CN112004620B

CN112004620B - Processing device and processing method for processing plate

Info

Publication number: CN112004620B
Application number: CN201980026990.7A
Authority: CN
Inventors: 竹内忍
Original assignee: Individual
Current assignee: Individual
Priority date: 2018-10-31
Filing date: 2019-10-30
Publication date: 2021-12-21
Anticipated expiration: 2039-10-30
Also published as: CN112004620A; JP6749036B1; TW202031468A; JPWO2020090872A1; WO2020090872A1; TWI711535B

Abstract

The invention provides a processing device and a processing method which can reduce the generation of fracture surfaces on the thick surface of a punched plate material and can prevent the generation of burrs. In the first partial press step, the lower punch is raised by 20 to 70% of the thickness of the metal plate, and the lower punch is pressed into the metal plate. The upper punch is held in a position not abutting against the surface of the metal plate. Subsequently, the lower punch is moved downward to end the first partial press process. In the second partial press working step, the upper punch is moved downward so as to be lowered by 20 to 70% of the thickness of the metal plate, and the upper punch is pressed into the metal plate 20. The lower punch is moved to a position below the bottom surface of the punch portion. Subsequently, the upper punch is lifted up, and the second partial press working is terminated. The press portion is fitted into the press hole and held on the metal plate so as not to fall from the press hole.

Description

Processing device and processing method for processing plate

Technical Field

The present invention relates to a processing apparatus and a processing method for processing a plate material such as a metal plate, and more particularly to a processing apparatus and a processing method capable of performing double-sided press processing and cutting processing of a metal plate.

Background

Machining of metal parts and the like applied to precision machines is performed using a machining apparatus including a press apparatus and a die. In recent years, high precision is required for machining of metal parts applied to precision machines. For example, when applied to a metal terminal for a connector of a mobile device or the like, the connector and the terminal thereof are required to be miniaturized in accordance with the demand for miniaturization of the mobile device. In this way, when the workpiece of the object to be processed is miniaturized, the processing apparatus needs very high processing accuracy.

The present inventors have proposed a pressing device and a die that can be miniaturized and have high accuracy (see patent document 1). Even if the press apparatus described in patent document 1 is a so-called C-type press apparatus having a relatively simple structure, the press apparatus has a high processing accuracy.

In recent years, however, metal parts formed by processing a thin metal plate have been mass-produced and used for terminals of micro-connectors of electronic devices such as smart phones, lead frames of semiconductor devices such as LSIs, and the like in a large number of products.

Since such a metal part is produced by pressing a sheet metal with a processing apparatus, a sagging portion and a fracture surface where a metal structure is fractured due to a punch and a die of the processing apparatus exist on a thickness surface of the pressed metal plate. Further, burrs may be generated at the broken portions including the thick surface of the sheet under various conditions such as the clearance between the punch and the die.

In recent years, as the processing speed of electronic equipment has increased, signals flowing through connectors and the like have also increased in speed and frequency. In such an electronic apparatus, if a connector or the like has burrs, the burrs may act as an antenna and generate high-frequency noise. Since such high-frequency noise is a cause of an operation error occurring in an electronic apparatus, in recent years, a connector or the like in the electronic apparatus is required to have a flat surface roughness without burrs.

As a processing device for cutting a plate material, there is a device called a shearer (Shearing). The shearing machine is a device for clamping and shearing a plate material by an upper blade and a lower blade, and the blades are provided with an angle called a shearing angle. In the shearing machine, the plate material is clamped by the upper blade and the lower blade which are provided with the angle, and the plate material is sheared like a shear.

When the plate material is sheared by the shearing machine, a fracture surface and burrs are generated at the shearing surface, and the plate material is warped or twisted. These problems can be alleviated to some extent by adjusting the blade clearance between the upper and lower blades, or by reviewing the shear angle, but the problems cannot be completely solved.

