure]
A specific example of a mounting component mounting structure of the present disclosure will be described below with reference to the drawings. It should be noted that the present invention is not limited to this exemplification, and is shown by the scope of the claims, and is intended to include meanings equivalent to the scope of the claims and all modifications within the scope.
　＜実施例１＞
　実施例１を、図１～図９を参照して説明する。なお、以下の説明において、前後の方向については、図２，７，１１，１２において紙面下方を前方、紙面上方を後方と定義する。上下の方向については、図８，９，１３，１４にあらわれる向きを、そのまま上方、下方と定義する。左右の方向については、図２，７，９，１１，１２，１４にあらわれる向きを、そのまま左方、右方と定義する。 <Example 1>
Example 1 will be described with reference to FIGS. 1 to 9. In the following description, in the front-back direction, the lower side of the paper surface is defined as the front and the upper side of the paper surface is defined as the rear side in FIGS. Regarding the up and down directions, the directions shown in FIGS. 8, 9, 13, and 14 are defined as the upper and lower directions as they are. Regarding the left and right directions, the directions shown in FIGS. 2, 7, 9, 11, 12, and 14 are defined as left and right.
　本第１実施例の実装部品の取付け構造は、図１に示すフレキシブル導電路１０に用いられている。フレキシブル導電路１０は、図１に示すように、フレキシブルプリント配線板（以下、単に配線板という）２０と、配線板２０に実装される端子（導電部品）４０と、を備えている。フレキシブル導電路１０は、例えば上下に分割可能なコネクタハウジング（図示略）に組み付けられて、コネクタ（図示略）を構成する。フレキシブルプリント配線板２０は、本発明の「取付対象部材」の一例に相当する。端子４０は、本発明の「実装部品」の一例に相当する。 The mounting structure for mounting components according to the first embodiment is used for the flexible conductive path 10 shown in FIG. As shown in FIG. 1, the flexible conductive path 10 includes a flexible printed wiring board (hereinafter, simply referred to as a wiring board) 20 and terminals (conductive parts) 40 mounted on the wiring board 20. The flexible conductive path 10 is assembled in, for example, a vertically separable connector housing (not shown) to form a connector (not shown). The flexible printed wiring board 20 corresponds to an example of the "member to be attached" of the present invention. The terminal 40 corresponds to an example of the "mounting component" of the present invention.
　配線板２０は、図２に示すように、複数の帯状の電線２１と、各電線２１を被覆する絶縁シート２２と、を備えている。電線２１は、例えば銅箔によって形成されている。絶縁シート２２は、絶縁樹脂製のシートである。 As shown in FIG. 2, the wiring board 20 includes a plurality of strip-shaped electric wires 21 and an insulating sheet 22 that covers the electric wires 21. The electric wire 21 is formed of, for example, a copper foil. The insulating sheet 22 is a sheet made of insulating resin.
　配線板２０は、図２に示すように、配線本体３１と、複数の帯状部３２と、から構成されている。配線本体３１は、複数の電線２１の一部が一体的に絶縁シート２２で被覆されるように構成されている。帯状部３２は、配線本体３１の一側の端部において所定間隔をおいて並列した状態で配列されている。帯状部３２は、先端にランドパターン３３が設けられている。ランドパターン３３は、電線２１の先端であり、絶縁シート２２から露出するように形成されている。具体的には、帯状部３２は、絶縁シート２２の先端側の上面が除かれており、ランドパターン３３が上方に露出している。帯状部３２の先端には、図８，９に示すように、前方に向かうにつれて高位置となるようなテーパ部３４が形成されている。 As shown in FIG. 2, the wiring board 20 is composed of a wiring body 31 and a plurality of strip-shaped portions 32. The wiring body 31 is configured such that a part of the plurality of electric wires 21 is integrally covered with the insulating sheet 22. The strip portions 32 are arranged in parallel at a predetermined interval at one end of the wiring body 31. A land pattern 33 is provided at the tip of the band-shaped portion 32. The land pattern 33 is the tip of the electric wire 21 and is formed so as to be exposed from the insulating sheet 22. Specifically, the strip-shaped portion 32 has an upper surface on the tip side of the insulating sheet 22 removed, and the land pattern 33 is exposed upward. As shown in FIGS. 8 and 9, a taper portion 34 is formed at the tip of the strip portion 32 so that the taper portion 34 becomes higher toward the front.
　配線板２０には、図２、図８、図９に示すように、目印３５が設けられている。目印３５は、ランドパターン３３に端子４０が接続された状態で、ランドパターン３３に対する端子４０の位置が適正か否か検査する際に用いられる。目印３５は、ランドパターン３３に対する端子４０の位置を把握する指標となる。目印３５は、絶縁シート２２の一部（帯状部３２の先端）を切り欠いて形成されている。目印３５は、帯状部３２の先端における左右方向の中心位置において、後方に凹む形状である。目印３５は、図２に示すように、上下方向から見てくさび状に凹んでいる。このように、目印３５は、絶縁シート２２の一部を切り欠く加工によって、簡単に形成することができる。また、目印３５は、突起状である場合に比べ、変形し難く、配線板２０の小型化を図ることができる。 As shown in FIGS. 2, 8 and 9, the wiring board 20 is provided with a mark 35. The mark 35 is used when inspecting whether or not the position of the terminal 40 with respect to the land pattern 33 is proper in a state where the terminal 40 is connected to the land pattern 33. The mark 35 is an index for grasping the position of the terminal 40 with respect to the land pattern 33. The mark 35 is formed by cutting out a part of the insulating sheet 22 (the tip of the strip portion 32). The mark 35 has a shape that is recessed rearward at the center position in the left-right direction at the tip of the band-shaped portion 32. As shown in FIG. 2, the mark 35 is recessed in a wedge shape when viewed from above and below. In this way, the mark 35 can be easily formed by cutting out a part of the insulating sheet 22. Further, the mark 35 is less likely to be deformed than in the case where it has a projection shape, and the wiring board 20 can be downsized.
