JPH02230787A - Printed wiring board - Google Patents

Printed wiring board

Info

Publication number
JPH02230787A
JPH02230787A JP5103789A JP5103789A JPH02230787A JP H02230787 A JPH02230787 A JP H02230787A JP 5103789 A JP5103789 A JP 5103789A JP 5103789 A JP5103789 A JP 5103789A JP H02230787 A JPH02230787 A JP H02230787A
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
line
along
router
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5103789A
Other languages
Japanese (ja)
Inventor
Yuichi Sato
雄一 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP5103789A priority Critical patent/JPH02230787A/en
Publication of JPH02230787A publication Critical patent/JPH02230787A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0097Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards

Landscapes

  • Structure Of Printed Boards (AREA)

Abstract

PURPOSE:To easily enable sectioning and separating along a specified outer- shape-process-line in the case of cutting-OFF by bending, by forming a v-shaped groove along the outer-shape-process-line in a printed wiring board main region, which groove interposes between router slits and combines temporarily the wiring board main region and the outer-shape-process-region. CONSTITUTION:Along an outer-shape-process-line 3a between a printed wiring board main region 3 and a non-circuit-forming region 4, the cutting edge of a punch blade for forming a v-shaped groove 2a is made to abut and pressed, thereby forming a specified v-shaped groove 2a. Along the outer-shape- process-line 3a, the cutting edge of a punch blade for forming a router slit 1 is made to abut on a specified position and pressed, and a specified router slit 1 is formed by punching process using a metal mold press. Hence, in the case of separating by bending, easy sectioning and separating along the specified outer-shape-process-line are enabled.

Description

【発明の詳細な説明】 [発明の目的] (産業上の利用分野) 本発明はプリント配線基板に係り、特にプリント配線基
板本体領域と被外形加工領域とを区画切離するためのル
ータスリットおよびV溝を有するプリント配線基板の改
良に関する。
[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to a printed wiring board, and particularly to a router slit and The present invention relates to an improvement of a printed wiring board having a V-groove.

(従来の技術) 周知のようにプリント配線基板は、その製造過程やプリ
ント配線基板に対する電子部品の実装過程tどにおける
プリント配線基板の保持(支持)や位置出しなどを目的
として周辺に非回路形成部を備えている。しかして、こ
の非回路形成部は前記のような役割を果した後プリント
配線基板本体領域と切離される(外形加工)。また、こ
のプリント配線基板本体領域の切離しは、多面取りプリ
ント配線基板の製造過程でもよく行なわれている。
(Prior Art) As is well known, printed wiring boards have non-circuits formed around them for the purpose of holding (supporting) and positioning the printed wiring board during the manufacturing process and the mounting process of electronic components on the printed wiring board. It has a department. After this non-circuit forming part has fulfilled its role as described above, it is separated from the main body area of the printed wiring board (outline processing). Moreover, this separation of the printed wiring board main body region is often performed in the manufacturing process of multi-sided printed wiring boards.

ところで、上記プリント配線基板本体領域の切離しを比
較的容易に行ない得るようにたとえば、第3図に平面的
に示めす如く、所定の区画部にルータスリット1および
ミシン目2を形設してある。
By the way, in order to relatively easily separate the main body region of the printed wiring board, router slits 1 and perforations 2 are formed in predetermined partitions, as shown in plan in FIG. 3, for example. .

つまり、所要の外形加工を施しプリント配線基板本体領
域3同志もしくはプリント配線基板本体領域3と非回路
形成部4とを切離す部分5に、予めルータスリット1お
よびミシン目2を形設しておき、この部分5を折曲げな
どすることによって容易に切離し、所要の外形加工など
を行い得るようにしてある。
In other words, the router slit 1 and the perforation 2 are formed in advance in the portion 5 where the printed wiring board body area 3 is separated from the printed wiring board body area 3 or the printed wiring board body area 3 and the non-circuit forming portion 4 by performing the required external processing. This portion 5 can be easily separated by bending, etc., so that required external processing can be performed.

(発明が解決しようとする課題) しかし、上記プリント配線基板の場合には次のような不
都合がある。すなわち、外形加工乃至切離のため、前記
切離し部分5(ルータスリット1およびミシン目2形設
部分)を折曲げて切離しする場合、ミシン目2形設部分
の切離し面が凹凸化する。つまり、被外形加工線に沿っ
て直線的に切離せずに、ミシン目2形設部分では凹凸化
しており、寸法精度が損われと言う問題がある。上記ミ
シン目2形設部分での凹凸化を回避する手段として、切
離し部分5に■溝を形設しておくことも知られているが
、前記切離し部分5が曲線状などで複雑な場合には、■
溝の形設加工が事実上困難で適用し難い。
(Problems to be Solved by the Invention) However, the above printed wiring board has the following disadvantages. That is, when the separation portion 5 (router slit 1 and perforation 2 forming portion) is bent and separated for external processing or separation, the separation surface of the perforation 2 forming portion becomes uneven. In other words, there is a problem that the part cannot be cut linearly along the line to be processed, and the part where the second perforation is formed is uneven, resulting in a loss of dimensional accuracy. As a means to avoid unevenness at the part where the perforation 2 is formed, it is also known to form a groove in the cut-off part 5. is ■
It is difficult to form grooves and is therefore difficult to apply.

