JP2001219396A - Metal mold for printed wiring other board work, and working method of printed wiring mother board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce cost of a printed circuit board by solving a problem to cause increase of cost of a metal mold and mandays in case of press-working a printed wiring mother board. SOLUTION: Two sides crossing with each other of a printed wiring mother board 20 are cut in an L shape by using an outside cutter 36 showing an L shape and free to be divided at an L shape intersection and an inside cutter 62 while holding the printed wiring mother board by a pushing plate 50 and the inside cutter 62. In this case, drilled holes 66a, 66b... are erected on a pin holder 42, and it is favorable to drill a standard hole and a sub-standard hole simultaneously with cutting of an outline. Additionally, press-working of one side half of the printed wiring mother board 20 is carried out by erecting a port 92 only on either one of the left and right sides against a delivering direction of the printed wiring mother board 20 in case of punching a printed circuit board 22 from the printed wiring mother board 20, and press-working of the other side half of the printed wiring mother board 20 is carried out after reinstalling the post 92 on the other side.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold for processing a printed wiring board and a method for processing a printed wiring board, and more particularly, to a method for punching a printed circuit board from a printed wiring board on which circuits are printed. In order to be able to automatically mount electronic components using a printed wiring board processing die and an automatic insertion machine, trim the outer shape of the printed wiring board into which the punched printed circuit board has been fitted, and The present invention relates to a mold for processing a printed wiring board for forming a reference hole and a sub-reference hole for automatic mounting, and a method for processing a printed wiring board using these dies.

[0002]

2. Description of the Related Art In recent years, with the miniaturization of electronic devices, the demand for miniaturization and modification of printed circuit boards used in electronic devices is increasing. On the other hand, electronic component automatic mounting machines such as chip mounters and automatic insertion machines for mounting electronic components on a printed circuit board (hereinafter referred to as “self-equipped machines”) have a large work size due to their transportation. Has upper and lower limits. In addition, the external shape of the work used in the self-equipped machine is required to be substantially rectangular, that is, at least one side is a straight line, and all or a part of the side perpendicular to the side is a straight line. You.

In order to mount electronic components on a small and irregularly shaped printed circuit board by using a self-contained machine, a plurality of printed circuit boards are mounted on a printed wiring board having a size that can be conveyed by the self-contained machine. A method is used in which a board is formed, a printed circuit board is temporarily fixed to an original printed wiring board using a V-cut method, a pushback method, or the like, and the board is passed through a self-installed machine in this state. . In particular, the pushback method
This is an effective method when electronic components are automatically mounted on odd-shaped printed circuit boards.

When a plurality of printed circuit boards are formed on a printed wiring board by using the pushback method, one of the following methods is generally used. That is, the first method is a method of simultaneously punching all the plurality of printed circuit boards and cutting the four sides of the printed wiring board. In this case, for punching and cutting, a reference hole and a sub-reference hole serving as a reference for automatic mounting are previously formed on a printed wiring board on which a plurality of circuits are printed using an NC hole opening machine or the like. Is generally performed on the basis of

[0005] A second method is to punch a printed circuit board while shifting a printed wiring board by using a mold capable of punching one to several printed circuit boards per press. In this method, four sides of a printed wiring board on which a printed circuit board is fitted are simultaneously cut using a mold. In this case, the punching is performed on a printed wiring mother board on which a plurality of circuits are printed, by using an NC drilling machine or the like to form a pushback reference hole in advance, and using the pushback reference hole as a reference. Also, the cutting
Similarly, the drilling is generally performed using an NC drilling machine or the like with reference to a reference hole, a pushback reference hole, or the like formed in advance on the printed wiring board.

[0006]

The first method has an advantage that punching of a plurality of printed circuit boards and cutting of four sides of a printed wiring board can be performed in one step. However, since the die requires the same number of punched parts (punches, component hole pins, etc.) as the printed circuit printed on the printed wiring board, the number of printed circuit boards formed on the printed wiring board is limited. When the number of molds is increased, there is a disadvantage that the cost of the mold becomes extremely high. Also, even if the shape of the printed circuit board is the same, if the size of the printed wiring board is different,
There was a problem that different molds were required.

On the other hand, the second method has an advantage that the die cost is low because only one or several punched portions are required regardless of the number of printed circuits printed on the printed wiring board. Even if the size of the printed wiring board is different, as long as the shape of the printed circuit board is the same,
There is an advantage that the same die can be used for punching a printed circuit board. However, if the size of the printed wiring board changes, a separate outer mold for cutting the outer shape of each printed wiring board having a different size is required separately, resulting in a problem of increased costs.

Further, in the case of punching a printed circuit board while shifting the printed circuit board, when the size of the printed circuit board is less than half the minimum size of the printed circuit board that can be used in the self-equipped machine, In order to increase the allowance for the printed circuit board, it is common to punch the printed circuit board from the printed wiring board in a plurality of rows.

On the other hand, as illustrated in FIG. 9, a die 10 for punching a printed circuit board is composed of an upper die 12 and a lower die 14 provided with positioning guide pins 16 and 16. In general, posts 18, 18... For guiding the upper mold 12 to the lower mold 14 are provided upright at the four corners of the 14. The posts 18, 18,... Are usually in the form of bolts, and have a structure in which the distal end is inserted from below the lower die 14 and cannot be pulled upward by the flange portion 19.

Therefore, when a printed circuit board is punched in a plurality of rows from a printed wiring mother board, FIG.
As shown in FIG. 1, first, the lower die 1 is inserted into the push-back reference holes 24, 24 formed in the printed wiring board 20 in advance.
4 are punched out from one half of the printed wiring mother board 20 with reference to the push-back reference holes 24, 24, and then FIG. As shown in b), the printed circuit board 2 is mounted on the other half of the printed wiring board 20.
It is general to punch out 2, 22, ....

