JP3759744B1 - Mold for processing base plate, method for manufacturing processed plate, and method for manufacturing product plate - Google Patents

Abstract

In a case where a mounting board including a printed circuit board facing a relatively short interval through a relatively long straight portion is manufactured by pushback processing, the printed wiring board is damaged or Suppress the deterioration of mold strength and life.
In a first pushback region 3, pushback processing of first printed circuit boards (A) 14a, 14a is performed. Next, the mother board 10 is conveyed, and the first pushback board (B) 14b and the second printed circuit board (A) are newly added in the first pushback area 3 and the second pushback area 7, respectively. 14a ′, 14a ′... Are pushed back. Further, the mother board 10 is conveyed, and in the first pushback area 3 and the second pushback area 7, new first printed circuit board (C) 14c and second printed circuit board (B) 14b are respectively obtained. At the same time as push-back of 'is performed, the mounting board 18 is cut out in the outer cutting region 5.
[Selection] Figure 7

Description

  The present invention relates to a mold for processing a mother board, a method for manufacturing a processed board, and a method for manufacturing a product board. More specifically, the processed board (for example, a printed circuit board) temporarily fixed by pushback processing (for example, a printed board) , A mounting board) from a mother board (for example, a printed wiring mother board), a mother board processing mold, a method of manufacturing such a processed board, and a product board obtained from such a processed board It relates to a manufacturing method.

  In recent years, with the miniaturization of electronic devices, there has been an increasing demand for miniaturization and modification of printed circuit boards used in electronic devices. On the other hand, an electronic component automatic mounting machine (hereinafter referred to as “self-mounting machine”) such as a chip mounter or an automatic insertion machine for mounting electronic components on a printed circuit board is referred to as the size of a workpiece because of its conveyance. Have upper and lower limits. Moreover, the external shape of the workpiece | work used for a self-machine is required to be substantially rectangular, ie, at least one side is a straight line, and at least one of the orthogonal sides is a straight line.

  Therefore, when mounting electronic components on a small and irregular printed circuit board using a self-mounting machine, first, a plurality of printed circuit boards are formed on the printed wiring board, and the V-cut method and pushback method are used. Using a perforation method, etc., the printed circuit board is temporarily fixed to the original printed wiring board, and then the printed wiring board has a size and shape that can be conveyed by the self-equipment. A method of cutting a substrate (mounting substrate) is used.

Of these, the V-cut method uses a V-shaped groove (V-cut) along the boundary of the printed circuit printed on the printed wiring board, mounts electronic components on the printed circuit, and then cuts the V-cut. It is a method of breaking along. Therefore, the V-cut method can be applied only to a printed circuit board whose outer shape is linear.
The perforation method is a method in which a large number of small holes are formed along the boundary line of the printed circuit board and the holes are broken along the small holes. The perforation method is applicable only to a printed circuit board that does not require dimensional accuracy of the outer shape, because unevenness remains on the boundary line after fracture.

  On the other hand, in the pushback method, the printed circuit board is punched out using a blade having a predetermined shape while holding the printed wiring board between the upper mold and the lower mold, and then the punched printed circuit board is removed from the original hole. It is a method of fitting. The pushback method has a high dimensional accuracy of the outer shape and there is no restriction on the shape of the printed circuit board, and is therefore an effective method particularly when electronic components are automatically mounted on a deformed printed circuit board.

The processing of printed wiring board using the pushback method is generally
(1) Form a reference hole for pushback on the printed wiring board on which the electric circuit is printed,
(2) Push-back processing of the printed circuit board using the push-back mold, and drilling of component holes as necessary,
(3) Cutting the outer shape of the printed wiring board using an outer cutting die and cutting out a mounting board including a predetermined number of printed circuit boards from the mother board.
Has been done.

  However, the pushback process generally tends to warp because a strong shearing force acts on the printed wiring board. Conventionally, pushback processing and outline cutting are generally performed using separate molds. However, if only pushback processing is performed continuously on the mother board, a large warp will occur on the mother board. There is a problem that it becomes difficult to cut the outer shape and to remove individual printed circuit boards. In addition, a pushback mold and an outer cutting mold are required, which increases the cost.

Therefore, in order to solve this problem, Patent Document 1 discloses that the printed circuit board is disposed on the upstream side with respect to the conveyance direction of the printed wiring board, and the printed circuit board is punched out from the printed wiring board. A mounting board including one or two or more of the printed circuit boards that are arranged on the downstream side with respect to the transport direction of the printed wiring board and pushed back. There is disclosed a printed wiring board processing die having an outer shape cutting means for cutting out from a printed wiring board.
In this document, the area pushed back by the pushback means is sequentially separated by the outline cutting means, so that the outline cutting can be easily performed without being greatly affected by the warp of the printed wiring board, and for mounting with less warpage. It describes that a printed circuit board can be easily removed because a substrate can be obtained, and that the mold cost can be reduced because pushback processing and outline cutting can be performed with a single mold. .

JP 2002-233996 A

The printed wiring board usually has a certain standardized dimension. Each user cuts a printed wiring board having a certain size into an appropriate work size as needed, and then uses it for pushback processing, outer shape cutting processing, and the like. Therefore, the work size is determined almost uniquely according to the number of divisions of the mother board.
On the other hand, the shape and size of the printed circuit board are various. Therefore, in order to increase the number of workpieces per work, it is necessary to change the interval and arrangement of the printed circuit boards according to the shape and size of the printed circuit boards and the work size.