Documents of the prior art

Patent document

Patent document 1: japanese patent No. 5636572

Disclosure of Invention

Problems to be solved by the invention

The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a processing apparatus and a processing method capable of minimizing the occurrence of fracture surfaces on the plate thickness surface of a plate material after punching or cutting and preventing the occurrence of burrs.

Means for solving the problems

A processing apparatus for press-processing a plate material according to the present invention is a processing apparatus for press-processing a plate material, comprising: a pair of dies having punch holes of the same shape as the punching shape and capable of sandwiching the plate material from the front and back; a pair of punches which can freely advance and retreat in the punch holes and can press the plate material from the front and the back; an extrusion punch provided separately from the pair of punches; and a driving device that drives the die, the punch, and the extrusion punch; the driving device clamps the plate material at an initial position by driving the die, presses the plate material with one punch against the die to form a pressed portion, and moves the plate material 20% to 70% of the plate thickness in a forward direction from the initial position in a plate thickness direction of the plate material, and presses the pressed portion with the other punch to move the plate material and the pressed portion 20% to 70% of the plate thickness in a reverse direction from the initial position in the plate thickness direction of the plate material, thereby moving the plate material and the pressed portion from the initial position, and pressing the pressed portion from the plate material with the extrusion punch.

According to the processing apparatus of the present invention, since the plate material is pressed by one punch, and the plate material is moved forward by 20% to 70% of the plate thickness in the plate thickness direction of the plate material from the initial position to form the pressed portion, the other side of the plate material as the pressed portion can be sagged. Further, the other punch presses the punching portion, and the punching portion is moved in the reverse direction of 20% to 70% of the plate thickness from the initial position in the plate thickness direction of the plate material, whereby the one side of the punching portion can be caused to sag. Further, the punched portion can be removed from the plate material by a pressing punch provided separately from the pair of punches. When the other punch presses the punch, one punch is released from the driving device, and the punches are prevented from interfering with each other, or the other punch is returned in the reverse direction by the driving device.

Further, by setting the amount of elevation of one punch to 20% to 70% of the plate thickness and the amount of depression of the other punch to 20% to 70% of the plate thickness, the occurrence of fracture surfaces in the punched portion and the punched hole side surface after punching of the punched portion can be minimized. Further, the front and back surfaces of the punch portion and the punch hole are caused to droop, thereby preventing burrs from being generated.

In the processing apparatus of the present invention, since one punch is not inserted into the other punch hole (die), the punch and the die do not interfere with each other. In addition, the other punch does not interfere with the one die. Therefore, damage to each punch and each die is reduced, and the maintenance life of the pair of punches, such as the need to regrind, can be greatly improved. The processing apparatus of the present invention may be a press machine or a die apparatus having a punch and a die as die parts.

In the processing apparatus of the present invention, the one punch may return the pressing portion to the initial position before the pressing by the pressing punch. With this configuration, the plate material can be moved while the press portion is held by the plate material.

In the processing apparatus according to the present invention, the extrusion punch may be provided in a second punch hole provided in one of the pair of dies so as to be movable forward and backward, and a punch opening that faces the second punch hole and is larger than the punch portion may be formed in the other of the pair of dies. Alternatively, the extrusion punch may be provided to be movable forward and backward in a second punch hole provided in one of a pair of second dies provided separately from the pair of dies, and a punch opening that faces the second punch hole and is larger than the punch portion may be formed in the other of the second dies. Thus, the extrusion punch, the second punch hole and the punching opening can be arranged on the pair of dies, and also can be arranged on the second die which is separated from the pair of dies.

