JPS6211258A - Gaas semiconductor integrated circuit - Google Patents

Gaas semiconductor integrated circuit

Info

Publication number
JPS6211258A
JPS6211258A JP60150390A JP15039085A JPS6211258A JP S6211258 A JPS6211258 A JP S6211258A JP 60150390 A JP60150390 A JP 60150390A JP 15039085 A JP15039085 A JP 15039085A JP S6211258 A JPS6211258 A JP S6211258A
Authority
JP
Japan
Prior art keywords
fet
gate
surge
drain
input terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60150390A
Other languages
Japanese (ja)
Inventor
Ryuichiro Yamamoto
隆一郎 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP60150390A priority Critical patent/JPS6211258A/en
Publication of JPS6211258A publication Critical patent/JPS6211258A/en
Pending legal-status Critical Current

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  • Bipolar Integrated Circuits (AREA)
  • Junction Field-Effect Transistors (AREA)

Abstract

PURPOSE:To increase surge resistance by connecting a drain for a first FET to an input terminal for an active circuit at the next step and a source to a grounding terminal and each connecting a source and a gate for a second FET having the same threshold voltage to a gate and the source for the first FET by an offset gate and a drain to an input terminal. CONSTITUTION:When a polarity surge is applied to a second FET 11 from an input terminal 9, large reverse voltage is applied between a gate and a drain because the gate is grounded, previously the FET 11 is cut off, the surge is damped largely, and a FET 1 for driving is not annealed. When a negative polarity surge is applied to the terminal 9, the gate and the drain for the FET 11 are biassed in the forward direction. A space between the gate and the drain is increased and a voltage drop is generated owing to offset structure at that time, and the FET 11 is not burnt out. A signal passes through the FET 11 and is applied to a gate for the FET 1 when there is no surge. According to the constitution, the surge is damped or bypassed without damaging high-frequency characteristics, thus improving the surge-resistant performance of a GaAs IC device.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はGaAs半導体集積回路に関し、特にショット
キー障壁型のF E ’I’を基本素子としたGaAs
半導体集積回路に関する。
[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a GaAs semiconductor integrated circuit, and particularly to a GaAs semiconductor integrated circuit using a Schottky barrier type F E 'I' as a basic element.
Regarding semiconductor integrated circuits.

「従来の技術〕 GaAs半導体結晶はSj半導体結晶と比較して電子移
動度が5〜6倍大きく、高周波特性に優れていることか
ら各所で活発な研究開発が行われている。
"Prior Art" GaAs semiconductor crystals have an electron mobility 5 to 6 times higher than Sj semiconductor crystals and have excellent high frequency characteristics, so active research and development is being carried out in various places.

従来、この種のGaAs半導体集積回路は、基本素子と
して第2図に示すようなF E Tが使用され、寄生抵
抗を低減し、理想的な高周波特性を実現するために、F
ETのゲー■・電極21とオーミック電極(ソース電極
22とドレイン電極23)との距離は通常0.5〜1.
971mの値が用いられている4 〔発明が解決しようとする問題点〕 」二連した従来の(E a A s半導体集積回路は、
電極間隔を小さくして高周波特性を向上している反面、
耐サージ性能が低下するという問題があり、その改善策
として、保護抵抗を入力端子に直列に接続して耐サージ
性能の向上を実現しているが、この場合、保護抵抗は抵
抗値の大きなものが必要とされ、その結果高周波特性が
劣化するという欠点がある。
Conventionally, this type of GaAs semiconductor integrated circuit uses an FET as shown in FIG. 2 as a basic element, and in order to reduce parasitic resistance and achieve ideal high frequency characteristics,
The distance between the ET gate electrode 21 and the ohmic electrodes (source electrode 22 and drain electrode 23) is usually 0.5 to 1.
The value of 971m is used.
Although the electrode spacing is reduced and high frequency characteristics are improved,
There is a problem that surge resistance performance deteriorates, and as a solution to this problem, a protective resistor is connected in series with the input terminal to improve surge resistance performance, but in this case, the protective resistor has a large resistance value. is required, which has the disadvantage of deteriorating high frequency characteristics.

