JP4341929B1 - Mold for processing base plate, method for manufacturing processed plate, and method for manufacturing product plate - Google Patents

Abstract

Even when a mounting board incorporating a large number of printed circuit boards is manufactured, a mother board that does not cause complicated mold structure, increased press pressure, and reduced mold durability To provide a processing mold, a method for manufacturing a processed plate using the same, and a method for manufacturing a product plate.
A mold for processing a mother board having the following configuration, a method for manufacturing a processed board using the same, and a method for manufacturing a product board. (1) The mother board processing mold includes product board outer shape cutting means for cutting all or part of the outer shape of the product board from the mother board. (2) The product plate outer shape cutting means (a) cuts all or a part of the outer shape of the first product plate at a part in a region to be a processed plate when the base plate is fed forward. And (b) after feeding the base plate forward, and further feeding the base plate in the reverse direction, the entire outer shape of the second product plate in the blank portion in the region to be the processed plate or It arrange | positions so that a part can be newly cut | disconnected.
[Selection] Figure 1

Description

  The present invention relates to a mold for processing a mother board, a method for manufacturing a processed board, and a method for manufacturing a product board, and more specifically, a mounting board in which a printed circuit board is temporarily fixed to a frame portion by a pushback method, and a printed board A base plate processing mold for manufacturing various processing boards such as a mounting substrate in which a circuit board is temporarily fixed to a frame portion through a perforation or a V cut, and such a base plate processing mold is used. The present invention relates to a method for manufacturing a processed board, and a method for manufacturing a product board for obtaining a product board (printed circuit board) from a processed board obtained by such a method.

  In recent years, with the miniaturization of electronic devices, there has been an increasing demand for miniaturization and modification of printed circuit boards used in electronic devices. On the other hand, an electronic component automatic mounting machine (hereinafter referred to as “self-mounting machine”) such as a chip mounter or an automatic insertion machine for mounting electronic components on a printed circuit board is referred to as the size of a workpiece because of its conveyance. Have upper and lower limits. Moreover, the external shape of the workpiece | work used for a self-machine is required to be substantially rectangular, ie, at least one side is a straight line, and at least one of the orthogonal sides is a straight line.

  Therefore, when mounting electronic components on a small and irregular printed circuit board using a self-mounting machine, first, a plurality of printed circuit boards are formed on the printed wiring board, and the V-cut method and pushback method are used. The printed circuit board is temporarily fixed to the original printed wiring board using a perforation method, etc., and then the size and shape of the printed wiring board can be conveyed by the self-equipment. A method of cutting a substrate (mounting substrate) is used.

Of these, the V-cut method inserts V-shaped, U-shaped and other concave grooves (V-cut) along the printed circuit boundary printed on the printed wiring board, and mounts electronic components on the printed circuit. And then breaking along the V-cut. Therefore, the V-cut method can be applied only to a printed circuit board whose outer shape is linear.
The perforation method is a method in which a large number of small holes are formed along the boundary line of the printed circuit board and the holes are broken along the small holes. The perforation method is applicable only to a printed circuit board that does not require dimensional accuracy of the outer shape, because unevenness remains on the boundary line after fracture. In addition, instead of perforations, a method is also known in which discontinuous long holes are discretely formed along the boundary line of the printed circuit board and temporarily fixed to the frame portion with a narrow connecting portion.

  On the other hand, in the pushback method, the printed circuit board is punched out using a blade having a predetermined shape while holding the printed wiring board between the upper mold and the lower mold, and then the punched printed circuit board is removed from the original hole. It is a method of fitting. The pushback method has a high dimensional accuracy of the outer shape and there is no restriction on the shape of the printed circuit board, and is therefore an effective method particularly when electronic components are automatically mounted on a deformed printed circuit board.

The processing of printed wiring board using the pushback method is generally
(1) Form a reference hole for pushback on the printed wiring board on which the electric circuit is printed,
(2) Push-back processing of the printed circuit board using the push-back mold, and drilling of component holes as necessary,
(3) Cutting the outer shape of the printed wiring board using an outer cutting die and cutting out a mounting board including a predetermined number of printed circuit boards from the mother board.
Has been done.

  However, the pushback process generally tends to warp because a strong shearing force acts on the printed wiring board. Conventionally, pushback processing and outline cutting are generally performed using separate molds. However, if only pushback processing is performed continuously on the mother board, a large warp will occur on the mother board. There is a problem that it becomes difficult to cut the outer shape. In addition, a pushback mold and an outer cutting mold are required, which increases the cost. Further, when the manufactured mounting board is warped or has a relatively large residual stress, it is difficult to remove the printed circuit board from the frame.

In order to solve this problem, various proposals have heretofore been made.
For example, in Patent Document 1, the printed circuit board is disposed upstream of the printed wiring board conveyance direction, and the printed circuit board is punched from the printed wiring board, and the punched printed circuit board is fitted into the original hole. And a pushback means, and a printed circuit board that is disposed downstream of the printed wiring board transport direction and includes one or more printed circuit boards that are pushed back. A printed wiring board processing die having an outer shape cutting means is disclosed.
In this document, since the area pushed back by the pushback means is sequentially separated by the outline cutting means, the outline cutting can be easily performed without being greatly affected by the warp of the printed wiring board, and one metal It describes that the die cost can be reduced because push back processing and external cutting processing can be performed with the mold.

Further, in Patent Document 2, a printed circuit board is punched from a printed wiring board, pushback means for fitting the punched printed circuit board into an original hole, and at least one of the punched printed circuit boards. Vertical slit forming means for forming continuous vertical slits serving as reference sides of the processed board by sequentially forming vertical slit pieces parallel to the conveyance direction of the printed wiring board on the side. A printed wiring mother board processing mold provided is disclosed.
In the same document,
(1) Since a continuous vertical slit is formed on at least one side of the printed circuit board that has been pushed back, the outline cutting can be simplified as compared with the conventional method.
(2) When the horizontal slit forming means is further provided, a discontinuous horizontal slit perpendicular to the vertical slit is formed between the printed circuit boards arranged in the transport direction of the printed wiring mother board. After the back processing is completed, a processed board including a predetermined number of printed circuit boards pushed back can be obtained simply by breaking the connecting portion of the horizontal slit formed at a predetermined position, and
(3) Since a separate mold for outline cutting or an outline cutting process becomes unnecessary or simplified, the mold cost can be greatly reduced, and workability is improved,
Is described.

JP 2002-233996 A JP 2003-089097 A

When electronic components are automatically mounted on a printed circuit board incorporated in a mounting board, the mounting efficiency increases as the number of printed circuit boards incorporated in the mounting board increases. However, in order to manufacture a mounting board in which a large number of printed circuit boards are incorporated, a mold capable of forming a large number of printed circuit boards in the mounting board is required. Therefore, as the number of printed circuit boards incorporated in the mounting board increases, there is a problem that the structure of the mold becomes complicated and the number of necessary parts increases.
Further, as the number of printed circuit boards incorporated in the mounting board increases, the area of the mounting board increases, and the mold also increases in size accordingly. For this reason, there is a problem that the press pressure required for the processing increases, and a larger press machine is required.
Furthermore, in order to incorporate a large number of printed circuit boards on the mounting substrate, it is necessary to incorporate a mechanism for performing various processing in the mold. However, if a large number of mechanisms are incorporated in a limited area, the strength of the mold may be lowered, and the durability may be lowered.