However, for this purpose, as shown in FIG. 10, the distance between the posts 18a and 18b located on the left side with respect to the feed direction of the printed wiring board 20 and the posts 18c and 18d located on the right side is increased. A mold is required. As a result, compared to the size of the printed circuit board 22,
There is a problem that a large mold is required, which causes an increase in mold cost. Further, since the weight of the mold also increases, there is a problem that workability is reduced.

Further, in order to automatically mount an electronic component using a self-contained machine, it is necessary to provide a reference hole and a sub-reference hole, and this hole is conventionally formed by using an NC drilling machine or the like. Had been done. However, drilling using an NC drilling machine or the like involves a large time loss, which causes a problem of increasing the cost of the printed circuit board.

An object of the present invention is to solve the above-mentioned problems which cause an increase in die cost and man-hour when press-working a printed wiring board, and to reduce the cost of a printed circuit board. It is to plan.

[0014]

SUMMARY OF THE INVENTION In order to solve the above problems, a die for processing a printed wiring motherboard according to the present invention is used for cutting two intersecting sides of a printed wiring motherboard at right angles. A pair of blades, a pressing plate for holding the printed wiring board when the intersecting two sides are cut at a right angle, and a pair of blades and the pressing plate for detachably attaching the pair of blades and the pressing plate. And a pair of base plates.

According to the printed wiring board processing die of the present invention having the above configuration, two crossing sides of the four sides of the printed wiring board can be cut at a right angle by the pair of blades. . Further, at the time of cutting, an uneven force is applied to the printed wiring mother board, but the printed wiring mother board is held by the pressing plate, so that the linearity of the two sides to be cut is maintained. Therefore, in one process, the printed wiring mother board can be finished to an outer shape that can be transported by the self-equipment. Furthermore, if the length of the blade is sufficiently longer than the basic dimension of the printed wiring board, even if the dimensions of the printed wiring board are different, cutting of two intersecting sides using the same mold can be performed. Can be performed, and the mold cost can be reduced.

The second aspect of the present invention relates to a method for processing a printed wiring board, wherein a pushback reference hole is used as a reference.
A push-back step of punching a printed circuit board from a printed wiring board and immediately inserting the punched printed circuit board into an original hole, and holding the printed wiring board while holding the push-back reference hole. As a reference, a press step of cutting two intersecting sides of the outer shape of the printed wiring board at a right angle is provided.

According to the method of processing a printed wiring board according to the present invention having the above-described configuration, two sides intersecting the printed wiring board are cut at right angles while holding the printed wiring board by the pressing plate. Therefore, in one process, the printed wiring mother board can be finished to an outer shape that can be transported by the self-equipment. Further, since the outer shape processing of the printed wiring mother board is performed with reference to the pushback reference hole, positioning is easy, and the number of steps required for cutting the outer shape can be greatly reduced.

A third aspect of the present invention is a die for processing a printed wiring board, comprising an upper mold and a lower mold for punching a printed circuit board from the printed wiring board, and an upper mold and a lower mold. At least one pair of post holes provided at opposing positions, one or more posts having a straight shape that can be inserted into all of the post holes, and for each of the post holes, the post inserted into the post hole And a fixing means for fixing the object.

According to the printed wiring board processing die according to the present invention having the above-described configuration, post holes are provided at opposing positions of an upper die and a lower die for punching a printed circuit board, and Since the post has a straight shape, the post can be attached to an arbitrary post hole without detaching the upper die and the lower die from the press. Further, since the fixing means is provided for each post hole, the inserted post can be fixed to an arbitrary post hole. for that reason,
It is possible to easily carry out the work of removing or replacing the post, which is an obstacle when the printed circuit board is pressed.

A fourth aspect of the present invention is a method of processing a printed wiring board, using a mold having a post provided on one of the right and left sides with respect to the feed direction of the printed wiring board. A first pressing step of punching a printed circuit board from one half of the printed wiring mother board, a post replacing step of removing the post and replacing it with the other side of the mold; Using the mold,
A second pressing step of punching a printed circuit board from the other half of the printed wiring board.

According to the method of processing a printed wiring board according to the present invention having the above-described configuration, a post is erected only on one of the right and left sides of the mold, and pressing of one half of the printed wiring board is alternately performed. Since it is performed, it is possible to press the printed wiring mother board having a width dimension approximately twice as large as the interval between the right and left posts. Therefore, even when the width of the printed wiring board is larger than the size of the printed circuit board, a small-sized mold can be used, and the mold cost can be reduced. In addition, since it is not necessary to attach and detach the mold, the number of steps can be reduced.

[0022]

Embodiments of the present invention will be described below in detail with reference to the drawings. 1 and 2
Next, a mold 30 for processing a printed wiring board according to the first embodiment of the present invention (hereinafter referred to as a “mold 30”).
1 shows a plan view and a cross-sectional view of FIG. Mold 3 according to the present embodiment
0 comprises an upper mold 32 and a lower mold 56.

As shown in FIG. 1, the upper die 32 includes an upper die base plate 34, an outer blade 36, a pin holder 42, and a pressing plate 50, and the outer blade 36, the pin holder 42, and the pressing plate 50. Can be detachably attached to the upper base plate 34.

The outer cutter 36 has an L shape and can be divided into two straight portions 36a and 36b at the intersection of the L shape. Straight line part 3 constituting the short side part of L-shape
6a, dowel pin insertion holes 36c.
d ... are provided. Straight portion 36a of the outer cutter 36
Inserts a knock pin (not shown) erected on the upper base plate 34 into a knock pin insertion hole 36 c.
.. are fixed to the upper mold base plate 34 by bolts (not shown) inserted from. Similarly, the linear portion 36b constituting the long side portion of the L-shape is provided with knock pin insertion holes 36c and bolt holes 36d. Further, in the linear portion 36b, convex portions 36e, 36e,... For forming convex notches in the printed wiring board.
Is provided.