本発明の目的は、高周波特性をそこなうことなく耐サー
ジ性能を向上できるGa A S半導体集積回路を提供
することにある。
An object of the present invention is to provide a Ga AS semiconductor integrated circuit that can improve anti-surge performance without impairing high frequency characteristics.

〔問題点を解決するための手段〕[Means for solving problems]

本発明のG a 、A s半導体集積回路は、ドレイン
が次段の能動回路の入力端子に接続しソースが接地端子
に接続する第1のFETと、オフセラトゲ−1・構造で
前記第1のFETと少くとも等しいしきい電圧を有しソ
ースが前記第1のFETのゲートに接続しゲートが前記
第1のFETのソースに接続しドレインが入力端子に接
続する第2のFETとを含んで構成される。
The Ga, As semiconductor integrated circuit of the present invention includes a first FET whose drain is connected to the input terminal of the next-stage active circuit and whose source is connected to the ground terminal, and the first FET with an off-cell toggle structure. a second FET having a threshold voltage at least equal to , a source connected to the gate of the first FET, a gate connected to the source of the first FET, and a drain connected to the input terminal. be done.

〔実施例〕〔Example〕

次に、本発明の実施例について図面を参照して説明する
Next, embodiments of the present invention will be described with reference to the drawings.

第1図は本発明の一実施例を示す回路図である。FIG. 1 is a circuit diagram showing one embodiment of the present invention.

第1図において、駆動用FET (第1のFETに対応
する)1と能動負荷FET2とからなるインバータ部は
入力反転信号を発生し、ソースホロワF E T 3、
レベルシフトダイオード4、カレントソースF E T
 5からなるバッファ部は入力反転信号を次段の論理回
路に伝搬する働きをする。
In FIG. 1, an inverter section consisting of a drive FET (corresponding to the first FET) 1 and an active load FET 2 generates an inverted input signal, and the source follower FET 3,
Level shift diode 4, current source FET
The buffer section consisting of 5 serves to propagate the input inverted signal to the next stage logic circuit.

駆動用FETIのゲートには耐サージ用FET(第2の
FETに対応する)11のソースが節点1()において
接続されており、耐サージ用FET11のゲートは駆動
用FETIのソースに節点8において接続され、節点8
は接地されている。
The gate of the drive FETI is connected to the source of the anti-surge FET 11 (corresponding to the second FET) at node 1 (), and the gate of the anti-surge FET 11 is connected to the source of the drive FETI at node 8. connected, node 8
is grounded.

耐サージ用FETIIのドレインが接続する入力端子9
に極性が正の大きなサージ雑音が印加されたとする。耐
サージ用FETI 1のゲートは節点8において接地さ
れているため、耐サージ用FETIIのゲート・ドレイ
ン間には大きな逆バイアスがかかり、耐サージ用FET
IIはカヅトオフかあるいはそれに近い状態になり、サ
ージ雑音は大きく減衰し、駆動用FETIのゲート部が
焼損することはない。
Input terminal 9 to which the drain of anti-surge FET II is connected
Suppose that a large surge noise with positive polarity is applied to Since the gate of anti-surge FET 1 is grounded at node 8, a large reverse bias is applied between the gate and drain of anti-surge FET II.
II is in a state where it is turned off or close to it, the surge noise is greatly attenuated, and the gate part of the driving FETI is not burned out.

入力端子9に負極性のサージ雑音が印加されたときは、
耐サージ用FETIIのゲート・ドレイン間は順方向に
バイアスされることになり、ゲー1−には節点8を介し
て順方向電流が流れるが、耐サージ用FETIIはオフ
セット構造を有しており、ゲート・ドレイン間隔が大き
いため電圧降下が発生し、耐サージ用FETIIが焼損
するには至らない。
When negative polarity surge noise is applied to input terminal 9,
The gate and drain of the anti-surge FET II are biased in the forward direction, and a forward current flows through the gate 1- through the node 8, but the anti-surge FET II has an offset structure. Since the gate-drain distance is large, a voltage drop occurs, but the anti-surge FET II does not burn out.

