JP3922465B1 - Mold for processing base plate, method for manufacturing processed plate, and method for manufacturing product plate - Google Patents

Abstract

A shaving tool capable of shaving a product plate without increasing the number of processing steps, a base plate processing mold using the shaving tool, a manufacturing method of the processing plate, and a manufacturing method of the product plate To provide.
A shaving tool comprising a step capable of shaving a cut surface of the mother plate on at least a part of a surface in contact with the mother plate, and being separable from the step portion, such as this A mold for processing a mother board using a shaving tool, a method for manufacturing a processed plate, and a method for manufacturing a product plate.
[Selection] Figure 1

Description

The present invention, the mother plate processing mold, a manufacturing method of machining plate, and relates to a manufacturing method of the product sheet, more particularly, for the mother plate processed with a shaving Engineering tool for shaving the cut surface of the mother plate A mold, a method of manufacturing a processed board for manufacturing a processed board (for example, a mounting board) in which a product board (for example, a printed circuit board) is temporarily fixed by using a frame, and The present invention relates to a method of manufacturing a product plate that breaks a frame portion provided in such a processed plate.

  In recent years, with the miniaturization of electronic devices, there has been an increasing demand for miniaturization and modification of printed circuit boards used in electronic devices. On the other hand, an electronic component automatic mounting machine (hereinafter referred to as “self-mounting machine”) such as a chip mounter or an automatic insertion machine for mounting electronic components on a printed circuit board is referred to as the size of a workpiece because of its conveyance. Have upper and lower limits. Moreover, the external shape of the workpiece | work used for a self-machine is required to be substantially rectangular, ie, at least one side is a straight line, and at least one of the orthogonal sides is a straight line.

  Therefore, when mounting electronic components on a small and irregular printed circuit board using a self-mounting machine, first, a plurality of printed circuit boards are formed on the printed wiring board, and the V-cut method and pushback method are used. Using a perforation method, etc., the printed circuit board is temporarily fixed to the original printed wiring board, and then the printed wiring board has a size and shape that can be conveyed by the self-equipment. A method of cutting a substrate (mounting substrate) is used.

Of these, the V-cut method inserts V-shaped, U-shaped and other concave grooves (V-cut) along the printed circuit boundary printed on the printed wiring board, and mounts electronic components on the printed circuit. And then breaking along the V-cut. Therefore, the V-cut method can be applied only to a printed circuit board whose outer shape is linear.
The perforation method is a method in which a large number of small holes are formed along the boundary line of the printed circuit board and the holes are broken along the small holes. The perforation method is applicable only to a printed circuit board that does not require dimensional accuracy of the outer shape, because unevenness remains on the boundary line after fracture.

  On the other hand, in the pushback method, the printed circuit board is punched out using a blade having a predetermined shape while holding the printed wiring board between the upper mold and the lower mold, and then the punched printed circuit board is removed from the original hole. It is a method of fitting. The pushback method has a high dimensional accuracy of the outer shape and there is no restriction on the shape of the printed circuit board, and is therefore an effective method particularly when electronic components are automatically mounted on a deformed printed circuit board.

The processing of printed wiring board using the pushback method is generally
(1) Form a reference hole for pushback on the printed wiring board on which the electric circuit is printed,
(2) Push-back processing of the printed circuit board using the push-back mold, and drilling of component holes as necessary,
(3) Cutting the outer shape of the printed wiring board using an outer cutting die and cutting out a mounting board including a predetermined number of printed circuit boards from the mother board.
Has been done.

  However, the pushback process generally tends to warp because a strong shearing force acts on the printed wiring board. Conventionally, pushback processing and outline cutting have been generally performed using separate molds. However, if only pushback processing is performed continuously on the base plate, large warpage will occur in the base plate. There is a problem that it becomes difficult to cut the outer shape. In addition, a pushback mold and an outer cutting mold are required, which increases the cost. Further, when the manufactured mounting board is warped or has a relatively large residual stress, it is difficult to remove the printed circuit board from the frame.

Therefore, in order to solve this problem, Patent Document 1 discloses that the printed circuit board is disposed on the upstream side with respect to the conveyance direction of the printed wiring board, and the printed circuit board is punched out from the printed wiring board. A mounting board including one or two or more of the printed circuit boards that are arranged on the downstream side with respect to the transport direction of the printed wiring board and pushed back. There is disclosed a printed wiring board processing die having an outer shape cutting means for cutting out from a printed wiring board.
In this document, since the area pushed back by the pushback means is sequentially separated by the outline cutting means, the outline cutting can be easily performed without being greatly affected by the warp of the printed wiring board, and one metal It describes that the die cost can be reduced because push back processing and external cutting processing can be performed with the mold.

  Further, Patent Document 2 is arranged on the upstream side with respect to the conveyance direction of the mother board, punches the punching board from the mother board, and pushback means for fitting the punched punching board into the original hole; For processing a mother board provided with an external cutting means for cutting out from the mother board a processing board including one or more punched plates that are disposed downstream of the mother board in the conveying direction and pushed back In the mold, a mother board further comprising flat punching means for pressing the mother board in which the punching plate is fitted between the pushback means and the outer shape cutting means to flatten the surface of the mother board. A processing die is disclosed. By adopting such a configuration in this document, it is possible to manufacture a flat processed plate that does not have deformation or damage around the through hole, etc., regardless of the material of the base plate, the shape of the punched plate, etc. In addition, it describes that it is possible to reduce mold costs and man-hours.

  Further, Patent Document 3 is based on the first pushback plate that is arranged upstream of the conveyance direction of the mother plate, punches out one or more first pushback plates from the mother plate, and is punched out. A first pushback means for fitting into the hole, and a downstream side of the first pushback means with respect to the conveying direction of the mother board, and one or more second pushback boards from the mother board. A second pushback means for fitting the punched and punched second pushback plate into the original hole; and a pushback disposed downstream of the second pushback means with respect to the conveying direction of the mother plate. Disclosed is a mother board machining die provided with one or two or more of the first pushback board and the outer shape cutting means for cutting out a machining board including the second pushback board from the mother board. There. According to this document, by adopting such a configuration, even if the shape of the pushback plate is complicated, pushback processing is easy, the consumption of the mold is small, and the material yield is improved. Are listed.

  Further, Patent Document 4 includes a first means disposed on the upstream side with respect to the conveyance direction of the mother board, and a second means disposed on the downstream side with respect to the conveyance direction of the mother board, The first means is formed in the region at the same time as the pushback means for punching out the region that is the same as or larger than the processed plate from the mother plate and fitting the punched region into the original hole. First elongated hole forming means for discretely forming first elongated holes in a part of the outer periphery of the finished product plate, and the second means punches the processed plate including the product plate from the mother plate. At the same time as the punching means and the punching of the processed plate, at least one end thereof is close to one end of the first elongated hole, and is the outer periphery of the product plate, and the second elongated hole between the first elongated holes. Gold for processing a mother board provided with second slot forming means for forming a hole There has been disclosed. In the same document, by adopting such a configuration, in the case where a processed plate in which a product plate is temporarily fixed to a frame portion by a discontinuous long hole from a base plate is manufactured using a die press method, It describes that the die cost and man-hours can be reduced, the mold is complicated and the strength is suppressed, and the mother board can be prevented from being lifted.