The pin holder 42 is provided adjacent to the inside of the outer cutter 36. Since the height is lower than the height of the outer blade 36, a space of a predetermined size is formed at the tip of the pin holder 42. The pin holder 42 has an L-shape, like the outer blade 36, and has two straight portions 42a, 42a at the intersection of the L-shape.
b. Linear portion 42a forming the short side portion of L-shape and linear portion 42 forming the long side portion
b are provided with knock pin insertion holes 42c and bolt holes 42d, respectively. In addition, the linear portion 42a
At the approximate center and right and left of the straight line portion 42b, respectively.
A pin holder attaching / detaching tap 42e penetrating the straight portions 42a, 42b is provided.

The linear portions 42a, 42b of the pin holder 42
Is designed so that the knock pins 44 erected on the upper base plate 34 are inserted into the knock pin insertion holes 42c and fixed to the upper base plate 34 by bolts 46 inserted from the bolt holes 42d. Also, the linear portions 42a, 42b
When removing the bolt, after removing the bolt 46, a detaching bolt (not shown) may be inserted into the pin holder detaching tap 42e, and the detaching bolt may be screwed. When the detachment bolt is screwed in, the tip protrudes from the back surface of the linear portions 42a and 42b and presses the upper die base plate 34, so that the linear portions 42a and 42b can be easily removed from the knock pin 44.

The straight portions 42a and 42b are provided with a plurality of holes 42g for piercing pins, in which piercing pins (not shown) can be respectively erected.
Here, the perforation pin standing holes 42g are provided on the dashed line shown in FIG. 1A, but the number thereof can be arbitrarily determined according to the use of the mold 30. Further, the intervals may be equal intervals or may be different.

Of these pierced pin standing holes 42g, L
A piercing pin for piercing a reference hole is erected in the piercing pin erected hole 42g located at the intersection of the character. In addition, when the printed wiring mother board is mounted on the self-installed machine, a sub-reference hole is required in addition to the reference hole. Also, one or more drilling pins for drilling the sub-reference hole are provided upright.

In this case, each piercing pin erect hole 42g is provided.
... may have the same length or different lengths. In particular, when piercing pins of different lengths are erected, as described later, without changing the piercing pins, only by changing the press stroke,
There is an advantage that the position and / or number of the reference holes and / or sub-reference holes can be changed.

Further, in the case where the printed wiring mother board is divided from the corners of the convex notch by the V-cutting process described later, the holes 42g... It is good to set up a perforation pin. The holes formed by the perforated pins serve as reference holes of the printed wiring board after being cut along the V-cut.

The pressing board 50 is for holding the printed wiring board when cutting the printed wiring board.
The push plate 50 has a plurality of taps 50a passing therethrough.
... are provided. The tips of a plurality of bolts 52 to be inserted from the back surface of the upper die base plate 34 are screwed into the taps 50a, and the pressing plate 50 is supported by the bolts 52. In this case, the height of the pressing plate 50 when supported by the bolts 52 is desirably equal to or higher than the height of the outer blade 36. The pressing plate 50 and the upper base plate 3
4, a plurality of urethane rubbers 54 are interposed.

Since the bolts 52 are merely loosely inserted into the bolt insertion holes 34a of the upper die base plate 34,
When the pressing plate 50 is pressed, the bolts 52 slide upward along the bolt insertion ports 34a. When the pressing force on the pressing plate 50 is removed, the urging force of the urethane rubber 54.
Is pushed back downward.

As shown in FIG. 2, the lower mold 56 includes a lower mold base plate 58, a guide 60, and an inner cutter 62. The guide 60 and the inner cutter 62 are attached to and detached from the lower mold base plate 58. It can be freely attached. Further, the lower die base plate 58 is provided with an L-shaped scrap removing groove 58a for accumulating pieces of the cut printed wiring board.

The guide 60 includes the outer cutter 36 and the inner cutter 6.
This is for preventing the outer cutter 36 from escaping when the printed wiring mother board is cut into an L-shape according to 2. Guide 60
Has an L-shape, and can be divided into two linear portions 60a and 60b at the intersection of the L-shape. Each of the straight portions 60a and 60b has a dowel pin insertion hole 60c.
And bolt holes 60d are provided so that the straight portions 60a and 60b can be fixed to the lower base plate 58 by knock pins and bolts (not shown).

The inner cutter 62 has a quadrangular shape.
It is attached to the lower mold base plate 58 at a predetermined distance from the guide 60. The outer cutter 36 is inserted between the inner cutter 62 and the guide 60, as shown in FIG.
In (a), the portion indicated by arrow C indicates the printed wiring board
It is the "blade" part that cuts into a letter shape. Also, the inner cutter 6
The reason why 2 is rectangular is to provide a function as one pressing plate for holding the printed wiring board at the time of cutting.

The inner cutter 62 has a dowel pin insertion hole 62.
a, 62a, bolt holes 62b,..., and an inner blade detaching tap 62c penetrating the inner blade 62.
The inner cutter 62 inserts the knock pins 64 erected on the lower mold base plate 58 into the knock pin insertion holes 62a and fixes them to the lower mold base plate 58 by fixing bolts (not shown) inserted from the bolt holes 62b. It has become.
When removing the inner cutter 62, after removing the fixing bolt, a detachment bolt (not shown) may be inserted into the inner cutter detachment tap 62c, and the detachment bolt may be screwed.

The inner cutter 62 is provided with a concave portion 62d at a position where it engages with the convex portion 36e provided on the outer cutter 36, and the perforated pin standing hole 4 provided on the outer cutter 36 is provided.
2g ... (on the dashed line in FIG. 2A)
A plurality of insertion holes 62e for inserting the tips of the piercing pins are provided.
Is provided.