　端子４０は、図３～図６に示すように、いわゆる雌型の端子金具であって、導電性の金属板をプレス加工や曲げ加工等して成形された実装部品である。端子４０は、全体として細長い筒形状であり、天板部４１と、底板部４２と、を備えている。なお、天板部４１は、長板状に形成されており、端子４０の長手方向全体に亘って形成されている。底板部４２は、長手方向の長さが天板部４１よりも短い長板状であり、天板部４１の一端側と対向するように配置されている。底板部４２は、端子４０を配線板２０に取り付ける際に、ランドパターン３３に半田付けされる。底板部４２は、本発明の「固着部」の一例に相当する。 As shown in FIGS. 3 to 6, the terminal 40 is a so-called female terminal fitting, and is a mounted component formed by pressing or bending a conductive metal plate. The terminal 40 has an elongated tubular shape as a whole, and includes a top plate portion 41 and a bottom plate portion 42. The top plate portion 41 is formed in a long plate shape and is formed over the entire longitudinal direction of the terminal 40. The bottom plate portion 42 has a long plate shape whose length in the longitudinal direction is shorter than that of the top plate portion 41, and is arranged so as to face one end side of the top plate portion 41. The bottom plate portion 42 is soldered to the land pattern 33 when the terminal 40 is attached to the wiring board 20. The bottom plate portion 42 corresponds to an example of the “fixed portion” of the present invention.
　端子４０は、図３～図６に示すように、箱部４３と、角筒部４４と、連結部４５と、を備えている。箱部４３は、全体として細長い筒形状である。箱部４３は、例えば端子４０に嵌合する相手側コネクタのタブを弾性的に挟持する弾性接触片（図示略）と、受け部（図示略）と、を収容している。 As shown in FIGS. 3 to 6, the terminal 40 includes a box portion 43, a square tube portion 44, and a connecting portion 45. The box portion 43 has an elongated tubular shape as a whole. The box portion 43 accommodates, for example, an elastic contact piece (not shown) that elastically clamps the tab of the mating connector that fits into the terminal 40, and a receiving portion (not shown).
　角筒部４４は、図５に示すように、底板部４２と天板部４１の一部とを対向させた形態で構成されている。具体的には、角筒部４４は、天板部４１の一端側（図４～図６では紙面右側）の部分と、底板部４２と、一対の側板部４６と、によって構成されている。一対の側板部４６は、天板部４１の一端側における一対の縁部から、それぞれ天板部４１に直交するように延出する長板である。底板部４２は、図３、図４に示すように、一対の板部４２Ａによって構成されている。一対の板部４２Ａは、一対の側板部４６における天板部４１とは反対側の縁部から、それぞれ一対の側板部４６に直交するように延出する長板である。一対の板部４２Ａは、１つの長板を構成するように隣接している。端子４０は、このような角筒部４４を具備することで、強度及び剛性を確保することができる。特に、フレキシブル導電路１０は、端子４０のような小さい部品であっても、角筒部４４を設けることで容易に強度及び剛性を確保することができる。 As shown in FIG. 5, the rectangular tube portion 44 is configured such that the bottom plate portion 42 and a part of the top plate portion 41 face each other. Specifically, the rectangular tube portion 44 is configured by a portion on one end side of the top plate portion 41 (on the right side of the paper surface in FIGS. 4 to 6), a bottom plate portion 42, and a pair of side plate portions 46. The pair of side plate portions 46 are long plates extending from the pair of edge portions on one end side of the top plate portion 41 so as to be orthogonal to the top plate portion 41, respectively. The bottom plate portion 42 is configured by a pair of plate portions 42A as shown in FIGS. 3 and 4. The pair of plate portions 42A are long plates that extend from the edge portions of the pair of side plate portions 46 on the opposite side to the top plate portion 41 so as to be orthogonal to the pair of side plate portions 46, respectively. The pair of plate portions 42A are adjacent to each other so as to form one long plate. The terminal 40 can secure strength and rigidity by including such a square tube portion 44. In particular, even if the flexible conductive path 10 is a small component such as the terminal 40, the strength and rigidity can be easily ensured by providing the square tube portion 44.
　連結部４５は、図３～図６に示すように、箱部４３と角筒部４４を連結している。連結部４５は、端子４０の長手方向に直交する切断面が略コ字状になっている。 The connecting portion 45 connects the box portion 43 and the square tube portion 44, as shown in FIGS. 3 to 6. The connecting portion 45 has a substantially U-shaped cut surface orthogonal to the longitudinal direction of the terminal 40.
