JP2609214B2 - Circuit board dividing method and circuit board dividing mold - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board dividing method for taking a plurality of individual circuit boards from a single board, and dividing the plurality of circuit boards into individual circuit boards, and a circuit board dividing metal. About the type.

[0002]

2. Description of the Related Art Conventionally, as a method of dividing a so-called multiple circuit board into individual circuit boards, there is a method of punching individual circuit boards at once using a high-pressure press device. Also, a V-shaped groove is formed at a predetermined dividing line of the substrate,
In some cases, the sheet is made to be easily broken, and is divided at the V-groove portion at the time of division. Further, there is a device in which perforations are formed along a dividing line, and the substrate is folded at the perforations to divide the circuit board into individual circuit boards as in the case of the V-groove.

[0003]

In the case of the above-mentioned prior art press, since a relatively large punch and a die are used to punch and separate the divided portions at a time, a large force is required for the press. There has been a problem that the size of the apparatus is increased and the punches and dies are also large. Furthermore, the gap between the punch and the die was relatively large, the cross section was rough, and the substrate was easily cracked. In particular, the step of dividing the board into individual circuit boards is performed after soldering, and unnecessary stress acts on the board and the attached parts at the time of press division, which causes a reduction in the electrical reliability of the circuit board. there were. Also,
The formation of the V-groove has a problem that the divided portion can be used only for a linear one, and the formation of the V-groove is difficult to control the depth and is relatively expensive. Also, in the case of division by perforation, the punched part of the perforation must be lengthened and the bridge part shortened in order to facilitate the work of breaking the substrate, so that the division part in the middle of the work process There is a problem that it is easily broken. Conversely, if the bridge portion is lengthened, it will not be broken exactly along the perforations, resulting in poor division. Further, the perforated divided cross section has a disadvantage that the cross section is not clean. There is also a problem that division by perforations can be used only for linear portions.

The present invention has been made in view of the above-mentioned problems of the prior art, and has a simple structure, a circuit board dividing method and a circuit board dividing metal which can surely and cleanly divide a circuit board with a small force. The purpose is to provide a type.

[0005]

According to the present invention, a plurality of circuit board areas are formed on a single board, and after the electronic elements of each circuit board are provided on the board, the circuit board is provided for each circuit board. Is a circuit board dividing method in which a punch for punching a predetermined divided portion of the substrate is provided in a stepwise manner, and a required time interval is provided for each part of the punched portion, and continuous punching is performed. .

Further, according to the present invention, in a circuit board dividing mold for dividing a plurality of circuit boards on which a plurality of circuit boards are formed on one board into individual circuit boards, a punch for punching a predetermined divided portion is provided. This is a circuit board dividing mold provided with a die that is formed in a step shape and that is inserted stepwise with a substrate on which the step punch is punched out.

[0007]

According to the circuit board dividing method and the circuit board dividing mold of the present invention, when a multi-piece board provided with a plurality of circuit boards is divided, a punched portion is punched out partly by a punch, and the punching is surely performed with a small pressing force. In addition, the punched section can be made clean.

[0008]

An embodiment of the present invention will be described below with reference to the drawings. As shown in FIGS. 1 and 2, the mold for dividing a circuit board according to this embodiment has a punch 10 formed in a step shape.
And a punch plate 12 to which a normal columnar punch 11 is attached, and the punches 10 and 11
And a die 14 for punching 3. Then, the punch plate 12 is fixed to the upper die holder 15 and the die 14
Are fixed to the lower mold holder 16. Upper mold holder 1
5, a guide post 18 for positioning projects toward the die 14, and the die 14 and the lower die holder 1 are provided.
6 are formed with positioning holes 19 and 20 through which the guide posts 18 are inserted and positioned.

After punching a substrate 13 which is a workpiece by punches 10 and 11, the upper die holder 15
When 0 and 11 rise, the circuit board is
A stripper 22 that is separated from the motor 11 is attached via a coil spring 23. Therefore, the stripper 22
The lower surface is located slightly below the distal ends of the punches 10, 11, and is relatively retractable at the base ends of the punches 10, 11 at the time of punching by a coil spring 23.