The problem to be solved by the present invention is that even when a processed board (for example, a mounting board) in which a large number of product boards (for example, a printed circuit board) are manufactured, the mold structure becomes complicated. Alternatively, a die for processing a base plate without increasing the number of necessary parts, a method for manufacturing a processed plate using the same, and a method for manufacturing a product plate for manufacturing a product plate from such a processed plate are provided. There is to do.
In addition, another problem to be solved by the present invention is a metal for processing a base plate that does not increase the press pressure necessary for processing even when a processed plate incorporating a large number of product plates is manufactured. An object of the present invention is to provide a mold, a method for producing a processed plate using the same, and a method for producing a product plate for producing a product plate from such a processed plate.
Furthermore, another problem to be solved by the present invention is that it is possible to manufacture a processed plate in which a large number of product plates are incorporated, and furthermore, a die for processing a base plate that is excellent in durability is used. It is providing the manufacturing method of a processed plate, and the manufacturing method of the product plate which manufactures a product plate from such a processed plate.

In order to solve the above-described problems, a base metal mold according to the present invention is summarized as having the following configuration.
(1) The mother board processing mold includes product board outer shape cutting means for cutting all or part of the outer shape of the product board from the mother board.
(2) The product plate outer shape cutting means includes:
(A) When the base plate is forwardly fed, all or part of the outer shape of the first product plate can be cut in a part of the region to be the processed plate; and
(B) After feeding the base plate in the forward direction, when the base plate is further fed in the reverse direction, all or part of the outer shape of the second product plate is newly added in the blank portion in the region to be the processed plate. It is arranged so that it can be cut.
(3) The metal mold for processing the base plate is formed with a vertical slit parallel to the transport direction of the base plate, thereby forming a side slit parallel to the transport direction of the processed plate. Forming means are provided.
(4) The vertical slit forming means includes:
Vertical slit piece forming means for forming continuous vertical slits by sequentially forming vertical slit pieces parallel to the conveying direction of the base plate and communicating them.
It is.
(5) The vertical slit piece forming means includes:
(A) When the base plate is forwardly fed, the vertical slit piece is not communicated; and
(B) When the mother board is fed in the forward direction, and further when the mother board is fed in the reverse direction, the vertical slit pieces communicate with each other and become the continuous vertical slit.
Are arranged as follows.
The mother board processing mold is
It may further comprise a horizontal slit forming means for forming a side perpendicular to the conveying direction of the processed plate by forming a horizontal slit perpendicular to the conveying direction of the mother plate.

The manufacturing method of the processed plate which concerns on this invention is equipped with the following processes.
(1) Using the die for processing a base plate according to the present invention, while feeding the base plate in the forward direction, cutting all or part of the outer shape of the first product plate in a part of the region to be the processed plate. 1st process to do.
(2) After feeding the base plate in the forward direction, while further feeding the base plate in the reverse direction, the whole or part of the outer shape of the second product plate is newly renewed in the blank portion in the region to be the processed plate. Second step of cutting.
The method for producing a processed plate according to the present invention includes:
A V-cut forming step of forming the V-cut on the processed plate so that the V-cut contacts the outer periphery of the product plate or the V-cut is formed along the outer periphery of the product plate; May be.
Furthermore, the manufacturing method of the product board which concerns on this invention is equipped with the product board separation process which isolate | separates a frame part from the processed board obtained by the method which concerns on this invention, and obtains a product board.

All or part of the outline of some product boards can be cut when the mother board is fed forward, and all or part of the outline of other product boards can be renewed when the mother board is fed in the reverse direction. If the product plate outer shape cutting means is arranged so that it can be cut in half, the number of product plate outer shape cutting means built in the mold is less than half compared to the case of processing while simply feeding the mother plate in the forward direction. be able to. Therefore, the mold structure is simpler and the number of parts required for the mold is reduced.
Moreover, the press pressure required for one press is also less than half. Therefore, it is possible to manufacture a large-area processed plate in which a large number of product plates are incorporated, using a small press machine having a small pressing capability.
Furthermore, since it is not necessary to incorporate a mechanism for performing various processes in a narrow area, the durability of the mold is also improved.

It is the top view of the lower mold | type of the metal mold | die for mother board processing which concerns on the 1st Embodiment of this invention, and its A-A 'line sectional drawing. It is the bottom view of the upper mold | type of the metal mold | die for mother board processing which concerns on the 1st Embodiment of this invention, and its A-A 'line sectional drawing. It is process drawing explaining operation | movement of the metal mold | die for mother board processing shown in FIG.1 and FIG.2. FIG. 4 is a continuation of the process diagram shown in FIG. 3. FIG. 3 is a process diagram showing a process for forming a mounting substrate when a printed wiring mother board is processed while being fed forward using the mother board machining mold shown in FIGS. 1 and 2. FIG. 6 is a continuation of the process diagram shown in FIG. 5. FIG. 7 is a continuation of the process diagram shown in FIG. 6. It is process drawing which shows the formation process of the board | substrate for mounting when it processes while performing the process shown in FIGS. FIG. 9 is a continuation of the process diagram shown in FIG. 8. FIG. 10 is a continuation of the process diagram shown in FIG. 9.

It is a top view of the lower mold | type of the metal mold | die for mother board processing which concerns on the 2nd Embodiment of this invention. It is a figure which shows the formation process of the board | substrate for mounting using the metal mold | die for mother board processing shown in FIG. It is a top view of the lower mold | type of the metal mold | die for mother board processing which concerns on the 3rd Embodiment of this invention. It is a figure which shows the formation process of the board | substrate for mounting using the metal mold | die for mother board processing shown in FIG. It is a top view of the lower mold | type of the metal mold | die for mother board processing which concerns on the 4th Embodiment of this invention. It is a figure which shows the formation process of the board | substrate for mounting using the metal mold | die for mother board processing shown in FIG.

Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.
In the following description, a mother board processing mold for manufacturing a mounting board including a printed circuit board from a printed wiring board, and a mounting board manufacturing method using such a mold will be described. As will be described, the present invention can be applied to a “mother board” other than the printed wiring board, a “processed board” other than the mounting board, and a “product board” other than the printed circuit board.

[1. First Embodiment]
[1.1 Configuration of mold for mother board processing (1)]
1 and 2 show a mold 1 for processing a mother board according to a first embodiment of the present invention. 1 and 2, the mother board machining mold 1 includes a lower mold 20 and an upper mold 50. Further, the lower mold 20 and the upper mold 50 are respectively the first region 3 on the upstream side with respect to the transport direction of the printed wiring mother board and the second region 5 on the downstream side with respect to the transport direction.

[1.1.1 First region and second region]
The first region 3 is a processing region disposed on the upstream side with respect to the transport direction of the printed wiring mother board and having an area equal to or larger than the mounting substrate.
The second region 5 is a processing region disposed on the downstream side with respect to the transport direction of the printed wiring mother board and having an area equal to or larger than the mounting substrate.
Depending on the shape, arrangement, processing method, etc. of the printed circuit board formed in the mounting substrate, a mold having only a processing area for one mounting substrate (for example, a mold described in FIG. 15 described later) However, the method according to the invention can be carried out. However, when the processing region of the base plate processing mold 1 is divided into the first region 3 and the second region 5, and the printed wiring base plate is sequentially processed in both the first region 3 and the second region 5. The function can be shared between the first region 3 and the second region 5. For this reason, it is possible to perform complicated processing on the printed wiring board without significantly complicating the structure of the mold or reducing the durability.
In particular, in the case of a mold having pushback means, a complicated pushback mechanism is required as compared with punching. Therefore, if the mold processing region is divided into two, pushback processing and other processing can be performed at the same time without significantly complicating the mold or reducing durability.