However, when the printed circuit boards that are pushed back are formed adjacent to each other, when the adjacent printed circuit boards face each other through a relatively long straight line portion, the distance between the two is usually 3% of the board thickness. It is necessary to be larger than double. For example, when a mother board having a thickness of 1.6 mm is subjected to pushback processing, an interval of about 5 mm is required between adjacent printed circuit boards. this is,
(1) In the case where the distance between the printed circuit boards facing each other through a relatively long straight line portion is narrow, if these are simultaneously pushed back, the portion of the mother board remaining between the printed circuit boards is likely to break, and ,
(2) Although it is necessary to form through holes corresponding to the shape of the printed circuit board in the mold, if the distance between the through holes becomes too short, the portion of the mold remaining between the through holes It becomes easy to break and the strength and life of the mold are reduced.

  On the other hand, if the interval between the printed circuit boards is widened in order to solve this problem, since the work size is almost determined, the number of workpieces is reduced and the product yield is reduced. In addition, when adjacent printed circuit boards face each other through a relatively long straight line portion, a plurality of molds are used to suppress damage to the mother board and a decrease in mold strength. Although a manufacturing method is also conceivable, the method using a plurality of molds causes an increase in cost.

The problem to be solved by the present invention is to push a mounting board (processed board) including a printed circuit board (product board) facing each other through a relatively long straight portion and at a relatively short interval. In the case of manufacturing by back processing, the object is to suppress damage to the printed wiring board (mother board) and reduction in mold strength and life.
In addition, another problem to be solved by the present invention is that a metal for processing a base plate capable of manufacturing a mounting substrate (processed plate) with a large number of workpieces per workpiece and a high material yield without incurring an increase in cost. It is providing the manufacturing method of a type | mold and a processed plate using this.
Furthermore, another problem to be solved by the present invention is to provide a method for producing a product plate from such a processed plate.

In order to solve the above problems, a mother board machining die according to the present invention is:
1st for performing the back-back process which is arrange | positioned in the upstream with respect to the conveyance direction of a motherboard, punches out the 1st product board from the said motherboard, and inserts the punched 1st product board into the original hole. A first pushback region comprising pushback means;
The first pushback process is performed on the downstream side of the first pushback region, and a second product plate is punched from the mother plate, and the punched second product plate is inserted into the original hole. A second pushback region comprising two pushback means;
An outer cutting means is provided on the downstream side with respect to the second pushback region, and performs outer cutting for cutting the processed plate including the first product plate and the second product plate from the mother plate. With external cutting area,
The second pushback means is a side of the first product plate, and forms the second product plate in an unprocessed region on the right side or the left side with respect to the conveyance direction of the mother plate. This is the gist.

Moreover, the manufacturing method of the processing board which concerns on this invention uses the metal mold | die for mother board processing which concerns on this invention,
(A) In the first pushback region, the first product plate (A) is punched from the mother plate using the first pushback means, and the punched first product plate (A) is restored to the original. A first step to fit into the hole;
(B) transporting the mother plate so that the region where the first product plate (A) is formed is on the second pushback region;
In the first pushback region, the first product plate (B) is newly punched from the mother plate using the first pushback means, and the punched first product plate (B) is returned to the original hole. At the same time,
In the second pushback region, the side of the first product plate (A) pushed back in the immediately preceding press using the second pushback means, with respect to the conveying direction of the mother plate A second step of punching the second product plate (A) from the right or left unprocessed region and fitting the punched second product plate (A) into the original hole;
(C) The first product plate (A), the second product plate (A), and the first product plate (B) are on the outer cutting region and the second pushback region, respectively. Transport the mother board so that it comes to
In the first pushback region, the first product plate (C) is newly punched from the mother plate using the first pushback means, and the punched first product plate (C) is returned to the original hole. In the second pushback region, the base plate is a side of the first product plate (B) pushed back in the immediately preceding press using the second pushback means. At the same time, the second product plate (B) is punched from the unprocessed region on the right side or the left side with respect to the conveyance direction, and the punched second product plate (B) is fitted into the original hole.
A third step of cutting the processed plate including the first product plate (A) and the second product plate (A) from the base plate using the outer shape cutting means in the outer shape cutting region;
The main point is that
Furthermore, the manufacturing method of the product board which concerns on this invention makes it a summary to isolate | separate the said product board from the processed board manufactured using the method which concerns on this invention.

  The mother board is processed using the mother board machining die according to the present invention in which the first pushback means, the second pushback means, and the outer shape cutting means are arranged in this order along the conveying direction of the mother board. And the 2nd product board can be formed in the side of the 1st product board punched in the last press. Therefore, when the first product plate and the second product plate are arranged in a direction substantially perpendicular to the conveyance direction of the mother board, even if the distance between the two is narrow, the crack of the mother board or the mold It is possible to suppress a decrease in strength and lifetime. Further, since the distance between the product plates can be reduced to the ultimate, the number of workpieces is increased, and the product yield is improved. Furthermore, since the pushed-back area is sequentially separated by the outer shape cutting means, the warp generated in the subsequent mother board is reduced, and the outer shape cutting operation can be easily performed. Furthermore, compared with the case where two molds are used, the mold cost can be reduced, and the mold replacement work is not necessary.

  Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. In the following description, a printed wiring board processing mold for processing the printed wiring board, a mounting board manufacturing method using the mold, and a printed circuit board manufacturing method will be described. However, the present invention can also be applied to a “mother board” other than the printed wiring board, a “processed board” other than the mounting board, and a “product board” other than the printed circuit board.

  1 to 4 show a printed wiring mother board processing mold (mother board processing mold) according to the present embodiment. The printed wiring mother board processing mold 1 includes a lower mold 20 and an upper mold 50. The lower mold 20 and the upper mold 50 each have a first pushback region 3 on the upstream side, a second pushback region 7 on the downstream side, and further on the downstream side in the conveyance direction of the printed wiring board. The outer cutting regions 5 are respectively arranged.

  The first pushback area 3 is a pushback in which a first printed circuit board (first product board) is punched from a printed wiring board (mother board), and the punched first printed circuit board is fitted into the original hole. First push back means for performing processing is provided. The second pushback area 7 is a side of the first printed circuit board that has been pushback processed in the immediately preceding press, and is printed in the unprocessed area on the right side or the left side with respect to the conveyance direction of the mother board. A second pushback means is provided for performing a pushback process in which a second printed circuit board (second product board) is punched from the wiring mother board, and the punched second printed circuit board is fitted into the original hole. Yes. Further, the outer cutting area 5 includes outer cutting means for cutting a mounting board (processed board) including the first printed circuit board and the second printed circuit board from the printed wiring board.

  As shown in FIGS. 1 and 2, the lower mold 20 includes a lower mold base plate 22 and a lower mold stripper 24. The first pushback region 3 of the lower mold base plate 22 is provided with two first lower punches 22a and 22b (first pushback means) for punching out the first printed circuit board. In the pushback region, three second lower punches 22c to 22e (second pushback means) for punching out the second printed circuit board are provided. Further, a third lower punch 22f (outer cutting means) for cutting out the mounting board from the printed wiring board is provided in the outer cutting area 5 of the lower mold base plate 22.

  The first lower punches 22a and 22b and the second lower punches 22c to 22e are formed when the first printed circuit board and the second printed circuit board are pushed back while stepping the printed wiring board. Printed circuit boards and second printed circuit boards are arranged in a horizontal row (substantially perpendicular to the direction of conveyance of the printed wiring board), and the first printed circuit boards and the second printed circuit boards are alternately arranged. It is arranged to be punched out. The third lower punch 22f is arranged so that a mounting board including a total of five printed circuit boards punched by the first lower punches 22a and 22b and the second lower punches 22c to 22e is punched.

The distance between the first printed circuit board punched by the first lower punches 22a and 22b and the second printed circuit board punched by the second lower punches 22c to 22e depends on the dimensions of the mother board and the shape of the printed circuit board. It can be arbitrarily selected according to the size. In general, in pushback processing, when two printed circuit boards face each other via a relatively long straight line portion, when the two are pushed back simultaneously, the distance between the two is 3% of the thickness of the mother board. It is necessary to be larger than double. Further, in terms of maintaining the strength of the mold, the distance between the printed circuit boards needs to be at least about 5 mm.
However, in the present invention, the push-back processing of the printed circuit boards adjacent to the left and right is performed in stages, so that the distance between the first printed circuit board and the second printed circuit board is 2 of the plate thickness. It may be less than double. Further, the distance between them can be 1.5 times or less of the plate thickness or about 1.0 times the plate thickness. For example, when the thickness of the mother plate is 1.6 mm, the interval can be about 1.6 mm.

In FIG. 1, a total of five first lower punches 22a and 22b and second lower punches 22c to 22e having a rectangular shape are illustrated, but this is merely an example. It is sufficient that the second lower punch is disposed so that the second printed circuit board is punched out at least to the side of the first printed circuit board punched by the first lower punch. The shape, number and arrangement of the punches can be arbitrarily selected according to the purpose.
That is, the first lower punches 22a and 22b and the second lower punches 22c to 22e may have the same shape or may be different from each other. Further, the first printed circuit board and the second printed circuit board punched out by the first lower punch and the second lower punch may be completely aligned in a horizontal row, or slightly back and forth along the transport direction. The position may be shifted.
Further, the first pushback area 3 and / or the second pushback area 7 includes a first pushback means and a second pushback for punching out printed circuit boards arranged alternately in the transverse direction with respect to the transport direction. In addition to the back means, means for pushing back another independent printed circuit board that is not in a positional relationship like the first printed circuit board and the second printed circuit board to the unprocessed portion of the mounting board May be further provided.

  The lower mold stripper 24 is provided with through holes at positions corresponding to the lower punches 22a to 22f, and the lower mold stripper 24 can move up and down along the peripheral wall surfaces of the lower punches 22a to 22f. Further, the lower mold stripper 24 is restricted from moving upward by a plurality of bolts 26, 26... That are loosely inserted from below the lower mold base plate 22, and the lower mold base plate 22 and the lower mold stripper 24. It is urged | biased by the upward direction by the elastic members 28, 28 ... inserted in between. The material of the elastic members 28, 28... Is not particularly limited, but urethane rubber or the like is suitable. Further, posts 30 a to 30 d inserted from below the lower mold base plate 22 are erected at the four corners of the lower mold stripper 24. The posts 30a to 30d are used for positioning the lower mold 20 and the upper mold 50 during pressing.

