JPWO2020090872A1 - Processing equipment and processing method for processing plate materials - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a processing apparatus and a processing method capable of making a fracture surface of a punched plate material as small as possible on a plate thickness surface and preventing the occurrence of burrs. SOLUTION: In a first partial punching step, a lower punch 5 is raised by 20 to 70% of the thickness of a metal plate 20, and the lower punch 5 is pushed into the metal plate 20. The upper punch 2 is held at a position where it does not come into contact with the surface of the metal plate 20. Next, the lower punch 5 is moved downward, and the first partial punching step is completed. In the second partial punching step, the upper punch 2 is moved downward as shown in FIG. 3 (A), lowered by 20 to 70% of the thickness of the metal plate 20 as shown in FIG. 3 (B), and the upper punch is punched. 2 is pushed into the metal plate 20. The lower punch 5 has moved to a position below the lower surface of the punching portion 21. Next, as shown in FIG. 3C, the upper punch 2 is pulled up to end the second partial punching step. The punched portion 21 is in a state of being fitted into the punched hole 22, and is held by the metal plate 20 without falling from the punched hole 22. [Selection diagram] Fig. 3

Description

The present invention relates to a processing apparatus and processing method for processing a plate material such as a metal plate, and more particularly to a processing apparatus and processing method capable of double-sided punching processing of a metal plate and cutting processing of a plate material.

Processing of metal parts and the like used in precision equipment is performed using a processing device including a press device and a die. Further, in recent years, high precision is required for processing metal parts used in precision equipment. For example, as for metal terminals for connectors used in mobile terminals and the like, there is a demand for miniaturization of connectors and their terminals in response to a request for miniaturization of mobile terminals. When the workpiece, which is the object to be machined, is miniaturized in this way, the machining apparatus is required to have extremely high machining accuracy.

Conventionally, the inventor of the present application has proposed a press device and a die which can be miniaturized and have high accuracy (see Patent Document 1). The press device described in Patent Document 1 is a press device having high processing accuracy even if it is a so-called C-type press device having a relatively simple structure.

Japanese Patent No. 5636572

By the way, in recent years, a large amount of metal parts made by processing thin metal plates such as contacts of microconnectors used in electronic devices such as smartphones and lead frames used in semiconductor devices such as LSIs have been mass-produced. It is used in many products.

Since such metal parts are manufactured by punching a plate-shaped metal with a processing device, the thick surface of the punched metal plate has a sagging portion caused by a punch and a die of the processing device and a metal structure. There is a fractured fracture surface. Further, depending on various conditions such as clearance between punches and dies, burrs may occur at the fractured portion including the thick surface of the plate.

In recent years, due to the increase in processing speed of electronic devices, the speed and frequency of signals flowing through connectors and the like have increased. In such an electronic device, if there is a burr on the connector or the like, the burr becomes an antenna and high frequency noise may occur. Since such high-frequency noise causes an operation error in electronic devices, a flat surface roughness without burrs is required for connectors and the like in recent electronic devices.

Further, as a processing device for cutting a plate material, there is a device called shirring. This shirring is a device for cutting by sandwiching a plate material between an upper blade and a lower blade, and these blades are provided with an angle called a shear angle. In shirring, the plate material is cut like scissors by sandwiching the plate material between the upper and lower blades with this angle.

When the plate material is cut by this shirring, a fracture surface and burrs are generated on the cut surface, and the plate material is warped and twisted. These can be reduced to some extent by adjusting the clearance between the upper and lower blades and reviewing the shear angle, but they cannot be completely eliminated.

In order to eliminate the above-mentioned inconvenience, the present invention provides a processing apparatus and processing method capable of making the fracture surface of a punched or cut plate material as small as possible on the plate thickness surface and preventing the occurrence of burrs. The purpose is to provide.

The plate material processing apparatus of the present invention is a processing apparatus for punching a plate material, and has a punched hole, a pair of dies capable of sandwiching the plate material from the front and back, and freely advancing and retreating in the punched hole. It is provided with a pair of punches capable of pressing the plate material from the front and back, an extrusion punch provided separately from the pair of punches, and a drive device for driving the die, the punch, and the extrusion punch. The drive device sandwiches the plate material in the initial position by the die, presses the plate material against the die with one punch, and 20 to 70% in the forward direction in the plate thickness direction of the plate material from the initial position. The punched portion is formed by moving the punched portion by a minute, and the punched portion is pressed by the other punch to move from the initial position in the direction opposite to the plate thickness direction of the plate material by 20 to 70%, and the plate material and the punching portion are moved. It is characterized in that the punched portion is moved from the initial position and the punched portion is punched from the plate material by the extrusion punch.