When the processing area is divided into the first area 3 and the second area 5, the product outer shape cutting means is provided in at least one of the first area 3 and the second area 5. The product outer shape cutting means may be provided in both the first region 3 and the second region 5.
The same applies to other processing means (for example, a through hole means for forming a through hole in a base plate such as a perforation forming means, a vertical slit forming means, a horizontal slit forming means, etc.) You can choose.

[1.1.2 Lower mold]
As shown in FIG. 1, the lower mold 20 includes a lower mold base plate 22, a female mold 24, and a lower mold space base 26. The lower mold space base 26 is for forming a predetermined space below the lower mold base plate 22, and is attached to the lower surface of the lower mold base plate 22. The female mold 24 is attached on the lower mold base plate 22. Further, guide post guide holes 24 a, 24 a... Are provided at the four corners of the female die 24.

A slide space is provided in the first region 3 of the female mold 24, and lower mold strippers 26a, 26b, and 26c that can move up and down are inserted in the slide space.
Similarly, a slide space is provided in the second region 5 of the female die 24 at a position different from that in the first region 3, and each of the slide spaces is a lower die that can move up and down. Strippers 26d, 26e, and 26f are inserted.
The shape of the lower mold strippers 26a to 26f is not particularly limited, and can be arbitrarily selected according to the purpose. That is, the lower mold strippers 26a to 26f may have the same shape as each other or may be different from each other.

The lower mold stripper 26 a is restricted from moving upward by a plurality of support bolts 28, 28, which are loosely inserted from below the lower mold base plate 22. Further, on the lower surface of the lower mold base plate 22, there are provided a pressing plate 30 movable in the vertical direction and an elastic member 32 for urging the pressing plate 30 upward. The material of the elastic member 32 is not particularly limited, but urethane rubber or the like is suitable.
Further, a pressing pin 34 for transmitting an upward biasing force of the elastic member 32 to the lower mold stripper 26 a through the pressing plate 30 is inserted into the lower mold base plate 22. The upper end of the pressing pin 34 is in contact with the lower surface of the lower mold stripper 26 a, and the lower end thereof is in contact with the upper surface of the pressing plate 30.
The same applies to the lower strippers 26b to 26f.

The lower mold strippers 26a to 26f are pushback means (product board outer shape cutting means) for punching out the printed circuit board from the printed wiring board and fitting the punched printed circuit board into the original holes.
These lower strippers 26a-26f are
(A) When the printed wiring board is forwardly fed, the first printed circuit board can be pushed back in a part of the region to be the mounting board; and
(B) When the printed wiring board is forwardly fed and then the printed wiring board is fed in the reverse direction, the second printed circuit board is subjected to a new pushback process in the blank portion in the region to be the mounting board. Arranged to be able to.
Here, the “reversing direction” means the first feed direction (forward direction) is a direction rotated by 180 °.

The mother board processing mold 1 according to the present embodiment is for manufacturing a mounting board including a printed circuit board that is pushed back in 2 rows × 6 columns (12 in total).
The lower mold strippers 26a to 26c are respectively
(A) During forward feed, the printed circuit boards in the first, third and fifth rows from the upper right can be pushed back,
(B) During reverse feed, the printed circuit boards in the first, third, and fifth rows from the lower left when viewed from the forward feed can be pushed back. Yes.
Similarly, the lower mold strippers 26d to 26 are respectively
(A) During forward feed, the printed circuit boards in the first, third and fifth rows from the lower right can be pushed back,
(B) During reverse feed, the printed circuit boards in the first, third, and fifth rows from the upper left when viewed from the forward feed can be pushed back. .

In the first region 3 of the female die 24, through-hole forming pin guide holes 36 for forming various through-holes used for component holes or the like in the printed circuit board pushed back by the lower die strippers 26d to 26f, 36 (through-hole forming means) are provided.
Similarly, in the second region 5 of the female die 24, through hole forming pin guides for forming various through holes used for component holes or the like in the printed circuit board pushed back by the lower die strippers 26a to 26c. Holes 36, 36... (Through-hole forming means) are provided.
Each of the through-hole forming pin guide holes 36, 36... Penetrates the lower mold base plate 22 and discharges the waste generated by the punching downward.

A vertical slit piece forming pin guide hole 38a is provided on the left side with respect to the transport direction of the printed wiring board so as to straddle the first region 3 and the second region 5 and in parallel with the transport direction. Yes. Further, on the right side of the printed wiring board transport direction, a vertical slit segment forming pin guide hole 38b is provided in the second region 5 and parallel to the transport direction.
The inner protrusion provided in the central portion of the vertical slit piece forming pin guide hole 38b has a slit (slit) for stress relaxation on the outer periphery of the mounting board, and a side parallel to the transport direction of the mounting board. It is for forming. A cut for stress relaxation is not always necessary, but if a cut is made in the outer periphery of the mounting board, the warping of the mounting board can be reduced, and the removal of the printed circuit board is facilitated.

The vertical slit element forming pin guide holes 38a and 38b are for forming a side parallel to the transport direction of the mounting board by forming a vertical slit parallel to the transport direction of the printed wiring board. It is an example of a means (longitudinal slit formation means).
Further, the vertical slit piece forming pin guide holes 38a and 38b sequentially form vertical slit pieces parallel to the transport direction of the printed wiring board, and form continuous vertical slits by communicating them. It is also an example of a means (vertical slit piece forming means) for the purpose.
In the example shown in FIG. 1, the vertical slit piece forming pin guide holes 38a, 38b are
(A) When the printed wiring board is fed forward, the vertical slit pieces formed by these do not communicate with each other; and
(B) When the printed wiring mother board is forwardly fed and then the printed wiring mother board is further fed in the reverse direction, the length of the longitudinal slit pieces formed by them is communicated and becomes a continuous vertical slit. The length and arrangement are determined.

For example, if the length of the vertical slit piece forming pin guide hole 38b is extended to the same length as the side of the mounting substrate (side parallel to the transport direction), the mounting substrate can be A vertical slit (punching hole) to be a side can be formed.
Similarly, the length of the vertical slit piece forming pin guide hole 38a is extended, or a plurality of vertical slit piece forming pin guide holes are discretely arranged on the same straight line as the vertical slit piece forming pin guide hole 38a. When the forward feeding of the printed wiring board is completed, the vertical slit pieces formed by the vertical slit piece forming pin guide holes communicate with each other (a vertical slit is formed). You can also.
However, the longer the length of the vertical slit piece forming pin guide hole formed in the mold, the lower the strength of the mold may be. Similarly, if a plurality of guide holes are formed on only one side of the mold, the strength of the region where the guide holes are formed may be reduced.

On the other hand, when the printed wiring board is fed forward, the vertical slit pieces do not communicate with each other, and when the printed wiring board is fed in the reverse direction, the vertical slit pieces communicate with each other so that a vertical slit is formed. If the vertical slit piece forming pin guide hole is arranged in the mold, it is possible to suppress complication of the mold and strength reduction.
Furthermore, the vertical slit forming means is not always necessary. After the printed circuit board push-back and various through holes are punched, the vertical slit is formed or the mounting board is cut out using a separate mold. It can also be done. However, if the vertical slit forming means is provided, the vertical slit can be formed simultaneously with pushback processing or the like using a single mold, so that the manufacturing cost can be greatly reduced.