Further, a processing method according to the present invention is a processing method for press-processing a plate material, the processing method using a processing apparatus including: a pair of dies having punch holes of the same shape as the punching shape and capable of sandwiching the plate material from the front and back; a pair of punches which can freely advance and retreat in the punch holes and can press the plate material from the front and the back; an extrusion punch provided separately from the pair of punches; and a driving device that drives the die, the punch, and the extrusion punch; the driving device clamps the plate material at an initial position by driving the die, presses the plate material with one punch against the die to form a pressed portion, and moves the plate material 20% to 70% of the plate thickness in a forward direction from the initial position in a plate thickness direction of the plate material, and presses the pressed portion with the other punch to move the plate material and the pressed portion 20% to 70% of the plate thickness in a reverse direction from the initial position in the plate thickness direction of the plate material, thereby moving the plate material and the pressed portion from the initial position, and pressing the pressed portion from the plate material with the pressing punch.

Further, a processing apparatus according to the present invention is a processing apparatus for cutting a plate material, comprising: a pair of first cutters capable of clamping the plate material from the front and back; a pair of second cutters provided with cutters so as to clamp a predetermined cutting line therebetween with the first cutters, the pair of second cutters being capable of clamping the plate from the front and back; and a driving device that drives the first tool and the second tool; the driving device clamps the plate material at an initial position by the first tool and the second tool, moves one of the first tool and the second tool forward by 20% to 70% of the plate thickness from the initial position in a plate thickness direction of the plate material with respect to the other, and then moves one of the first tool and the second tool backward by 20% to 70% of the plate thickness from the initial position in the plate thickness direction of the plate material with respect to the other to cut the plate material.

According to the processing apparatus for performing cutting processing of a plate material of the present invention, when the plate material is cut, the plate material is cut by moving 20% to 70% of the plate thickness in the forward or reverse direction by the first cutter and the second cutter, and therefore, the edge portion of the plate material after cutting is caused to sag on the front surface and the back surface, and burrs are prevented from being generated. Further, the occurrence of fracture surfaces on the thickness surface of the plate material after press forming can be minimized.

Further, a processing method according to the present invention is a processing method for cutting a plate material, the method using a processing apparatus including: a pair of first cutters capable of clamping the plate material from the front and back; a pair of second cutters provided with cutters so as to clamp a predetermined cutting line therebetween with the first cutters, the pair of second cutters being capable of clamping the plate from the front and back; a driving device that drives the first tool and the second tool; the driving device clamps the plate material at an initial position by driving the first tool and the second tool, moves one of the first tool and the second tool forward by 20% to 70% of the plate thickness from the initial position in a plate thickness direction of the plate material with respect to the other, and then moves one of the first tool and the second tool backward by 20% to 70% of the plate thickness from the initial position in the plate thickness direction of the plate material with respect to the other to cut the plate material.

According to the present invention, it is possible to provide a processing apparatus and a processing method capable of minimizing the occurrence of a fracture surface on the plate thickness surface of a plate material after punching or cutting and preventing the occurrence of burrs.

Drawings

Fig. 1(a) and 1(B) are explanatory views of a holding step for explaining a processing method performed by the processing apparatus according to the embodiment of the present invention.

Fig. 2(a) and 2(B) are explanatory views of a first partial pressing step in the working method of the present embodiment.

Fig. 3(a) to 3(C) are explanatory views of a second partial pressing step in the processing method of the present embodiment.

Fig. 4(a) and 4(B) are explanatory views of the push-back step in the processing method of the present embodiment.

Fig. 5(a) to 5(C) are explanatory views of the extrusion step in the processing method of the present embodiment.

Fig. 6(a) is a photograph showing the surface state of a processed plate material processed by the processing method of the processing apparatus according to the embodiment of the present invention.

Fig. 6(B) is a photograph showing a back side of a processed plate material processed by the processing method of the processing apparatus according to the embodiment of the present invention.

Fig. 7(a) to 7(C) are explanatory views of the initial position holding step and the first partial cutting step in the method of the cutting process according to the present embodiment.

Fig. 8(a) and 8(B) are explanatory views of the second partial cutting step and the return step in the method of the cutting process according to the present embodiment.