  Positioning pins 32a and 32b used for positioning in pushback processing are provided upright on the upper surface of the lower mold stripper 24 and on the sides of the first lower punches 22a and 22b. Further, on the upper surface of the lower mold stripper 24 and on the sides of the second lower punches 22c and 22e, the positions are symmetrical with the positioning pins 32a and 32b, respectively, and correspond to the transport distance of the printed wiring board. Positioning pins 32c and 32d are erected at positions separated by a distance. Further, on the upper surface of the lower mold stripper 24, on the side of the third lower punch 22f, the positions are symmetrical with the positioning pins 32c and 32d, respectively, and a distance corresponding to the transport distance of the printed wiring mother board. Positioning pins 32e and 32f are erected at positions apart from each other.

  Further, on the upper surface of the second lower punch 22f, there are formed component hole forming holes 34, 34,... For forming component holes, and slits that communicate with the outer periphery of the mounting board and do not communicate with the printed circuit board. .., A reference hole forming hole 38a for forming a reference hole for automatically mounting electronic components, and a sub reference hole forming hole 38b for forming a sub reference hole are provided. It has been.

  The upper mold | type 50 is provided with the upper mold | type base board 52 and the four holders 54a-54d as shown in FIG.3 and FIG.4. The upper mold base plate 52 and the holders 54a to 54d are stacked on the basis of knock pins 56, 56 erected on the upper mold base plate 52, and fastened by a plurality of fastening bolts 58, 58. In addition, the first pushback region 3, the second pushback region 7 and the outer shape cutting region 5 of the holder 54d located at the forefront of the upper mold 50 are respectively provided with a first upper part for punching the first printed circuit board. Mold strippers 60a and 60b (first pushback means), second upper mold strippers 60c to 60e (second pushback means) for punching the second printed circuit board, and third for cutting out the mounting substrate. An upper mold stripper 60f (outer cutting means) is attached. The first upper mold strippers 60a and 60b, the second upper mold strippers 60c to 60e, and the third upper mold stripper 60f are first lower punches 22a and 22b, second lower punches 22c to 22e and second 3 is provided at a position corresponding to the lower punch 22f.

  The first upper mold strippers 60a and 60b and the second upper mold strippers 60c to 60e are loosely inserted into the first slide spaces 62a and 62b and the second slide spaces 62c to 62e provided in the holder 54d, respectively. It is. Further, the first upper mold strippers 60a and 60b and the second upper mold strippers 60c to 60e are bolts 64, 64... Which are loosely inserted from above the holder 54c so that their tips slightly protrude from the surface of the holder 54d. Supported and restricted to move downward. Further, the bolts 64, 64... Can move up and down along a through hole 65 provided in the holder 54b.

  The first pressing pins 66a, 66a,... Are for pressing the first upper mold strippers 60a, 60b and the second upper mold strippers 60c-60e downward, and are through holes penetrating the holders 54b, 54c in the vertical direction. It is loosely inserted in. One end thereof abuts on the upper surface of the first upper mold stripper 60a, 60b or the second upper mold stripper 60c-60e, and the other end thereof is the first pressing plate 70a or the second press plate disposed in the central space 68 of the holder 54a. It is in contact with the lower surface of the pressing plate 70b.

  The first pressing plate 70a and the second pressing plate 70b are for pressing the first pressing pins 66a, 66a,. Elastic members 74, 74... Are interposed between the upper surfaces of the first pressing plate 70 a and the second pressing plate 70 b and the cap bolt 72, respectively, and the first pressing plate 70 a and the elastic members 74, 74. The second pressing plate 70b is urged downward. The material of the elastic members 74, 74... Is not particularly limited, but urethane rubber or the like is suitable.

  Similarly, the third upper mold stripper 60f is loosely inserted into a third slide space 62f provided in the holder 54d. Further, the third upper mold stripper 60f is supported by bolts 64, 64... Which are loosely inserted from above the holder 54c so that the tip thereof slightly protrudes from the surface of the holder 54d, and the downward movement is restricted. ing.

  The second pressing pins 66b, 66b,... Are for pressing the third upper mold stripper 60f downward, and are loosely inserted into through holes penetrating the holders 54b, 54c in the vertical direction. One end thereof is in contact with the upper surface of the third upper mold stripper 60f, and the other end is in contact with the lower surface of the third pressing plate 70c disposed in the central space 68 of the holder 54a. The third pressing plate 70c is for pressing the second pressing pins 66b, 66b,. On the upper surface of the third pressing plate 70c, knockout bushes 76, 76... For pressing the third pressing plate 70c downward are provided. The lengths of the knockout bushes 76 and 76 are determined so that the tip ends slightly protrude from the upper surface of the upper mold base plate 52 in an unloaded state.