At the boundary line between the first region 3 and the second region 5, a horizontal slit segment forming pin guide hole 40 is provided. The horizontal slit element forming pin guide hole 40 is a means for forming a side perpendicular to the transport direction of the printed wiring board by forming a horizontal slit perpendicular to the transport direction of the printed wiring board ( It is an example of a horizontal slit formation means.
Further, the horizontal slit piece forming pin guide hole 40 is formed in order to form a horizontal slit piece perpendicular to the conveyance direction of the printed wiring board and to form a continuous horizontal slit by communicating these pieces. It is also an example of means (lateral slit piece forming means).
In the example shown in FIG. 1, the transverse slit piece forming pin guide hole 40 is
(A) When the printed wiring mother board is fed in the forward direction, the horizontal slit piece formed thereby does not communicate, and
(B) After the printed wiring board is forwardly fed, when the printed wiring mother board is further fed in the reverse direction, the length of the transverse slit piece formed by these is continuous so as to become a continuous transverse slit. The length and arrangement are determined.

For example, if the length of the horizontal slit piece forming pin guide hole 40 is extended to the same length as the side of the mounting substrate (side perpendicular to the transport direction), the mounting substrate can be A lateral slit (punching hole) to be a side can also be formed.
Similarly, not only on the boundary line between the first region 3 and the second region 5, but also at the upstream end of the first region 3 and the downstream end of the second region 5, one or a plurality of lateral slit piece forming pin guide holes. When the forward feed of the printed wiring board is completed, the horizontal slit piece formed by the horizontal slit piece forming pin guide hole may be communicated (a horizontal slit is formed). it can.
However, as the length of the horizontal slit piece forming pin guide hole formed in the mold increases, the strength of the mold may decrease. Similarly, as the number of guide holes formed in the mold increases, the strength of the mold may decrease.

In contrast, when the printed wiring board is fed in the forward direction, the horizontal slit pieces do not communicate with each other, and when the printed wiring board is fed in the reverse direction, the horizontal slit pieces communicate with each other so that a horizontal slit is formed. If the horizontal slit piece forming pin guide hole is disposed in the mold, it is possible to suppress complication of the mold and a decrease in strength.
Further, the lateral slit forming means is not necessarily required. After the printed circuit board push-back and various through holes are punched, the lateral slit is formed or the mounting board is cut out using a separate mold. It can also be done. However, when the horizontal slit forming means is provided, the horizontal slit can be formed simultaneously with pushback processing or the like with a single mold, so that the manufacturing cost can be greatly reduced.

On the first region 3 of the female die 24, positioning pins 42a to 42d used for positioning the printed wiring board are erected. Similarly, positioning pins 42e to 42h are provided on the second region 5 of the female die 24 at positions corresponding to the positioning pins 42a to 42d, respectively.
Further, in the vicinity of the boundary line between the first region 3 and the second region 5 of the female mold 24, a cut (slit) for stress relaxation is provided on the mounting substrate on a side perpendicular to the mounting substrate transport direction. A pin guide hole 44 for forming is provided.

[1.1.3 Upper mold]
The upper mold 50 includes an upper mold base plate 52, three holders 54 a to 54 c, and an upper mold stripper 56. The upper mold base plate 52 and the holders 54a to 54c are stacked on the basis of knock pins (not shown) erected on the upper mold base plate 52 and fastened by a plurality of fastening bolts (not shown). Guide posts 58, 58... Are provided at the four corners of the holder 54c at positions corresponding to the guide post guide holes 24a, 24a.

The upper mold stripper 56 can move up and down along the guide posts 58, 58... The upper mold stripper 56 is restricted from moving downward by a plurality of support bolts (not shown) that are loosely inserted from above the holder 54c.
The pressing pins 60, 60... Are for pressing the upper mold stripper 56 downward, and are loosely inserted into through holes that penetrate the holders 54b, 54c in the vertical direction. The lower end thereof is in contact with the upper surface of the upper mold stripper 56, and the upper end thereof is in contact with the lower surface of the pressing plate 62 disposed in the central space of the holder 54a.

The pressing plate 62 is for pressing the pressing pins 60, 60. .. Are inserted between the upper surface of the pressing plate 62 and the cap bolts 64, 64... So that the pressing plate 62 is urged downward by the elastic members 66, 66. It has become. The material of the elastic members 66, 66... Is not particularly limited, but urethane rubber is suitable.
In addition, when attaching the metal mold | die 1 for mother board processing to a hydraulic press, you may provide the bush for providing a holder pressure to the press plate 62. FIG. Providing a bush for applying the holder pressure makes it easier to return the punched printed circuit board to the original hole.

Upper punches 68a to 68f (product board outer shape cutting means, pushback means) for pushing back the printed circuit board are provided at positions corresponding to the lower mold strippers 26a to 26f provided on the lower mold 20, respectively. ing.
Similarly, through-hole forming pins 70, 70 for forming through-holes at positions corresponding to the through-hole forming pin guide holes 36, 36 ... provided in the lower mold 20, respectively (through-hole forming means) Is provided.
Similarly, vertical slit piece forming pins 72a and 72b (vertical slit piece forming means) are provided at positions corresponding to the vertical slit piece forming pin guide holes 38a and 38b provided in the lower mold 20, respectively. ing.
Similarly, a horizontal slit element forming pin 74 (lateral slit element forming means) is provided at a position corresponding to the horizontal slit element forming pin guide hole 40 provided in the lower mold 20.
Further, a pin 76 is provided at a position corresponding to the pin guide hole 44 for forming a notch (slit) for stress relaxation provided in the lower mold 20.
Each of these punches and pins protrudes from the lower surface of the upper mold stripper 56 as the upper mold stripper 56 moves upward.

  Furthermore, positioning pin guide holes 78a to 78h are provided at positions corresponding to the positioning pins 42a to 42h provided on the lower mold 20, respectively.

[1.2 Operation of mold for mother board processing]
Next, operation | movement of the metal mold | die 1 for mother board processing which concerns on this Embodiment is demonstrated. 3 to 4 show process drawings of press working.
First, as shown in FIG. 3A, the printed wiring board 10 is placed on the upper surface of the lower mold 20. In the printed wiring board 10, the printed circuit board 14 was pushed back and punched by the upper punches 68 a to 68 c and the through hole forming pins 70, 70... It is in a state.

  The printed wiring board 10 is conveyed in the right direction in FIG. Then, it is placed on the upper surface of the lower mold 20 so that the portion processed in the first region 3 comes on the second region 5 in the immediately preceding pressing step. The printed wiring board 10 is positioned by inserting positioning pins 42 a to 42 h provided on the upper surface of the lower mold 20 into reference holes formed in the printed wiring board 10 in advance.

When the upper die 50 is lowered from this state, the upper die stripper 56 comes into contact with the upper surface of the printed wiring mother board 10.
When the upper die 50 is further lowered, as shown in FIG. 3B, the upper die stripper 56 moves upward along the guide posts 58, 58... Against the urging force of the elastic members 66, 66. To do. At the same time, the upper punches 68 a to 68 f, the component hole forming pins 70, 70..., The horizontal slit piece forming pins 74 protrude from the lower surface of the upper mold stripper 56 and punch the printed wiring board 10.
Further, the upper punches 68a to 68f push down the lower mold strippers 26a to 26f against the urging force of the elastic members 32, 32.

  Next, when the upper die 50 is raised after punching is finished, the elastic members 32, 32... Are punched together with the lower die strippers 26a to 26f by their restoring force as shown in FIG. Push the printed circuit board up. At the same time, the pressing plate 62 urged by the elastic members 66, 66... Pushes the upper mold stripper 56 downward via the pressing pins 60, 60. As a result, when the upper die 50 is completely detached from the lower die 20, the printed circuit boards 14, 14... Punched are fitted into the original holes of the printed wiring mother board 10, as shown in FIG. It becomes a state.