[発明の構成] (課題を解決するための手段) 本発明は上記事情に対処してなされたもので、プリント
配線基板本体領域の周辺に配設されている被外形加工領
域とを区画切離するためのルータスリットおよびV溝を
有するプリント配線基板において、前記V溝を少なくと
もプリント配線基板本体領域の被外形加工線に沿ってそ
れぞれ形設したことを特徴とするものである。
[Structure of the Invention] (Means for Solving the Problems) The present invention has been made in response to the above-mentioned circumstances, and is designed to separate the printed wiring board main body area from the area to be processed into external shapes, which is disposed around the printed wiring board main body area. In the printed wiring board having a router slit and a V-groove, the V-groove is formed at least along a line to be processed in the outer shape of the main body region of the printed wiring board.

(作 用) 本発明によれば、ルータスリット間に介在して配線基板
本体領域と被外形加工領域とを一時的に結合し一体化す
る役割を成すV溝を少なくともプリント配線基板本体領
域の被外形加工線に沿ってそれぞれ形設してある。この
ためたとえば、折曲げにより切離した場合、所定の被外
形加工線に沿って容易に区画.切離する。
(Function) According to the present invention, at least the V-groove, which is interposed between the router slits and serves to temporarily connect and integrate the wiring board main body region and the region to be externally processed, is formed on the printed wiring board main body region. They are each formed along the outer processing line. Therefore, for example, when cut by bending, it can be easily partitioned along a predetermined outline processing line. Separate.

(実施例) 以下第1図および第2図を参照して本発明の実施例を説
明する。第1図は本発明に係るプリント配線基板を平面
的に、また第2図は第1図A−A線に沿って断面的にそ
れぞれ示したもので、3はプリント配線基板本体領,域
、4はこのプリント配線基板本体領域3の周辺に配設さ
れている被外形加工領域乃至非回路形成領域である。ま
た、5は前記プリント配線基板本体領域3と被外形加工
領域など4とを区画切離するためのルータスリット1お
よびV溝2aから成る切離部分である。しかして、前記
■溝2aは少なくともプリント配線基板本体領域3の被
外形加工線3aに沿ってそれぞれ形設されている。つま
り、プリント配線基板本体領域3の周辺が非回路形成領
域4の場合には、ルータスリット間に、前記プリント配
線基板本体領域3の被外形加工線3aに沿って一条のV
溝2aが片面もしくは両面に、またプリント配線基板本
体領域3が多面的に形成されている場合には、ルータス
リット間に、それぞれプリント配線基板本体領域3の被
外形加工線3aに沿って二条のV溝2aが片面もし《は
両面に設けられた構成を成している。
(Example) An example of the present invention will be described below with reference to FIGS. 1 and 2. FIG. 1 shows a printed wiring board according to the present invention in plan view, and FIG. 2 shows a cross-sectional view along the line A-A in FIG. Reference numeral 4 denotes an area to be processed for external shape or a non-circuit forming area, which is arranged around the main body area 3 of the printed wiring board. Further, reference numeral 5 denotes a separation portion consisting of a router slit 1 and a V-groove 2a for partitioning and separating the printed wiring board main body region 3 and the region 4 to be processed into external shapes. Thus, the grooves 2a are formed at least along the contour processing line 3a of the printed wiring board main body region 3. That is, when the periphery of the printed wiring board main body region 3 is a non-circuit forming region 4, a single V is formed between the router slits along the contour processing line 3a of the printed wiring board main body region 3.
If the groove 2a is formed on one side or both sides, or if the printed wiring board main body area 3 is formed on multiple sides, two strips are formed between the router slits along the contour processing line 3a of the printed wiring board main body area 3. The V-groove 2a is provided on one side and on both sides.

なお、上記構成のプリント配線基板はたとえば、次のよ
うにして製造しうる。すなわち、所要の回路パターンを
形成した後、その所要の回路パターンを備えたプリント
配線基板本体領域3同志の間、もしくはプリント配線基
板本体領域3と非回路形成領域4との間の被外形加工線
3aに沿い、所定の位置にV溝2a形設用のポンチ刃の
刃先を対接し加圧して所定のV溝2aを形設する一方、
同じく前記被外形加工線3aに沿い、所定の位置にルー
タスリット1形設用のポンチ刃の刃先を対接し金型ブレ
スにより打抜き加工しt所定のルータスリット1を形設
することによって容易に製造できる。
Note that the printed wiring board having the above configuration can be manufactured, for example, as follows. That is, after forming the required circuit pattern, the line to be processed is formed between the printed wiring board main body regions 3 having the required circuit pattern, or between the printed wiring board main body region 3 and the non-circuit forming region 4. 3a, the cutting edge of a punch blade for forming the V-groove 2a is brought into contact with the predetermined position and pressurized to form the predetermined V-groove 2a.
Similarly, along the contour processing line 3a, the cutting edge of a punch blade for forming the router slit 1 is brought into contact with a predetermined position, and punching is performed using a mold press to form a predetermined router slit 1, thereby easily manufacturing. can.

