JPH0513516Y2 - - Google Patents
Info
- Publication number
- JPH0513516Y2 JPH0513516Y2 JP7948987U JP7948987U JPH0513516Y2 JP H0513516 Y2 JPH0513516 Y2 JP H0513516Y2 JP 7948987 U JP7948987 U JP 7948987U JP 7948987 U JP7948987 U JP 7948987U JP H0513516 Y2 JPH0513516 Y2 JP H0513516Y2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- printed wiring
- wiring board
- pores
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011148 porous material Substances 0.000 claims description 26
- 238000003825 pressing Methods 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims description 5
- 238000004080 punching Methods 0.000 claims description 3
- 230000000414 obstructive effect Effects 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002131 composite material Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Structure Of Printed Boards (AREA)
Description
【考案の詳細な説明】
（産業上の利用分野）
この考案はプリント配線基板の金型に関し、詳
しくは電子機器に組み付ける際に、不要部分又は
邪魔となる部分を割つて切断する場合、もしくは
部品の自動挿入率向上の為、小物基盤の集合化を
図り組立て時に分割する切断が可能なプリント配
線基板をプレス加工によつて一体成形するプリン
ト配線基板の金型に関する。[Detailed description of the invention] (Industrial application field) This invention relates to molds for printed wiring boards, specifically when cutting out unnecessary or obstructive parts when assembling them into electronic equipment, or when cutting out parts that are unnecessary or obstructive. This invention relates to a printed wiring board mold for integrally molding a printed wiring board that can be cut into parts during assembly by gathering small parts in order to improve the automatic insertion rate.
（従来の技術）
プリント配線基板は、主として銅箔を表面に有
する積層板からなり、一般にはプレス加工により
方形に形成されているが、最近の電子機器の高密
度実装の進展によつて、その不要部分又は邪魔と
なる部分を割つて切断し、もしくは部品の自動挿
入率向上の為、小物基盤の集合化を図り組立て時
に分割して切断し、電子機器に組み付けるときに
所定の形状にして組み付けを容易に行なうものが
ある。(Prior art) Printed wiring boards are mainly made of laminates with copper foil on the surface, and are generally formed into a rectangular shape by press working. However, with the recent progress in high-density packaging of electronic devices, Split and cut unnecessary parts or parts that get in the way, or collect small parts to improve the automatic insertion rate of parts, divide and cut them at the time of assembly, and then assemble them into the specified shape when assembling them into electronic equipment. There are some things that can be done easily.
このプリント配線基板の一例を第７図に示す
と、積層板１００の所定箇所にスリツト１０１が
接続部１０２を残して形成されており、これによ
り分割可能な部分１０３が設けられ、スリツト間
の接続部１０２には細孔１０４が連続して線状に
複数形成されている。このプリント配線基板には
チツプ部品等が接続され、その後、これを電子機
器に組み込むときに、その取付けスペースに応じ
て、不要又は邪魔になる部分１０３を手で折つて
切断し、限られたスペースでも容易に組み付けら
れるようにし、高密度実装を可能にしている。 An example of this printed wiring board is shown in FIG. 7. Slits 101 are formed at predetermined locations on a laminated board 100, leaving connecting portions 102. This provides a divisible portion 103, and connects the slits. A plurality of pores 104 are continuously formed in a linear shape in the portion 102 . Chip parts, etc. are connected to this printed wiring board, and then, when incorporating this into an electronic device, unnecessary or obstructive parts 103 are manually folded and cut according to the installation space to save space. However, it is easy to assemble and enables high-density mounting.