  The holder 54d is provided with post guide holes 78a to 78d at positions corresponding to the posts 30a to 30d erected on the lower mold 20, respectively. In addition, positioning pin guide holes 80a to 80f are provided on the lower surface of the holder 54d and the third upper mold stripper 60f at positions corresponding to the positioning pins 32a to 32f erected on the lower mold 20, respectively.

  In the positions corresponding to the component hole forming holes 34, 34..., The slit forming holes 36, 36... And the reference hole forming hole 38a and the sub reference hole forming hole 38b formed on the upper surface of the third lower punch 22f. , Component hole forming pins 82, 82..., Slit forming pins 84, 84..., A reference hole forming pin 86a, and a sub reference hole forming pin 86b. These tips are loosely inserted into through holes provided in the third upper mold stripper 60f. As the third upper mold stripper 60f moves upward along the third slide space 62f, the third upper mold stripper 60f moves upward. It protrudes from the lower surface of the mold stripper 60f.

  The number, shape, and position of the slit forming pins 84, 84... And the corresponding slit forming holes 36, 36... (Slit forming means) provided in the third upper mold stripper 60f, that is, the outer margin of the mounting substrate. The number, shape, and position of the slits formed on the substrate are preferably selected so that the warp generated on the mounting substrate is minimized when the mounting substrate is cut out from the printed wiring board.

For example, when the warpage generated on the mounting substrate is relatively small, it is only necessary to form a slit on at least one side of the mounting substrate. In addition, when the warpage generated on the mounting substrate is relatively large, it is preferable to form slits on at least two opposing sides of the mounting substrate.
Further, when the generated warp is large, such as when the area of the mounting substrate is large, it is preferable to provide slits on all four sides of the mounting substrate.
Further, when possible depending on the shape, arrangement, etc. of the printed circuit board, in addition to forming one or two or more slits around the mounting board, one or two or more isolated parts in the margin of the center of the mounting board A long hole may be formed.

  In general, the longer the slit length, the greater the effect of reducing the warp generated on the mounting substrate. For example, when a slit is formed in the blank portion on the outer periphery of the mounting substrate (the portion from the outer periphery of the mounting substrate to the printed circuit board), the length of the slit is 2/3 or more of the length of the blank portion. preferable. However, if the slit is too long, the strength of the mounting substrate is reduced. Accordingly, it is preferable to select an optimum length of the slit according to the shape, arrangement, etc. of the printed circuit board so that the strength enough to withstand automatic mounting is maintained.

  Further, the lengths of the respective slits may be the same or different. For example, when the length of the blank portion where the slit is to be provided is substantially equal, the length of each slit may be the same. On the other hand, when the length of the blank portion differs depending on the location, the length of each slit may be changed according to the position where the slit is formed. The number of slits provided on the mounting substrate is the same, and it is preferable to determine the degree of warpage and the strength of the mounting substrate. This also applies to the case where an isolated slot is formed.

  In FIG. 1, slit forming means, component hole forming pins 82, 82... And component hole forming holes 34, 34... (Component hole forming means), reference hole forming holes 38a and reference hole forming pins 86a (reference hole forming means). ), And the sub reference hole forming hole 38b and the sub reference hole forming pin 86b (sub reference hole forming means) are provided on the outer cutting area 5 side. You may provide in the 3 side or the 2nd push back area | region 7 side. However, when these means are provided in the first pushback region 3 or the second pushback region 7, the punched printed circuit board may come off from the mother board when the pin is pulled out from the mother board after the punching is completed. Therefore, it is preferable that both of these means are provided on the outer cutting area 5 side.

  In addition, when all electronic components are automatically mounted on the mounting board at one time, it is sufficient to have only one reference hole and one sub reference hole, but the electronic components are automatically mounted in multiple times. In some cases, a plurality of reference holes and sub-reference holes are required. Therefore, in such a case, a plurality of sets of reference hole forming means and sub reference hole forming means are provided on the pushback region 3 side or the outer cutting region 5 side, and a plurality of reference holes and sub reference holes are formed at the same time. good.

  Further, in the printed wiring board processing die 1 shown in FIGS. 1 to 4, the first pushback region 3, the second pushback region 7, and the outer shape cutting region 5 are provided in this order. A pushback region may be further provided before and after the back region 3 or the second pushback region 7. However, since the warpage of the mother board increases as the length of the printed wiring board that is pushed back increases, it is preferable to determine the number of pushback regions in consideration of the degree of warpage.

  Next, a method of using the printed wiring motherboard processing die 1 according to the present embodiment will be described. 5 and 6 show process drawings of the press working. First, as shown in FIG. 5A, the printed wiring board 10 is placed on the upper surface of the lower mold 20.

  The printed wiring board 10 includes a first printed circuit board (B) 14b subjected to pushback processing in the immediately preceding press, and a first printed circuit board subjected to pushback processing in the second previous press. (A) 14a and the second printed circuit board (A) (not shown) subjected to the push-back process in the immediately preceding press are fitted in the original holes of the printed wiring board. Yes.

  The printed wiring mother board 10 is conveyed in the right direction in FIG. 5A after the immediately preceding press is finished, and the portion where the pushback processing is performed in the first pushback region 3 in the immediately preceding pressing process and the second The parts on which the pushback process is performed in the pushback region 7 are placed on the upper surface of the lower mold 20 so as to come on the second pushback region 7 and the outer shape cutting part 5, respectively. The printed wiring board 10 is positioned by inserting positioning pins 32 a to 32 f provided on the upper surface of the lower mold 20 into pushback reference holes provided in the printed wiring board 10.