According to the processing apparatus of the present invention, since the plate material is pressed by one punch and moved by 20 to 70% in the forward direction in the plate thickness direction of the plate material from the initial position to form a punched portion, the plate material is punched. It is possible to cause sagging on the other side of the portion to be a portion. Further, by pressing the punched portion with the other punch and moving it from the initial position in the direction opposite to the plate thickness direction by 20 to 70%, it is possible to cause sagging on one side of the punched portion. .. Further, the punched portion can be removed from the plate material by an extrusion punch separate from the pair of punches. When the punching portion is pressed by the other punch, one punch may be freed from the driving device to prevent the punches from interfering with each other, or one punch may be returned in the opposite direction by the driving device. Good.

Further, by setting the rising portion of one punch to 20 to 70% of the thickness of the plate material and the descending portion of the other punch to 20 to 70% of the thickness of the plate material, the punched portion and the punched portion are formed. It is possible to minimize the occurrence of fracture surface on the side surface of the punched hole of the punched mark. In addition, it is possible to prevent the occurrence of burrs by causing sagging on the front and back surfaces of the punched portion and the punched hole.

Further, in the processing apparatus of the present invention, since one punch is not inserted into the other punch hole (die), the punch and the die do not interfere with each other. Also, the other punch and one die do not interfere in the same way. Therefore, the damage of each punch and each die is reduced, and the maintenance life such as re-polishing of a pair of punches can be greatly improved. The processing apparatus in the present invention may be an apparatus such as a punch press, or may be a mold apparatus using punches and dies as mold parts.

Further, in the processing apparatus of the present invention, the punched portion may be returned to the initial position by the one punch before punching by the extrusion punch. With this configuration, the plate material can be moved while the punched portion is held by the plate material.

Further, in the processing apparatus of the present invention, the extrusion punch is freely provided in a second punch hole provided in one of the pair of dies, and is provided in the second punch hole in the other of the pair of dies. A punched opening that faces the punched portion and is larger than the punched portion may be formed. Alternatively, the extrusion punch is movably provided in a second punch hole provided in one of the pair of second dies provided separately from the pair of dies, and the other of the second dies has the said A punched opening that faces the second punched hole and is larger than the punched portion may be formed. As described above, the extrusion punch, the second punch hole, and the punching opening may be provided in the pair of dies, or may be provided in the pair of second dies different from the pair of dies.

Further, the processing method for punching a plate material of the present invention has a pair of dies having a punched hole and capable of sandwiching the plate material from the front and back, and the plate material can be moved forward and backward in the punched hole. A processing device including a pair of punches that can be pressed from the front and back, an extrusion punch provided separately from the pair of punches, and a drive device for driving the die, the punch, and the extrusion punch is used. The drive device drives the die to hold the plate material in the initial position, presses the plate material against the die with one punch, and 20 to 70 in the forward direction in the plate thickness direction of the plate material from the initial position. The punched portion is formed by moving the punched portion by%, and the punched portion is pressed by the other punch to move the punched portion from the initial position in the direction opposite to the plate thickness direction by 20 to 70%, and the plate material and the plate material are moved. It is characterized in that the punched portion is moved from the initial position and the punched portion is punched from the plate material by the extrusion punch.

Further, the processing apparatus for cutting the plate material of the present invention is provided with a pair of first blades capable of sandwiching the plate material from the front and back, sandwiching the first blade and the planned cutting line, and holding the plate material on the front and back sides. The drive device includes a pair of second blades that can be sandwiched from the first blade and a drive device that drives the first blade and the second blade, and the drive device uses the plate material as the first blade and the second blade. It is sandwiched by the blade at the initial position, and the first blade and the second blade are moved from the initial position in the forward direction in the plate thickness direction by 20 to 70%, and then the first blade. It is characterized in that the body and the second blade are moved from the initial position in the direction opposite to the plate thickness direction by 20 to 70% to cut the plate material.

According to the processing apparatus for cutting the plate material of the present invention, when the plate material is cut, the first blade and the second blade are moved in the forward and reverse directions by 20 to 70% of the plate thickness to cut the plate material. As a result, the edge of the cut plate material is sagging on both the front and back surfaces, so that burrs are prevented from occurring. In addition, the fracture surface of the punched plate material on the thick surface can be made as small as possible.