（考案が解決しようとする問題点）
ところで、このプリント配線基板は雄型と雌型
とからなる金型で、プレス加工によつて形成され
ているが、接続部１０２に形成された細孔１０４
は、積層板１をプレス加工によつて成形すると
き、スリツト１０１や他の電子部品のリード線等
を挿入する図示しない孔と同時に形成され、この
細孔１０４間のピツチＰが積層板１の厚さと同じ
程度以上であると、手で割れ難い。従つて、第８
図に示すように、ピツチＰを狭くする必要がある
が、このようにピツチＰを狭くすると、プレス加
工によつて形成するときにクラツクが入り、電子
部品のリード線を挿入する孔と同時に形成するこ
とが困難なため、金型によるプレス加工とは別な
工程でドリル等によつて形成する必要があり、製
作コストが嵩む一原因となつている。(Problems to be Solved by the Invention) By the way, this printed wiring board is formed by press working with a mold consisting of a male mold and a female mold, but the pores 104 formed in the connecting portion 102
are formed at the same time as holes (not shown) into which slits 101 and lead wires of other electronic components are inserted, when the laminate 1 is formed by press working, and the pitch P between the pores 104 is If the thickness is about the same or more, it will be difficult to break by hand. Therefore, the eighth
As shown in the figure, it is necessary to narrow the pitch P, but if the pitch P is narrowed in this way, cracks will occur when forming the hole by press working, and the hole will be formed at the same time as the hole into which the lead wire of the electronic component is inserted. Since it is difficult to do so, it is necessary to form it using a drill or the like in a process different from press working using a mold, which is one of the causes of increased manufacturing costs.
この考案はかかる実情に鑑みてなされたもの
で、電子機器への組み付け時に、不要又は邪魔に
なる部分を容易に割つて分割することが可能なプ
リント配線基板をプレス加工で形成できるプリン
ト配線基板の金型を提供することを目的としてい
る。 This idea was made in view of the above circumstances, and it is a printed wiring board that can be formed by press processing into a printed wiring board that can be easily separated by cutting unnecessary or obstructive parts when assembling into electronic equipment. The purpose is to provide molds.
（問題点を解決するための手段）
この考案は前記の問題点を解決するため、抜孔
を有する雌型と、突部を有する雄型とからなり、
この雌型と雄型とのプレス加工で、銅箔を表面に
有する積層板に接続部を残してスリツトと、この
接続部に細孔を打抜いて形成するプリント配線基
板の金型において、前記雄型に押圧部を形成し、
この押圧部で前記接続部の細孔に連なる割り溝を
押圧して形成するようになしたことを特徴として
いる。(Means for solving the problem) In order to solve the above-mentioned problem, this invention consists of a female mold having a hole and a male mold having a protrusion.
By pressing the female mold and the male mold, a slit is formed in the laminate having a copper foil on the surface, leaving a connection part, and a pore is punched in this connection part.In the mold for the printed wiring board, A pressing part is formed in the male mold,
The device is characterized in that the pressing portion presses and forms the split grooves that are connected to the pores of the connection portion.
（作用）
この考案では、雄型と雌型により、銅箔を表面
に有する積層板をプレス加工すると、積層板に接
続部を残してスリツトと、この接続部に細孔とが
打抜きにより形成される。さらに、雄型に形成さ
れた押圧部で同時に接続部に割り溝が細孔に連な
るように形成される。従つて、容易に切断するこ
とが可能なプリント配線基板が、金型によるプレ
ス加工で、接続部の細孔間のピツチを従来より狭
くする必要がなく、簡単に形成される。(Function) In this invention, when a laminate with copper foil on the surface is pressed using a male die and a female die, a slit is formed in the laminate, leaving a connection part, and a pore is formed in this connection part by punching. Ru. Further, at the same time, a dividing groove is formed in the connecting part of the male-shaped pressing part so as to be connected to the pore. Therefore, a printed wiring board that can be easily cut can be easily formed by press working using a mold, without making it necessary to make the pitch between the pores of the connection part narrower than before.
（実施例）
以下、この考案の実施例を添付図面に基づいて
詳細に説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings.