In the die 14, punch holes 24, 25 are formed at locations corresponding to the punches 10, 11, and the lower die holder 16 communicates with the punch holes 24, 25 to form the punch holes 24, 25. An escape space 21 having a larger width and inner diameter is formed. Then, the punches 10 and 11 and the punched holes 24 and 25 of the die 14 are formed.
Is formed with an accuracy of 1/100 mm or less. The length of the punches 10 and 11 is
At the lowest position where 0 and 11 are inserted into the die 14, the tip of the shortest punch is also set to a length that is located in the escape space 21.

As shown in FIG. 2B, the punch 10 is formed in, for example, three steps with respect to the punching direction, and the punch pieces 10a, 10b, and 10c are formed on the substrate with a delay of the step difference. 13 is punched out. Each punch piece 1
The cutting edges 0a to 10c have arc-shaped concave portions 27 formed therein. This prevents a horizontal force from acting on the substrate 13 at the time of punching, and allows the tip of the punch 10 to be easily inserted into the substrate 13.
Furthermore, since the punch 10 is divided into three, the punching force is reduced to one third. And each punch piece 1
0a to 10c are provided integrally, and the punch plate 12
It is fixed to.

As shown in FIG. 3, the circuit board 13 is formed with three circuit board 26 formation regions on which electronic elements are mounted. Are formed at the corners of the circuit board 26 and the like. The space between the long holes 28 for division is formed by the punched portion 29.
It has become. The punched portion 29 is a bridge portion connecting the circuit board 26 and the board 13, and is formed to be relatively long so that the circuit board 26 is not separated during a predetermined work process. A long punched portion 29 of a punched portion is punched by the step-shaped punch 10. Therefore, the stepped punch 1
In the case of 0, the number of steps and the size of the punch piece are set by the length of the punched portion 29.

Press device 3 for driving punches 10 and 11
In FIG. 6, the upper mold holder 15 is fixed to the movable portion 33 of the air cylinder device 32 and is provided so as to be able to descend freely, and the lower mold holder 16 is fixed to the base 34 as shown in FIG.
Positioning posts 37 for the holder are provided at the four corners of the upper die holder 15, and positioning holes into which the positioning posts 37 are inserted are formed in the lower die holder 16. Further, a chute 35 for discharging chips of the punched substrate is attached below the lower die holder 16. The press device 30 may be of a relatively small size and has a thrust of about 3 tons.

The method for dividing a circuit board according to this embodiment uses
After the die 3 is set at a predetermined position on the die 14 and the die 14 is set on the lower die holder 16, the press device 30 is operated to lower the upper die holder 15. Thus, first,
The stripper 22 comes into contact with the substrate 13, and the coil spring 23 is compressed as the upper die holder 15 descends, and the punches 10 and 11 punch out predetermined punched portions 29 of the substrate 13 as shown in FIG. At this time, the punching portion 29 having a long distance is punched by the punch 10 and this punch 10
Are punched pieces 10a, 10b, and 10c in this order,
Punching out the punching portion 29 of FIG. Punches 10, 11
As shown in FIG. 5, the punched piece 13a of the substrate punched by the punch 1
4, falls into the escape space 21 through the punched holes 24 and 25, and is discharged through the chute 35. In this dividing step, as shown in FIG. 5, after the various electronic elements 36 are attached to the front and back surfaces of the circuit board 26, the individual circuit boards 26
It is divided for each.

After the punching, when the upper die holder 15 is raised, even if the punches 10 and 11 start to rise, the stripper 22 presses the substrate 13 by the coil spring 23, and the punches 10 and 11 And the stripper 22 is moved away from the substrate 1 only during the stroke of the coil spring 23.
After pressing 3, the stripper 22 moves up together with the upper die holder 15. Therefore, the substrate 13 is not lifted by being caught by the punches 10 and 11.

According to this embodiment, when punching is performed at relatively long intervals by the punch 10, each punch piece 10
Since a to c punches out the punched portion step by step, even if the thrust of the press device 30 is relatively small, the punching can be reliably performed, and the air press device can be used. Moreover, punching over a long distance is possible, and a bridge portion connecting the divided circuit board 26 and the board 13 outside the circuit board 26 can be lengthened, so that the circuit board 26 is not inadvertently separated. . Moreover,
Since the bridge portion can be lengthened, the circuit board 26 does not warp due to heat generated when the electronic element 36 is soldered to the circuit board 26. Also,
Since the long hole 28 such as a corner of the circuit board 26 can be shortened, the primary mold for forming the long hole 28 can be made small and simple, and the cost for forming the temporary mold can be reduced. . That is, the temporary mold for punching the irregular mold portion is usually formed by wire-cut electric discharge machining, but this machining is time-consuming and costly. become. Further, the divided section is clean, and the substrate quality is improved.