  Thereafter, the printed wiring mother board 10 is conveyed rightward so that the portion processed in the first area 3 comes directly under the second area 5. Then, the press of the next region is repeated as many times as necessary according to the same procedure as described above. Further, after the forward feeding of the printed wiring board is completed, the printed wiring board is turned 180 °, and the press is repeated as many times as necessary while feeding the printed wiring board in the reverse direction.

[1.3 Process of printed wiring board]
5 to 10 show a process of processing a printed wiring mother board using the mother board machining die 1 shown in FIGS. 1 and 2.
First, as shown in FIG. 5, the printed wiring board 10 is placed on the first region 3 of the lower mold 20. Positioning is performed by inserting positioning pins 42 a to 42 d into reference holes 10 a, 10 a... Previously formed in the printed wiring board 10.

When the first press is performed from this state, in the first region 3,
(1) Push-back of the printed circuit board by the upper punches 68a to 68c and the lower mold strippers 26a to 26c,
(2) Punching a through hole with the through hole forming pin 70 and the through hole forming pin guide hole 36;
(3) Punching of the vertical slit piece by the vertical slit piece forming pin 72a and the vertical slit piece forming pin guide hole 38a,
(4) punching of the horizontal slit piece by the horizontal slit piece forming pin 74 and the horizontal slit piece forming pin guide hole 40, and (5) notching (slit) for stress relaxation by the pin 76 and the pin guide hole 44. Punched,
Is done.

Next, as shown in FIG. 6, the printed wiring board 10 is conveyed, and the portion processed in the first region 3 is placed on the second region 5 in the immediately preceding press. Positioning is performed by inserting positioning pins 42a to 42h into the reference holes 10a, 10a.
When the second press is performed from this state, the same processing as described above is performed in the first region 3, and at the same time, in the second region 5,
(1) Push-back of the printed circuit board by the upper punches 68d to 68f and the lower mold strippers 26d to 26f in the region including the through hole formed by the immediately preceding press,
(2) In the area of the printed circuit board pushed back by the immediately preceding press, punching a through hole by the through hole forming pin 70 and the through hole forming pin guiding hole 36, and
(3) Punching of the vertical slit piece by the vertical slit piece forming pin 72b and the vertical slit piece forming pin guide hole 38b,
Is done.

In the same manner, while the printed wiring board 10 is fed forward, the printed circuit board is pushed back and various through holes are punched. Then, as shown in FIG. 7, when the portion of the printed wiring mother board 10 that has been subjected to the last processing in the first region 3 is placed on the second region 5 and pressed, the forward feed press is completed. To do.
At this point, six printed circuit boards are already built in the mounting board. In addition, the outer peripheral portion of the printed wiring board 10 has a total of three locations: two vertically located by the vertical slit segment forming pin 72a and the vertical slit segment forming pin guiding hole 38a, and one lower position by the pin 76 and the pin guiding hole 44. A cut is made in

Next, as shown in FIG. 8, the printed wiring board 10 is turned 180 ° and the leading portion of the printed wiring board 10 is placed on the first region 3.
In this state, when the first press with the reverse direction feed is performed, the printed circuit board is pushed in the blank area that is not processed in the forward feed press within the area to be the mounting substrate. The back and various through holes are formed.
Further, on the left side of the printed wiring board 10, a new vertical slit element is formed at the same time as a new vertical slit element is formed by the vertical slit element forming pin 72a and the vertical slit element forming pin guide hole 38a. The piece and the vertical slit piece formed by the vertical slit piece forming pin 72b and the vertical slit piece forming pin guide hole 38b in the forward feed are communicated to form a continuous vertical slit.
Similarly, a new horizontal slit piece is formed by the horizontal slit piece forming pin 74 and the horizontal slit forming pin guide hole 40, and at the same time, a newly formed horizontal slit piece and a forward feed are formed. The horizontal slit pieces communicated to form a continuous horizontal slit.

Next, as shown in FIG. 9, the portion of the first region 3 that has been pressed in the first reverse direction feed is placed on the second region 5.
In this state, when the second press with the reverse feed is performed, the printed circuit board is pushed in the blank area that is not processed in the forward feed press within the region to be the mounting substrate. The back and various through holes are formed.
Further, on the left side of the printed wiring board 10, a new vertical slit piece is formed by the vertical slit piece forming pin 72 a and the vertical slit piece forming pin guide hole 38 a, and at the same time, the vertical slit is used for forward feeding. The two vertical slit pieces formed by the piece forming pin 72b and the vertical slit piece forming pin guiding hole 38b communicate with each other by a newly formed vertical slit piece, thereby forming a continuous vertical slit.
Similarly, on the right side of the printed wiring board 10, a new vertical slit piece is formed by the vertical slit piece forming pin 72 b and the vertical slit piece forming pin guide hole 38 b, and at the same time when the forward feed is performed, The two vertical slit pieces formed by the slit piece forming pin 72a and the vertical slit piece forming pin guiding hole 38a communicate with each other by a newly formed vertical slit piece to form a continuous vertical slit.

  Further, a new horizontal slit piece is formed by the horizontal slit piece forming pin 74 and the horizontal slit forming pin guide hole 40, and at the same time, a newly formed horizontal slit piece and a forward feed are formed. The horizontal slit piece communicates to form a continuous horizontal slit. In addition, since the continuous horizontal slits communicate with the continuous vertical slits formed on the left and right, the mounting board 12 is completely separated from the printed wiring board 10.

In the same manner, the mounting substrate 12 can be sequentially cut out from the printed wiring board 10 by pressing in the reverse direction. Then, as shown in FIG. 10, when the portion of the printed wiring board 10 that has been subjected to the last processing in the first region 3 is placed on the second region 5 and pressing is performed, pressing in the reverse direction feed is completed. To do.
Each of the obtained mounting boards 12 has twelve printed circuit boards built therein. Further, in each of the forward feed and the reverse feed, since the outer periphery of the printed wiring board 10 is cut at two or more locations, when the reverse feed is finished, the printed wiring board 10 is transported in the transport direction. An elongated end member extending in the parallel direction and an elongated end member perpendicular to the conveying direction remain.

The obtained mounting board 12 may be sent to the automatic mounting process as it is, or the V-cut is formed so that the V-cut contacts the outer periphery of the printed circuit board or along the outer periphery of the printed circuit board. As described above, a V-cut may be formed on the mounting substrate (V-cut forming step). In particular, when the printed circuit board is pushed back, if the V-cut is formed so as to be in contact with the boundary line of the printed circuit board, there is an advantage that the printed circuit board can be easily separated.
Note that the V-cut formation position is not necessarily limited directly above the design boundary of the printed circuit board, and may be slightly deviated from the design boundary within the allowable dimensional accuracy range. good. That is, “the V-cut comes into contact with the outer periphery of the printed circuit board” or “the V-cut is formed along the outer periphery of the printed circuit board” means that the V-cut is formed immediately above the design boundary line. In addition to this, a case where a V-cut is formed in the vicinity of the design boundary within the allowable dimensional accuracy range is also included. This is the same in other embodiments.

  After forming a V-cut as necessary, the mounting substrate 12 is sent to an automatic mounting process, and various electronic components are mounted on the surface. After the automatic mounting on the mounting board is completed, the frame portion and the printed circuit board can be separated by breaking the frame portion, and the separated printed circuit board can be incorporated into various electronic devices.