JP 2002-233996 A JP 2004-247499 A Japanese Patent Laid-Open No. 2004-2731992 Japanese Patent No. 3396835

  When a mother board is punched out using a mold, the cut surface of the mother board is usually in a rough state. For this reason, if the printed circuit board is removed after punching or pushback processing is performed on the mother board and electronic components are mounted on the surface of the printed circuit board, chips may fall from the cut surface. If such chips adhere to the surface of the printed circuit board or enter the apparatus into which the printed circuit board is incorporated, a malfunction may occur. Therefore, in applications where generation of such chips is particularly disliked, it is common to perform a shaving process on the outer periphery of the printed circuit board. However, the method of separately performing the shaving process has a problem that the efficiency of the shaving process is poor because the man-hour for the shaving process increases.

  Moreover, as disclosed in Patent Documents 1 to 4, when the mold is divided into a plurality of regions along the conveyance direction of the mother board, and a processing means for processing the mother board is arranged in each area, Complex machining can be continuously performed on the mother board. However, all of the conventional molds basically have a structure in which either the upper mold or the lower mold is a female mold and the other is a punch (male mold), and the entire base plate is pressed in one direction. It has become. Therefore, the processing methods that can be selected in each region are limited by the pressing direction of the mother board, and there is a problem that the degree of freedom in selecting the processing method in each region is small. Even if the processing method can be selected, there is a problem that the mold becomes complicated in order to perform the desired processing.

  Further, as disclosed in Patent Documents 1 to 4, in the case of a mold that presses the entire mother board downward, usually, a lower mold stripper for placing the mother board and a lower mold stripper are supported. An elastic member for restoring the pressed base plate and the lower mold stripper to the original position is inserted between the lower mold base plate and the lower mold base plate. At the time of pressing, the lower stripper is pressed downward against the urging force of the elastic member. However, as the number of parts to be urged using elastic members increases, it is necessary to press the lower mold stripper against the urging force of these elastic members, so a large press machine with a large load is required. . In addition, since a relatively large load is repeatedly applied to the mold, there is a problem that the elastic member deteriorates early and the frequency of replacement work increases.

An object of the present invention is to provide, without increasing the number of processing steps, the mother plate processing mold having a shaving Engineering tools capable of performing the shaving of the product sheet, a manufacturing method of machining plate, and the product It is in providing the manufacturing method of a board.
Further, another problem to be solved by the present invention is that a shaving process is possible, and even when a small press machine is used, a plurality of processes are performed along the conveyance direction of the mother board. It is an object of the present invention to provide a die for processing a base plate, a method for manufacturing a processed plate using such a die for processing a base plate, and a method for manufacturing a product plate.
Furthermore, another problem to be solved by the present invention is for processing a base plate that can be shaved and has a low frequency of replacement of an elastic member for restoring each part of the mold to its original position. An object of the present invention is to provide a mold, a method of manufacturing a processed plate using such a base plate processing mold, and a method of manufacturing a product plate.

(Delete)

Engaging Ru mother plate processing mold to the present invention,
A first region arranged on the downstream side with respect to the conveying direction of the mother plate, for cutting out the processed plate from the mother plate;
A second region that is disposed upstream of the transport direction of the base plate, has an area corresponding to at least one of the processing plates, and for processing the base plate;
Provided with a mother board cutting means provided between the first area and the second area for cutting the mother board in a direction intersecting the conveying direction of the mother board;
The mother board cutting means is
A lower surface of the upper mold (a) a female mold fixed on the first region of the upper mold;
(B) Dividing into an upper stripper for cutting a mother plate that can move up and down along the upstream side surface of the female mold and is biased downward;
On the second region of the lower mold, the downstream side surface is arranged so as to slide along the upstream side surface of the female mold, and the base in the direction perpendicular to the conveying direction of the base plate is arranged. Fixing a punch for cutting a mother board having a width wider than the length of the board;
In the first region and the second region, processing is performed on the mother plate, respectively, and at the same time, using the upstream side surface of the female mold and the downstream side surface of the mother plate cutting punch, Shearing the mother board along the direction intersecting the transport direction,
The first region and / or the second region are provided with a step capable of shaving the cut surface of the mother plate on at least a part of the surface in contact with the mother plate, and divided from the step portion. The gist is that a shaving tool that can be used is provided.

Manufacturing method of engaging Ru pressurized Engineering plate to the invention,
With engaging Ru mother plate processing mold to the present invention, in the second region, a first pressing step of performing first press to the base plate,
The mother board is transported so that the area pressed in the second area in the immediately preceding press is on the first area, and at the same time as the new pressing of the mother board is performed in the second area, In the region, a second press step of cutting a processed plate in which a product plate is supported by a frame portion from the mother plate;
Simultaneously with the second pressing step, using the mother board cutting means, a mother board cutting step of shearing the mother board along a direction intersecting the conveying direction of the mother board is provided. And
Further, the production method of engaging Ru products plate in the present invention, a frame portion provided in the processing plate obtained by the production method of engaging Ru pressurized Engineering plate to the invention is broken, and summarized in that the separation of the product sheet .

When the mother board is processed using a die for processing a mother board provided with a shaving tool having a step capable of shaving the cut surface of the mother board on at least a part of the surface in contact with the mother board, press working At the same time, the cut surface can be shaved. Moreover, since it is not necessary to perform shaving separately, the manufacturing cost can be reduced.
Further, when the lower surface of the upper die is divided into the female die on the first region and the upper die stripper for cutting the mother plate on the second region, the mother plate is cut between the first region and the second region simultaneously with pressing. The At this time, the mother board on the second area side does not move downward, and only the mother board on the first area side moves downward, so that separate operations are performed in the first area and the second area, respectively. To make it easier. Therefore, the degree of freedom in selecting the processing method in the first region and the second region is increased as compared with a conventional mold that moves the entire base plate downward. Moreover, different processing can be easily performed in the first region and the second region without making the mold complicated and large.
Further, by dividing the upper die into the female die and the upper die stripper for cutting the mother board, the amount of the elastic member to be used can be greatly reduced depending on the type of processing. Therefore, even if a small press machine is used, it can be processed easily. Moreover, since only a relatively small force is applied to the elastic member, the replacement frequency of the elastic member is also reduced.
Furthermore, for such base plate processing mold, a product sheet having Applying shea Ebin grayed for engineering tools with a step that can shave the cut surface of the mother plate, a complicated shape However, shaving can be easily performed without increasing the number of processing steps.

  Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. In the following description, a shaving tool used for manufacturing a mounting board in which a printed circuit board is supported by a frame portion from a printed wiring board, and a mother for manufacturing such a mounting board. Explains a plate processing mold, a method for manufacturing a mounting substrate, and a method for manufacturing a printed circuit board, the present invention is a "base plate" other than a printed wiring mother board, a "work board" other than a mounting substrate, It can also be applied to “product boards” other than printed circuit boards.

First, the shaving tool according to the present invention will be described.
Shebin grayed for engineering tool according to the present invention, at least a portion of the surface in contact with the printed wiring mother board, comprising a step capable of shaving the cut surface of the mother plate, it has become possible division from the portion of the step It is characterized by.

In FIG. 1 (a), the mother plate punched holes Shebin grayed for engineering tool used as a pin for forming (hereinafter, "shaving Pin" hereinafter) cross-sectional view of the (left) and a bottom view thereof (the right) Show. In FIG. 1A, the shape of each part is drawn enlarged or reduced from the actual size for easy viewing.
In FIG. 1A, the shaving pin 100 includes an S-shaped upper pin 102 and an L-shaped lower pin 104. The shaving pin 100 is integrated by superimposing the tip of the upper pin 102 bent in an L shape on the tip surface of the lower pin 104. The shaving pin 100 has a rectangular cross section in the longitudinal direction, and a step that can be shaved is provided on one long side of the rectangular cross section. The step is constituted by the right side surface at the tip of the upper pin 102 and the tip surface of the lower pin 104. Further, the shaving pin 100 can be divided from the stepped portion.

The distance (step width) g between the right side surface of the upper pin 102 and the right side surface of the lower pin 104 may be any width that allows shaving.
Here, the “shaving width” means that the printed wiring board is not cut at different positions by the right side surface of the upper pin 102 and the right side surface of the lower pin 104, and is formed by the right side surface of the upper pin 102. The width is such that the rough cut surface can be smoothed by the right side surface of the lower pin 104. Generally, when the width of the step is too narrow, a sufficient shaving effect cannot be obtained. On the other hand, if the width of the step becomes too large, a new cut surface is formed by the right side surface of the lower pin 104 and shaving is not performed. Although the optimum step width varies depending on the material of the printed wiring board, the shape of the printed circuit board, and the like, it is about ten to several hundreds of μm.

  The distance (height of the step) L between the distal end surface of the upper pin 102 and the distal end surface of the lower pin 104 is not particularly limited and can be arbitrarily selected according to the purpose. Generally, when the height L of the step is too small, the strength of the upper pin 102 is lowered. On the other hand, even if the height L of the step is large, there is no particular problem because shaving can be performed if the stroke during pressing is increased, so there is no practical benefit if the height L of the step is increased more than necessary. The optimum height L of the step differs depending on the material of the printed wiring board, the shape of the printed circuit board, etc., but is about 1 to 2 times the thickness of the printed wiring board.

  The method for fixing the shaving pin 100 to the mold is not particularly limited, and an optimal fixing method may be used according to the mold for which the shaving pin 100 is used. For example, as shown in the right diagram of FIG. 1A, the shaving pin 100 is inserted into a through hole formed in the holder 106, and the holder 108 is further stacked on the holder 106. May be fixed. In this case, the upper pin 102 and the lower pin 104 may only be physically overlapped, or the upper pin 102 and the lower pin 104 may be fixed by appropriate detachable fixing means (for example, screwing). Also good.

In FIG. 1 (b), Shebin grayed for engineering tools which is used as a female mold for punching the plate material having a predetermined shape from the mother plate (hereinafter, referred to as "shaving die") shows a cross-sectional view of. In FIG. 1B, the shape of each part is drawn enlarged or reduced from the actual size for easy viewing.
In FIG. 1B, the shaving die 110 includes an upper die 112 having a step-like inner peripheral surface and a lower die 114 having an L-shaped cross section. In the shaving die 110, the lower die 114 is inserted into a stepped recess formed on the inner peripheral surface of the upper die 112, and the tip of the upper die 112 bent in an L shape is superimposed on the tip surface of the lower die 114. It is integrated by. On the inner peripheral surface of the tip of the shaving die 110, a step that can be shaved is provided. The step is constituted by the inner peripheral surface at the tip of the upper die 112 and the tip surface of the lower die 114. Further, the shaving die 110 can be divided from the stepped portion.

The details of the step width g and the step height L are the same as those of the shaving pin 100 shown in FIG.
The method for fixing the shaving die 110 is not particularly limited, and an optimal fixing method may be used according to the mold in which the shaving die 110 is used. For example, as shown in FIG. 1B, the shaving die 110 may be fixed by superimposing a base plate 116 on the shaving die 110. In this case, the upper die 112 and the lower die 104 may only be physically overlapped, or the upper die 112 and the lower die 114 may be fixed by appropriate detachable fixing means (for example, screwing). good.

In FIG. 1 (c), Shebin grayed for engineering tools which is used as a punch for punching a plate material having a predetermined shape from the mother plate (hereinafter, referred to as "shaving punch") shows a cross-sectional view of. In FIG. 1C, the shape of each part is drawn enlarged or reduced from the actual size for easy viewing.
1C, the shaving punch 120 includes an upper punch 122 having a T-shaped cross section and a lower punch 124 having a through hole into which the upper punch 122 can be inserted. The shaving punch 120 is integrated by superimposing the tip of the upper punch 122 protruding in a T shape on the tip surface of the lower punch 124. On the outer peripheral surface of the tip of the shaving punch 120, a step that can be shaved is provided. The step is constituted by the side surface at the front end of the upper punch 122 and the front end surface of the lower punch 124. Further, the shaving punch 120 can be divided from the stepped portion.

The details of the step width g and the step height L are the same as those of the shaving pin 100 shown in FIG.
Moreover, the fixing method of the shaving punch 120 is not particularly limited, and an optimal fixing method may be used according to the mold in which the shaving punch 120 is used. For example, as shown in FIG. 1 (c), when the shaving punch 120 is used so that the tip of the shaving punch 120 faces upward, the upper punch 122 may be simply inserted into the through hole of the lower punch 124, or the upper punch 122 And the lower punch 124 may be fixed by appropriate detachable fixing means (for example, screwing).

Next, a method used in Shebin grayed for engineering tool according to the present invention. FIG. 2 shows a process diagram of a method for processing a printed wiring board using shaving pins.
The shaving pin 100 is fixed to the upper mold 130, and the lower mold 140 is formed with a guide hole 140 a for guiding the shaving pin 100. It is not necessary to provide a step in the guide hole 140a that is the counterpart of the shaving pin 100. This also applies to the shaving die and the shaving punch.
As shown in FIG. 2A, the printed wiring board 1 is placed on the upper surface of the lower mold 140. Next, when the upper die 130 is lowered, first, the upper pin 102 punches out the printed wiring board 1 as shown in FIG. When the upper die 130 is further lowered, one side of the hole formed by the upper pin 102 is shaved by the lower pin 104 as shown in FIG.
In FIG. 2, since the width g of the step of the shaving pin 100 is drawn larger than the actual size, the printed wiring board 1 seems to be newly cut by the lower pin 104. If the width g of the step is optimized, the printed wiring board 1 is not newly cut by the lower pin 104, and the surface cut by the upper pin 102 is shaved by the lower pin 104.