Further, in the processing method for cutting the plate material of the present invention, a pair of first blades capable of sandwiching the plate material from the front and back, and the first blade and the planned cutting line are provided so as to sandwich the plate material from the front and back. A processing device including a pair of second blades that can be sandwiched between the two blades and a drive device that drives the first blade and the second blade is used, and the first blade and the first blade are driven by the drive device. The second blade body is driven to sandwich the plate material at the initial position, and the first blade body and the second blade body are moved from the initial position in the forward direction in the plate thickness direction of the plate material by 20 to 70%. Then, the first blade and the second blade are moved from the initial position in the opposite direction of the plate thickness direction by 20 to 70% to cut the plate material.

According to the present invention, it is possible to provide a processing apparatus and a processing method capable of making the fracture surface of a punched or cut plate material as small as possible on the plate thickness surface and preventing the occurrence of burrs.

(A) and (B) are explanatory views which show the holding process by the processing method by the processing apparatus which is embodiment of this invention. (A) and (B) are explanatory views which show the 1st partial punching process in the processing method of this embodiment. (A) to (C) are explanatory views which show the 2nd partial punching process in the processing method of this embodiment. (A) and (B) are explanatory views which show the push-back process in the processing method of this embodiment. (A) to (C) are explanatory views showing an extrusion process among the processing methods of this embodiment. It is a photograph which shows the plate material processed by the processing method by the processing apparatus of this embodiment, (A) shows the state of the front surface, (B) shows the state of the back surface. (A) to (C) are explanatory views showing an initial position holding process and a first partial cutting process among the processing methods of the cutting process of this embodiment. (A) and (B) are explanatory views which show the 2nd partial cutting process and the return process among the processing methods of the cutting process of this Embodiment.

Next, the processing apparatus and processing method of the present invention will be described with reference to FIGS. 1 to 8. As shown in FIG. 1A, the processing apparatus 1 of the present embodiment is arranged below the upper punch 2 and the upper die 3 arranged above the metal plate 20 which is a plate material to be processed, and below the metal plate 20. It is provided with a lower punch 5 and a lower die 6. The upper punch 2 and the lower punch 5 are a pair of punches in the present invention, and the upper die 3 and the lower die 6 correspond to a pair of dies in the present invention.

In the present embodiment, these punches and dies are a part of the mold device 1A including a driving device such as a motor. As shown in FIG. 1 (A), the mold apparatus 1A includes an upper mold 3a and an upper push pin 2b, and a lower mold 6a and a lower push pin 5b (both are indicated by a alternate long and short dash line). In the present application, the mold device 1A such as the upper mold 3a is not shown in FIGS. 1 (B) and later.

The upper die 3 is provided with an upper punch hole 4 for guiding the upper punch 2, and the upper punch 2 is held inside the upper punch hole 4 so as to be able to move forward and backward. The lower die 6 is provided with a lower punch hole 7 for guiding the lower punch 5, and the lower punch 5 is held inside the lower punch hole 7 so as to be able to move forward and backward.

The upper punch 2 and the lower punch 5 are formed so that the shapes of the contact surfaces 2a and 5a that come into contact with the metal plate are the same. The shapes of the contact surfaces 2a and 5a are determined according to the shape of the product (punched portion) formed by the processing apparatus 1 of the present embodiment. For example, in the case of the terminal 30 of the inter-board connector as shown in FIG. 6, a punch for extracting the outer shape of the terminal 30 and a shape for extracting the planar shape of the punching hole 22 provided inside the terminal 30 are formed.

The upper die 3, the upper punch 2, and the lower punch 5 are driven in the vertical direction by a driving device provided in the mold device 1A. Specifically, the upper die 3 is moved up and down by the driving device via the upper die 3a, the upper punch 2 is pressed in the forward direction (from top to bottom) by the upper push pin 2b, and the punch 5 is pushed downward. It is pressed in the opposite direction (from bottom to top) by the pin 5b. In this embodiment, the movement from top to bottom is in the forward direction, and the movement from bottom to top is in the opposite direction.

The lower die 6 is fixed to a press device (not shown) via the lower die 6a. In the driving device, when the upper die 3, the upper punch 2 and the lower punch 5 are driven, their movements are synchronized by a synchronization means such as a timing belt. As an example of the configuration of the drive device, the configuration described in the publication of Patent Document 1 by the inventor of the present application can be adopted.