　端子４０は、図４～図６に示すように、天板部４１に開口部４７が形成されている。開口部４７は、天板部４１を板厚方向に貫通する円形の貫通孔である。開口部４７は、天板部４１の短手方向の長さの半分程度の直径になっている。開口部４７は、角筒部４４と連結部４５を跨る位置に形成されている。開口部４７は、天板部４１の板厚方向において、底板部４２の箱部４３側の縁部（縁部４８という）と重なる位置に形成されている。具体的には、縁部４８の中央側部分は、天板部４１の板厚方向から見て、開口部４７の開口領域内に位置している。 The terminal 40 has an opening 47 formed in a top plate portion 41, as shown in FIGS. 4 to 6. The opening 47 is a circular through hole that penetrates the top plate portion 41 in the plate thickness direction. The opening portion 47 has a diameter of about half the length of the top plate portion 41 in the lateral direction. The opening 47 is formed at a position straddling the rectangular tube portion 44 and the connecting portion 45. The opening 47 is formed at a position that overlaps with the edge of the bottom plate 42 on the side of the box 43 (referred to as edge 48) in the plate thickness direction of the top plate 41. Specifically, the central portion of the edge portion 48 is located within the opening region of the opening portion 47 when viewed in the plate thickness direction of the top plate portion 41.
　端子４０は、図７～図９に示すように、配線板２０に実装されている。具体的には、端子４０は、配線板２０のランドパターン３３に半田付けによって接合されている。角筒部４４は、図２、図７に示すように、ランドパターン３３を上方から覆っている。 The terminal 40 is mounted on the wiring board 20, as shown in FIGS. 7 to 9. Specifically, the terminal 40 is joined to the land pattern 33 of the wiring board 20 by soldering. The rectangular tube portion 44 covers the land pattern 33 from above, as shown in FIGS. 2 and 7.
　底板部４２の先端部（先端部４９という）は、図２、図７に示すように、ランドパターン３３の後端部（後端部３６という）よりも僅かに前方に位置している。底板部４２の縁部４８は、図７、図８に示すように、目印３５の後端よりも僅かに後方に位置している。目印３５は、開口部４７の下方に位置している。すなわち、目印３５は、上側（配線板２０とは反対側）から見て、開口部４７の開口領域内に位置している。これにより、端子４０は、ランドパターン３３上の適正な位置に配置された状態において、目印３５を上側から開口部４７を介して視認可能になっている。このように、端子４０は、底板部４２の先端部４９がランドパターン３３の後端部３６付近に位置するとともに、上側から見て開口部４７の開口領域内に目印３５が位置する状態で、ランドパターン３３に対する適正位置となる。 As shown in FIGS. 2 and 7, the tip portion of the bottom plate portion 42 (referred to as the tip portion 49) is located slightly forward of the rear end portion of the land pattern 33 (referred to as the rear end portion 36). As shown in FIGS. 7 and 8, the edge portion 48 of the bottom plate portion 42 is located slightly rearward of the rear end of the mark 35. The mark 35 is located below the opening 47. That is, the mark 35 is located in the opening region of the opening 47 when viewed from the upper side (the side opposite to the wiring board 20). As a result, the terminal 40 can visually recognize the mark 35 from the upper side through the opening 47 when the terminal 40 is arranged at an appropriate position on the land pattern 33. In this manner, in the terminal 40, with the tip end 49 of the bottom plate portion 42 positioned near the rear end portion 36 of the land pattern 33, and the mark 35 positioned within the opening region of the opening 47 as viewed from above, It is an appropriate position with respect to the land pattern 33.
　半田５０は、図８、図９に示すように、ランドパターン３３と底板部４２の間に介在している。半田５０は、ランドパターン３３と底板部４２の間で濡れ広がっている。半田５０には、図８に示すように、底板部４２の縁部４８の下方においてフィレットＦが形成されている。 As shown in FIGS. 8 and 9, the solder 50 is interposed between the land pattern 33 and the bottom plate portion 42. The solder 50 wets and spreads between the land pattern 33 and the bottom plate portion 42. As shown in FIG. 8, a fillet F is formed on the solder 50 below the edge portion 48 of the bottom plate portion 42.
　次に、端子４０がランドパターン３３に対して適正な位置にあるか否か確認する検査について説明する。
　上記のように構成されるフレキシブル導電路１０は、天板部４１に形成された開口部４７を利用して、ランドパターン３３への端子４０の取り付けが適正か否か確認することができる。上述したように、端子４０には、ランドパターン３３上に配置された状態において、配線板２０に設けられた目印３５を上側（配線板２０とは反対側）から視認可能な開口部４７が設けられている。そのため、フレキシブル導電路１０は、開口部４７を介して目印３５を見ることで、目印３５を指標にして端子４０のランドパターン３３に対する位置を把握することができる。端子４０は、底板部４２の先端部４９がランドパターン３３の後端部３６付近に位置する状態（図２、図７参照）で、上側から見て開口部４７の開口領域内に目印３５が位置すること（図７に示す状態）を確認できた場合に、ランドパターン３３に対する端子４０の位置が適正であると判断することができる。 Next, an inspection for confirming whether or not the terminal 40 is in the proper position with respect to the land pattern 33 will be described.
In the flexible conductive path 10 configured as described above, it is possible to confirm whether the terminal 40 is properly attached to the land pattern 33 by utilizing the opening 47 formed in the top plate portion 41. As described above, the terminal 40 is provided with the opening 47 through which the mark 35 provided on the wiring board 20 can be viewed from the upper side (the side opposite to the wiring board 20) when the terminal 40 is arranged on the land pattern 33. Has been. Therefore, the flexible conductive path 10 can grasp the position of the terminal 40 with respect to the land pattern 33 by using the mark 35 as an index by looking at the mark 35 through the opening 47. The terminal 40 has a mark 35 in the opening region of the opening 47 when viewed from above in a state where the tip 49 of the bottom plate 42 is located near the rear end 36 of the land pattern 33 (see FIGS. 2 and 7). When it can be confirmed that the terminal 40 is located (the state shown in FIG. 7), it can be determined that the position of the terminal 40 with respect to the land pattern 33 is proper.