また、サージ雑音が誘起されない状況では、通常の信号
は入力端子9から耐サージ用FETIIを通って、駆動
用FETIのゲートに加えられるが、耐サージ用FET
IIのオン抵抗はしきい電圧またはゲート幅を適切に選
択することにより、充分に低くすることが可能である。
In addition, in a situation where surge noise is not induced, a normal signal is applied from the input terminal 9 through the anti-surge FET II to the gate of the drive FET I, but the anti-surge FET
The on-resistance of II can be made sufficiently low by appropriately selecting the threshold voltage or gate width.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明のGaAs半導体集積回路は
、入力端子にゲート接地のFETを接続し、そのFET
のドレインを入力端子に接続することにより、高周波特
性をそこなうことなく、サージ雑音を減衰またはバイパ
スして、耐サージ性能を向上できるという効果がある。
As explained above, the GaAs semiconductor integrated circuit of the present invention has a gate-grounded FET connected to the input terminal, and the FET
By connecting the drain of the input terminal to the input terminal, there is an effect that surge noise can be attenuated or bypassed without impairing high frequency characteristics, and surge resistance performance can be improved.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例の回路図、第2図は一般的な
GaAs半導体集積回路におけるショットキー障壁型の
FETの断面図である。 1・・・駆動用FET、2・・・能動負荷FET、3・
・・ソースホロワFET、4・・・レベルシフトダイオ
ード、5・・・カレントソースF B T、6・・・負
バイアス電源、7・・・正バイアス電源、8・・・接地
点、9・・・入力端子、11・・・耐サージ用FET、
21・・・ゲート、22・・・ソース、23・・・ドレ
イン。
FIG. 1 is a circuit diagram of an embodiment of the present invention, and FIG. 2 is a sectional view of a Schottky barrier type FET in a general GaAs semiconductor integrated circuit. 1... Drive FET, 2... Active load FET, 3...
... Source follower FET, 4... Level shift diode, 5... Current source FBT, 6... Negative bias power supply, 7... Positive bias power supply, 8... Grounding point, 9... Input terminal, 11... anti-surge FET,
21...gate, 22...source, 23...drain.

Claims (1)

【特許請求の範囲】[Claims] ドレインが次段の能動回路の入力端子に接続しソースが
接地端子に接続する第1のFETと、オフセットゲート
構造で前記第1のFETと少くとも等しいしきい電圧を
有しソースが前記第1のFETのゲートに接続しゲート
が前記第1のFETのソースに接続しドレインが入力端
子に接続する第2のFETとを含むことを特徴とするG
aAs半導体集積回路。
a first FET having a drain connected to an input terminal of a next-stage active circuit and a source connected to a ground terminal; a second FET connected to the gate of the FET, a second FET having a gate connected to the source of the first FET and a drain connected to the input terminal.
aAs semiconductor integrated circuit.
JP60150390A 1985-07-08 1985-07-08 Gaas semiconductor integrated circuit Pending JPS6211258A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60150390A JPS6211258A (en) 1985-07-08 1985-07-08 Gaas semiconductor integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60150390A JPS6211258A (en) 1985-07-08 1985-07-08 Gaas semiconductor integrated circuit

Publications (1)

Publication Number Publication Date
JPS6211258A true JPS6211258A (en) 1987-01-20

Family

ID=15495943

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60150390A Pending JPS6211258A (en) 1985-07-08 1985-07-08 Gaas semiconductor integrated circuit

Country Status (1)

Country Link
JP (1) JPS6211258A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH054536U (en) * 1991-07-04 1993-01-22 日本メクトロン株式会社 Flexible circuit board with reinforcing plate
JP2009033637A (en) * 2007-07-30 2009-02-12 Panasonic Corp Level conversion circuit

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5181579A (en) * 1975-01-16 1976-07-16 Hitachi Ltd
JPS551142A (en) * 1978-06-19 1980-01-07 Nec Corp Semiconductor with protector

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5181579A (en) * 1975-01-16 1976-07-16 Hitachi Ltd
JPS551142A (en) * 1978-06-19 1980-01-07 Nec Corp Semiconductor with protector

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH054536U (en) * 1991-07-04 1993-01-22 日本メクトロン株式会社 Flexible circuit board with reinforcing plate
JP2009033637A (en) * 2007-07-30 2009-02-12 Panasonic Corp Level conversion circuit

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