Description of the symbols

1: processing device

1B: cutting device (processing device)

2: upper punch

2 a: abutting surface (Upper punch)

2 b: upper pushing pin

3: upper module

3 a: upper die

4: upper punch hole

5: lower punch

5 a: abutting surface (lower punch)

5 b: lower push pin

6: lower mould

6 a: lower die

7: lower punch hole

8: extrusion device

9: extrusion upper punch

10: extrusion punch

10 a: abutting surface (extrusion punch)

11: extrusion punch hole

12: extrusion lower punch

13: punching opening

20: metal plate

21: punching part

22: punching hole

22 a: sag of surface

22 b: sag of surface

22 c: cut surface

30: terminal with a terminal body

31: side surface

31B: sag of surface

40: first knife

41: pedestal

42: pressed sheet material

50: second tool

51: lower edge

52: upper blade

60: drive device

61: a first drive part

62: second driving part

63: third driving part

L: cutting predetermined line

Detailed Description

Next, a machining apparatus and a machining method according to the present invention will be described with reference to fig. 1 to 8. As shown in fig. 1(a), the processing apparatus 1 of the present embodiment includes an upper punch 2 and an upper die 3 disposed above a metal plate 20 of a processed plate material, and a lower punch 5 and a lower die 6 disposed below the metal plate 20. The upper punch 2 and the lower punch 5 correspond to a pair of punches of the present invention, and the upper die 3 and the lower die 6 correspond to a pair of dies of the present invention.

In the present embodiment, these punch and die are part of a die apparatus 1A including a driving device such as a motor. As shown in fig. 1A, the die apparatus 1A includes an upper die 3a, an upper push pin 2b, and a lower die 6a, a lower push pin 5b (both shown by chain lines). In the present embodiment, the die device 1A such as the upper die 3a is not shown after fig. 1 (B).

The upper die member 3 is provided with an upper punch hole 4 for guiding the upper punch 2, and the upper punch 2 is kept in a state of freely advancing and retreating in the upper punch hole 4. The lower die 6 is provided with a lower punch hole 7 for guiding the lower punch 5, and the lower punch 5 is kept in a state of being freely advanced and retreated in the lower punch hole 7.

The upper punch 2 and the lower punch 5 are formed to have the same shape as the contact surface 2a and the contact surface 5a that contact the metal plate. The shapes of the abutment surface 2a and the abutment surface 5a are determined according to the shape of the product (press part) formed by the processing apparatus 1 of the present embodiment. For example, when the terminals 30 of the inter-substrate connector shown in fig. 6 are formed, there are formed: a punch for punching out the "outer shape of the terminal 30" and a punch for punching out the "planar shape of the punch hole 22 provided in the terminal 30".

The upper die 3, the upper punch 2, and the lower punch 5 are driven in the vertical direction by a driving device provided in the die apparatus 1A. Specifically, the upper die 3 is moved up and down by the driving device via the upper die 3a, the upper punch 2 is pressed forward (from top to bottom) by the upper push pin 2b, and the lower punch 5 is pressed backward (from bottom to top) by the lower push pin 5 b. In this embodiment, the movement from top to bottom is forward, and the movement from bottom to top is reverse.

The lower die 6 is fixed to a press device not shown via the lower die 6 a. In the driving means, the upper die member 3, the upper punch 2, and the lower punch 5 are driven while synchronizing their respective movements by a synchronizing means such as a timing belt. As an example of the structure of the driving device, the structure disclosed in patent document 1 proposed by the present inventors can be adopted.

In the present embodiment, the gap between the upper punch 2 and the upper punch hole 4 is set to 3.0 μm regardless of the thickness of the metal plate 20. The gap between the lower punch 5 and the lower punch hole 7 is also the same value. In general, the clearance between the punch and the punch hole is usually about 5% of the thickness of the metal plate 20, and for example, in the case of a metal plate having a thickness of 0.08mm (80 μm), the clearance is 4.0 μm, which is not preferable because a fracture surface is generated in the plate thickness surface after cutting. Further, unless otherwise noted, the gap in this case represents a one-sided gap.