The same applies to the shaving die 110 shown in FIG. 1B. If the shaving die 110 is attached to a die and pressed, the plate material is punched from the printed wiring board by the shaving die 110, and at the same time, the inner end of the shaving die 110 is also removed. By the peripheral surface, the outer periphery of the punched plate material can be shaved. Further, when the punched plate material is fitted into the original hole, the outer periphery of the plate material can be shaved simultaneously with the push back of the plate material.
The shaving punch 120 shown in FIG. 1C is also the same. If this is attached to a die and pressed, the plate material is punched from the printed wiring board by the shaving punch 120, and at the same time, the tip of the shaving punch 120 With this outer peripheral surface, the inner peripheral surface of the punched hole formed in the printed wiring board after punching the plate material can be shaved.

Next, the mother board machining die according to the present invention will be described.
Mother plate working die according to the first embodiment of the present invention is characterized by using Shebin grayed for engineering tool according to the present invention in any portion of the mold. When these shaving pins, shaving dies and / or shaving punches are used for various molds for manufacturing a mounting substrate in which a printed circuit board is supported by a frame portion, simultaneously with pressing, the mounting substrate Any part can be shaved.

For example, a printed circuit board pushback mold, a mounting board outer shape cutting mold, and a mounting board in which a printed circuit board is supported by a frame by punching or pushing back unnecessary portions. When the shaving pin according to the present invention is applied to various molds such as a mold, a printed circuit board is supported by a frame by pressing a mother board, and at the same time, any of the mounting boards A through hole whose inner peripheral surface is shaved can be formed in such a portion.
Further, for example, when the shaving die according to the present invention is used as a female die for push-back processing of a printed circuit board, a printed circuit board is pushed back by pressing the mother board, and at the same time, a printed circuit board is printed. The outer peripheral surface of the circuit board can be shaved.
Further, for example, when the shaving punch according to the present invention is used as a punch for punching or pushing back unnecessary portions, a manufacturing substrate in which unnecessary portions are punched or pushed back by press working of the mother board, The outer peripheral surface of the printed circuit board can be shaved.
When the frame portion of the mounting substrate thus obtained is broken, the printed circuit board can be easily separated.

When continuously performing the processing with reference to FIG. 1 (a) ~ FIG. 1 Shebin grayed for engineering tool (c), the marked with R and eventually wear corners of the corner portions and the stepped portion of the distal end surface, the cutting efficiency And shaving efficiency is reduced. In this case, when Shebin grayed for engineering tools are integrated, re-polishing of the step portion is not easy. In contrast, when dividable a Shebin grayed for engineering tools from the portion of the step to decompose Shebin grayed for engineering tools when corners are worn, the distal end surface of the upper side of the tool (upper pin, the upper die, the upper punch) The corners of the stepped portion can be easily regenerated by simply polishing the tip surfaces of the lower and lower tools (lower pin, lower die, lower punch).

Next, a mother board machining die according to a second embodiment of the present invention will be described.
3 and 4 show a mother board machining die 10 according to a second embodiment of the present invention. In FIGS. 3 and 4, the dimensions of the respective parts are appropriately enlarged and reduced from the actual dimensions for easy understanding. 3 and 4, the mother board machining mold 10 includes a lower mold 20 and an upper mold 50.

The base plate processing mold 10 has a first region 12 on the downstream side and a second region 14 on the upstream side with respect to the conveyance direction of the printed wiring mother plate.
The first area 12 is an area for cutting out the mounting board from the printed wiring board. In the present embodiment, the first region 12 includes punching means for punching the mounting substrate. In addition, although illustration is omitted, in the first area 12, a pushback means for punching out a printed circuit board from a printed wiring board and fitting the punched printed circuit board into the original hole, if necessary, and mounting Instead of punching out the circuit board, pushback means for pushing back the mounting board, through hole forming means for forming various through holes in the printed circuit board or the frame portion, and the like can be provided.
The second region 14 has an area corresponding to at least one mounting substrate and is a region for processing the mother board. In addition, although illustration is omitted, in the second region 14, push-back means for performing push-back of the printed circuit board as needed, and through-holes for forming various through-holes in the printed circuit board and the frame portion Forming means and the like can be provided.
The printed wiring board is sequentially pressed in the second region 14 and the first region 12 while being stepped from the second region 14 toward the first region 12.

  As shown in FIG. 3, the lower mold 20 includes a lower mold base plate 22, a mounting substrate punch 24, a lower mold stripper 28, and a mother board cutting punch 38.

  Two guide posts 30, 30 that are used for positioning the upper die 50 at the time of pressing are erected at the corner on the downstream side of the lower die base plate 22. The lower mold stripper 28 is movable up and down along the peripheral wall surfaces of the guide posts 30, 30. On the other hand, on the upstream side of the lower mold base plate 22, two guide post guide holes 30 a and 30 a for guiding a guide post standing on the upper mold 50 are provided.

  The mounting substrate punching punch 24 is a punch (male die) for punching the mounting substrate upward from a printed wiring board placed on the lower die 20, and is a first region of the lower die base plate 22. 12 is fixed at substantially the center. In FIG. 1, the outer shape of the mounting substrate punch 24 is rectangular. However, the shape is not limited to this, and at least one side is a straight line, and at least one side is orthogonal thereto. It only has to be. Each side may have unevenness for partially forming a slit for stress relaxation, a semicircular or rectangular cutout, and the like.

  On the upper surface of the mounting substrate punch 24, positioning pins 32a and 32a used for positioning when the printed wiring board is pressed are provided upright. In FIG. 1, two positioning pins 32a and 32a are provided on the diagonal of the mounting board punching punch 24. However, this is merely an example, and the position and number of the positioning pins 32a and 32a. Can be arbitrarily selected according to the purpose.

The lower mold stripper 28 is used for placing a printed wiring mother board during processing, and is arranged so that it can be moved up and down along the peripheral wall surfaces of the mounting board punching punch 24 and the mother board cutting punch 38. It is supported by the mold 20 and biased upward. Support bolts 34, 34... Loosely inserted from the lower surface of the lower mold base plate 22 are fixed to the lower surface of the lower mold stripper 28. The support bolts 34, 34... Can move up and down in the lower mold base plate 22. Further, elastic members 36, 36... Are inserted between the lower surface of the lower mold stripper 28 and the upper surface of the lower mold base plate 22. That is, the lower mold stripper 28 is restricted from moving upward by the support bolts 34, 34... And is urged upward by the elastic members 36, 36.
The number and arrangement of the support bolts 34, 34... And the elastic members 36, 36... Are not particularly limited, and an optimal number and arrangement are appropriately selected so that the printed wiring board can be processed smoothly. . Further, the material of the elastic members 36, 36... Is not particularly limited, but urethane rubber or the like is preferable.