[1.4 Action of base plate processing mold (1)]
The mother board machining die 1 according to the present embodiment is
(A) It is possible to push back six printed circuit boards in a region that becomes a mounting board when the printed wiring board 10 is forwardly fed; and
(B) When the printed wiring board 10 is fed in the reverse direction, so that six printed circuit boards can be pushed back in the blank portion in the region to be the mounting board.
Since pushback means (product board outer shape cutting means) is arranged, the number of pushback means built into the mold is reduced to less than half compared to the case of processing while simply feeding the printed wiring mother board in the forward direction. be able to. Therefore, the mold structure is simpler and the number of parts required for the mold is reduced.
In addition, the pressing pressure required for one press is approximately half or less. Therefore, it is possible to manufacture a mounting board having a large area in which a large number of printed circuit boards are incorporated, using a small press machine having a small pressing capability.
Furthermore, since the processing region is divided into the first region 3 and the second region 5 and the processing is assigned to each region, it is not necessary to incorporate a mechanism for performing various processings in the narrow region. Therefore, the durability of the mold is also improved.

[2. Second Embodiment]
[2.1 Structure of mold for processing base plate (2)]
In FIG. 11, the top view of the lower mold | type 20a of the metal mold | die 1a for mother board processing which concerns on the 2nd Embodiment of this invention is shown. In FIG. 11, the mother board processing mold 1a has a first area 3 on the upstream side in the conveyance direction of the printed wiring mother board and a second area 5 on the downstream side in the conveyance direction.

The mother board processing mold 1a is a mold for manufacturing a mounting board including a total of seven printed circuit boards. The first region 3 of the lower mold 20a includes two lower parts for pushback. Mold strippers 26a, 26b are arranged. An upper punch (not shown) is provided with an upper punch at a position corresponding to this (product plate outer shape cutting means, pushback means).
The lower mold strippers 26a and 26b are arranged so that printed circuit boards that have been pushed back and printed circuit boards that have not been pushed back are alternately arranged when the forward feed and the reverse feed are finished. Yes.

The first region 3 is provided with two vertical slit piece forming pin guide holes 38a and 38c. This point is different from the first embodiment. The second region 5 is provided with one vertical slit segment forming pin guide hole 38b.
The vertical slit segment forming pin guide holes 38a to 38c are
(1) The vertical slit piece formed by the vertical slit piece forming pin guide holes 38a and 38c and the vertical slit piece formed by the vertical slit piece forming pin guide holes 38b are at the time of forward feeding. They do not communicate, and (2) they communicate when fed in the reverse direction.
As such, its length and arrangement are determined.
On the other hand, the length and arrangement of the vertical slit pieces formed by the vertical slit piece forming pin guide holes 38a and 38c are determined so as to communicate with each other during forward feed and reverse feed. Yes.

Furthermore, the vertical slit piece forming pin guide hole 38a is
(A) When the printed wiring board is forwardly fed, the outer periphery of the printed wiring board is cut only at one place so that the outer periphery of the printed wiring board communicates with the outer periphery of the mounting board; and
(B) After the printed wiring board is forwardly fed, and when the printed wiring board is further fed in the reverse direction, the outer circumference of the printed wiring board and the outer circumference of the mounting board are communicated with each other. The length and arrangement are determined so that the outer frame portion is cut only at one place (outer frame cutting means).
Further, the length and arrangement of the vertical slit piece forming pin guide holes 38c are determined so as not to cut the outer frame of the printed wiring board in both the forward feed and the reverse feed.

  At the upstream end of the first region 3, pin guide holes 44, 44 for forming notches (slits) for stress relaxation in the mounting substrate at a side perpendicular to the transport direction of the mounting substrate. Is provided. The reason why the pin guide holes 44 are provided at the upstream end of the first region 3 is to prevent the outer frame of the printed wiring board from being cut in the final press of the forward feed and the reverse feed.

  The second region 5 is provided with through-hole forming pin guide holes 36, 36... For forming through-holes used as component holes or the like inside the printed circuit board. The through hole forming pin guide holes 36, 36... Are for forming two symmetrical through holes in one printed circuit board. That is, when the position for forming the through hole is symmetrical, the mechanism for forming the through hole can be reduced to half or less.

Further, the second region 5 is provided with perforation forming pin guide holes 46, 46... For forming perforations in portions other than the pushed back portion. The upper mold (not shown) is provided with perforation forming pins at positions corresponding to the perforation forming pin guide holes 46, 46 .
In the mold 1a shown in FIG. 11, the perforation forming pin guide holes 46, 46... Are for forming perforations along the upper and lower boundary lines of the printed circuit board not pushed back (perforation forming means). , Through-hole forming means). Since the perforations can be formed respectively during forward feed and reverse feed, there is a set of perforation forming means for forming perforations at the upper and lower boundary lines of the printed circuit board. It ’s fine.

  In the present embodiment, the perforation forming means is used as product plate outer shape cutting means, but the perforation forming means is also a kind of through hole forming means. Accordingly, the use of perforations is not limited to the formation of the outer shape of the printed circuit board. For example, in order to facilitate breakage of the mounting board frame and removal of the printed circuit board, perforations may be formed in the frame portion of the mounting board.

[2.2 Process of printed wiring board]
FIG. 12 shows a process of processing the printed wiring mother board 10 using the mother board machining die 1a shown in FIG. FIG. 12 shows a state where the press by the forward feed is finished and the reverse feed is in progress.
The mounting board 12 obtained by the mother board processing mold 1a is in a state where the printed circuit boards 14 that are pushed back and the printed circuit boards 16 that are not pushed back are alternately arranged. Further, perforations 18 and 18 are formed on the upper and lower boundary lines of the printed circuit board 16 that is not pushed back.

  In addition, since the length and arrangement of the vertical slit piece forming pin guide hole 38a and the vertical slit piece forming pin (not shown) are optimized, when the forward feed is finished, the printed wiring Only one outer frame part of the mother board 10 is cut (part A in FIG. 12). Similarly, at the time when the reverse direction feeding is completed, only one outer frame portion of the printed wiring mother board 10 (B portion in FIG. 12) is cut. As a result, the end material of the finely cut printed wiring board 10 does not remain on the lower mold 20a, and only two L-shaped end materials remain. Therefore, it is possible to simplify the disposal of the end material and the cleaning of the surface of the lower mold 20a.

The obtained mounting board 12 is sent to an automatic mounting process, and various electronic components are mounted on the surface. After the automatic mounting on the mounting board is completed, the frame portion and the printed circuit board can be separated by breaking the frame portion, and the separated printed circuit board can be incorporated into various electronic devices.
When the outer periphery of the printed circuit board is formed by the perforation method, the cost is low, but there is a disadvantage that the dimensional accuracy of the outer periphery is inferior. Therefore, when the printed circuit board is required to have an external accuracy, it is preferable to form a V-cut along the boundary line of the printed circuit board instead of the perforation method.

[2.3 Action of mold for processing base plate (2)]
The mother board machining die 1a according to the present embodiment is
(A) It is possible to push back two printed circuit boards in an area that becomes a mounting board when the printed wiring board 10 is forwardly fed; and
(B) When the printed wiring board 10 is fed in the reverse direction, two more printed circuit boards can be pushed back in the blank portion in the region to be the mounting board; and
(C) so that the printed circuit boards that are pushed back and the printed circuit boards that are not pushed back are alternately arranged,
Since pushback means (product board outer shape cutting means) is arranged, the number of pushback means built into the mold is reduced to less than half compared to the case of processing while simply feeding the printed wiring mother board in the forward direction. be able to. Therefore, the mold structure is simpler and the number of parts required for the mold is reduced.
In addition, the pressing pressure required for one press is approximately half or less. Therefore, it is possible to manufacture a mounting board having a large area in which a large number of printed circuit boards are incorporated, using a small press machine having a small pressing capability.
Furthermore, since the processing region is divided into the first region 3 and the second region 5 and the processing is assigned to each region, it is not necessary to incorporate a mechanism for performing various processings in the narrow region. Therefore, the durability of the mold is also improved.