The clearance between the punches 10, 11 and the punched holes 24, 25 of the die 14 is 1/100 mm.
By setting the following, the punched waste 13a of the substrate 13 is formed between the punched holes 24 and 25 and the punches 10 and 11.
Is prevented from entering and completely escapes to the escape space 21 to be discharged. In addition, the shear surface of the substrate 13 can be made extremely clean. In particular, the substrate 13 for the circuit board 26 is provided with glass fibers as a core material, and when the hard glass fiber chips enter the gaps between the punches 10 and 11 and the punched holes 24 and 25, the punches 10 and 11 And the life of the die 14 is shortened, which is not preferable. Especially,
When the side wall thickness of the punched holes 24 and 25 is thin, unnecessary stress is exerted at the time of punching due to the debris and the like, which causes the accuracy of the punched holes 24 and 25 to decrease. Can be prevented.

The shape of the punch of the present invention is not limited to the above embodiment, and the number of steps of the stepped tip can be appropriately selected.
An inverted V-shape may be used. Further, the punch pieces may be integrated by appropriately assembling individual separate punch pieces, or a plurality of punch pieces may be integrally formed from the beginning.

[0019]

According to the circuit board dividing method and the circuit board dividing mold of the present invention, a relatively long distance is not partially punched at once, but is partially punched one by one by a step-shaped punch. The substrate can be reliably punched with a small force, and vibration and sound are small. In addition, punching shape by punch can be set freely,
Non-linear or irregular types can be easily handled. Therefore, the bridge portion of the circuit board can be lengthened, and a part of the plurality of circuit boards can be prevented from being separated during the work or the circuit board being warped due to soldering or the like. is there.

[Brief description of the drawings]

FIG. 1 is a partially cutaway front view of a circuit board dividing mold according to one embodiment of the present invention.

FIG. 2 is a plan view (A) and a front view (B) showing a punch of a circuit board dividing mold according to this embodiment.

FIG. 3 is a plan view of a circuit board divided by a circuit board dividing mold according to this embodiment.

FIG. 4 is a longitudinal sectional view showing a use state of the circuit board dividing mold of this embodiment.

FIG. 5 is a longitudinal sectional view showing another use state of the circuit board dividing mold of this embodiment.

FIG. 6 is a front view of a pressing device for a circuit board dividing mold according to this embodiment.

[Explanation of symbols]

 10, 11 punch 10a, 10b, 10c punch piece 12 upper die holder 14 die 16 lower die holder 24, 25 punched hole

Claims (5)

(57) [Claims] 1. A circuit board dividing method for setting a plurality of regions of individual circuit boards on a single board and subsequently dividing the circuit board into individual circuit boards, wherein a punch for punching a predetermined divided portion of the board is continuously formed. Provided stepwise, continuous punching of the substrate
The punched part is punched out with a time difference
A circuit board dividing method, characterized in that continuous through holes are formed in order and a necessary part is punched out. 2. A circuit board dividing mold for dividing a plurality of circuit boards on which a plurality of circuit boards are formed on a single board into individual circuit boards . Composed of step-shaped punch pieces
And, of the stepped punch across the substrate to be punched
A die for dividing a circuit board, comprising a die into which individual punch pieces are inserted stepwise. Tip of wherein each punch piece, according to claim 2 circuit board split mold for, wherein a peripheral edge portion thereof is formed into a concave shape which protrudes from the center portion. 4. The punched hole of the die into which the punch is inserted has a clearance of 1/100 mm from the punch.
The mold for dividing a circuit board according to claim 2, wherein the mold is formed as follows. 5. The punch and a punching hole of a die into which the punch is inserted, wherein the punch reaches a lower limit,
5. The circuit board dividing mold according to claim 4, wherein a punch piece at an upper limit portion of the step-shaped punch is set to be in a state of being inserted into the die.