  Further, the lower mold stripper 28 is provided with shaving pin guide holes 28a, 28a... At the upper and lower ends of the left side of the mounting substrate punch 24 and the upper and lower ends of the right side. The shaving pin guide holes 28 a, 28 a... Penetrate the lower mold base plate 22, and drop a punch punched out by a shaving pin described later to drop below the lower mold base plate 22.

  The mother board cutting punch 38 is fixed to the lower mold base plate 22 on the second region 14. The mother board cutting punch 38 becomes a mounting substrate on the first region 12 (a region surrounded by the outer periphery of the mounting substrate punching punch 24) and a mounting substrate on the second region 14. This is for cutting the printed wiring mother board in a direction intersecting with the conveyance direction of the printed wiring mother board (mother board cutting means) between the area (the area indicated by the dotted line in FIG. 3). Therefore, the lateral width of the mother board cutting punch 38 is wider than the lateral width of the printed wiring mother board. In the present embodiment, the mother board cutting punch 38 is perpendicular to the conveyance direction of the printed wiring mother board along the downstream side of the area to be the mounting board on the second area 14. The shape is determined so that the printed wiring board is cut.

In the present embodiment, the mother board cutting punch 38 is not only a mother board cutting means but also a means for cutting a part of the outer periphery of the mounting board. Therefore, a pin guide hole 38a for cutting the upstream side of the region serving as the mounting substrate on the second region 14 and a part of the left and right sides are cut in the mother board cutting punch 38. Pin guide holes 38b, 38b are provided. The pin guide holes 38b and 38b are configured to cut between the shaving pin guide holes 28a and 28a provided in the first region 12, respectively. Each of the pin guide holes 38a, 38b, 38b penetrates the lower mold base plate 22 and discharges the punched scraps downward.
Further, positioning pins 32b and 32b are provided on the upper surface of the mother board cutting punch 38 at positions corresponding to the positioning pins 32a and 32a.
In addition, although not shown in the drawings, the punch 38 for cutting the base plate is provided with a through hole forming hole for guiding a pin for forming the through hole and a push for performing the push back of the printed circuit board, if necessary. Back means and the like can be provided.

  For shaving the downstream side of the region to be the mounting substrate, as shown in FIG. 3, the downstream side of the mother board cutting punch 38 and the mounting substrate on the second region 14 In the case where it is necessary to match the downstream side of the region, but the downstream side does not need to be shaved, the downstream side of the base plate cutting punch 38 is upstream of the frame punching punch 24. It may be between the side edge and the downstream edge of the area to be the mounting substrate on the second area 14.

The upper die 50 includes a top plate 52, a pressing plate holder 54, a pin holder 56, a punch plate 58, a female die 60, and an upper die stripper 70 for cutting a mother plate. That is, in the present invention, the lower surface of the upper mold 50 is divided into a female mold 60 and an upper mold stripper 70 for cutting a mother board. The top plate 52, the pressing plate holder 54, the pin holder 56, the punch plate 58, and the female die 60 are stacked via knock pins 52a, 52a, and fixed by fastening bolts 52b, 52b, and so on.
The female die 60 is for punching out a mounting substrate, and is fixed on the first region 12 of the upper die 50. The female die 60 is disposed on the first region 12 such that the upstream side surface slides along the downstream side surface of the upper die stripper 70 for cutting the mother plate. Further, the lateral width of the female mold 60 is wider than the width of the printed wiring board. Further, guide post guide holes 60 a, 60 a... Are formed in the female mold 60 at positions corresponding to the guide posts 30, 30.

Also, a slide space is provided at a position substantially in the center of the female mold 60 and corresponding to the mounting board punching punch 24, and an upper mold for punching the mounting board from the printed wiring board in the slide space. A stripper 62 is loosely inserted.
The upper mold stripper 62 is supported by support bolts 62a, 62a... Loosely inserted from above the punch plate 58, and is restricted from moving downward. The upper ends of the support bolts 62 a, 62 a... Can be moved up and down along the through holes formed in the pin holder 56. The upper mold stripper 62 is supported by support bolts 62a, 62a... So that its lower end slightly protrudes from the lower surface of the female mold 60 in the no-load state. Further, the upper mold stripper 62 is provided with positioning pin guide holes 62b and 62b at positions corresponding to the positioning pins 32a and 32a.

In the through hole that penetrates the pin holder 56 and the punch plate 58, pressing pins 66c, 66c,. The lower ends of the pressing pins 66c, 66c ... are in contact with the upper surface of the upper stripper 62, and the upper ends of the pressing pins 66c, 66c ... are in contact with the lower surface of the pressing plate 66d provided in the slide space of the pressing plate holder 54. is doing.
Further, the top plate 52 is provided with a through hole at a position corresponding to the pressing plate 66d, and knockout bushes 66e, 66e,... Are inserted into the through hole. The knockout bushes 66e, 66e,... Are set so that their tips slightly protrude from the upper surface of the top plate 52 in an unloaded state.

  On the left and right sides of the upper mold stripper 62, shaving pins 100, 100... Are provided at positions corresponding to the shaving pin guide holes 28a, 28a. The shaving pins 100, 100... Are provided with steps that can be shaved on the surface in contact with the upper stripper 62. Further, the shaving pins 100, 100... Are fixed by a pin holder 56, and their tips protrude from the lower surface of the female die 60.

  The upper die stripper 70 for cutting the mother plate is movable up and down along the upstream side surface of the female die 60. The boundary line between the mother board cutting upper mold stripper 70 and the female mold 60 is on the downstream side of the mother board cutting punch 38. The upper stripper 70 for cutting the mother board is supported by support bolts 70a, 70a, ..., and its downward movement is restricted. The support bolts 70 a, 70 a... Are loosely inserted from above the punch plate 58, and their upper ends can be moved up and down along the through holes formed in the pin holder 56.

  The punch plate 58 is provided with a through hole above the upper stripper 70 for cutting the base plate, and a lower surface of the cap bolt 58c fitted into the upper portion of the through hole and an upper surface of the upper stripper 70 for cutting the base plate. An elastic member 58d for biasing the upper die stripper 70 for cutting the mother board downward is inserted between the elastic members 58d. The number and arrangement of the elastic members 58d are not particularly limited, and can be arbitrarily selected according to the purpose. The material of the elastic member 58d is not particularly limited, but urethane rubber or the like is suitable.