　また、フレキシブル導電路１０は、天板部４１に形成された開口部４７を利用して、ランドパターン３３と底板部４２の間の半田５０の濡れ広がりが適正か否か確認することができる。具体的には、半田５０の濡れ広がりは、フィレットＦの位置を確認して判断することができる。例えば、底板部４２の縁部４８にフィレットＦが沿う状態（下方に位置する状態）では、ランドパターン３３と底板部４２との間の半田５０が、内側から底板部４２の縁部４８まで濡れ広がっていることが想定される。図８に示す本第１実施形態のフレキシブル導電路１０は、上側から見て、底板部４２の縁部４８に沿ったフィレットＦが、開口部４７の開口領域内に位置する構成であるため、上側から開口部４７を介してフィレットＦを視認することができる。したがって、フレキシブル導電路１０は、開口部４７を介してフィレットＦを見ることで、半田５０がランドパターン３３と底板部４２との間で適正に濡れ広がっていると判断することができる。 In addition, the flexible conductive path 10 can confirm whether the spread of the solder 50 between the land pattern 33 and the bottom plate portion 42 is proper by utilizing the opening 47 formed in the top plate portion 41. Specifically, the wet spread of the solder 50 can be determined by checking the position of the fillet F. For example, in a state where the fillet F is along the edge portion 48 of the bottom plate portion 42 (a state in which the fillet F is located below), the solder 50 between the land pattern 33 and the bottom plate portion 42 gets wet from the inside to the edge portion 48 of the bottom plate portion 42. It is supposed to be spreading. Since the flexible conductive path 10 according to the first exemplary embodiment shown in FIG. 8 has a configuration in which the fillet F along the edge portion 48 of the bottom plate portion 42 is located in the opening region of the opening portion 47 when viewed from above, The fillet F can be visually recognized from the upper side through the opening 47. Therefore, by looking at the fillet F through the opening 47 in the flexible conductive path 10, it can be determined that the solder 50 has spread properly between the land pattern 33 and the bottom plate portion 42.
　以上のように、本実施例１のフレキシブル導電路１０には、ランドパターン３３上に配置された状態において、配線板２０に設けられた目印３５を配線板２０とは反対側から視認可能な開口部４７が設けられている。そのため、フレキシブル導電路１０は、開口部４７を介して目印３５を見ることで、目印３５を指標にして端子４０のランドパターン３３に対する位置を把握することができる。したがって、フレキシブル導電路１０は、ランドパターン３３に対する端子４０の位置が適正か検査することができる。 As described above, in the flexible conductive path 10 of the first embodiment, the mark 35 provided on the wiring board 20 in the state of being arranged on the land pattern 33 can be visually recognized from the side opposite to the wiring board 20. A section 47 is provided. Therefore, the flexible conductive path 10 can grasp the position of the terminal 40 with respect to the land pattern 33 by using the mark 35 as an index by looking at the mark 35 through the opening 47. Therefore, the flexible conductive path 10 can be inspected for proper position of the terminal 40 with respect to the land pattern 33.
　また、端子４０は、ランドパターン３３に半田付けされる底板部４２を具備している。上側（配線板２０とは反対側）から見て、底板部４２の縁部４８に沿ったフィレットＦが、開口部４７の開口領域内に位置している。
　このように、フレキシブル導電路１０は、配線板２０とは反対側から見て、底板部４２の縁部４８に沿ったフィレットＦが、開口部４７の開口領域内に位置する構成であるため、配線板２０とは反対側から開口部４７を介してフィレットＦを視認することができる。底板部４２の縁部４８にフィレットＦが沿う状態では、ランドパターン３３と底板部４２との間の半田５０が、内側から底板部４２の縁部４８まで濡れ広がっていることが想定される。そのため、フレキシブル導電路１０は、開口部４７を介してフィレットＦを見ることで、半田５０がランドパターン３３と底板部４２との間で適正に濡れ広がっているか否か検査することができる。 The terminal 40 also includes a bottom plate portion 42 that is soldered to the land pattern 33. When viewed from the upper side (the side opposite to the wiring board 20), the fillet F along the edge portion 48 of the bottom plate portion 42 is located in the opening region of the opening portion 47.
As described above, in the flexible conductive path 10, the fillet F along the edge portion 48 of the bottom plate portion 42 is located in the opening region of the opening portion 47 when viewed from the side opposite to the wiring board 20, The fillet F can be viewed through the opening 47 from the side opposite to the wiring board 20. When the fillet F is along the edge 48 of the bottom plate portion 42, it is assumed that the solder 50 between the land pattern 33 and the bottom plate portion 42 is wet and spread from the inside to the edge portion 48 of the bottom plate portion 42. Therefore, the flexible conductive path 10 can be inspected by seeing the fillet F through the opening 47 to see if the solder 50 is properly wet and spread between the land pattern 33 and the bottom plate portion 42.
　また、端子４０は、底板部４２と天板部４１の一部とを対向させた形態の角筒部４４を具備している。底板部４２は、ランドパターン３３に半田付けされている。天板部４１には、開口部４７が形成されている。
　これによれば、端子４０は、角筒部４４を具備することで、強度及び剛性を確保することができる。 Further, the terminal 40 includes a rectangular tube portion 44 in which the bottom plate portion 42 and a part of the top plate portion 41 are opposed to each other. The bottom plate portion 42 is soldered to the land pattern 33. An opening 47 is formed in the top plate portion 41.