In the present embodiment, the clearance between the upper punch 2 and the upper punch hole 4 is 3.0 μm regardless of the thickness of the metal plate 20. The clearance between the lower punch 5 and the lower punch hole 7 has the same value. Normally, the clearance between the punch and the punch hole is said to be about 5% of the plate thickness of the metal plate 20 to be processed. For example, in the case of a metal plate with a plate thickness of 0.08 mm (80 μm), the clearance is Is 4.0 μm, which is not preferable because a fracture surface is generated on the cut plate thickness surface. The clearance in the present application indicates a one-sided clearance unless otherwise specified.

Next, a processing method in the case of processing the metal plate 20 using the processing apparatus 1 of the present embodiment will be described. In the present embodiment, the case where the material of the metal plate 20 is phosphor bronze for a spring and the plate thickness is 0.08 mm will be described as an example.

The processing method of the present embodiment includes a holding step of holding the metal plate 20 with the upper die 3 and the lower die 6, and partial punching from the lower side of the metal plate 20 to a part of the thickness using the lower punch 5. The first partial punching step of performing the above, the second partial punching step of partially punching the metal plate 20 from above using the upper punch 2, and the punching portion 21 cut out from the metal plate 20 using the lower punch 5. It includes a push-back step of pushing back to the punch-out hole 22 and a push-back step of pushing out the punch-out portion 21 from the punch-out hole 22 of the metal plate 20.

First, in the holding step, as shown in FIG. 1 (A), a metal plate is conveyed between the upper die 3 and the lower die 6 by a transfer device (not shown), and then the upper die is as shown in FIG. 1 (B). 3 is pushed downward, and the metal plate 20 is sandwiched between the upper die 3 and the lower die 6 at a predetermined pressure. The position of the metal plate 20 in this state is set as the initial position. At this time, the metal plate 20 is accurately conveyed for each process at a constant pitch by a transfer device (not shown).

Next, in the first partial punching step, as shown in FIG. 2A, the lower punch 5 is raised by 20 to 70% of the thickness of the metal plate 20, and the lower punch 5 is pushed into the metal plate 20. The punched portion 21 is formed with. At this time, the upper punch 2 is held at an upper position so as not to come into contact with the surface of the punched portion 21 raised by the rise of the lower punch 5. From this state, as shown in FIG. 2B, the lower punch 5 is moved downward, and the first partial punching step is completed.

Next, in the second partial punching step, as shown in FIG. 3A, the upper punch 2 is moved downward, and as shown in FIG. 3B, 20 to 70% of the thickness of the metal plate 20 is used. It is lowered and the punched portion 21 is pushed into the metal plate 20 by the upper punch 2. At this time, the lower punch 5 has moved to a position lower than the lower surface of the punched portion 21 lowered by the lowering of the upper punch 2.

Next, as shown in FIG. 3C, the upper punch 2 is pulled upward to end the second partial punching step. At this time, the punching portion 21 is in a state of being fitted into the punching hole 22, and is held in the metal plate 20 without falling from the punching hole 22.

Next, in the push-back step, as shown in FIG. 4A, the lower punch 5 is pushed upward. As shown in FIG. 4B, the lower punch 5 is pushed up to a position (initial position) where the punching portion 21 enters the punching hole 22 and is held in the punching hole 22. At this time, the lower side of the punched portion 21 may be aligned with the height of the upper surface of the lower die 6, or the upper side of the punched portion 21 may be aligned with the height of the lower surface of the upper die 3.

Next, in the extrusion step, as shown in FIG. 5A, the metal plate 20 in which the punching portion 21 is fitted in the punching hole 22 is moved to a predetermined position of the extrusion device 8 for the extrusion step. The extrusion device 8 includes an extrusion upper die 9, an extrusion punch 10, and an extrusion lower die 12. The extruded upper die 9 and the extruded lower die 12 correspond to a pair of second dies in the present invention. The extrusion die 9 is provided with an extrusion punch hole 11 (second punch hole) for guiding the extrusion punch 10 in the vertical direction. Further, the extruded lower die 12 is provided with a punching opening 13 that penetrates and opens in the vertical direction.

The extruded punch 10 is formed so that the area of the contact surface 10a is smaller than the area of the surface of the punched portion 21. On the other hand, the punching opening 13 provided in the extrusion die 12 is formed to be larger than the surface area of the punching portion 21. The extrusion device 8 is provided on the downstream side of the above-mentioned processing device 1, and is formed separately from the processing device 1.