The upper stripper 70 for cutting the base plate is provided with a through hole at a position corresponding to the pin guide hole 38a and the pin guide holes 38b and 38b, and each of the through holes serves as a mounting substrate. Cutting pins 68a for cutting the upstream side of the region, and cutting pins 68b and 68b for cutting part of the left and right sides of the region to be the mounting substrate are loosely inserted. The cutting pin 68 a and the cutting pins 68 b and 68 b are inserted from above the punch plate 58 and fixed by the pin holder 56. For this reason, as the upper stripper 70 for cutting the mother board moves upward, the tips of the cutting pins 68a and the cutting pins 68b and 68b protrude from the lower surface of the upper stripper 70 for cutting the mother board.
The upper stripper 70 for cutting the mother board is provided with positioning pin guide holes 70b and 70b at positions corresponding to the positioning pins 32b and 32b.

  Further, guide posts 74 and 74 are erected on the punch plate 58 at positions corresponding to the guide post guide holes 30 a and 30 a provided in the lower mold 20. The upper die stripper 70 for cutting the base plate is movable up and down along the peripheral wall surfaces of the guide posts 74 and 74. The guide posts 74, 74 may be erected on the lower mold 20, but when provided on the upper mold 50, it is possible to suppress lateral displacement when the upper mold stripper 70 for cutting the mother board moves up and down. There are advantages.

  Instead of standing the cutting pin 68a and / or the cutting pins 68b, 68b on the upper mold 50, the shape of the punch 38 for cutting the mother board is optimized at the same time as standing on the lower mold 20. As the mold stripper 28 moves downward, its tip may protrude from the upper surface of the lower mold stripper 28. However, in this case, since the structure of the upper mold 50 is complicated, it is preferable that the cutting pin 68a and the cutting pins 68b and 68b are erected on the upper mold 50.

  Next, the manufacturing method of the mounting board | substrate using the metal mold | die for mother board processing shown in FIG.3 and FIG.4 and the manufacturing method of a printed circuit board are demonstrated. FIG. 5 and FIG. 6 show process diagrams of a printed wiring board processing step as viewed from the direction perpendicular to the transport direction.

First, as shown in FIG. 5A, the printed wiring board 1 is placed on the lower mold 20. The printed wiring board 1 is provided with a pushback reference hole in advance, and positioning is performed by inserting the pushback reference hole into the positioning pins 32a and 32a and the positioning pins 32b and 32b.
Note that the printed wiring board 1 illustrated in FIG. 5A is obtained by cutting the cutting pin 68a and the cutting pins 68b and 68b in the second region 14 in the immediately preceding press. After pressing in the second area 14, the printed wiring board 1 is conveyed rightward, and the portion pressed in the second area 14 is placed on the first area 12.

  In addition, the printed wiring board 1 is preliminarily subjected to push-back of the printed circuit board, punching or push-back of unnecessary portions, formation of discontinuous long holes along the outer periphery of the printed circuit board, etc. using other molds. The printed circuit board may be temporarily fixed, or the printed circuit board may be temporarily fixed. In the case of using the printed wiring board 1 on which the printed circuit board is not temporarily fixed, a pushback means for performing a pushback of the printed circuit board in either the first region 12 or the second region 14; For temporarily fixing the printed circuit board, such as means for punching or pushing back unnecessary portions that do not constitute the printed circuit board, means for forming discontinuous long holes along the outer periphery of the printed circuit board, etc. Various means are provided. This point will be described later.

When the upper die 50 is lowered from this state, as shown in FIG. 5B, in the first region 12, the upper die stripper 62 contacts the printed wiring board 1 and moves upward. Accordingly, the tips of the shaving pins 100, 100... Punch the printed wiring board 1. When the upper stripper 62 moves further upward, the mounting substrate 2 is punched from the printed wiring board 1 and, at the same time, the cut surface is shaved by the steps of the shaving pins 100, 100. Further, as the upper mold stripper 62 moves upward, the pressing pins 66c, 66c... Push the pressing plate 66d upward. As a result, knockout bushes 66e, 66e,... Protrude from the top surface of the top plate 52.
On the other hand, in the second region 14, the mother board cutting punch 38 pushes up the mother board cutting upper mold stripper 70 against the urging force of the elastic member 58 d. As a result, the cutting pin 68a and the cutting pins 68b, 68b,... Protrude from the tip of the upper die stripper 70 for cutting the mother board, and the printed wiring board 1 is punched out.

  Further, in the second region 14, the downward movement of the printed wiring mother board 1 is restricted by the mother board cutting punch 38. Therefore, when the upper die 50 is further lowered, the downstream area of the mother board cutting punch 38 is reduced. The printed wiring board 1 is sheared in the direction perpendicular to the conveying direction by the side surface and the upstream side surface of the female die 60.

  When the upper die 50 is raised after the press is finished, the elastic members 36, 36... Push up the lower die stripper 28 upward as shown in FIG. At the same time, the elastic member 58d pushes the upper die stripper 70 for cutting the mother board downward. On the other hand, the downward force is not applied to the upper stripper 62. As a result, when the upper mold 50 is completely detached from the lower mold 20, the mounting substrate 2 remains held in the slide space of the female mold 60.

Thereafter, when the upper die 50 is further raised and the upper die 50 approaches the top dead center, a pressing means (not shown) presses the knockout bushes 66e, 66e. As a result, the pressing plate 66d pushes down the upper mold stripper 62 downward via the pressing pins 66c, and the mounting substrate 2 is removed from the upper mold 50.
The obtained mounting board 2 is sent to an automatic mounting process, and electronic components are automatically mounted on the printed circuit board. After the automatic mounting, the printed circuit board can be separated by breaking the frame part.

  FIG. 7 shows a plan view of the lower mold 20 and the printed wiring mother board 1 of the mother board processing mold 10. As shown in FIG. 7A, pushback reference holes 1a, 1a,... Formed in the printed wiring board 1 are inserted into the positioning pins 32b, 32b, and the first press is performed in the second region 14 (the first press). 1 press step) and the cutting pins 68a cut the upstream side of the region to be the mounting substrate. In addition, the cutting pins 68b and 68b cut part of the left and right sides of the region to be the mounting substrate. Further, the printed wiring mother board 1 is sheared along the downstream side of the mother board cutting punch 38. In FIG. 7A, the region is hatched so as to be cut out by the first press.

  Next, the printed wiring mother board 1 is transported and placed on the lower mold 20 so that the portion processed in the second region 14 in the immediately preceding press comes on the first region 12. The printed wiring board 1 is positioned using positioning pins 32a and 32a and positioning pins 32b and 32b. When the second press is performed from this state (second pressing step), as shown in FIG. 7B, in the second region 14, the cutting pin 68a, the cutting pins 68b and 68b, and the mother board cutting punch The printed wiring board 1 is cut by 38.

  On the first region 12, the mounting substrate 2 is punched by the mounting substrate punch 24. In this case, the upstream side is in a state where the same portion is cut twice by the mounting substrate punch 24 and the cutting pin 68a, so that the cut surface is in a shaved state. Similarly, the downstream side is cut twice by the mounting board punch 24 and the mother board cutting punch 38, and the center of the left and right sides is cut by the mounting board punch 24 and the cutting pins 68b and 68b. Since the same part is cut twice, the cut surface is shaved in both cases.