Furthermore, when optimizing the length and arrangement of the vertical slit forming means,
(A) When the printed wiring board is forwardly fed, the outer periphery of the printed wiring board is cut only at one place so that the outer periphery of the printed wiring board communicates with the outer periphery of the mounting board; and
(B) After the printed wiring board is forwardly fed, and when the printed wiring board is further fed in the reverse direction, the outer circumference of the printed wiring board and the outer circumference of the mounting board are communicated with each other. Cut only one part of the outer frame,
be able to. As a result, the end material of the finely cut printed wiring board 10 does not remain on the lower mold 1b, and only two L-shaped end materials remain. For this reason, it is possible to simplify scrap disposal and cleaning of the lower mold surface.

[3. Third Embodiment]
[3.1 Configuration of Mold for Motherboard Processing (3)]
FIG. 13 shows a plan view of the lower mold 20b of the mother board machining mold 1b according to the third embodiment of the present invention. In FIG. 13, the base plate processing mold 1b has a first region 3 on the upstream side in the transport direction of the printed wiring mother board and a second region 5 on the downstream side in the transport direction.

The mother board processing mold 1b is a mold for manufacturing a mounting board including a total of seven printed circuit boards. The first area 3 of the lower mold 20a has two lower parts for pushback. Instead of the mold stripper, punch guide holes 27a to 27d (punching means) for punching only the sides of the printed circuit board that are parallel to the transport direction are provided. The upper die (not shown) is provided with a punching punch (punching means) at a position corresponding to these. This point is different from the second embodiment.
Further, in the mother board processing mold 1b, since push back is not performed, it is not always necessary to form a notch (slit) for stress relaxation in the mounting substrate. Therefore, in the mother board machining die 1b, there is no means (pin guide hole 44) for forming a notch for stress relaxation, and the vertical slit piece forming pin guide hole 38b provided in the second region is not provided. Has no protrusion protruding toward the inside of the mounting substrate. Furthermore, the mother board processing mold 1b does not include perforation forming means.
The other points are the same as those of the mother board machining mold 1a shown in FIG.

[3.2 Process of processing printed wiring board]
FIG. 14 shows a process of processing the printed wiring mother board 10 using the mother board processing mold 1b shown in FIG. FIG. 14 shows a state in which the press by the forward feed is completed and the reverse feed is in progress.
The mounting substrate 12 obtained by the mother board processing mold 1b is formed by punching only the sides parallel to the transport direction in the outer periphery of the printed circuit boards 14 and 14, and the side perpendicular to the transport direction is It is in a state connected to the mounting substrate 12. Therefore, it is necessary to form a V-cut along the boundary line of the printed circuit boards 14, 14.

In addition, since the length and arrangement of the vertical slit segment forming pin guide hole 38a and the vertical slit segment forming pin (not shown) are optimized, the forward feed is finished and the reverse feed is finished. At that time, only the outer frame portion of the printed wiring board 10 is cut at one place (A portion and B portion in FIG. 14), which is the same as in the second embodiment.
When the dimensional accuracy of the outer periphery of the printed circuit board is not required, the first region 3 or the second region 5 is formed so that perforations are formed along the boundary line of the printed circuit board instead of the V-cut. Perforation forming means may be provided.

  The obtained mounting board 12 is sent to an automatic mounting process, and various electronic components are mounted on the surface. After the automatic mounting on the mounting board is completed, the frame portion and the printed circuit board can be separated by breaking the frame portion, and the separated printed circuit board can be incorporated into various electronic devices.

[3.3 Operation of mold for processing base plate (3)]
The mother board machining die 1b according to the present embodiment is
(A) A part of the outer shape of the two printed circuit boards can be punched in the region that becomes the mounting substrate when the printed wiring board 10 is forward-forwarded; and
(B) When the printed wiring board 10 is fed in the reverse direction, a part of the outer shape of the two printed circuit boards can be punched out further in the blank portion in the region to be the mounting board.
Since punching means (product board outer shape cutting means) are arranged, the number of punching means built into the mold can be reduced to half or less compared to the case of processing while simply feeding the printed wiring board forward. it can. Therefore, the mold structure is simpler and the number of parts required for the mold is reduced.
In addition, the pressing pressure required for one press is approximately half or less. Therefore, it is possible to manufacture a mounting board having a large area in which a large number of printed circuit boards are incorporated, using a small press machine having a small pressing capability.
Furthermore, since the processing region is divided into the first region 3 and the second region 5 and the processing is assigned to each region, it is not necessary to incorporate a mechanism for performing various processings in the narrow region. Therefore, the durability of the mold is also improved.

Furthermore, when optimizing the length and arrangement of the vertical slit forming means,
(A) When the printed wiring board is forwardly fed, the outer periphery of the printed wiring board is cut only at one place so that the outer periphery of the printed wiring board communicates with the outer periphery of the mounting board; and
(B) After the printed wiring board is forwardly fed, and when the printed wiring board is further fed in the reverse direction, the outer circumference of the printed wiring board and the outer circumference of the mounting board are communicated with each other. Cut only one part of the outer frame,
be able to. As a result, the end material of the finely cut printed wiring board 10 does not remain on the lower mold 1b, and only two L-shaped end materials remain. For this reason, it is possible to simplify scrap disposal and cleaning of the lower mold surface.

[4. Fourth Embodiment]
[4.1 Structure of mold for mother board processing (4)]
FIG. 15 shows a plan view of the lower mold 20c of the mother board machining mold 1c according to the fourth embodiment of the present invention. In FIG. 15, the mother board machining mold 1c has only one machining area. The base plate processing mold 1c includes the vertical slit piece forming pin guide hole 38b and the through hole forming pin guide hole 36 provided in the second region 5 in the base plate processing mold 1b shown in FIG. It is moved to the first area 3.
Further, a transverse slit piece forming pin guide hole 40b is further provided at the upstream end portion with respect to the transport direction. The horizontal slit piece forming pin guide hole 40b is a component that is necessary because the processing area is made one.
Since the other points regarding the mother board machining mold 1c are the same as those of the mother board machining mold 1b, description thereof will be omitted.

[4.2 Process of processing printed wiring board]
FIG. 16 shows a process of processing the printed wiring mother board 10 using the mother board processing mold 1c shown in FIG. FIG. 16 shows a state in which the press by the forward feed is completed and the reverse feed is in progress.
The mounting substrate 12 obtained by the mother board processing mold 1c is stamped only on the sides of the printed circuit boards 14 and 14 parallel to the transport direction, and the side perpendicular to the transport direction is: It is in a state connected to the mounting substrate 12. Therefore, it is necessary to form a V-cut along the boundary line of the printed circuit boards 14, 14.

Note that the length and arrangement of the vertical slit piece forming pin guide hole 38a and the vertical slit piece forming pin (not shown) are the same as those in the third embodiment, but the processing region on the lower mold 20c is as follows. Since there is one, the outer frame portion of the printed wiring board 10 is not cut at any time when the forward feed is finished and when the reverse feed is finished. Therefore, at the time when the feed in the reverse direction is finished, one continuous outer frame remains, and the end material finely cut does not remain on the lower mold 1c.
However, if the length of the vertical slit piece forming pin guide hole 38c is further extended to the upstream side with respect to the transport direction, the printed wiring mother board 10 will be removed when the forward feed and the reverse feed are finished. Each outer frame can also be cut once.
Further, when the dimensional accuracy of the outer periphery of the printed circuit board is not required, a perforation forming means may be provided so that the perforation is formed along the boundary line of the printed circuit board instead of the V cut. .