In the extrusion step, as shown in FIG. 5 (A), the metal plate 20 in which the punching portion 21 is fitted into the punching hole 22 after the pushing back step is designated as the extrusion device 8 for the extrusion step on the downstream side. After moving to a location, as shown in FIG. 5B, the extrusion upper die 9 is lowered, and the metal plate 20 is held in a predetermined position by the extrusion upper die 9 and the extrusion lower die 12.

Next, as shown in FIG. 5C, the extrusion punch 10 is lowered, and the extrusion punch 10 pushes out the punching portion 21 fitted in the punching hole 22 toward the punching opening 13. After that, the extrusion punch 10 is returned upward and the extrusion die 9 is raised to release the holding of the metal plate 20.

In the metal plate 20 in which the punched holes 22 are formed by the above steps, the side surfaces of the punched holes 22 are in the states shown in FIGS. 6 (A) and 6 (B). FIG. 6 (A) is a photograph of the terminal 30 for a connector formed of the metal plate 20 as viewed from the front surface, and FIG. 6 (B) is a photograph as viewed from the back surface.

The side surface 31 of the terminal 30 appearing in FIGS. 6 (A) and 6 (B) is not machined in the above step, and is a side surface processing punch and a side surface processing punch (not shown) from the surface side of FIG. 6 (A). The cross section is the result of punching in one direction with a side processing die.

As shown in FIG. 6A, when the surface side of the terminal 30 is viewed, the upper edge portion of the punching hole 22 on the surface side becomes a surface sagging 22a processed by the second partial punching step of the upper punch 2. There is. Similarly, the upper edge portion of the side surface 31 of the terminal 30 on the front surface side also has a surface sagging 31B punched by a side surface processing punch.

On the other hand, as shown in FIG. 6B, when looking at the back surface side of the terminal 30, the lower edge portion on the back surface side of the punch hole 22 is the surface sagging 22b processed by the first partial punching step of the lower punch 5. It has become. On the other hand, the lower edge portion on the back surface side of the side surface 31 of the terminal 30 is the surface on the side surface processing die side punched out by the side surface processing punch, and this is a fracture surface.

As described above, in the punched holes 22 machined by the processing apparatus 1 and the processing method of the present embodiment, both the upper edge portion on the front surface side and the lower edge portion on the back surface side have surface sagging 22a and 22b. Further, the inner peripheral surface of the punched hole 22 has no fracture surface, and the portion between the surface sagging 22a and 22b is a cut surface 22c.

Therefore, when the processing device 1 and the processing method of the present embodiment are used for processing the terminal 30 for the connector, the terminal on the other side is inserted into the punching hole 22 to break the contact surface with the terminal on the other side. Since no cross section is formed, the connection state of the connector can be improved.

Further, in the processing apparatus 1 and the processing method of the present embodiment, the generation of burrs at the processed portion is suppressed. Thereby, when the processing apparatus 1 and the processing method of the present embodiment are used for processing a lead frame used for, for example, a semiconductor, it is possible to provide a lead frame having no burrs and high reliability.

In the above embodiment, the lower punch 5 is raised in the first partial punching step and the upper punch 2 is lowered in the second partial punching step, but conversely, the upper punch 2 is raised in the first partial punching step. The punch 2 may be lowered and the lower punch 5 may be raised in the second partial punching step. At that time, in the push-back step, the lower punch 5 is lowered so as not to hit the metal plate 20, and the upper punch 2 is lowered so that the punched portion 21 generated by the second partial punching step is returned to the punched hole 22. Just do it.

Further, in the above embodiment, the upper die 3 is moved up and down by the driving device and the lower die 6 is fixed to the press device. However, the present invention is not limited to this, and the upper die 3 is fixed to the press device and the lower die 6 is fixed. May be moved up and down by a drive device.

Further, in the above embodiment, in the first partial punching step, the lower punch 5 is raised by 20 to 70% of the plate pressure of the metal plate 20, but the ratio is appropriately determined depending on the material and thickness of the metal plate 20. It is determined. The same applies to the upper punch 2 in the second partial punching step.

Further, in the above embodiment, the extrusion device 8 is composed of the extrusion upper die 9, the extrusion punch 10, and the extrusion lower die 12, but the extrusion device 8 is not limited to this, and the extrusion upper die 9 is integrated with the upper die 3. It can also be. At that time, the lower die 6 and the extruded lower die 12 can be integrated.