On the other hand, when the upper die 50 does not have the shaving pins 100 according to the present invention, the upper and lower ends of the left and right sides of the mounting substrate 2 are cut only once by the mounting substrate punching punch 24. I can't do shaving.
On the other hand, when the upper die 50 is provided with shaving pins 100, 100... For cutting the upper and lower ends of the left and right sides of the mounting substrate 2, the shaving pins 100, 100. The same part can be cut twice. Therefore, when the mounting substrate 2 is cut out, the entire circumference of the mounting substrate 2 is in a state of being shaved.

  In the mother board processing mold 10 according to the present embodiment, the lower surface of the upper mold 50 is divided into the female mold 60 and the upper mold stripper 70 for cutting the mother board. It is easy to perform separate operations. In addition, this allows a large degree of freedom in processing selection that can be performed in the first region 12 and the second region 14.

Further, in the case where the through hole is formed along the side of the region to be the mounting substrate in the second region 14, the die structure becomes simpler when the through hole is punched downward. In this case, in a mold that does not have a punch for cutting the base plate, a cutting pin for forming a through hole is erected in the upper mold 50, a cutting pin guide hole is provided in the lower mold stripper 28, and the entire lower mold stripper 28 is The through hole can be punched downward with a cutting pin while urging upward by the elastic member and supporting the lower mold stripper 28 with the elastic member.
However, for that purpose, an elastic member having such a strength that the position of the lower mold stripper 28 does not move is inserted between the lower mold stripper 28 and the lower mold base plate 22 until the through hole is formed. There is a need. Therefore, in order to continue the processing after forming the through hole, it is necessary to push down the lower mold stripper 28 against the urging force of the elastic member, so that a large press machine with a large load is required. Moreover, since a large repeated load is applied to the elastic member, the deterioration of the elastic member is accelerated, and the replacement frequency of the elastic member is increased.

  On the other hand, when the base plate cutting punch 38 is fixed to the lower mold 20 of the second region 14 and the cutting pin guide hole is formed in the base plate cutting punch 38, the lower mold stripper 28 is formed when the through hole is formed. No downward force is applied. Therefore, the amount of the elastic member inserted between the lower mold stripper 28 and the lower mold base plate 22 can be reduced. As a result, the load required for further lowering the upper mold 50 after forming the through hole is reduced. Therefore, even if a small press machine is used, processing can be easily performed. In addition, since the load applied to the elastic member is relatively small, the replacement frequency of the elastic member is also reduced.

Furthermore, the shaving process of the outer periphery of the mounting substrate is performed, for example, by pushing back a region having the same dimensions as the mounting substrate in the second region 14, and again in the first region 12, the region having the same dimensions as the mounting substrate is formed. It can also be performed by punching.
However, depending on the shape and size of the mounting substrate 2 or the type of processing performed in the first region 12 and / or the second region 14, the mounting substrate 2 in the first region 12 and the second region 14, respectively. It may be difficult to punch.
On the other hand, as shown in FIGS. 5 and 6, the positions of the base plate cutting punch 38, the cutting pins 68a, the cutting pins 68b and 68b, and the mounting board punching punch 24 are optimized and used for mounting. If a part of the outer periphery of the substrate is shaved and the remaining part is shaved using the shaving pin according to the present invention, the mounting substrate 2 is processed while performing different processing in the first region 12 and the second region 14 respectively. Can be shaved all around.

Other processing methods that can be performed in the first region 12 and / or the second region 14 of the base plate processing mold 10 include the following.
For example, when manufacturing a mounting substrate in which unnecessary portions are punched and both ends of the printed circuit board are supported by the frame portion, in addition to the configuration shown in FIGS. As the upper die stripper 70 for cutting the mother board moves upward, an unnecessary portion punching punch is fixed so that the tip protrudes from the lower surface of the upper die stripper 70 for cutting the mother board. A guiding hole for guiding the punch for punching may be provided. As a result, the entire periphery of the mounting substrate 2 is shaved, and at the same time, unnecessary portions can be punched out.
At this time, if the shaving punch according to the present invention is used as a punch for punching unnecessary portions, a part of the outer periphery of the printed circuit board can be shaved simultaneously with the punching of unnecessary portions. Alternatively, if a punch for punching unnecessary portions is provided in the first area in addition to the second area 14, the punching means for the second area 14 and the punching means for the first area 12 can be used without using a shaving punch. By using the same part twice, the inner periphery of the hole after the unnecessary part is punched can be shaved.
The obtained mounting board is in a state in which a part of the outer periphery of the printed circuit board is connected to the frame portion, but if a V-cut is formed along the connecting portion, the frame portion along the V-cut after automatic mounting. The printed circuit board can be easily separated by breaking.

Further, for example, when manufacturing a printed circuit board or a mounting board with unnecessary portions pushed back, in addition to the configuration shown in FIGS. As the die stripper 70 moves upward, the printed circuit board or a punch for pushing back an unnecessary portion is fixed so that the tip protrudes from the lower surface of the upper die stripper 70 for cutting the mother plate. The punch 38 may be provided with a stripper urged upward by an elastic member. As a result, the entire periphery of the mounting substrate is shaved, and at the same time, unnecessary portions or the printed circuit board can be pushed back.
When the printed circuit board is pushed back, if the shaving die according to the present invention in which a step is provided on the inner peripheral surface of the hole for guiding the punch for pushback is used as the punch 38 for cutting the mother board, the printed circuit Simultaneously with the push back of the board, the entire circumference of the printed circuit board can be shaved.
Further, when the unnecessary part is pushed back, when the shaving punch according to the present invention is used as a punch for performing the push back of the unnecessary part attached to the upper die 50, the unnecessary part is punched out simultaneously with the push back of the unnecessary part. The inner peripheral surface of the remaining hole (that is, the outer peripheral surface of the printed circuit board) can be shaved.
When the unnecessary part is pushed back, a part of the outer periphery of the printed circuit board is connected to the frame part, but if a V-cut is formed along the connection part, the frame part along the V-cut after automatic mounting. The printed circuit board can be easily separated by breaking. Even when the printed circuit board is pushed back, if the V-cut is formed so as to contact the pushback line, the printed circuit board can be easily removed.

Further, for example, in the case where the printed circuit board and the frame portion for supporting the printed circuit board are simultaneously pushed back in the first region 12, the upper stripper 62 is used instead of the means for punching and knocking out the mounting board. ,
(1) The upper mold stripper 62 is urged downward by an elastic member,
(2) A punch for pushing back the printed circuit board is fixed inside the upper mold stripper 62 so that the tip of the upper mold stripper 62 protrudes from the lower surface of the upper mold stripper 62 as the upper mold stripper 62 moves upward. ,
(3) A pushback stripper for pushing back the printed circuit board is provided inside the mounting substrate punching punch 24, and the pushback stripper is urged upward by an elastic member.
What is necessary is just to add the means.