Next, a processing method when the metal plate 20 is processed by the processing apparatus 1 of the present embodiment will be described. In the present embodiment, a metal plate 20 made of phosphor bronze for spring and having a plate thickness of 0.08mm is used as an example and described.

The processing method of the present invention comprises: a holding step of holding the metal plate 20 by the upper mold 3 and the lower mold 6; a first partial press step of performing partial press from the lower side of the metal plate 20 to a position of a part of the thickness thereof by using the lower punch 5; a second partial press step of performing partial press from the upper side of the metal plate 20 by using the upper punch 2; a push-back step of pushing back the cut punched portion 21 to the punched hole 22 from the metal plate 20 by the lower punch 5; and an extrusion step of extruding the punched portion 21 from the punched hole 22 of the metal plate 20.

First, in the holding step, as shown in fig. 1(a), the metal plate is conveyed between the upper mold 3 and the lower mold 6 by a conveying device not shown, and then, as shown in fig. 1(B), the upper mold 3 is pushed downward, whereby the metal plate 20 is held between the upper mold 3 and the lower mold 6 under a predetermined pressure. The position of the metal plate 20 in this state is set as an initial position. At this time, the metal plate 20 is accurately conveyed at a constant pitch in each step by a conveying device not shown.

Next, in the first partial press step, as shown in fig. 2(a), the lower punch 5 is raised by 20% to 70% of the thickness of the metal plate 20, and the lower punch 5 is press-fitted into the metal plate 20 to form the pressed portion 21. At this time, the upper punch 2 is held at the upper position so as not to abut on the surface of the punch portion 21 that is raised by the rise of the lower punch 5. From this state, as shown in fig. 2(B), the lower punch 5 is moved downward, and the first partial press working is ended.

Next, in the second partial press working step, as shown in fig. 3(a), the upper punch 2 is moved downward, and as shown in fig. 3(B), the upper punch 2 is lowered by 20% to 70% of the thickness of the metal plate 20, and the press part 21 is pressed into the metal plate 20 by the upper punch 2. At this time, the lower punch 5 moves to a position below the bottom surface of the punch portion 21 lowered by the lowering of the upper punch 2.

Next, as shown in fig. 3(C), the upper punch 2 is lifted upward, and the second partial press step is completed. At this time, the pressed portion 21 is fitted into the pressed hole 22, and is held by the metal plate 20 so as not to fall from the pressed hole 22.

Next, as shown in fig. 4(a), in the pushing-back step, the lower punch 5 is pushed upward. As shown in fig. 4(B), the lower punch 5 is pushed until the punch portion 21 enters the punch hole 22 and is held at the position (initial position) of the punch hole 22. In this case, the lower side of the punch 21 may be matched to the height of the upper surface of the lower mold 6, or the upper side of the punch 21 may be matched to the height of the lower surface of the upper mold 3.

Next, as shown in fig. 5(a), in the pressing step, the metal plate 20 is moved to a predetermined position of the pressing device 8 used in the pressing step, and the pressed portion 21 is fitted into the pressed hole 22 in the state of the metal plate 20. The pressing device 8 includes an upper pressing punch 9, a lower pressing punch 10, and a lower pressing punch 12. The upper and

lower extrusion punches

9 and 12 correspond to a pair of second dies of the present invention. The upper extrusion punch 9 is provided with an extrusion punch hole 11 (second punch hole) for guiding the extrusion punch 10 in the vertical direction. Further, the lower punch 12 is provided with a punch opening 13 that penetrates and opens in the vertical direction.

The pressing punch 10 is formed such that the area of the abutment surface 10a is smaller than the surface area of the pressed portion 21. On the other hand, the punch opening 13 provided in the lower punch 12 is formed to be larger than the surface area of the punch portion 21. The pressing device 8 is provided downstream of the processing device 1 and is formed separately from the processing device 1.