Further, in the above embodiment, the metal plate 20 is described as an example of the plate material, but the present invention is not limited to this, and a plate material of another material such as a paper plate material, a mica plate, or a synthetic resin plate may be used. .. Further, the present invention is particularly effective for a plate material having a plate material thickness of 0.3 mm or less. Further, the clearance between the upper punch hole 4 and the upper punch 2 and the clearance between the lower punch hole 7 and the lower punch 5 are set to 3.0 μm, but the clearance may be between 1.5 and 3.0 μm.

Next, the processing apparatus and processing method for cutting the plate material in the present invention will be described with reference to FIGS. 7 to 8. The cutting device 1B, which is a processing device for cutting the metal plate 20, is provided with a pair of first blades 40 capable of sandwiching the metal plate 20 from the front and back, and sandwiching the first blade 40 and the planned cutting line L. A pair of the second blades 50, and a drive device 60 for driving the first blades 40 and the second blades 50 are provided.

The lower part of the first blade 40 is a table 41 fixed at the installation location, and the upper part is a plate material holding tool 42 that is moved up and down by the drive device 60. The second blade 50 has a lower blade 51 at the lower side and an upper blade 52 at the upper side. The planned cutting line L is a line representing the edge of the metal plate 20 after cutting (see FIG. 8B), and is an imaginary line that does not actually appear on the surface of the metal plate 20.

As shown in FIG. 7A, the drive device 60 moves the first drive unit 61 that moves the plate material retainer 42 up and down, the second drive unit 62 that moves the lower blade 51 up and down, and the upper blade 52 up and down. It is provided with a third drive unit 63 to be operated. In the present application, these drive units are schematically represented, but specifically, they are composed of a cylinder, a cam mechanism, and the like that are generally widely used as this type of cutting device. In the drive device 60 having these configurations, each drive unit is driven in synchronization with each other. Note that in FIGS. 7 (B) to 8 (B), the drive device 60 is not shown.

The cutting device 1B of the present embodiment is adjusted so that the clearance between the first blade body 40 and the second blade body 50 is from 0 to about 5% of the plate thickness of the metal plate 20. This clearance is appropriately adjusted according to the thickness and material of the metal plate 20 so that the metal plate 20 can be cut without causing burrs and the like.

Next, a method of cutting the metal plate 20 using the cutting device 1B of the present embodiment will be described with reference to FIG. 7. The cutting method (machining method) of the present embodiment includes an initial position holding step of holding the metal plate 20 at the initial position by the first blade 40 and the second blade 50, and the first blade 40 and the second blade 50. The first partial cutting step of moving the first blade 40 and the second blade 50 in the relatively forward direction, the second partial cutting step of moving the first blade 40 and the second blade 50 in the relatively opposite directions, and the first blade 40 and the first blade. 2 It consists of a return step of returning the blade body 50 to the initial position.

FIG. 7A shows a state in which the metal plate 20 has been moved to the surface of the table 41 of the first blade body 40. At this time, the plate material holding tool 42 of the first blade 40 is held upward away from the table 41, and the upper blade 52 and the lower blade 51 are also held at positions separated vertically from the metal plate 20.

Next, as shown in FIG. 7B, the plate material presser 42 of the first blade 40 is lowered, and the metal plate 20 is pressed against the table 41 by the plate material presser 42 to hold the metal plate 20. Further, also in the second blade body 50, the upper blade 52 is lowered and brought into contact with the metal plate 20, and the lower blade 51 is raised and brought into contact with the metal plate 20. In the present embodiment, the positions of the first blade body 40 and the second blade body 50 in FIG. 7B are set as initial positions.

Next, as shown in FIG. 7 (C), while holding the positions of the table 41 and the plate material holding tool 42, which are the first blades 40, the first blades 40 and the second blades 50, which are the second blades 50. The blade body 50 is pressed upward (forward in the plate thickness direction) and pushed up (first partial cutting step). The rising height at this time is 20 to 70% of the plate thickness of the metal plate 20 from the initial position. Since the ratio of the metal plate 20 to be cut cleanly differs depending on the thickness of the metal plate 20 and the material of the metal plate 20, an appropriate ratio is obtained in the actual cutting work.