Further, on the upper surface of the inner cutter 62, positioning guide pins 62f, 62f are erected. The guide pins 62f, 62f may be provided upright at positions corresponding to any of the plurality of pushback reference holes formed in the printed wiring board, but may be provided directly below the pin holder 42 attached to the upper base plate 34. It is preferable to set up. If the guide pins 62f, 62f are erected directly below the pin holder 42, the guide pins 62f do not come into contact with the upper mold 32 at the time of press working. Therefore, it is necessary to separately provide holes in the upper mold 32 for protecting the tips of the guide pins 62f, 62f. There is no advantage.

Next, the operation of the mold 30 shown in FIGS. 1 and 2 will be described. The mold 30 according to the present embodiment
Since the outer blade 36 and the inner blade 62 having the character shape are provided, two intersecting sides of the printed wiring board can be cut simultaneously and at a right angle. Further, the printed wiring mother board is held by the pressing plate 50 and the inner cutter 62,
In addition, since the lateral movement of the outer cutter 36 is regulated by the guide 60, the linearity of the two cut edges is also maintained. Therefore, in one process, the printed wiring mother board can be finished into a shape that can be transported by the self-equipment.

If the lengths of the outer blade 36 and the inner blade 62 are sufficiently longer than the basic dimensions of the printed wiring board, even if the printed wiring boards have different dimensions,
The same mold 30 can be used to cut two intersecting sides. Therefore, it is not necessary to prepare a mold having a different size every time the size of the printed wiring mother board is different, and the mold cost can be greatly reduced.

If the L-shaped outer blade 36 is an integral body, the cost of manufacturing the mold is high. However, if the outer blade 36 is formed to be dividable at the intersection of the L-shape, the outer blade 36 is formed using a milling machine or the like. Can be manufactured, and the die cost can be greatly reduced. Also, repair of the mold is easy, and maintenance costs can be reduced.

In the case where the required external dimensions of the printed wiring board are small, if the printed circuit board is punched from the small printed wiring mother board using the push-back method and the external shape is cut, the material loss is usually lost. And the number of printed circuit boards per material is reduced. In addition, the number of printed wiring mother boards flowing in the process also increased,
Accordingly, the number of steps increases.

On the other hand, even when the required size of the printed wiring board is small, a large printed wiring board is used, and after a large number of printed circuit boards are punched out of the board, the printed wiring board is projected to a position where it is engaged with each other. When the outer shape is cut using the outer cutter 36 and the inner cutter 62 provided with the portion 36e and the concave portion 62d, the cut of the outer shape is simultaneously performed with one of the cut two sides of the printed wiring mother board. Notches can be provided. If the printed wiring board is cut along the notch, a small-sized printed wiring board can be efficiently obtained, and the number of printed circuit boards per material increases.

If a punching pin is set up on the pin holder 42 and pressed in this state, the reference hole and / or the sub-reference hole can be formed simultaneously with the cutting of the outer shape of the printed wiring board. Also, a drilling step using an NC drilling machine or the like is not required.

Further, if the length of the piercing pin provided on the pin holder 42 is changed, the position and / or the number of piercing the reference holes and / or sub-reference holes can be changed only by changing the press stroke. Therefore, the removal of the pin holder 42 and the replacement of the perforated pins become unnecessary,
Man-hours can be greatly reduced.

Next, an example of a method for processing a printed wiring board using the mold 30 shown in FIGS. 1 and 2 will be described. FIG. 3 shows the process diagram. In FIG. 3, for easy viewing, the pressed plate 50 is indicated by a virtual line (two-dot chain line), and only the lower mold 56 is illustrated in a cross-sectional view.

In this case, as shown in FIG. 3, a total of four perforation pins 66a, 66a are
The mold 30 on which 6b, 66c, and 66d were erected was used.
Of these, the piercing pin 66a erected at the left end is for making a reference hole in the printed wiring board 20 and has substantially the same height as the outer cutter 36.

On the other hand, the perforation pins 66b, 66c, 66d
Are for drilling sub-reference holes, respectively.
Those having different lengths were used. That is, the piercing pin 6
The piercing pin 66b located on the right side of 6a has the shortest length, and the piercing pin 66c located on the right side has a longer length than the piercing pin 66b and a shorter length than the piercing pin 66a. . Also, the piercing pin 6 located at the right end
6d has substantially the same length as the perforation pin 66a.

Further, in the example shown in FIG. 3A, the width of the printed wiring board 20 is larger than the distance from the perforating pins 66a to the perforating pins 66c, and the perforated pins 66a to 66d are formed. The one smaller than the distance to was used.

First, as shown in FIG. 3 (a), the printed wiring mother board 20 from which a printed circuit board (not shown) has been punched out and fitted into the original hole by the pushback method is put into a lower mold 56. Set to. At this time, a guide pin 62f erected on the surface of the inner cutter 62 is inserted into a push-back reference hole previously opened in the printed wiring board 20,
If 62f is inserted, positioning can be easily performed.

Next, as shown in FIG.
Is lowered. Since the height of the pressing plate 50 is equal to or greater than the height of the outer blade 36, before or at the same time as the outer blade 36 contacts the printed wiring mother board 20, the height between the pressing plate 50 and the inner blade 62 is increased. The printed wiring board 20 is held. Further, when the upper die 32 is lowered, the outer shape of the printed wiring board 20 is reduced by the outer cutter 36 and the inner cutter 62.
Cut into a letter shape. At this time, an uneven force is applied to the printed wiring board 20, but the pressing board 50 and the inner cutter 62 are not applied.
As a result, the printed wiring board 20 is sandwiched, and the escape of the outer blade 36 is suppressed by the guide 60, so that the two intersecting sides of the printed wiring board 20 can be cut at a right angle and linearly.