第１図はプリント配線基板を形成する金型の要
部の断面図、第２図はプリント配線基板の平面
図、第３図はその一部を拡大した斜視図、第４図
は要部の拡大平面図、第５図は第４図の−断
面図、第６図は第４図の−断面図である。 Figure 1 is a sectional view of the main parts of the mold that forms the printed wiring board, Figure 2 is a plan view of the printed wiring board, Figure 3 is a partially enlarged perspective view, and Figure 4 is the main part of the mold. FIG. 5 is an enlarged plan view, FIG. 5 is a cross-sectional view taken from FIG. 4, and FIG. 6 is a cross-sectional view taken from FIG. 4.
図において符号１は雌型、２は雄型で、雌型１
には円形の抜孔１ａと、帯状の抜孔１ｂとを有
し、雄型２は円形の突部２ａと、帯状の突部２ｂ
とを有している。さらに、雄型２には両側の突部
２ｂと、この突部２ｂに近接する突部２ａとの間
と、さらにこの突部２ａに近接する突部２ａとの
間に帯状に突出する押圧部２ｃがそれぞれ形成さ
れている。 In the figure, 1 is the female type, 2 is the male type, and the female type 1
has a circular punch hole 1a and a strip-shaped punch hole 1b, and the male die 2 has a circular protrusion 2a and a strip-shaped protrusion 2b.
It has Further, the male mold 2 has a pressing portion that projects in a band shape between the protrusion 2b on both sides and the protrusion 2a adjacent to the protrusion 2b, and between the protrusion 2a adjacent to the protrusion 2a. 2c are formed respectively.
この雄型２の突部２ａ，２ｂが雌型１の抜孔１
ａ，１ｂに嵌合できるようになつており、雌型１
と雄型２との間にプリント配線基板の積層板３を
介在させてプレス加工すると、第２図乃至第６図
に示すプリント配線基板が形成される。このプリ
ント配線基板の積層板３の絶縁部はガラス繊維不
織布基材４を、その両側からガラス布基材５でサ
ンドイツチ状に挟んで形成されたコンポジツト材
が用いられ、このガラス布基材５に銅箔が形成さ
れている。 The protrusions 2a and 2b of the male mold 2 are the holes 1 of the female mold 1.
a, 1b, female mold 1
When the printed wiring board laminate 3 is interposed between the male die 2 and the printed wiring board 3 and pressed, the printed wiring board shown in FIGS. 2 to 6 is formed. The insulating part of the laminated board 3 of this printed wiring board is made of a composite material formed by sandwiching a glass fiber non-woven fabric base material 4 between glass cloth base materials 5 from both sides in a sandwich-like manner. Copper foil is formed.
プリント配線基板の積層板３には第２図に示す
ように、その両端部に一部に接続部６を残してス
リツト７が雌型１の抜孔１ｂと雄型２の突部２ｂ
とで形成され、これにより不要又は邪魔となる部
分８が形成される。このスリツト７間の接続部６
には細孔９が雌型１の抜孔１ａと雄型２の突部２
ａとで、スリツト７と同一線上に形成される。こ
の細孔９間のピツチＰは積層板３のコンポジツト
材の厚さより大きく形成されており、例えば、こ
の実施例では細孔９の直径が1.2mm、ピツチが2.5
mmで、積層板３の厚さが1.6mmに形成される。 As shown in FIG. 2, in the laminated board 3 of the printed wiring board, a slit 7 is formed between the punching hole 1b of the female mold 1 and the protrusion 2b of the male mold 2, leaving a part of the connection part 6 at both ends.
This forms an unnecessary or obstructive portion 8. Connection part 6 between this slit 7
The pore 9 is located between the hole 1a of the female die 1 and the protrusion 2 of the male die 2.
a and is formed on the same line as the slit 7. The pitch P between the pores 9 is formed to be larger than the thickness of the composite material of the laminate 3. For example, in this embodiment, the diameter of the pores 9 is 1.2 mm, and the pitch is 2.5 mm.
mm, and the thickness of the laminate 3 is 1.6 mm.