Next, as shown in FIG. 7 (D), while holding the positions of the table 41 and the plate material holding tool 42, which are the first blades 40, the first blades 40 and the second blades 50, which are the second blades 50. The blade body 50 is pushed down (in the direction opposite to the plate thickness direction) (second partial cutting step). The descending height at this time is also set to be 20 to 70% of the plate thickness of the metal plate 20 from the initial position. At that time, the rate of increase in FIG. 7 (C) and the rate of decrease in FIG. 7 (D) may be the same rate or may be separate rates.

Next, as shown in FIG. 7 (E), while holding the positions of the table 41 and the plate material holding tool 42, which are the first blades 40, the first blades 40 and the second blades 50, which are the second blades 50. The blade body 50 is returned to the initial position (returning step). The metal plate 20 is cut by a series of these steps.

Here, depending on the plate thickness or material of the metal plate 20, the metal plate 20 may be cut by the second partial cutting step of FIG. 7 (D), but in this case, even if the subsequent restoration step is performed. Often, the return step does not have to be performed.

Also in the method of cutting the metal plate 20 using the cutting device 1B of the present embodiment, the moving directions of the first blade body 40 and the second blade body 50 are downward in the first partial cutting step, and the second portion. It may be moved upward in the cutting step. Further, depending on the thickness and material of the metal plate 20, the first blade body 40 and the second blade body 50 may be moved a plurality of times.

1 ... Processing device 1B ... Cutting device (processing device)
2 ... Upper punch 2a ... Contact surface (upper punch)
3 ... Upper die 4 ... Upper punch hole 5 ... Lower punch 5a ... Contact surface (lower punch)
6 ... Lower die 7 ... Lower punch hole 8 ... Extruder 9 ... Extruded upper die 10 ... Extruded punch 10a ... Contact surface (extruded punch)
11 ... Extruded punch hole 12 ... Extruded lower die 13 ... Punched opening 20 ... Metal plate (plate material)
21 ... Punching portion 22 ... Punching hole 22a ... Surface sagging 22b ... Surface sagging 22c ... Cutting surface 30 ... Terminal 31 ... Side surface 31B ... Surface sagging 40 ... First blade 41 ... Table 42 ... Plate material holding tool 50 ... Second blade Body 51 ... Lower blade 52 ... Upper blade L ... Scheduled cutting line

The plate material processing apparatus of the present invention is a processing apparatus for punching a plate material, has a punch hole having the same shape as the punched material, and has a pair of dies capable of sandwiching the plate material from the front and back, and the inside of the punch hole. A pair of punches capable of advancing and retreating the plate material from the front and back, an extrusion punch provided separately from the pair of punches, a drive device for driving the die, the punch, and the extrusion punch. The drive device holds the plate material at an initial position by the die, presses the plate material against the die with one punch, and presses the plate material from the initial position in the forward direction in the plate thickness direction of the plate material 20. The punched portion is formed by moving the punched portion by about 70%, and the punched portion is pressed by the other punch to move the punched portion by 20 to 70% from the initial position in the direction opposite to the plate thickness direction of the plate material. Further, the punched portion is moved from the initial position and the punched portion is punched from the plate material by the extrusion punch.

Further, the processing method for punching the plate material of the present invention is a processing method for punching the plate material, and is a pair of dies having punch holes having the same shape as the punched shape and capable of sandwiching the plate material from the front and back. A pair of punches that can move forward and backward in the punch hole and can press the plate material from the front and back, an extrusion punch provided separately from the pair of punches, the die, the punch, and the extrusion punch. A processing device provided with a drive device for driving the die is used, the die is driven by the drive device to hold the plate material at an initial position, and the plate material is pressed against the die with one punch to perform the initial stage. A punched portion is formed by moving the plate material from the position in the forward direction in the plate thickness direction by 20 to 70%, and the punched portion is pressed by the other punch in the plate thickness direction of the plate material from the initial position. It is characterized in that the plate material and the punched portion are moved from the initial position by moving in the opposite direction by 20 to 70%, and the punched portion is punched from the plate material by the extrusion punch.

Further, the processing apparatus for cutting the plate material of the present invention is provided with a pair of first blades capable of sandwiching the plate material from the front and back, sandwiching the first blade and the planned cutting line, and holding the plate material on the front and back sides. The drive device includes a pair of second blades that can be sandwiched from the first blade and a drive device that drives the first blade and the second blade, and the drive device uses the plate material as the first blade and the second blade. It is sandwiched by the blade at the initial position, and either one of the first blade and the second blade is moved from the initial position to the other in the forward direction of the plate material by 20 to 70% in the plate thickness direction. , to then the other one of the first blade and said second blade, cutting the plate material opposite direction is relatively moved 20% to 70% content of the plate thickness direction from the initial position It is characterized by doing.