The outer blade 36 is connected to the printed wiring board 2
At the same time, the perforation pin 66a also comes into contact with the printed wiring board 20, so that the reference hole is perforated simultaneously with the cutting of the outer shape. On the other hand, the perforation pins 66b and 66c
At this point, the perforation pins 66b and 6
No perforation by 6c is performed.

When the upper mold 32 is further lowered, FIG.
As shown in (c), the perforation pin 66c comes into contact with the printed wiring board 20 and the perforation pin 66c perforates the sub-reference hole. Thereafter, when the upper die 32 is raised, the printed wiring mother board 20 in which the outer shape is cut and the reference hole and the sub reference hole are punched can be obtained. Note that FIG.
If the upper die 32 is further lowered from the state shown in (c), the second sub-reference hole can be pierced by the piercing pin 66b.

According to the above-described processing method, since the outer shape of the printed wiring board 20 and the drilling of the reference hole and the sub-reference hole can be simultaneously performed, the shape of the printed wiring board 20 can be reduced in only one process. It can be finished into a shape that can be transported by a self-contained machine. Further, there is no need to previously drill the reference hole and the sub-reference hole using an NC drilling machine or the like. Therefore, the number of steps in the pressing process can be reduced, and the manufacturing cost of the printed circuit board can be significantly reduced.

Further, only by changing the press stroke, the position and / or the position at which the reference hole and / or the sub reference
Alternatively, since the number can be changed, it is not necessary to remove the pin holder 42 and replace the perforated pins even if the shape, the number, and the like of the printed circuit boards to be manufactured are changed, and the number of steps can be greatly reduced.

Next, an example of another processing method using the mold 30 shown in FIGS. 1 and 2 will be described. When electronic components are automatically mounted on a printed circuit board using a self-contained machine, at least two intersecting sides of the four sides of the printed wiring board should be straight and intersect at right angles. If it is desired to cut both sides at a right angle, the following procedure may be used.

That is, as shown in FIG. 4 (a), the printed wiring mother board 20 in which a plurality of printed circuit boards 22 have been punched and fitted by the pushback method with reference to the pushback reference holes 24. In the same manner as above, the side 20a and the side 20b are simultaneously cut and the reference hole 20c and the sub-reference hole 20d are punched.
Next, as shown in FIG.
0 is turned 180 degrees, and the sides 20e and 20f are cut and the reference hole 20g is formed according to the same procedure as described above.
And drilling of the sub reference hole 20h.

When the outer shape is cut using such a method, the dimensional variation is larger than in the conventional method in which four sides are cut at the same time. However, the mounting accuracy of the electronic component by the self-equipment does not depend on the width dimension of the printed wiring board 20, and the reference hole 20 c or 20 g and each printed circuit board 22.
This dimensional variation does not pose a problem because of the positional accuracy between the two.

Next, an example of another processing method using the mold 30 shown in FIGS. 1 and 2 will be described. In general, the size of the printed wiring board that can be transported by the self-contained machine has an upper limit and a lower limit, and the value differs depending on the model. Therefore, in the case where the size of the printed wiring board that can be transported is small, a small printed wiring board corresponding to the size is prepared, and then the printed circuit board is punched. The number of take is reduced. In addition, the number of printed wiring boards to be processed also increases, and the number of steps required for processing increases.

Therefore, in such a case, the printed wiring mother board may be processed according to the following procedure. That is, as shown in FIG. 5 (a), a printed wiring board 20 having a size larger than the size that can be transported by the self-equipment is prepared, and a plurality of printed circuit boards 22 are punched by using a pushback method. And inset.

Then, the side 20a of the printed wiring board 20 is
And the side 20b are cut. At this time, by using the mold 30 in which the convex portion 36e and the concave portion 62d are provided on the outer blade 36 and the inner blade 62, respectively, two orthogonal sides are simultaneously cut and a convex notch is formed in the cut side. 24k is formed. In addition, a total of 4
The two perforating pins are erected, and at the same time as the cutting, the reference holes 20c and 20i are perforated near the corners of the printed wiring board 20 and the notch 24k, respectively.
i to predetermined positions from the sub reference holes 20d and 2d, respectively.
Drill 0j.

Next, as shown in FIG.
A V-cut 28 is inserted from the corner of the notch 24k formed in (2) (V-cut step), and the printed wiring mother board 20 is divided along the V-cut 28, whereby a printed wiring mother board having a small size can be obtained. According to such a method, since the printed wiring board 20 having a large size can be used, the number of steps can be reduced as compared with the case where a large number of printed wiring mother boards having a small size are used. Also, material loss is reduced,
The number of printed circuit boards per material also increases.

Before cutting, the printed wiring mother board may be turned 180 degrees and the remaining two sides may be cut. In this case, if the position of the pushback reference hole 24 is formed in advance vertically symmetrically, the notch 20k can be formed vertically symmetrically.

Next, a mold for processing a printed wiring board according to a second embodiment of the present invention will be described. In FIG.
Printed wiring motherboard processing mold 70 according to the present embodiment
(Hereinafter, this is referred to as “die 70”.) In FIG. 6, a mold 70 includes an upper mold 72 and a lower mold 8.
0 and a post 92.

The upper die 72 includes an upper die base plate 74 and four holders 76a to 76d. The uppermost holder 76a has an upper die stripper having the same shape as the outer shape of the printed circuit board to be punched. 78 is attached. The upper mold stripper 78 can move up and down in the holder 76a, and is urged downward by urging means (not shown). At the four corners of the holder 76a, post holes 76b for inserting the posts 92 are provided. Further, each post hole 76b is provided with a bolt hole 76c penetrating from the side surface of the holder 76a to the inner surface of each post hole 76b.