According to this, since the terminal 40 is provided with the rectangular tube portion 44, strength and rigidity can be secured.
　また、配線板２０は、絶縁シート２２と、絶縁シート２２から露出するランドパターン３３と、を有する。目印３５は、絶縁シート２２の一部を切り欠くことで形成されている。
　これによれば、目印３５は、絶縁シート２２の一部を切り欠く加工によって、簡単に形成することができる。また、目印３５は、突起状である場合に比べ、変形し難く、配線板２０の小型化を図ることができる。 The wiring board 20 also includes an insulating sheet 22 and a land pattern 33 exposed from the insulating sheet 22. The mark 35 is formed by cutting out a part of the insulating sheet 22.
According to this, the mark 35 can be easily formed by notching a part of the insulating sheet 22. Further, the mark 35 is less likely to be deformed than in the case where it has a projection shape, and the wiring board 20 can be downsized.
　＜実施例２＞
　次に、本開示の実装部品の取付け構造を具体化した実施例２を、図１０～図１４を参照して説明する。本実施例２の端子４０の取付け構造は、端子４０を取り付ける取付対象部材の構成を上記実施例１とは異なる構成としたものである。その他の構成については上記実施例１と同じであるため、同じ構成については、同一符号を付し、構造、作用及び効果の説明は省略する。 <Example 2>
Next, a second embodiment in which the mounting structure for mounting components according to the present disclosure is embodied will be described with reference to FIGS. 10 to 14. In the mounting structure of the terminal 40 of the second embodiment, the structure of the mounting target member for mounting the terminal 40 is different from that of the first embodiment. Since the other configurations are the same as those in the first embodiment, the same reference numerals are given to the same configurations, and the description of the structure, operation, and effect is omitted.
　電子装置２１０は、図１０に示すように、回路基板２２０と、回路基板２２０に実装される端子４０と、を備えている。回路基板２２０は、本発明の「取付対象部材」の一例に相当する。電子装置２１０は、例えば上下に分割可能なコネクタハウジング（図示略）に組み付けられて、コネクタ（図示略）を構成する。 As shown in FIG. 10, the electronic device 210 includes a circuit board 220 and terminals 40 mounted on the circuit board 220. The circuit board 220 corresponds to an example of the “member to be attached” of the present invention. The electronic device 210 is assembled in, for example, a vertically separable connector housing (not shown) to form a connector (not shown).
　回路基板２２０は、図１０、図１１に示すように、例えば矩形平板状をなす硬質のリジッド基板である。回路基板２２０は、絶縁材料で形成され、上面に導体の配線パターンであるランドパターン２３３が複数形成されている。ランドパターン２３３は、回路基板２２０の一側の端部２２３に沿って所定間隔をおいて並列した状態で配列されている。ランドパターン２３３は、例えば銅箔によって形成されている。 As shown in FIGS. 10 and 11, the circuit board 220 is a rigid rigid board having a rectangular flat plate shape, for example. The circuit board 220 is made of an insulating material and has a plurality of land patterns 233, which are conductor wiring patterns, formed on the upper surface thereof. The land patterns 233 are arranged in parallel along an end 223 on one side of the circuit board 220 at a predetermined interval. The land pattern 233 is formed of, for example, copper foil.
　回路基板２２０には、図１１、図１２に示すように、目印２３５が設けられている。目印２３５は、ランドパターン２３３に対する端子４０の位置を把握する指標となる。目印２３５は、例えば、三角形状の図形であり、回路基板２２０の上面に印刷されている。目印２３５は、回路基板２２０の上面において、ランドパターン２３３の端部２２３側の端部に隣接する位置（端部２２３とランドパターン２３３の間の位置）に形成されている。 As shown in FIGS. 11 and 12, the circuit board 220 is provided with a mark 235. The mark 235 serves as an index for grasping the position of the terminal 40 with respect to the land pattern 233. The mark 235 is, for example, a triangular figure, and is printed on the upper surface of the circuit board 220. The mark 235 is formed on the upper surface of the circuit board 220 at a position adjacent to the end of the land pattern 233 on the end 223 side (a position between the end 223 and the land pattern 233).
　端子４０は、実施例１の端子４０と同じ構成であり、図１２～図１４に示すように、回路基板２２０に実装されている。具体的には、底板部４２は、回路基板２２０のランドパターン２３３に半田付けによって接合されている。角筒部４４は、図１１、図１２に示すように、ランドパターン２３３を上方から覆っている。 The terminal 40 has the same configuration as the terminal 40 of the first embodiment, and is mounted on the circuit board 220 as shown in FIGS. 12 to 14. Specifically, the bottom plate portion 42 is joined to the land pattern 233 of the circuit board 220 by soldering. As shown in FIGS. 11 and 12, the rectangular tube portion 44 covers the land pattern 233 from above.