In the pressing step, as shown in fig. 5(a), the metal plate 20 is moved to a predetermined position of the pressing device 8 for the pressing step on the downstream side, the metal plate 20 is in a state where the punch 21 is fitted to the punch hole 22 after the pressing step, and as shown in fig. 5(B), the upper press punch 9 is lowered, and the metal plate 20 is held at the predetermined position by the upper press punch 9 and the lower press punch 12.

Next, as shown in fig. 5(C), the pressing punch 10 is lowered, and the pressing portion 21 fitted in the pressing hole 22 is pressed toward the press opening 13 by the pressing punch 10. Then, the pressing punch 10 is returned to the upper side, and the pressing upper punch 9 is raised to release the holding of the metal plate 20.

In the metal plate 20 having the punched hole 22 formed through the above steps, the side surface of the punched hole 22 is in a state shown in fig. 6(a) and 6 (B). The photograph of fig. 6(a) is a photograph of the connector terminal 30 formed of the metal plate 20 as viewed from the front. The photograph of fig. 6(B) is a photograph of the terminal 30 as viewed from the back side.

The side surface 31 of the terminal 30 shown in fig. 6(a) and 6(B) is not processed by the above-described steps, but is a cross section of the result of one-way punching from the front surface of fig. 6(a) by a side surface processing punch and a side surface processing die, which are not shown.

As shown in fig. 6(a), the upper edge portion of the front side of the punched hole 22 on the front side of the terminal 30 is observed to have a surface sag 22a formed by the second partial punching process of the upper punch 2. The upper edge portion of the side surface 31 of the terminal 30 on the front side is also pressed by a side surface processing punch to have a surface sag 31B.

On the other hand, as shown in fig. 6(B), when the lower edge portion of the rear surface side of the punched hole 22 on the rear surface side of the terminal 30 is observed, the surface sagging 22B is generated by the first partial punching process of the lower punch 5. On the other hand, the lower edge portion of the terminal 30 on the back side of the side surface 31 is a surface on the side of the side surface processing die which is pressed by the side surface processing punch, and is a fracture surface here.

In this way, the press hole 22 processed by the processing apparatus 1 and the processing method of the present embodiment forms both the upper edge portion on the front side and the lower edge portion on the back side into the surface droops 22a and 22 b. Further, the inner peripheral surface of the punched hole 22 has no fracture surface, and a portion between the surface droops 22a and 22b is formed as a cut surface 22 c.

Therefore, when the processing apparatus 1 and the processing method of the present embodiment are applied to the processing of the terminal 30 for a connector, the mating terminal is inserted into the press hole 22, so that the connection state of the connector can be made good without generating a fracture surface on the surface in contact with the mating terminal.

Further, according to the processing apparatus 1 and the processing method of the present embodiment, burrs generated at the processed portion are suppressed. Thus, the processing apparatus 1 and the processing method according to the present embodiment can provide a burr-free and highly reliable lead frame when applied to, for example, processing a lead frame for a semiconductor.

In the above embodiment, the lower punch 5 is raised in the first partial pressing step and the upper punch 2 is lowered in the second partial pressing step, but conversely, the upper punch 2 may be lowered in the first partial pressing step and the lower punch 5 may be raised in the second partial pressing step. At this time, in the push-back step, the lower punch 5 is lowered so as not to contact the metal plate 20, and the upper punch 2 is lowered, so that the pressed portion 21 generated in the second partial pressing step is returned to the press hole 22.

In the above embodiment, the upper mold 3 is moved up and down by the driving device and the lower mold 6 is fixed to the press device, but not limited thereto, the upper mold 3 may be fixed to the press device and the lower mold 6 may be moved up and down by the driving device.