Thus, in the first region 12, the entire circumference of the mounting substrate 2 is shaved, and at the same time, the printed circuit board and the frame portion can be pushed back in opposite directions.
In this case, a lift pin may be provided so that the tip protrudes from the lower surface of the upper mold stripper 62 in a no-load state. When the lift pins are provided, the lift pins pierce the mounting substrate in which the printed circuit board and the frame portion are pushed back in opposite directions, and the mounting substrate can be lifted upward by the friction force of the lift pins as the upper die 50 is lifted. .
Further, when the upper die 50 reaches the top dead center, the upper die stripper 62 may be provided with a stripping stripper that moves downward along the lift pins and scrapes the mounting substrate downward. If such a stripping stripper is further provided, when the upper mold 50 reaches the top dead center, the mounting substrate lifted by the frictional force of the lift pins can be stripped downward.

  Further, when the shaving die according to the present invention in which a step is provided on the inner peripheral surface of the slide space for pushing back the printed circuit board is used as the mounting board punching punch 24, simultaneously with the pushback of the printed circuit board. The entire circumference of the printed circuit board can be shaved.

For example, when manufacturing a mounting board in which the printed circuit board is temporarily fixed to the frame portion by discretely forming discontinuous long holes along the outer periphery of the printed circuit board, the first region 12 and A pin for discretely forming discontinuous long holes may be erected in the second region 14. As a result, the entire circumference of the mounting board is shaved, and at the same time, discontinuous long holes can be discretely formed along the outer circumference of the printed circuit board.
At this time, when the shaving pin according to the present invention is used as a pin for discretely forming discontinuous long holes, the inner peripheral surface of the long hole can be shaved simultaneously with cutting out the mounting substrate. . Alternatively, when the same long hole is punched twice in the first region 12 and the second region 14, the inner peripheral surface of the long hole can be shaved without using a shaving pin.
In the obtained mounting substrate, the printed circuit board and the frame portion are coupled by the connecting portion between the discontinuous long holes, and therefore the printed circuit board can be separated by breaking the connecting portion.

  Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the present invention.

The present invention in engagement Ru mother plate processing mold, a manufacturing method of machining plate, and method for manufacturing a product plate, mounting substrate printed circuit board is supported by the frame unit, or printed circuit board is discretely formed long hole connecting portion at the frame unit base plate processing die for manufacturing a supported mounting base plate, and a method of manufacturing such a mounting substrate, and such mounting substrate It can be used as a method for manufacturing a printed circuit board in which the frame portion is separated from the frame.

It is a figure which shows an example of the tool for shaving based on this invention (FIG. 1 (a): Shaving pin, FIG.1 (b): Shaving die, FIG.1 (c): Shaving punch). It is process drawing explaining the usage method of the shaving pin shown to Fig.1 (a). 3 (a), 3 (b), and 3 (c) are plan views of the lower mold of the mother board machining die according to the embodiment of the present invention, respectively, BB ′. It is line sectional drawing and the CC 'line sectional drawing. FIGS. 4 (a), 4 (b), and 4 (c) are plan views of the upper die of the mother board machining die according to the embodiment of the present invention, respectively, BB ′. It is line sectional drawing and the CC 'line sectional drawing. It is process drawing which shows the manufacturing method of the board | substrate for mounting using the metal mold | die for mother board processing shown in FIG.3 and FIG.4. FIG. 6 is a process diagram illustrating a method for manufacturing a mounting substrate using the mother board processing mold illustrated in FIGS. 3 and 4 and is a continuation of FIG. 5. It is process drawing which shows the manufacturing method of the mounting board | substrate using the metal mold | die for mother board processing shown in FIG.3 and FIG.4, Comprising: It is the figure seen from the normal line direction of the printed wiring mother board.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Mother board processing metal mold | die 12 1st area | region 14 2nd area | region 20 Lower mold | type 24 Mounting board punching punch 28a Shaving pin guide hole 38 Punch for mother board cutting (Mother board cutting means)
50 Upper mold 62 Upper mold first stripper 63 Shaving pin 70 Upper mold stripper for cutting a mother board (mother board cutting means)
100 Shaving pin (shaving tool)
102 Upper pin 104 Lower pin 110 Shaving dice (shaving tool)
112 Upper die 114 Lower die 120 Shaving punch (shaving tool)
122 Upper punch 124 Lower punch

Claims (8)

A first region arranged on the downstream side with respect to the conveying direction of the mother plate, for cutting out the processed plate from the mother plate;
A second region that is disposed upstream of the transport direction of the base plate, has an area corresponding to at least one of the processing plates, and for processing the base plate;
Provided with a mother board cutting means provided between the first area and the second area for cutting the mother board in a direction intersecting the conveying direction of the mother board;
The mother board cutting means is
A lower surface of the upper mold (a) a female mold fixed on the first region of the upper mold;
(B) Dividing into an upper stripper for cutting a mother plate that can move up and down along the upstream side surface of the female mold and is biased downward;
On the second region of the lower mold, the downstream side surface is arranged so as to slide along the upstream side surface of the female mold, and the base in the direction perpendicular to the conveying direction of the base plate is arranged. Fixing a punch for cutting a mother board having a width wider than the length of the board;
In the first region and the second region, processing is performed on the mother plate, respectively, and at the same time, using the upstream side surface of the female mold and the downstream side surface of the mother plate cutting punch, Shearing the mother board along the direction intersecting the transport direction,
The first region and / or the second region are provided with a step capable of shaving the cut surface of the mother plate on at least a part of the surface in contact with the mother plate, and divided from the step portion. Mold for processing a mother board provided with a shaving tool that can be used.   2. The mother board machining die according to claim 1, wherein the shaving tool is a pin for forming a punching hole in the mother board.   2. The mother board machining die according to claim 1, wherein the shaving tool is a female mold for punching a plate material having a predetermined shape from the mother board.   2. The mother board machining die according to claim 1, wherein the shaving tool is a punch for punching a board having a predetermined shape from the mother board. The mother plate cutting means along said on downstream side of the region to be processed plate located on the second region, for the mother plate processed according to Der Ru claim 1 which cuts the mother plate Mold.   6. The shaving tool is a pin provided on the first region for forming a punched hole along at least a part of a side other than a downstream side of the region to be the processed plate. Mold for processing mother board as described. A first pressing step of performing a first press on the mother board in the second region using the mother board machining die according to any one of claims 1 to 6 ,
The mother board is transported so that the area pressed in the second area in the immediately preceding press is on the first area, and at the same time as the new pressing of the mother board is performed in the second area, In the region, a second press step of cutting a processed plate in which a product plate is supported by a frame portion from the mother plate;
Simultaneously with the second pressing step, using the mother board cutting means, a mother board cutting step comprising shearing the mother board along a direction intersecting the conveying direction of the mother board. Method. The manufacturing method of the product board which fractures | ruptures the said frame part with which the said processed board obtained by the method of Claim 7 is equipped, and isolate | separates the said product board.

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