  When the upper die 50 is lowered from this state, first, the tips of the first upper die strippers 60a and 60b, the second upper die strippers 62c to 60e, and the third upper die stripper 60f come into contact with the upper surface of the printed wiring board 10. These move upward along the first slide spaces 62a and 62b, the second slide spaces 62c to 62e, and the third slide space 62f, respectively.

When the upper die 50 is further lowered, as shown in FIG. 5B, in the first pushback region 3, the first lower punches 22a and 22b push the first upper die strippers 60a and 60b upward, A new first printed circuit board (C) 14c is punched out.
Similarly, in the second pushback region 7, the second lower punches 22c to 22e push the second upper mold strippers 22c to 22e upward, so that they are lateral to the first printed circuit board (B) 14b. A new second printed circuit board (B) (not shown) is punched out.
At this time, the holder 54d prints after the first printed circuit board (C) 14c and the second printed circuit board (B) (not shown) are punched against the elastic force of the elastic member 28. The wiring mother board 10 and the lower mold stripper 24 are pushed down.

  On the other hand, on the outer cutting part 5 side, the second lower punch 22f pushes up the third upper mold stripper 60f, whereby the mounting substrate 18 is punched out. Further, as the third upper mold stripper 60f is pushed upward, from the lower surface of the third upper mold stripper 60f, the component hole forming pins 82, 82..., The slit forming pins 84, 84. And the tip of the sub reference hole forming pin 86b protrudes into the first printed circuit board (A) 14a and the second printed circuit board (A) (not shown), respectively, component holes (through holes), slits, In addition, a reference hole (through hole) and a sub reference hole (through hole) are formed.

Next, when the upper die 50 is raised after punching is finished, the elastic members 28, 28... Are moved together with the lower die stripper 24 by the restoring force as shown in FIG. Push up. At this time, on the first pushback region 3 and the second pushback region 7 side, the first pressing plate 70a and the second pressing plate 70b urged by the elastic members 74, 74,. Then, the first upper mold strippers 60a and 60b and the second upper mold strippers 60c to 60e are pushed downward.
Therefore, when the upper die 50 is completely detached from the lower die 20, as shown in FIG. 6A, the first printed circuit board (C) 14c and the second printed circuit board (B ) (Not shown) is fitted in the original hole of the printed wiring board 10.

  On the other hand, the downward biasing force does not act on the third upper mold stripper 60f on the outer cutting area 7 side. Therefore, as shown in FIG. 6 (a), even if the upper mold 50 is detached from the lower mold, the third upper mold stripper 60f does not descend, and the punched mounting board 18 remains in the third slide space 62f. Once held. At this time, the knockout bushes 76, 76... Protrude from above the upper mold base plate 52.

  When the upper die 50 is further raised and the upper die 50 approaches the vicinity of the top dead center, the pressing means (not shown) provided in the press machine eventually presses the knockout bushes 76, 76. The third pressing plate 70c pushes down the third upper mold stripper 60f via the second pressing pin 66b. Therefore, when the upper die 50 reaches the top dead center, as shown in FIG. 6B, the third upper die stripper 60f is pushed down to the original position, and at the same time, the mounting substrate 18 is moved to the third slide. The space 62f is pushed out.

  Thereafter, the first printed circuit board (C) 14c newly punched is directly below the second pushback region 7 and is punched by the immediately preceding press, and the first printed circuit board (B) 14b and The printed wiring board 10 is conveyed rightward so that the newly punched second printed circuit board (B) (not shown) is located directly below the outer cutting area 5. Then, according to the same procedure as described above, the mounting board including the first printed circuit board and the second printed circuit board punched out by the press of the next printed circuit board and the previous press. Is repeated as many times as necessary.

Next, the manufacturing method of the mounting board | substrate using the metal mold | die shown in FIGS. 1-4 is demonstrated. FIG. 7 shows the process diagram.
First, a printed wiring board 10 in which pushback reference holes 12, 12... Are formed in advance at predetermined positions is prepared. Next, as shown in FIG. 7A, the positioning pins 32a and 32b erected on the lower mold 20 are inserted into the pushback reference holes 12 and 12 formed in the first row of the printed wiring board. The first pushback process is performed in the pushback region 3 (first step). As a result, the first printed circuit boards (A) 14 a and 14 a are formed on the mother board 10.

  Next, as shown in FIG. 4 (b), the printed wiring board so that the two first printed circuit boards (A) 14a and 14a subjected to the pushback process are on the second pushback area 7. 10 is conveyed. The positioning is performed by inserting the positioning pins 32c and 32e and the positioning pins 32a and 32b into the pushback reference holes in the first row and the second row of the printed wiring board 10, respectively.

  When pressing is performed in this state, in the first pushback region 3, new first printed circuit boards (B) 14 b and 14 b are pushed back, and at the same time, in the second pushback region 7, The second printed circuit boards (A) 14a ′ and 14a ′ are adjacent to the side of the first printed circuit boards (A) 14a and 14a pushed back by the press of the press and spaced apart from each other by a predetermined distance. ... pushback processing is performed (second step).