  The obtained mounting board 12 is sent to an automatic mounting process, and various electronic components are mounted on the surface. After the automatic mounting on the mounting board is completed, the frame portion and the printed circuit board can be separated by breaking the frame portion, and the separated printed circuit board can be incorporated into various electronic devices.

[4.3 Action of Mother Plate Processing Die (4)]
The mother board machining die 1c according to the present embodiment is
(A) A part of the outer shape of the two printed circuit boards can be punched in the region that becomes the mounting substrate when the printed wiring board 10 is forward-forwarded; and
(B) When the printed wiring board 10 is fed in the reverse direction, a part of the outer shape of the two printed circuit boards can be punched out further in the blank portion in the region to be the mounting board.
Since punching means (product board outer shape cutting means) are arranged, the number of punching means built into the mold can be reduced to half or less compared to the case of processing while simply feeding the printed wiring board forward. it can. Therefore, the mold structure is simpler and the number of parts required for the mold is reduced.
In addition, the pressing pressure required for one press is approximately half or less. Therefore, it is possible to manufacture a mounting board having a large area in which a large number of printed circuit boards are incorporated, using a small press machine having a small pressing capability.

Furthermore, when optimizing the length and arrangement of the vertical slit forming means,
(A) When the printed wiring board is forwardly fed, the outer periphery of the printed wiring board is cut only at one place so that the outer circumference of the printed wiring board communicates with the outer circumference of the mounting board, or Without cutting the outer periphery of the printed wiring board, and
(B) After the printed wiring board is forwardly fed, and when the printed wiring board is further fed in the reverse direction, the outer circumference of the printed wiring board and the outer circumference of the mounting board are communicated with each other. Cut the outer frame part only at one place or do not cut the outer peripheral part of the printed wiring board at one place.
be able to. As a result, no end material of the finely cut printed wiring board 10 is left on the lower mold, two L-shaped end materials remain, or only one continuous end material remains. . For this reason, it is possible to simplify scrap disposal and cleaning of the lower mold surface.

  Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the present invention.

The mold for processing a mother board according to the present invention is
(1) A mounting board in which a printed circuit board is temporarily fixed to a frame portion by a pushback method,
(2) A mounting board in which a part of the outer periphery of the printed circuit board is temporarily fixed to the frame portion via a V-cut or perforation,
It can be used as a mold for producing various processed plates such as.
In addition, a method for manufacturing a processed plate and a method for manufacturing a product plate according to the present invention include a method for manufacturing a mounting substrate using such a base plate processing mold, and a mounting substrate obtained by such a method. It can be used as a method of separating the frame portion from the substrate and obtaining a printed circuit board.

DESCRIPTION OF SYMBOLS 1 Mother board processing metal mold | die 3 1st area | region 5 2nd area | region 10 Printed wiring mother board (mother board)
12 Mounting board (processed board)
20 Lower mold 26a-26f Lower mold stripper (pushback means)
50 Upper mold 68a-60f Upper punch (pushback means)

Claims (13)

A mold for processing a mother board having the following configuration.
(1) The mother board processing mold includes product board outer shape cutting means for cutting all or part of the outer shape of the product board from the mother board.
(2) The product plate outer shape cutting means includes:
(A) When the base plate is forwardly fed, all or part of the outer shape of the first product plate can be cut in a part of the region to be the processed plate; and
(B) After feeding the base plate in the forward direction, when the base plate is further fed in the reverse direction, all or part of the outer shape of the second product plate is newly added in the blank portion in the region to be the processed plate. It is arranged so that it can be cut.
(3) The metal mold for processing the base plate is formed with a vertical slit parallel to the transport direction of the base plate, thereby forming a side slit parallel to the transport direction of the processed plate. Forming means are provided.
(4) The vertical slit forming means includes:
Vertical slit piece forming means for forming continuous vertical slits by sequentially forming vertical slit pieces parallel to the conveying direction of the base plate and communicating them.
It is.
(5) The vertical slit piece forming means includes:
(A) When the base plate is forwardly fed, the vertical slit piece is not communicated; and
(B) When the mother board is fed in the forward direction, and further when the mother board is fed in the reverse direction, the vertical slit pieces communicate with each other and become the continuous vertical slit.
Are arranged as follows.   2. The mother board machining die according to claim 1, wherein the product board outer shape cutting means is pushback means for punching the product board from the mother board and fitting the punched product board into an original hole.   3. The mother board machining die according to claim 1, wherein the product board outer shape cutting means is a punching means for punching out a part of the outer periphery of the product board from the mother board. The mother board machining die according to any one of claims 1 to 3, further comprising the following configuration.
(6) before Symbol mother plate processing mold is,
A first region having an area equal to or greater than that of the processed plate, disposed on the upstream side with respect to the conveyance direction of the mother plate;
And a second region having an area equal to or larger than that of the processed plate, which is disposed on the downstream side with respect to the conveyance direction of the mother plate.
(7) to at least one of the previous SL first region or the second region is provided above the product plate contour cutting means. The mother board machining die according to any one of claims 1 to 4 , further comprising the following configuration.
(8) before Symbol motherboard processing mold by forming a lateral slit perpendicular to the conveying direction of the base plate, the horizontal to form a side perpendicular to the conveying direction of the machining plate Slit forming means is provided. The horizontal slit forming means includes
Sequentially forming a transverse slit segment perpendicular to the conveying direction of the base plate, by communicating them to the horizontal slit segment forming means der Ru claim 5 for forming a continuous said transverse slits Mold for processing mother board as described. The horizontal slit piece forming means includes:
(A) When the base plate is fed in the forward direction, the transverse slit piece does not communicate, and
After (b) the base plate forward feeding, further wherein when the base plate feeding reversed direction, to the claim 6 the transverse slit segment is that are arranged such that said transverse slit continuous communicated Mold for processing mother board as described. The mother board machining die according to any one of claims 1 to 7 , further comprising the following configuration.
(9) before Symbol mother plate processing mold is,
(A) cutting the outer frame portion of the mother plate at one location so that the outer periphery of the mother plate and the outer periphery of the processed plate communicate with each other when the mother plate is fed forward;
(B) After the mother board is fed forward, the outer frame portion of the mother board is arranged so that the outer circumference of the mother board communicates with the outer circumference of the processed board when the mother board is further fed in the reverse direction. An outer frame cutting means for cutting only one place is provided. The mother board machining die according to any one of claims 1 to 8 , further comprising the following configuration.
(10) before Symbol motherboard processing mold is provided with a through hole forming means for forming a through-hole in any part of the region to be the processing plate. The through hole forming means includes:
A portion other than the portion punched in said product plate contour cutting means, the mother plate processing mold according perforations forming means for forming a perforation in including claim 9. The manufacturing method of the processed board provided with the following processes.
(1) Using the mother board machining die according to any one of claims 1 to 10, while feeding the mother board in the forward direction, the first product board in a part of the region to be the machined board. A first step of cutting all or part of the outer shape.
(2) After feeding the base plate in the forward direction, while further feeding the base plate in the reverse direction, the whole or part of the outer shape of the second product plate is newly renewed in the blank portion in the region to be the processed plate. Second step of cutting. The manufacturing method of the processed board of Claim 11 further provided with the following processes.
(3) The manufacturing method of the processed plate is as follows:
A V-cut forming step of forming the V-cut on the processed plate such that the V-cut contacts the outer periphery of the product plate or the V-cut is formed along the outer periphery of the product plate; Yes. The manufacturing method of the product board provided with the product board separation process which isolate | separates a frame part from the processed board obtained by the method of Claim 11 or 12, and obtains a product board.

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