この接続部６に形成されたスリツト７側の細孔
９間には、割り溝１０が雄型２の突部２ｃで押圧
され、それぞれ細孔９に連なるように形成され
る。この割り溝１０は雌型１と雄型２の金型によ
るプレス加工で、プリント配線基板の積層板３を
形成する際に、スリツト７及び接続部６に形成さ
れる細孔９と、図示しない電子部品リード線を挿
入する孔と同時に形成されるから、製作コストが
低減する。 Between the pores 9 formed in the connecting portion 6 on the slit 7 side, dividing grooves 10 are pressed by the protrusions 2c of the male mold 2, and are formed so as to be continuous with the pores 9, respectively. This dividing groove 10 is formed by press working using a female die 1 and a male die 2, and is formed in the slit 7 and the pore 9 (not shown) formed in the connecting portion 6 when forming the laminated board 3 of the printed wiring board. Since the hole is formed at the same time as the hole into which the electronic component lead wire is inserted, manufacturing costs are reduced.
従つて、このように第１図に示す金型で、プレ
ス加工して形成されたプリント配線基板に電子部
品等を接続して回路を構成し、これを電子機器に
組み込むが、このとき電子機器の組み込むスペー
スに応じて手で、例えば一方の部分８を接続部６
を割つて切断して組み付ける。このように、プリ
ント配線基板は接続部６の細孔９間が割れて切断
されるが、このとき割り溝１０の打痕部分から折
れるから、細孔９間のピツチＰが積層板３の厚さ
より長く形成されていても、容易に切断すること
ができる。 Therefore, electronic components and the like are connected to a printed wiring board formed by pressing using the mold shown in Fig. 1 to form a circuit, and this is incorporated into an electronic device. For example, one part 8 can be connected to the connecting part 6 by hand depending on the space available
Split, cut and assemble. In this way, the printed wiring board is broken and cut between the pores 9 of the connection part 6, but at this time, since it is broken from the dented part of the groove 10, the pitch P between the pores 9 is equal to the thickness of the laminate 3. Even if it is longer than the diameter, it can be easily cut.
なお、前記実施例では、雄型２の押圧部２ｃを
突部２ｂ側に形成して、接続部６の割り溝１０を
スリツト７側に形成するようにして、スリツト７
側から剪断力が働き容易に割ることができる効果
があるが、押圧部２ｃを中央の突部２間に連なる
ように設けて、割り溝１０を中央部の細孔９間に
形成するようにしてもよく、さらに細孔９間の全
部に形成できるようにしてもよい。 In the above embodiment, the pressing part 2c of the male die 2 is formed on the protrusion 2b side, and the dividing groove 10 of the connecting part 6 is formed on the slit 7 side, so that the slit 7
This has the effect that shearing force acts from the sides and makes it easy to split, but the pressing part 2c is provided so as to be continuous between the central protrusions 2, and the dividing grooves 10 are formed between the pores 9 in the central part. Furthermore, the pores 9 may be formed entirely between the pores 9.
また、雄型２の押圧部２ｃは突部２ａや突部２
ｂに直接連なるように形成され、割り溝１０は細
孔９に直接連なるようにしているが、間接的に連
なる、即ち、押圧部２ｃと突部２ａや突部２ｂと
の間に凹部を設けて、割り溝１０を細孔９との間
に所定の間隔をおいて形成することも包含され
る。 Moreover, the pressing part 2c of the male mold 2 is the protrusion 2a and the protrusion 2.
b, and the split grooves 10 are directly connected to the pores 9, but they are connected indirectly, that is, a recess is provided between the pressing portion 2c and the protrusion 2a or the protrusion 2b. This also includes forming the grooves 10 with a predetermined spacing between them and the pores 9.