  Next, as shown in FIG. 4 (c), a total of five printed circuit boards (first printed circuit boards (A) 14a and 14a and second printed circuit boards (A) 14a ′) subjected to pushback processing. , 14a '...) is conveyed on the outer cutting area 5, and the printed wiring board 10 is conveyed so that the two first printed circuit boards (B) 14b, 14b are on the second pushback area 7. To do. For positioning, the positioning pins 32e and 32f, the positioning pins 32c and 32d, and the positioning pins 32a and 32b are inserted into the pushback reference holes in the first, second, and third rows of the printed wiring board, respectively. By doing.

  When pressing is performed in this state, in the first pushback region 3, pushback processing of new first printed circuit boards (C) 14c and 14c is performed. Further, in the second pushback region 7, a new second circuit is formed adjacent to the side of the first printed circuit boards (B) 14b and 14b formed by the immediately preceding press and at a predetermined interval. Of the printed circuit boards (B) 14b ′, 14b ′,. Further, at the same time, in the outer cutting area 7, the first printed circuit boards (A) 4a and 14a formed by the previous press and the second printed circuit board (A) formed by the immediately preceding press are used. The mounting substrate 18 including 14a ′, 14a ′,... Is cut out.

In the same manner, when the printed wiring board 10 is stepped and the push-back processing of the first printed circuit board and the second printed circuit board and the cutting out of the mounting board are repeated, the printed wiring board is repeated. The mounting substrate 18 can be cut out sequentially from 10.
Further, after the electronic component is automatically mounted and soldered on the mounting substrate 18 obtained, the first printed circuit boards 14a and 14a are cut by breaking the frame portion of the mounting substrate 18 and the like. And the second printed circuit boards 14a ′, 14a ′.

  The printed wiring mother board processing mold according to the present invention includes a first pushback area 3 and a second pushback area 7 that are step-feed along the mother board conveyance direction. Since they are arranged at a distance corresponding to the feed width, printed circuit boards arranged in the lateral direction (right side or left side with respect to the transport direction) can be punched alternately. Therefore, even if the distance between the printed circuit boards in the lateral direction is narrow, there is little risk of damage to the mother board. In addition, since it is not necessary to form a through hole adjacent to the mold, even when the printed circuit board is opposed through a relatively long straight portion and at a relatively narrow interval, A reduction in the strength and life of the mold can be suppressed.

  Furthermore, since the distance between the printed circuit boards can be reduced to the ultimate, more printed circuit boards can be built in the mother board having a certain size. Therefore, the material yield is greatly improved. Moreover, since it is not necessary to use a plurality of molds, the mold cost can be reduced. In addition, even when it is necessary to perform pushback processing and outer shape cutting using a single press machine, workability is improved because a mold replacement operation is unnecessary. Furthermore, since the total number of presses is reduced, productivity can be improved and processing costs can be reduced.

Further, after a predetermined number of pushback processes have been performed, the portion is transferred onto the outer cutting area 5 and the outer shape of the mounting substrate is cut, so that the pushed back area is sequentially separated from the mother board. Therefore, every time the outer shape is cut, the internal stress of the mother board is released, and the outer shape can be easily cut without being affected by the warp of the mother board.
In particular, when using a knockout means that once holds the processed plate cut out from the base plate with the upper die as the outer shape cutting means and then pushes the processed plate out of the upper die after the upper die is detached from the base plate, internal stress The relaxation of this appears remarkably. Therefore, the outer shape can be easily cut as compared with the case where the pushback processing and the outer shape cutting are performed using separate molds.

  In addition, in order to simultaneously perform the push-back processing and the outer shape cutting process by the knockout method with one press, the first upper mold strippers 60a and 60b and the second upper mold strippers 60c to 60e for pushback, and the outer shape cutting are performed. Therefore, it is necessary to cause the third upper mold stripper 60f to perform individual operations. In the present embodiment, the pressing plate for pressing the upper mold stripper is divided into the first pressing plate 70a, the second pressing plate 70b, and the third pressing plate 70c. It can be done easily.

Further, the mother board machining die 1 according to the present embodiment includes a slit forming means for forming one or more slits in the blank portion of the machined board when cutting the outer shape. The internal stress introduced into the plate is also relaxed. Therefore, the warp generated in the processed plate can be reduced to a level that does not hinder subsequent processes.
Furthermore, if the mother board is a printed wiring mother board, after mounting the parts with the self-equipment machine, either break the frame part of the work board along the slit, or simply press the product board, Product plate can be easily removed, improving workability.

  Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the present invention. For example, the above embodiment includes the first pressing plate 70a for pressing the first upper mold strippers 60a and 60a and the second pressing plate 70b for pressing the second upper mold strippers 60c to 60e. However, the first pressing plate 70a and the second pressing plate 70b are integrated so that the first upper mold strippers 60a and 60a and the second upper mold strippers 60c to 60d are pressed downward by one pressing plate. May be.

  The mold for processing a mother board according to the present invention can be used as a mold for manufacturing a mounting board from a printed wiring board. Moreover, the manufacturing method of the processed board which concerns on this invention can be used as a manufacturing method of the board | substrate for mounting. Furthermore, the manufacturing method of the product board which concerns on this invention can be used as a manufacturing method of a printed circuit board.