　底板部４２の先端部４９は、図１１、図１２に示すように、ランドパターン２３３の後端部（後端部２３６という）よりも僅かに前方に位置している。底板部４２の縁部４８は、図１２に示すように、目印２３５の後端よりも僅かに後方に位置している。目印２３５は、開口部４７の下方に位置している。すなわち、目印２３５は、図１２～図１４に示すように、上側（回路基板２２０とは反対側）から見て、開口部４７の開口領域内に位置している。これにより、端子４０は、ランドパターン２３３上に配置された状態において、目印２３５を上側から開口部４７を介して視認可能になっている。このように、端子４０は、底板部４２の先端部４９がランドパターン２３３の後端部２３６付近に位置するとともに、上側から見て開口部４７の開口領域内に目印２３５が位置する状態で、ランドパターン２３３に対する適正位置となる。 As shown in FIGS. 11 and 12, the tip 49 of the bottom plate 42 is located slightly forward of the rear end of the land pattern 233 (referred to as the rear end 236). As shown in FIG. 12, the edge portion 48 of the bottom plate portion 42 is located slightly rearward of the rear end of the mark 235. The mark 235 is located below the opening 47. That is, as shown in FIGS. 12 to 14, the mark 235 is located in the opening region of the opening 47 when viewed from the upper side (the side opposite to the circuit board 220). As a result, the terminal 40 can visually recognize the mark 235 from the upper side through the opening 47 in the state where the terminal 40 is arranged on the land pattern 233. As described above, in the terminal 40, with the front end portion 49 of the bottom plate portion 42 located near the rear end portion 236 of the land pattern 233, and the mark 235 located in the opening region of the opening portion 47 when viewed from above, It is an appropriate position with respect to the land pattern 233.
　半田５０は、図１３、図１４に示すように、ランドパターン２３３と底板部４２の間に介在している。半田５０は、ランドパターン２３３と底板部４２の間で濡れ広がっている。半田５０には、図１３に示すように、底板部４２の縁部４８の下方においてフィレットＦが形成されている。 The solder 50 is interposed between the land pattern 233 and the bottom plate portion 42, as shown in FIGS. 13 and 14. The solder 50 wets and spreads between the land pattern 233 and the bottom plate portion 42. As shown in FIG. 13, a fillet F is formed on the solder 50 below the edge portion 48 of the bottom plate portion 42.
　次に、端子４０がランドパターン２３３に対して適正な位置にあるか否か確認する検査について説明する。
　電子装置２１０は、実施例１のフレキシブル導電路１０と同様に、天板部４１に形成された開口部４７を利用して、ランドパターン２３３への端子４０の取り付けが適正か否か確認することができる。電子装置２１０は、開口部４７を介して目印２３５を見ることで、目印２３５を指標にして端子４０のランドパターン２３３に対する位置を把握することができる。端子４０は、底板部４２の先端部４９がランドパターン２３３の後端部２３６付近に位置する状態（図１１、図１２参照）で、上側から見て開口部４７の開口領域内に目印２３５が位置すること（図１２に示す状態）を確認できた場合に、ランドパターン２３３に対する端子４０の位置が適正であると判断することができる。 Next, an inspection for confirming whether or not the terminal 40 is in the proper position with respect to the land pattern 233 will be described.
Similar to the flexible conductive path 10 of the first embodiment, the electronic device 210 uses the opening 47 formed in the top plate portion 41 to check whether the terminal 40 is properly attached to the land pattern 233. You can By looking at the mark 235 through the opening 47, the electronic device 210 can grasp the position of the terminal 40 with respect to the land pattern 233 using the mark 235 as an index. The terminal 40 has a mark 235 in the opening area of the opening 47 when viewed from above, with the tip 49 of the bottom plate 42 positioned near the rear end 236 of the land pattern 233 (see FIGS. 11 and 12). If it can be confirmed that the terminal 40 is located (the state shown in FIG. 12), it can be determined that the position of the terminal 40 with respect to the land pattern 233 is appropriate.
　また、電子装置２１０は、天板部４１に形成された開口部４７を利用して、ランドパターン２３３と底板部４２の間の半田５０の濡れ広がりが適正か否か確認することができる。図１３に示す本第２実施形態の電子装置２１０は、上側から見て、底板部４２の縁部４８に沿ったフィレットＦが、開口部４７の開口領域内に位置する構成であるため、上側から開口部４７を介してフィレットＦを視認することができる。したがって、電子装置２１０は、開口部４７を介してフィレットＦを見ることで、半田５０がランドパターン２３３と底板部４２との間で適正に濡れ広がっていると判断することができる。 Further, the electronic device 210 can confirm whether or not the wet spread of the solder 50 between the land pattern 233 and the bottom plate portion 42 is appropriate by utilizing the opening 47 formed in the top plate portion 41. The electronic device 210 of the second embodiment shown in FIG. 13 has a configuration in which the fillet F along the edge portion 48 of the bottom plate portion 42 is located within the opening region of the opening portion 47 when viewed from above, The fillet F can be visually recognized from the opening 47. Therefore, by looking at the fillet F through the opening 47, the electronic device 210 can determine that the solder 50 is properly wet and spread between the land pattern 233 and the bottom plate portion 42.