The lower die 80 includes a lower die base plate 82 and a lower die stripper 84. A punch 82a having the same shape as the outer shape of the printed circuit board to be punched is provided on the lower mold base plate 82 in a protruding manner. The lower die base plate 82 has a post hole 76b provided in the holder 76a.
Are provided at positions corresponding to... Through the lower die base plate. Also, each post hole 82
are provided with bolt holes 82c penetrating from the side surface of the lower die base plate 82 to the inner surfaces of the respective post holes 82b.

The lower stripper 84 includes a punch 82 a
The lower die stripper 84 can be moved up and down along the side wall surface of the punch 82a. The lower die stripper 84 is restricted from moving upward by a bolt 86 loosely inserted from below the lower die base plate 82, and a urethane rubber 88 inserted between the lower die base plate 82 and the lower die stripper 84. Urged upwards by In addition, the upper die stripper 84 includes:
The through holes 84b are provided at positions corresponding to the post holes 82b provided in the lower die base plate 82, respectively. Further, on the upper surface of the lower die stripper 84, guide pins 90, 90 used for positioning are erected.

As shown in FIGS. 6C to 6E, the post 92 has a straight shape and is inserted into any of the post holes 76b of the holder 76a and the post holes 82b of the lower mold base plate 82. It is possible. Both ends of the post 92 are flat, and the side surfaces near the upper end and the lower end of the post 92 have flat portions 92, respectively.
a, 92a are provided. The post 92 inserted into the post hole 76b... Or the post hole 82b.
A bolt 94 is screwed into the bolt hole 76c or the bolt hole 82c.
a is fixed by pressing a.

Next, the operation of the mold 70 shown in FIG. 6 will be described. In the mold 70 according to the present embodiment, the post 92 for guiding the upper mold 72 to the lower mold 80 at the time of pressing has a straight shape.
Can be removed from the press without any post holes 76
.. or the post holes 82b. Also, each post hole 76b.
2b are provided with bolt holes 76 for fixing the post 92.
or the bolt holes 82c are provided, so that the post 92 can be fixed to any of the post holes 76b or the post holes 82b by the bolt 94. Therefore, it is possible to easily perform the work of removing and replacing the post 92 that becomes an obstacle during the press working.

Since both ends of the post 92 are flat, even if the tip of the post 92 collides with the bottom of the post hole 76b, the tip of the post 92 and the bottom of the post hole 76b may be deformed. Few. Further, since the flat portion 92 a is provided on the side surface of the post 92, the post 92 can be securely fixed at the tip of the bolt 94.

Next, a method of replacing the post 92 provided in the mold 70 shown in FIG. 6 will be described. FIG. 7 shows an example of the process diagram. When the post 92 is fixed to the left post hole 82b of the lower mold base plate 82, first,
As shown in FIG. 7A, the bolt 94 is removed, and the post 92 is pulled out from below the lower mold base plate 82.

Next, as shown in FIG. 7B, the removed post 92 is inserted into a post hole 76b located on the right side of the holder 76a, and is fixed with a bolt 94. In this case, it is necessary to push the post 92 into the post hole 76b until the flat portion 92a on the side surface of the post 92 reaches the position of the bolt hole 76c.

Generally, the difference between the outer diameter of the post 92 and the inner diameter of the post hole 76b is small, and it is not easy to insert the post 92 into the post hole 76b. In such a case, the post 92 is lightly inserted into the post hole 76b, and a bolt (not shown) is screwed into the bolt hole 82c of the post hole 82b located immediately below the right post hole 76b. The tip of the bolt protrudes from the inner peripheral surface of the hole 82b. When the press machine is operated in this state to lower the entire upper die 72, the downward movement of the post 92 is regulated by the tip of a bolt (not shown) protruding from the inner peripheral surface of the post hole 82b. So, by the power of the press,
The post 92 can be easily inserted into the post hole 76b.

Next, as shown in FIG.
With the post 92 fixed in the post hole 76b on the right side of 6a, the upper mold 72 is lowered. In this case, post 92
The upper mold 72 is lowered until the flat portion 92a provided at the tip of the hole comes to the position of the bolt hole 82c of the post hole 82b.

Next, as shown in FIG. 7D, the bolt 94 screwed into the bolt hole 76c is removed, and the post 92 is fixed by screwing it into the bolt hole 82c. Finally, as shown in FIG. 7E, when the upper mold 72 is raised, the replacement of the post 92 is completed.

Next, an example of a method for processing a printed wiring board using the mold 70 shown in FIG. 6 will be described. FIG.
FIG. 5 is a process diagram showing a method of punching a printed circuit board from a printed wiring mother board over a plurality of rows using the mold 70 according to the present embodiment.

First, as shown in FIG. 8A, the posts 92 are erected in the post holes 82b, 82b of the lower die base plate 82 located on the left side in the feed direction of the printed wiring board 20. Next, from the left half of the printed wiring mother board 20 on which the printed circuits are printed over two rows, with reference to the pushback reference hole 24 previously opened,
The printed circuit boards 22 are punched in a line.

Next, as shown in FIG. 8B, the post 92 is replaced in the post holes 82b, 82b located on the right side of the lower die base plate 82 by using the above-described method. Next, the printed circuit boards 22 are punched in a row from the right half of the printed wiring board 20 with reference to the pushback reference holes 24.

According to such a method, it is possible to press the printed wiring mother board 20 having a width twice as large as the interval between the left and right post holes 82b. Therefore, a die having a smaller width than the printed wiring mother board can be used, so that die costs can be reduced. Further, even in the case where the shape of the printed circuit board 22 is the same and only the size of the printed wiring board 20 is different, the press working can be performed only by replacing the post 92, and the attaching and detaching of the mold 70 is unnecessary. Becomes Further, by replacing the post 92, the load applied to the mold 70 is equalized.
One-sided reduction of the mold 70 is suppressed, and the mold life is also improved.

Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the gist of the present invention. is there.

For example, the mold 30 according to the first embodiment
Can cut the outer shape and drill the reference hole and the sub-reference hole at the same time. However, when the reference hole and / or the sub-reference hole is previously formed in the printed wiring board 20 to be processed, Can remove the perforated pin from the pin holder 42 and cut only the outer shape.

Further, in the mold 30 according to the first embodiment, the inner cutter 62 is an integral member having a square shape, but this is divided into an L-shaped cutter and a square pressing plate. You may. Although the pin holder 42 is provided inside the outer cutter 36, if the inner cutter 62 can be moved up and down by using a biasing means and a perforation pin is erected on the inner cutter 62 side, the inner cutter 62 is provided. Can also be used as a pin holder. An outer blade 36 is attached to the upper mold 32, and an inner cutter 62 is attached to the lower mold 56. The upper cutter 32 is turned upside down, the inner cutter is attached to the upper mold 32, and the outer cutter is attached to the lower mold 56. You may make it attach.

In the above-described mold and processing method according to the first embodiment, the case where a small-sized printed circuit board which is difficult to be conveyed by a self-installed machine is manufactured has been mainly described. Even when the size of the printed circuit board is large enough to be conveyed by the self-contained machine, the outer shape is cut and the reference hole and / or the sub-reference hole is punched using the processing method according to the present invention. You can also.

Further, in the mold and the processing method according to the second embodiment, the case where the post 92 is fixed to the lower die 80 has been described. However, the post 92 may be fixed to the upper die 72. . Furthermore, the mold and the processing method according to the second embodiment are not limited to the case where the printed circuit board is punched and inserted from the printed wiring board using the pushback method, but the case where the printed circuit board is simply punched. However, the same effects as in the above embodiment can be obtained.

[0085]

The die for processing a printed wiring board according to the present invention comprises a pair of blades for cutting two intersecting sides at a right angle in the outer shape of the printed wiring board, and a right angle between the two intersecting sides. Since it is provided with a pressing plate for holding the printed wiring mother board when cutting into a pair and a pair of base plates for detachably attaching the pair of blades and the pressing plate, in one process, There is an effect that the printed wiring board can be finished to an outer shape that can be transported by the self-contained machine. In addition, even when the dimensions of the printed wiring mother board are different, the two intersecting sides can be cut using the same mold, and there is an effect that the cost of the mold can be reduced.

Further, if at least one of the pair of blades is formed in an L-shape and can be divided at the intersection of the L-shape, there is an effect that the manufacturing cost of the mold can be reduced. Further, when a pair of blades are provided with a convex portion and a concave portion for forming a convex cutout on the printed wiring mother board, and a perforated pin and a pin holder for erecting the same, cutting of the outer shape is performed simultaneously. There is an effect that a notch can be formed and a reference hole and / or a sub-reference hole can be formed.

Further, according to a second method of processing a printed wiring board according to the present invention, a printed circuit board is punched from a printed wiring board based on a pushback reference hole.
Immediately thereafter, a pushback step of inserting the printed circuit board punched into the original hole, and intersecting the outer shape of the printed wiring mother board with respect to the pushback reference hole while holding the printed wiring board. Since there is provided a pressing step of cutting two sides at right angles, there is an effect that the printed wiring mother board can be finished to an outer shape that can be transported by the self-mounting machine in one step.

At the same time, the two intersecting sides of the printed wiring board are cut at a right angle, and at the same time, one or more convex notches are formed on one of the cut two sides, and the corners of the notch are cut. If the printed wiring board is divided as a starting point, the number of printed circuit boards per material is increased, and the production cost of the printed circuit board can be reduced.

A third embodiment of the printed wiring board processing die according to the present invention is an upper mold and a lower mold for punching a printed circuit board from a printed wiring board, and the upper mold and the lower mold are opposed to each other. At least one pair of post holes provided at positions, one or two or more posts having a straight shape that can be inserted into all of the post holes, and for each of the post holes,
Since there is provided a fixing means for fixing the post inserted in the post hole, there is an effect that the work of removing and replacing the post can be easily performed.

Further, the method of processing a printed wiring board according to the fourth aspect of the present invention is a method of processing a printed wiring board using a mold having posts erected on one of the right and left sides with respect to the feed direction of the printed wiring board. A first pressing step of punching a printed circuit board from one half of a printed wiring mother board, a post replacing step of removing a post and replacing it on the other side of the mold, and a printed wiring board using the replaced die. A second pressing step of punching a printed circuit board from the other half of the mother board, so that even if the width of the printed wiring board is large compared to the size of the printed circuit board, a small There is an effect that the mold can be used and the mold cost can be reduced.

As described above, according to the present invention, the die cost and the man-hour required for the punching step of the printed circuit board in the manufacturing cost of the printed circuit board can be greatly reduced, and this can be used for various electronic devices. If used in the manufacture of printed circuit boards, it will contribute to a significant cost reduction of the printed circuit boards, and is an invention that is extremely effective industrially.

[Brief description of the drawings]

FIG. 1A is a plan view of an upper mold of a mold according to a first embodiment of the present invention, and FIG.
FIG. 1C is a sectional view taken along the line BB ′ of FIG.

FIG. 2A is a plan view of a lower mold of a mold according to the first embodiment of the present invention, and FIG.
FIG. 2C is a sectional view taken along the line BB ′ of FIG.