In the above embodiment, in the first partial press step, the lower punch 5 is raised by 20% to 70% of the thickness of the metal plate 20, and the ratio thereof is determined appropriately depending on the material and thickness of the metal plate 20. The same is true for the upper punch 2 in the second partial press working process.

In the above embodiment, the extrusion device 8 is composed of the upper extrusion punch 9, the lower extrusion punch 10, and the lower extrusion punch 12, but not limited thereto, and the upper extrusion punch 9 and the upper die 3 may be formed integrally. In this case, the lower die 6 and the lower extrusion punch 12 may be formed as an integral structure.

In the above embodiments, the metal plate 20 is taken as an example and described as the plate material, but the plate material is not limited thereto, and may be a plate material made of other materials, such as a paper plate material, a mica plate material, a synthetic resin plate material, and the like. Furthermore, the present invention is particularly effective for a plate having a plate thickness of 0.3mm or less. In addition, the gap between the upper punch 4 and the upper punch 2 and the gap between the lower punch 7 and the lower punch 5 are set to be 3.0 μm, but may be between 1.5 μm and 3.0 μm.

Next, a processing apparatus and a processing method for performing cutting processing of a plate material according to the present invention will be described with reference to fig. 7 to 8. A cutting device 1B as a processing device for cutting a metal plate 20 comprises: a pair of first cutters 40 capable of clamping the metal plate 20 from the front and back; a pair of second tools 50 provided so as to sandwich the line L to be cut with the first tool 40; and a driving device 60 for driving the first cutter 40 and the second cutter 50.

The first cutter 40 has a base 41 fixed at a set position below the cutter, and a plate material pressed member 42 moved up and down by a driving device 60 above the cutter. The second cutter 50 has a lower blade 51 at the lower side and an upper blade 52 at the upper side. The line L is a line indicating the edge of the metal plate 20 after cutting (see fig. 8B), and is a virtual line that does not actually appear on the surface of the metal plate 20.

As shown in fig. 7(a), the driving device 60 includes a first driving portion 61 that moves the plate material pressed member 42 up and down; a second driving portion 62 that moves the lower blade 51 up and down; and a third driving portion 63 which moves the upper blade 52 up and down. These driving portions are exemplified in the present application, and specifically, as such a cutting device, a cylinder, a cam mechanism, and the like, which are widely used in general, are used. The driving device 60 constituted by these components synchronizes the respective driving units and drives them. In fig. 7(B) to 8, the driving device 60 is not shown.

The cutting device 1B of the present embodiment is adjusted so that the gap between the first cutter 40 and the second cutter 50 is from 0 to about 5% of the thickness of the metal plate 20. The gap is appropriately adjusted according to the thickness or material of the metal plate 20 so that the metal plate 20 is cut without generating burrs or the like.

Next, a method of cutting the metal plate 20 by the cutting apparatus 1B of the present embodiment will be described with reference to fig. 7. The cutting method (machining method) of the present embodiment comprises the following steps: an initial position holding step of holding the metal plate 20 at the initial position by the first cutter 40 and the second cutter 50; a first partial cutting step of relatively moving the first cutter 40 and the second cutter 50 in the forward direction; a second partial cutting step of relatively moving the first cutter 40 and the second cutter 50 in the reverse direction; and a returning step of returning the first tool 40 and the second tool 50 to the initial positions.

Fig. 7(a) shows a state where the metal plate 20 is moved onto the surface of the table 41 of the first cutter 40. At this time, the plate material pressing member 42 of the first cutter 40 is held above and away from the base 41, and the upper blade 52 and the lower blade 51 are also held at positions above and below and away from the metal plate 20.

Next, as shown in fig. 7(B), the plate pressing member 42 of the first cutter 40 is lowered, and the metal plate 20 is pressed onto the pedestal 41 by the plate pressing member 42, thereby holding the metal plate 20. In the second cutter 50, the upper blade 52 is also lowered to come into contact with the metal plate 20, and the lower blade 51 is raised to come into contact with the metal plate 20. In the present embodiment, the positions of the first tool 40 and the second tool 50 shown in fig. 7(B) are used as initial positions.