[発明の効果] プリント配線基板本体領域の周辺に配設されている被外
形加工領域とを区画切離するためのルータスリットおよ
びV溝を有するプリント配線基板において、前記V溝を
少なくともプリント配線基板本体領域の被外形加工線に
沿ってそれぞれ形設してある。つまり、区画切離し部分
の一部を成すルータスリット間に介在して配線基板本体
領域と被外形加工領域とを結合し一時的に一体性を保持
する役割を成すV溝が少なくともプリント配線基板本体
領域の被外形加工線に沿ってそれぞれ形設してある。こ
のためたとえば、折曲げにより切離した場合、所定の被
外形加工線に沿って直線的かつ、容易に区画,切離すこ
とが可能となる。すなわち、プリント配線基板の区画切
離し部分に凹凸などのない(直線的な)寸法精度の良好
なものに常に切断.分離できる。
[Effects of the Invention] In a printed wiring board having a router slit and a V-groove for partitioning and separating a region to be processed into an external shape disposed around a main body region of the printed wiring board, the V-groove is formed at least in the printed wiring board. They are formed along the contour line of the main body area. In other words, the V-groove, which is interposed between the router slits forming a part of the section separation part and serves to connect the wiring board main body area and the area to be processed and temporarily maintain the integrity, is at least in the printed wiring board main body area. They are each formed along the contour line to be machined. For this reason, for example, when cutting by bending, it becomes possible to partition and separate easily and linearly along a predetermined outline processing line. In other words, the printed wiring board is always cut into pieces with good dimensional accuracy (straight lines) with no unevenness in the section separation area. Can be separated.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明に係るプリント配線基板の構成例を示め
す平面図、第2図は第1図A−A線に沿った断面図、第
3図は従来のプリント配線基板の構成例を示めす平面図
である。 1・・・ルータスリット 2a・・・V溝 3・・・プリント配線基板本体領域 4・・・被外形加工領域 5・・・切離し部分 出願人     株式会社 東芝 代理人 弁理士 須 山 佐 一
FIG. 1 is a plan view showing an example of the configuration of a printed wiring board according to the present invention, FIG. 2 is a sectional view taken along the line A-A in FIG. 1, and FIG. 3 is an example of the configuration of a conventional printed wiring board. FIG. 1... Router slit 2a... V groove 3... Printed wiring board main body area 4... Outer shape processing area 5... Separated portion Applicant Toshiba Corporation Agent Patent attorney Saichi Suyama

Claims (1)

【特許請求の範囲】 プリント配線基板本体領域と、このプリント配線基板本
体領域の周辺に配設されている被外形加工領域と、前記
プリント配線基板本体領域と被外形加工領域とを区画切
離するためのルータスリットおよびV溝を有し、 前記V溝は少なくともプリント配線基板本体領域の被外
形加工線に沿ってそれぞれ形設されていることを特徴と
するプリント配線基板。
[Scope of Claims] A printed wiring board main body region, a region to be processed for contouring arranged around the printed wiring board main body region, and a section and separation between the printed wiring board main body region and the region to be processed for external shape. 1. A printed wiring board, comprising a router slit and a V-groove, the V-grooves being formed at least along contour processing lines in a main body region of the printed wiring board.
JP5103789A 1989-03-03 1989-03-03 Printed wiring board Pending JPH02230787A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5103789A JPH02230787A (en) 1989-03-03 1989-03-03 Printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5103789A JPH02230787A (en) 1989-03-03 1989-03-03 Printed wiring board

Publications (1)

Publication Number Publication Date
JPH02230787A true JPH02230787A (en) 1990-09-13

Family

ID=12875605

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5103789A Pending JPH02230787A (en) 1989-03-03 1989-03-03 Printed wiring board

Country Status (1)

Country Link
JP (1) JPH02230787A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100361682B1 (en) * 2000-04-24 2002-11-22 봉문근 Cutting Method of Print Circuit Board
CN112188744A (en) * 2020-10-29 2021-01-05 惠州市特创电子科技有限公司 Circuit board and processing method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100361682B1 (en) * 2000-04-24 2002-11-22 봉문근 Cutting Method of Print Circuit Board
CN112188744A (en) * 2020-10-29 2021-01-05 惠州市特创电子科技有限公司 Circuit board and processing method thereof

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