［本開示の他の実施形態］
　今回開示された実施の形態はすべての点で例示であって制限的なものではないと考えるべきである。例えば、以下の実施形態を採用することができる。
　（１）上記実施例１，２では、天板部４１の開口部４７は、角筒部４４と連結部４５を跨る位置に形成されていたが、その他の位置にあってもよい。例えば、図１５（Ａ）に示すフレキシブル導電路３１０の開口部３４７は、連結部４５に形成されている。具体的には、開口部３４７は、連結部４５を構成する天板部４１において、角筒部４４に隣接する位置に形成されている。このような構成によっても、フレキシブル導電路３１０は、目印３５及びフィレットＦを上側から開口部３４７を介して視認可能である。
　（２）上記実施例１，２では、端子４０は、底板部４２の全体を含むように角筒部４４が構成されていたが、底板部４２の一部のみを含むように角筒部４４が構成されていてもよい。例えば、図１５（Ｂ）に示すフレキシブル導電路４１０の端子４４０は、天板部４１の一端側（図１５（Ｂ）では紙面右側）の部分と、底板部４４２の一端側（図１５（Ｂ）では紙面左側）の部分と、一対の側板部４６と、によって構成されている。
　（３）上記実施例１，２では、端子４０は、角筒部４４を備えていたが、角筒部４４を備えなくてもよい。例えば、図１５（Ｃ）に示すフレキシブル導電路５１０の端子５４０は、角筒部を構成しない底板部５４２を備えている。端子５４０は、箱部５４３と底板部５４２を連結する連結部５４５に開口部５４７が形成されている。このような構成によっても、フレキシブル導電路５１０は、目印３５及びフィレットＦを上側から開口部５４７を介して視認可能である。
　また、図１５（Ｄ）に示すフレキシブル導電路６１０の端子６４０のように、天板部６４１が半田付けされる構成であってもよい。天板部６４１には、開口部６４７が形成されている。このような構成によっても、フレキシブル導電路６１０は、目印３５及びフィレットＦを上側から開口部６４７を介して視認可能である。
　（４）上記実施例１では、端子４０の取付対象部材として、フレキシブルプリント配線板２０を例示したが、フレキシブルプリント基板であってもよい。
　（５）上記実施例１では、目印３５として、くさび状に凹む切り欠き部を例示したが、前方や上方に突出する突起部や、下方に凹む凹部や、貫通孔など、その他の構成であってもよい。
　（６）上記実施例２では、目印２３５として、回路基板２２０の上面に印刷される三角形状の図形を例示したが、ドット状など、その他の形状であってもよい。また、目印２３５は、その形状や位置が特定できるように、回路基板２２０の上面の色とは異なる色によって構成される図形であってもよい。また、目印２３５は、メッキ部分であってもよい。
　（７）上記実施例１，２では、開口部４７は、天板部４１を貫通する円形の貫通孔であったが、その他の形状であってもよく、大きさも任意に決めることができる。
　（８）上記実施例１，２では、実装部品は、端子４０以外の部品（半導体などの電子部品）であってもよい。 [Other Embodiments of the Present Disclosure]
The embodiments disclosed this time are to be considered as illustrative in all points and not restrictive. For example, the following embodiments can be adopted.
(1) In the first and second embodiments, the opening 47 of the top plate portion 41 is formed at a position that straddles the rectangular tube portion 44 and the connecting portion 45, but may be at another position. For example, the opening 347 of the flexible conductive path 310 shown in FIG. 15A is formed in the connecting portion 45. Specifically, the opening 347 is formed at a position adjacent to the square tube portion 44 in the top plate portion 41 that constitutes the connecting portion 45. Also with such a configuration, the flexible conductive path 310 can visually recognize the mark 35 and the fillet F from the upper side through the opening 347.
(2) In Embodiments 1 and 2 above, the terminal 40 has the square tubular portion 44 configured to include the entire bottom plate portion 42, but the square tubular portion 44 includes only a part of the bottom plate portion 42. May be configured. For example, the terminal 440 of the flexible conductive path 410 shown in FIG. 15B includes a portion on one end side of the top plate portion 41 (on the right side of the paper in FIG. 15B) and one end side of the bottom plate portion 442 (see FIG. ), The left side of the drawing) and a pair of side plate portions 46.
(3) In Embodiments 1 and 2 above, the terminal 40 includes the square tube portion 44, but the square tube portion 44 may not be provided. For example, the terminal 540 of the flexible conductive path 510 shown in FIG. 15C includes a bottom plate portion 542 that does not form a rectangular tube portion. The terminal 540 has an opening 547 formed in a connecting portion 545 that connects the box portion 543 and the bottom plate portion 542. Also with such a configuration, the flexible conductive path 510 can visually recognize the mark 35 and the fillet F from the upper side through the opening 547.
Alternatively, the top plate portion 641 may be soldered like the terminal 640 of the flexible conductive path 610 shown in FIG. An opening 647 is formed in the top plate portion 641. With such a configuration as well, the flexible conductive path 610 can visually recognize the mark 35 and the fillet F from the upper side through the opening 647.
(4) In the first embodiment, the flexible printed wiring board 20 is illustrated as the member to which the terminal 40 is attached, but it may be a flexible printed board.
(5) In the first embodiment, as the mark 35, a wedge-shaped recessed portion is illustrated, but other configurations such as a protrusion protruding forward and upward, a recess depressed downward, and a through hole may be used. May be.
(6) In the second embodiment, as the mark 235, a triangular figure printed on the upper surface of the circuit board 220 is illustrated, but other shapes such as a dot shape may be used. Further, the mark 235 may be a figure configured with a color different from the color of the upper surface of the circuit board 220 so that the shape and position thereof can be specified. Further, the mark 235 may be a plated portion.
(7) In Embodiments 1 and 2 above, the opening 47 is a circular through hole that penetrates the top plate portion 41, but it may have another shape and the size thereof can be arbitrarily determined.
(8) In the first and second embodiments, the mounted component may be a component (electronic component such as semiconductor) other than the terminal 40.