Further, in the processing method for cutting the plate material of the present invention, a pair of first blades capable of sandwiching the plate material from the front and back, and the first blade and the planned cutting line are provided so as to sandwich the plate material from the front and back. A processing device including a pair of second blades that can be sandwiched between the two blades and a drive device that drives the first blade and the second blade is used, and the drive device is used to drive the first blade and the second blade. The second blade body is driven to sandwich the plate material at the initial position, and either one of the first blade body and the second blade body is in the forward direction in the plate thickness direction of the plate material from the initial position with respect to the other. to move 20% to 70% partial, to then the other one of the first blade and the second blade 20 to 70% min relative to the opposite direction of the plate thickness direction from the initial position It is moved, characterized in that cutting the plate material.

Claims (7)

It is a processing device that punches plate materials.
A pair of dies that have punched holes and can hold the plate material from the front and back,
A pair of punches that can move forward and backward in the punch holes and can press the plate material from the front and back,
Extruded punches provided separately from the pair of punches,
The die, the punch, and a driving device for driving the extrusion punch are provided.
The drive device sandwiches the plate material in the initial position by the die.
The plate material is pressed against the die with one punch and moved from the initial position in the forward direction in the plate thickness direction by 20 to 70% to form a punched portion.
The punched portion is pressed by the other punch to move the plate material from the initial position in the direction opposite to the plate thickness direction by 20 to 70%.
A plate material processing apparatus characterized in that the plate material and the punched portion are moved from the initial position and the punched portion is punched from the plate material by the extrusion punch. The processing apparatus according to claim 1.
A plate material processing apparatus characterized in that the punched portion is returned to the initial position by the one punch before punching by the extrusion punch. The processing apparatus according to claim 2.
The extrusion punch is movably provided in a second punch hole provided in one of the pair of dies.
A plate material processing apparatus characterized in that a punched opening is formed on the other side of the pair of dies so as to face the second punch hole and have a larger opening than the punched portion. The processing apparatus according to claim 2.
The extrusion punch is movably provided in a second punch hole provided in one of a pair of second dies provided separately from the pair of dies.
A plate material processing apparatus characterized in that a punched opening is formed on the other side of the second die so as to face the second punch hole and open larger than the punched portion. It is a processing method for punching plate materials.
A pair of dies that have punched holes and can hold the plate material from the front and back,
A pair of punches that can move forward and backward in the punch holes and can press the plate material from the front and back,
Extruded punches provided separately from the pair of punches,
Using a processing device equipped with a drive device for driving the die, the punch, and the extrusion punch,
The drive device drives the die to hold the plate material in the initial position.
The plate material is pressed against the die with one punch and moved from the initial position in the forward direction in the plate thickness direction by 20 to 70% to form a punched portion.
The punched portion is pressed by the other punch to move the plate material from the initial position in the direction opposite to the plate thickness direction by 20 to 70%.
A method for processing a plate material, which comprises moving the plate material and the punched portion from the initial position and punching the punched portion from the plate material by the extrusion punch. It is a processing device that cuts plate materials.
A pair of first blades capable of sandwiching the plate material from the front and back,
A pair of second blades provided so as to sandwich the planned cutting line with the first blade and capable of holding the plate material from the front and back.
A drive device for driving the first blade and the second blade is provided.
The drive device sandwiches the plate material between the first blade body and the second blade body at an initial position.
The first blade and the second blade are moved from the initial position in the forward direction in the plate thickness direction of the plate material by 20 to 70%, and then the first blade and the second blade are moved. A processing apparatus characterized in that the plate material is cut by moving the plate material by 20 to 70% in the direction opposite to the plate thickness direction from the initial position. It is a processing method that cuts plate materials.
A pair of first blades capable of sandwiching the plate material from the front and back,
A pair of second blades provided so as to sandwich the planned cutting line with the first blade and capable of holding the plate material from the front and back.
Using a processing device including the first blade and a driving device for driving the second blade,
The driving device drives the first blade and the second blade to sandwich the plate material in the initial position.
The first blade and the second blade are moved from the initial position in the forward direction in the plate thickness direction of the plate material by 20 to 70%, and then the first blade and the second blade are moved. A processing method characterized by cutting the plate material by moving the plate material by 20 to 70% in the direction opposite to the plate thickness direction from the initial position.