It is a top view of the lower mold | type of the metal mold | die for mother board processing which concerns on this invention. 2A is a cross-sectional view taken along line A-A ′ of FIG. 1, and FIG. 2B is a cross-sectional view taken along line B-B ′ of FIG. It is a bottom view of the upper mold | type of the metal mold | die for mother board processing concerning this invention. 4A is a cross-sectional view taken along line A-A ′ of the upper mold shown in FIG. 3, and FIG. 4B is a cross-sectional view taken along line B-B ′ of FIG. It is process drawing which shows the processing method of the mother board using the metal mold | die for mother board processing shown in FIGS. FIG. 6 is a continuation of the process diagram shown in FIG. 5. It is process drawing which shows the manufacturing method of the processed board using the metal mold | die for mother board processing concerning this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Metal mold | die 3 for processing a 1st push back area | region 5 External cutting area | region 7 2nd push back area | region 10 Printed wiring mother board (mother board)
14a-14c 1st printed circuit board (1st product board)
14a ', 14b' Second printed circuit board (second product board)
18 Mounting board (processed board)
20 Lower mold 50 Upper mold 60a, 60b First upper mold stripper (first pushback means)
60c to 60d Second upper mold stripper (second pushback means)
60f Third upper mold stripper (outline cutting means)
70a First pressing plate 70b Second pressing plate 70c Third pressing plate 74 Elastic member 76 Knockout bush 84 Slit forming pin

Claims (8)

1st for performing the back-back process which is arrange | positioned in the upstream with respect to the conveyance direction of a motherboard, punches out the 1st product board from the said motherboard, and inserts the punched 1st product board into the original hole. A first pushback region comprising pushback means;
The first pushback process is performed on the downstream side of the first pushback region, and a second product plate is punched from the mother plate, and the punched second product plate is inserted into the original hole. A second pushback region comprising two pushback means;
An outer cutting means is provided on the downstream side with respect to the second pushback region, and performs outer cutting for cutting the processed plate including the first product plate and the second product plate from the mother plate. With external cutting area,
The second pushback means is a side of the first product plate, and forms the second product plate in an unprocessed region on the right side or the left side with respect to the conveyance direction of the mother plate. Mold for processing base plate. The outer shape cutting means temporarily holds the processed plate cut out from the mother plate with an upper die of the mother plate processing mold, and after the upper die is detached from the mother plate, the processing from the upper die is performed. The mold for processing a mother board according to claim 1, further comprising knockout means for extruding the board. The first pushback means includes a first pressing plate for urging the first upper mold stripper that is loosely inserted into the lower surface of the upper mold of the mother board processing mold,
The second pushback means includes a second pressing plate for biasing the second upper mold stripper that is loosely inserted into the lower surface of the upper mold,
3. The mother board machining die according to claim 1 , wherein the outer shape cutting means includes a third pressing plate for extruding a third upper mold stripper that is loosely inserted into the lower surface of the upper mold when knocking out. . The outer shape cutting region, the first push-back area or pre-Symbol second pushback region is further provided with a slit forming means for forming one or more slits in the margin around the working plate mother plate processing mold according to any of until claim 1 or et 3. A method of manufacturing a working plate using the mother plate processing mold according to any one of the claims 1 or et 4 or,
(A) In the first pushback region, the first product plate (A) is punched from the mother plate using the first pushback means, and the punched first product plate (A) is restored to the original. A first step to fit into the hole;
(B) transporting the mother plate so that the region where the first product plate (A) is formed is on the second pushback region;
In the first pushback region, the first product plate (B) is newly punched from the mother plate using the first pushback means, and the punched first product plate (B) is returned to the original hole. At the same time,
In the second pushback region, the side of the first product plate (A) pushed back in the immediately preceding press using the second pushback means, with respect to the conveying direction of the mother plate A second step of punching the second product plate (A) from the right or left unprocessed region and fitting the punched second product plate (A) into the original hole;
(C) The first product plate (A), the second product plate (A), and the first product plate (B) are on the outer cutting region and the second pushback region, respectively. Transport the mother board so that it comes to
In the first pushback region, the first product plate (C) is newly punched from the mother plate using the first pushback means, and the punched first product plate (C) is returned to the original hole. In the second pushback region, the base plate is a side of the first product plate (B) pushed back in the immediately preceding press using the second pushback means. At the same time, the second product plate (B) is punched from the unprocessed region on the right side or the left side with respect to the conveyance direction, and the punched second product plate (B) is fitted into the original hole.
A third step of cutting the processed plate including the first product plate (A) and the second product plate (A) from the base plate using the outer shape cutting means in the outer shape cutting region;
The manufacturing method of the processing board provided with. The first push-back region, the in the second push-back area or before Kigaikei cutting area, a slit forming step of forming one or more slits in the margin around the working plate using the slit forming means The manufacturing method of the processed board of Claim 5 further provided.   The method for manufacturing a processed plate according to claim 5 or 6, wherein an interval between the first product plate and the second product plate is 2.0 times or less of a thickness of the base plate. The manufacturing method of the product board which isolate | separates the said product board from the processed board manufactured using the method in any one of Claim 5-7.

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