Next, as shown in fig. 7C, the lower blade 51 and the upper blade 52 as the second tool 50 are pressed and pushed upward (in the direction along the thickness direction of the sheet material) while the positions of the base 41 and the sheet material pressing member 42 as the first tool 40 are maintained (first partial cutting step). The elevation height at this time is set to a height from the initial position to 20% to 70% of the thickness of the metal plate 20. Since the ratio of the metal plate 20 to be cleanly cut varies depending on the thickness and material of the metal plate 20, an appropriate ratio is calculated in accordance with the actual cutting operation.

Next, as shown in fig. 8 a, the lower blade 51 and the upper blade 52 as the second tool 50 are pushed downward (in the direction opposite to the plate thickness direction of the plate material) while the positions of the base 41 and the plate material pressed member 42 as the first tool 40 are maintained (second partial cutting step). The height of the drop is also set to be 20% to 70% of the thickness of the metal plate 20 from the initial position. In this case, the rising ratio in fig. 7(C) and the falling ratio in fig. 8(a) may be the same ratio or may be different ratios from each other.

Next, as shown in fig. 8B, the lower blade 51 and the upper blade 52 as the second blade 50 are returned to the initial positions while the positions of the base 41 and the plate material pressed material 42 as the first blade 40 are maintained (returning step). Through these series of steps, the metal plate 20 is cut.

Here, depending on the thickness or material of the metal plate 20, the metal plate 20 may be cut by the second partial cutting step of fig. 8(a), and in this case, the subsequent returning step may be performed or the returning step may not be performed.

In the method of cutting the metal plate 20 by using the cutting apparatus 1B of the present embodiment, the moving direction of the first cutter 40 and the second cutter 50 may be moved downward in the first partial cutting step and may be moved upward in the second partial cutting step. The first cutter 40 and the second cutter 50 can be moved a plurality of times depending on the thickness or material of the metal plate 20.

Claims

1. A processing device for performing press processing of a plate material, comprising:

a pair of dies having punch holes of the same shape as the punching shape and capable of sandwiching the plate material from the front and back;

a pair of punches which can freely advance and retreat in the punch holes and can press the plate material from the front and the back;

an extrusion punch provided separately from the pair of punches; and

a driving device that drives the die, the punch, and the extrusion punch;

the driving device drives the die to clamp the plate at the initial position,

pressing the plate material with a punch on one side against the die to form a pressed portion, the pressed portion being formed by moving the plate material from the initial position in a plate thickness direction of the plate material by 20% to 70% of the plate thickness,

pressing the punch by another punch to move the punch in a direction opposite to the plate thickness direction of the plate material from the initial position by 20 to 70% of the plate thickness,

the plate material and the press portion are moved from the initial position, and the press portion is pressed from the plate material by the press punch.

2. The processing apparatus according to claim 1, wherein the one punch returns the punched portion to the initial position before punching by the extrusion punch.

3. The processing apparatus according to claim 2, wherein the extrusion punch is provided to be able to advance and retreat in a second punch hole provided in one of the pair of dies,

a press opening that faces the second punch hole and is larger than the press portion is formed in the other of the pair of dies.

4. The processing apparatus according to claim 2, wherein the extrusion punch is provided to be movable forward and backward in a second punch hole provided in one of a pair of second dies provided separately from the pair of dies;

a press opening that faces the second punch hole and is larger than the press portion is formed in the other side of the second die.

5. A processing method for performing press processing of a plate material, characterized by using a processing apparatus comprising:

an extrusion punch provided separately from the pair of punches; and

a driving device that drives the die, the punch, and the extrusion punch;

the driving device drives the die to clamp the plate at the initial position,

moving the plate material and the press portion from the initial position, and pressing the press portion from the plate material by the press punch.