　１０，３１０，４１０，５１０，６１０…フレキシブル導電路
　２０…フレキシブルプリント配線板（取付対象部材）
　２１…電線
　２２…絶縁シート
　３１…配線本体
　３２…帯状部
　３３，２３３…ランドパターン
　３４…テーパ部
　３５，２３５…目印
　３６，２３６…後端部
　４０，４４０，５４０，６４０…端子
　４１，６４１…天板部
　４２，４４２，５４２…底板部（固着部）
　４２Ａ…板部
　４３，５４３…箱部
　４４…角筒部
　４５，５４５…連結部
　４６…側板部
　４７，３４７，５４７，６４７…開口部
　４８…縁部
　４９…先端部
　５０…半田
　２１０…電子装置
　２２０…回路基板（取付対象部材）
　２２３…端部
　Ｆ…フィレット 10, 310, 410, 510, 610 ... Flexible conductive path 20 ... Flexible printed wiring board (member to be attached)
21 ... Electric wire 22 ... Insulating sheet 31 ... Wiring body 32 ... Strip portion 33, 233 ... Land pattern 34 ... Tapered portion 35, 235 ... Mark 36, 236 ... Rear end 40, 440, 540, 640 ... Terminal 41, 641 ... Top plate portion 42, 442, 542 ... Bottom plate portion (fixed portion)
42A ... Plate part 43, 543 ... Box part 44 ... Square tube part 45, 545 ... Connection part 46 ... Side plate part 47, 347, 547, 647 ... Opening part 48 ... Edge part 49 ... Tip part 50 ... Solder 210 ... Electronic device 220 ... Circuit board (attachment target member)
223 ... Edge F ... Fillet

Claims (4)

  1. 　ランドパターンが設けられた取付対象部材と、
    　前記ランドパターンに半田付けされ、前記取付対象部材に実装される実装部品と、
    を備え、
    　前記取付対象部材には、目印が設けられており、
    　前記実装部品には、前記ランドパターン上に配置された状態において、前記取付対象部材とは反対側から前記目印を視認可能な開口部が設けられている実装部品の取付け構造。     A mounting target member provided with a land pattern,
    A mounting component that is soldered to the land pattern and mounted on the attachment target member,
    Equipped with
    The attachment target member is provided with a mark,
    The mounting structure for mounting the mounting component, wherein the mounting component is provided with an opening through which the mark can be visually recognized from a side opposite to the mounting target member when the mounting component is arranged on the land pattern.
  2. 　前記実装部品は、前記ランドパターンに半田付けされる固着部を具備し、
    　前記取付対象部材とは反対側から見て、前記固着部の縁部に沿ったフィレットが、前記開口部の開口領域内に位置する請求項１に記載の実装部品の取付け構造。     The mounting component includes a fixing portion that is soldered to the land pattern,
    The mounting structure for mounting components according to claim 1, wherein the fillet along the edge of the fixing portion is located within the opening region of the opening when viewed from the side opposite to the attachment target member.
  3. 　前記実装部品は、底板部の少なくとも一部と天板部の少なくとも一部とを対向させた形態の角筒部を具備し、
    　前記底板部は、前記ランドパターンに半田付けされ、
    　前記天板部には、前記開口部が形成されている請求項１又は請求項２に記載の実装部品の取付け構造。     The mounting component includes a square tube portion in which at least a part of the bottom plate portion and at least a part of the top plate portion are opposed to each other,
    The bottom plate portion is soldered to the land pattern,
    The mounting structure according to claim 1 or 2, wherein the opening is formed in the top plate portion.
  4. 　前記取付対象部材は、絶縁シートと、前記絶縁シートから露出する前記ランドパターンと、を有するフレキシブルプリント配線板であり、
    　前記目印は、前記絶縁シートの一部を切り欠くことで形成されている請求項１から請求項３のいずれか一項に記載の実装部品の取付け構造。     The attachment target member is a flexible printed wiring board having an insulating sheet and the land pattern exposed from the insulating sheet,
    The mounting structure for mounting components according to claim 1, wherein the mark is formed by cutting out a part of the insulating sheet.
PCT/JP2019/039752 2018-10-30 2019-10-09 Attachment structure for mounted component WO2020090385A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-203605 2018-10-30
JP2018203605A JP2020072134A (en) 2018-10-30 2018-10-30 Mounting structure for mounted component

Publications (1)

Publication Number Publication Date
WO2020090385A1 true WO2020090385A1 (en) 2020-05-07

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ID=70464011

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Application Number Title Priority Date Filing Date
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH054536U (en) * 1991-07-04 1993-01-22 日本メクトロン株式会社 Flexible circuit board with reinforcing plate
JPH08125396A (en) * 1994-10-26 1996-05-17 Sony Corp Electronic component for mounting and mounting of electronic component for mounting
JP2008300594A (en) * 2007-05-31 2008-12-11 Fujitsu Ltd Electronic equipment, and manufacturing method of electronic equipment
JP2017204380A (en) * 2016-05-11 2017-11-16 株式会社オートネットワーク技術研究所 Connection structure of flat wire

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH054536U (en) * 1991-07-04 1993-01-22 日本メクトロン株式会社 Flexible circuit board with reinforcing plate
JPH08125396A (en) * 1994-10-26 1996-05-17 Sony Corp Electronic component for mounting and mounting of electronic component for mounting
JP2008300594A (en) * 2007-05-31 2008-12-11 Fujitsu Ltd Electronic equipment, and manufacturing method of electronic equipment
JP2017204380A (en) * 2016-05-11 2017-11-16 株式会社オートネットワーク技術研究所 Connection structure of flat wire

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