（考案の効果）
この考案は前記のように、金型の雄型に押圧部
を形成し、この押圧部で接続部の細孔に連なる割
り溝を押圧して形成するようになしたから、金型
によるプレス加工で接続部の割り溝が形成され、
この割り溝によつて容易に切断することができ
る。また、金型で割り溝及び細孔が、電子部品の
リード線を挿入する孔と同時に形成されるため、
製作コストが低減する。(Effects of the invention) As mentioned above, this invention forms a pressing part on the male die of the mold, and uses this pressing part to press and form the grooves connected to the pores of the connection part. The groove for the connection part is formed by press processing using a mold,
This groove allows for easy cutting. In addition, since the split grooves and pores are formed in the mold at the same time as the holes into which the electronic component lead wires are inserted,
Manufacturing costs are reduced.
第１図はプリント配線基板を形成する金型の要
部の断面図、第２図はプリント配線基板の平面
図、第３図はその一部を拡大した斜視図、第４図
は要部の拡大平面図、第５図は第４図の−断
面図、第６図は第４図の−断面図、第７図及
び第８図は従来のプリント配線基板の平面図であ
る。
図中符号１は雌型、１ａ，１ｂは抜孔、２は雄
型、２ａ，２ｂは突部、２ｃは押圧部、３は積層
板、６は接続部、７はスリツト、９は細孔、１０
は割り溝である。
Figure 1 is a sectional view of the main parts of the mold that forms the printed wiring board, Figure 2 is a plan view of the printed wiring board, Figure 3 is a partially enlarged perspective view, and Figure 4 is the main part of the mold. FIG. 5 is a cross-sectional view taken from FIG. 4, FIG. 6 is a cross-sectional view taken from FIG. 4, and FIGS. 7 and 8 are plan views of a conventional printed wiring board. In the figure, 1 is a female mold, 1a and 1b are punched holes, 2 is a male mold, 2a and 2b are protrusions, 2c is a pressing part, 3 is a laminate, 6 is a connecting part, 7 is a slit, 9 is a pore, 10
is a split groove.
Claims (1)
なり、この雌型と雄型とによるプレス加工で、銅
箔を表面に有する積層板に後続部を残してスリツ
トと、この接続部に細孔を打抜いて形成するプリ
ント配線基板の金型において、前記雄型に押圧部
を形成し、この押圧部で前記後続部の細孔に連な
る割り溝を押圧して形成するようになしたプリン
ト配線基板の金型。 It consists of a female mold with a punched hole and a male mold with a protrusion, and by press working with the female mold and the male mold, a slit is formed in the laminate having a copper foil on the surface, leaving a trailing part. In a mold for a printed wiring board in which pores are formed by punching, a pressing part is formed in the male mold, and the dividing groove connected to the pore in the succeeding part is pressed and formed by this pressing part. Mold for printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7948987U JPH0513516Y2 (en) | 1987-05-26 | 1987-05-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7948987U JPH0513516Y2 (en) | 1987-05-26 | 1987-05-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63189593U JPS63189593U (en) | 1988-12-06 |
| JPH0513516Y2 true JPH0513516Y2 (en) | 1993-04-09 |
Family
ID=30929396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7948987U Expired - Lifetime JPH0513516Y2 (en) | 1987-05-26 | 1987-05-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0513516Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011145336A1 (en) * | 2010-05-19 | 2011-11-24 | 日本発條株式会社 | Method of forming a chained product of metal-base circuit boards, and chained product of metal-base circuit boards |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2609214B2 (en) * | 1993-05-12 | 1997-05-14 | ダイワ電機精工株式会社 | Circuit board dividing method and circuit board dividing mold |
-
1987
- 1987-05-26 JP JP7948987U patent/JPH0513516Y2/ja not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011145336A1 (en) * | 2010-05-19 | 2011-11-24 | 日本発條株式会社 | Method of forming a chained product of metal-base circuit boards, and chained product of metal-base circuit boards |
| JP2011243813A (en) * | 2010-05-19 | 2011-12-01 | Nhk Spring Co Ltd | Chain article formation method of metal base circuit board, and chain article of metal base circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63189593U (en) | 1988-12-06 |
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