FIG. 3 is a process chart showing an example of a method of processing a printed wiring board using the mold shown in FIGS. 1 and 2;

FIG. 4 is a process chart showing an example of another processing method of a printed wiring board using the mold shown in FIGS. 1 and 2;

5 is a process chart showing an example of another processing method of the printed wiring board using the mold shown in FIGS. 1 and 2. FIG.

FIG. 6 (a) is a front view of an upper mold and a lower mold of a mold according to a second embodiment of the present invention, and FIG. 6 (b)
Is a plan view of a lower die. FIG. 6 (c) is the same as FIG.
6D is a front view of a pin holder used in the mold shown in FIG. 6A, and FIGS.
It is sectional drawing along the A 'line and BB' line.

FIG. 7 is a process chart showing an example of a method of replacing a pin holder used in the mold shown in FIG.

8 is a process chart showing an example of a method for processing a printed wiring mother board using the mold shown in FIG.

FIG. 9 (a) is a front view of an upper mold and a lower mold of a conventionally used mold for processing a printed wiring board,
FIG. 9B is a plan view of the lower die. FIG. 9 (c)
9A is a front view of a pin holder used in the mold shown in FIG. 9A, and FIG. 9D is a plan view thereof.

FIG. 10 is a process chart showing an example of a processing method of punching a printed circuit board from a printed wiring board in two rows using a conventional mold.

DESCRIPTION OF SYMBOLS 30 Die for processing printed wiring mother board (die) 36 Outer blade 36e Convex part 42 Pin holder 42e Pin holder detachable tap 50 Pushing plate 60 Guide 62 Inner blade 62d Recess 66a to 66d Punch pin 70 Print wiring Base plate processing die (die) 72 Upper die 76b Post hole 76c Bolt hole 80 Lower die 82b Post hole 82c Bolt hole 92 Post 92a Flat portion 94 Bolt (fixing means)

Claims (20)

[Claims] 1. A pair of blades for cutting two intersecting sides at right angles in an outer shape of a printed wiring mother board, and holding the printed wiring mother board when cutting the two intersecting sides at right angles. A pair of blades and a pair of base plates for detachably attaching the pair of blades and the pressed plate. 2. The printed wiring board processing method according to claim 1, wherein at least one of the pair of blades has an L-shape and is dividable at an intersection of the L-shape. Mold. 3. An outer blade of the pair of blades has one or more convex portions for forming a convex cutout on any one of two sides of the printed wiring board cut at a right angle. The die for processing a printed wiring mother board according to claim 1, wherein the inner blade has one or more concave portions that mesh with the convex portions. 4. The printed wiring board processing method according to claim 1, wherein the base plate is provided with a guide for restricting a lateral movement of the outer cutter. Mold. 5. A printed wiring board further comprising: one or more perforation pins for forming a reference hole and / or a sub reference hole in the printed wiring board; and a pin holder for standing the one or more perforation pins. Claim 1, 2, characterized in that it comprises
The mold for processing a printed wiring board according to 3 or 4. 6. The pin holder according to claim 5, wherein the pin holder is adjacent to an inner side of an outer blade of the pair of blades and is detachably attached to the base plate. For printed wiring board. 7. The printed wiring board processing die according to claim 6, wherein the pin holder has an L-shape and can be divided at an intersection of the L-shape. 8. The printed wiring board processing die according to claim 6, wherein the pin holder is provided with one or more pin holder detaching taps. 9. The printed wiring board processing metal plate according to claim 5, wherein two or more of the perforation pins having different lengths are provided upright on the pin holder. Type. 10. With reference to a pushback reference hole,
Punching out a printed circuit board from a printed circuit board, and a pushback step of immediately inserting the printed circuit board into the original hole, while holding the printed circuit board, A press step of cutting two intersecting sides of the outer shape of the printed wiring board at a right angle as a reference. 11. The pressing step cuts two intersecting sides of the printed wiring board at a right angle, and forms one or more convex cutouts on one of the cut two sides. The method for processing a printed wiring board according to claim 10, wherein: 12. The method according to claim 11, further comprising a V-cutting step of making a V-cut on the printed wiring board starting from a corner of the notch formed in the pressing step. Processing method of printed wiring board. 13. The method according to claim 13, wherein in the pressing step, two or more intersecting sides of the printed wiring board are cut at a right angle, and at the same time, one or more reference holes and / or sub reference holes are formed. Item 13. The method for processing a printed wiring board according to Item 10, 11, or 12. 14. The press step comprises: erecting two or more piercing pins having different lengths in a mold, and changing a press stroke to pierce the reference hole and / or the sub-reference hole. 14. The method for processing a printed wiring board according to claim 13, wherein the number is changed. 15. An upper die and a lower die for punching a printed circuit board from a printed wiring mother board, at least one pair of post holes provided at opposing positions of the upper die and the lower die, and all of the post holes. A printed wiring comprising: one or more posts having a straight shape that can be inserted; and fixing means for fixing the post inserted into the post hole for each of the post holes. Die for mother plate processing. 16. The die for processing a printed wiring board according to claim 15, wherein at least one end of the post is flat. 17. The printed wiring board processing die according to claim 15, wherein the fixing means is a screw for pressing an outer peripheral surface of the post inserted into the post hole from a side. 18. The post is an outer peripheral surface thereof,
18. The die for processing a printed wiring board according to claim 17, wherein a flat portion is provided at a position pressed by the screw. 19. A first method for punching a printed circuit board from a half of one side of the printed wiring board using a mold having a post provided on one of right and left sides with respect to a feed direction of the printed wiring board. A pressing step; a post replacement step of removing the post and replacing it on the other side of the mold; and a printed circuit from the other half of the printed wiring board using the mold in which the post is replaced. And a second pressing step of punching a board. 20. The method according to claim 19, wherein the first pressing step and / or the second pressing step is a pushback step of inserting the punched printed circuit board into the printed wiring board. Processing method of printed wiring board.