JP3922464B1 - Processed plate and method for manufacturing the same, mold for processing base plate, and method for manufacturing product plate - Google Patents

Abstract

The present invention provides a processed plate that can stably support a product plate with a frame portion and that does not easily drop off, a manufacturing method thereof, a mold for processing a base plate, and a manufacturing method of the product plate. .
A printed circuit board (12a-12c) temporarily fixed to the frame part (14) through at least one side thereof, and a mother board including the frame part (14), the printed circuit boards (12a-12c). The support plates 16a to 16c punched from the region adjacent to the base plate and fitted into the original holes, and the grooves 18a to 18d formed along or near the boundary line between the frame portion 14 and the printed circuit boards 12a to 12c. 18c, and at least one of the front ends of the support plates 16a to 16c is inside the concave grooves 18a to 18c, and includes an adjacent region including a region from the front end of the support plates 16a to 16c to the concave grooves 18a to 18c. A machined plate in which the inside is punched, a method for producing the same, a mold for processing a mother board, and a method for producing a product plate.
[Selection] Figure 1

Description

  The present invention relates to a processed board, a manufacturing method thereof, a mother board processing mold, and a manufacturing method of a product board. More specifically, at least one side of a product board (for example, a printed circuit board) is framed through a concave groove. Processed plate (for example, mounting substrate) temporarily fixed to the part, a manufacturing method thereof, a base plate processing mold for manufacturing such a processed plate, and production of a product plate obtained from such processed plate Regarding the method.

  In recent years, with the miniaturization of electronic devices, there has been an increasing demand for miniaturization and modification of printed circuit boards used in electronic devices. On the other hand, an electronic component automatic mounting machine (hereinafter referred to as “self-mounting machine”) such as a chip mounter or an automatic insertion machine for mounting electronic components on a printed circuit board is referred to as the size of a workpiece because of its conveyance. Have upper and lower limits. Moreover, the external shape of the workpiece | work used for a self-machine is required to be substantially rectangular, ie, at least one side is a straight line, and at least one of the orthogonal sides is a straight line.

  Therefore, when mounting electronic components on a small and irregular printed circuit board using a self-mounting machine, first, a plurality of printed circuit boards are formed on the printed wiring board, and the V-cut method and pushback method are used. Using a perforation method, etc., the printed circuit board is temporarily fixed to the original printed wiring board, and then the printed wiring board has a size and shape that can be conveyed by the self-equipment. A method of cutting a substrate (mounting substrate) is used.

Of these, the V-cut method inserts V-shaped, U-shaped and other concave grooves (V-cut) along the printed circuit boundary printed on the printed wiring board, and mounts electronic components on the printed circuit. And then breaking along the V-cut. Therefore, the V-cut method can be applied only to a printed circuit board whose outer shape is linear.
The perforation method is a method in which a large number of small holes are formed along the boundary line of the printed circuit board and the holes are broken along the small holes. The perforation method is applicable only to a printed circuit board that does not require dimensional accuracy of the outer shape, because unevenness remains on the boundary line after fracture.

  On the other hand, in the pushback method, the printed circuit board is punched out using a blade having a predetermined shape while holding the printed wiring board between the upper mold and the lower mold, and then the punched printed circuit board is removed from the original hole. It is a method of fitting. The pushback method has a high dimensional accuracy of the outer shape and there is no restriction on the shape of the printed circuit board, and is therefore an effective method particularly when electronic components are automatically mounted on a deformed printed circuit board.

The processing of printed wiring board using the pushback method is generally
(1) Form a reference hole for pushback on the printed wiring board on which the electric circuit is printed,
(2) Push-back processing of the printed circuit board using the push-back mold, and drilling of component holes as necessary,
(3) Cutting the outer shape of the printed wiring board using an outer cutting die and cutting out a mounting board including a predetermined number of printed circuit boards from the mother board.
Has been done.

  However, the pushback process generally tends to warp because a strong shearing force acts on the printed wiring board. Conventionally, pushback processing and outline cutting have been generally performed using separate molds. However, if only pushback processing is performed continuously on the base plate, large warpage will occur in the base plate. There is a problem that it becomes difficult to cut the outer shape. In addition, a pushback mold and an outer cutting mold are required, which increases the cost. Further, if the manufactured mounting board is warped or has a relatively large residual stress, it is difficult to remove the printed circuit board from the frame portion.

Therefore, in order to solve this problem, Patent Document 1 discloses that the printed circuit board is disposed on the upstream side with respect to the conveyance direction of the printed wiring board, and the printed circuit board is punched out from the printed wiring board. A mounting board including one or two or more of the printed circuit boards that are arranged on the downstream side with respect to the transport direction of the printed wiring board and pushed back. There is disclosed a printed wiring board processing die having an outer shape cutting means for cutting out from a printed wiring board.
In this document, since the area pushed back by the pushback means is sequentially separated by the outline cutting means, the outline cutting can be easily performed without being greatly affected by the warp of the printed wiring board, and one metal It describes that the die cost can be reduced because push back processing and external cutting processing can be performed with the mold.

  Further, Patent Document 2 is formed by punching an unnecessary portion from a printed wiring board, and has first and second straight portions at both ends, and the first straight portion and the second straight portion are provided. One or two or more printed circuit board portions arranged so as to be aligned with each other, one end thereof being integrated with each printed circuit board via the first straight portion, and the other end being the printed wiring A first frame portion having a continuous third linear portion formed by sequentially punching one or two or more vertical slit pieces parallel to the conveying direction of the base plate so that they communicate with each other; and A second frame portion whose one end is integrated with each printed circuit board portion via the second straight portion, and a line that is on or near the first straight portion and parallel to the first straight portion. 1st V cut formed The second straight portion or on the mounting substrate having a first 2V and cut formed along a line parallel with the second straight portion in the vicinity thereof is disclosed. In this document, the mounting board obtained in this way is obtained by integrating a printed circuit board part, a first frame part, and a second frame part via a first straight part and a second straight part, respectively. Therefore, even when the shape of the printed circuit board is extremely complicated, there is no drop-off accident during automatic mounting, and unnecessary parts are punched out, so there is no warpage and smooth automatic mounting. It describes the points that can be performed and the point that there is no risk of breakage of the printed circuit board during removal because it can be separated into individual printed circuit boards just by breaking along the V-cut after completion of automatic mounting. Yes.

  Further, in Patent Document 3, a printed circuit board is punched from a printed wiring board, pushback means for fitting the punched printed circuit board into an original hole, and at least one of the punched printed circuit boards. Vertical slit forming means for forming continuous vertical slits serving as reference sides of the processed board by sequentially forming vertical slit pieces parallel to the conveyance direction of the printed wiring board on the side. A printed wiring mother board processing mold provided is disclosed.

JP 2002-233996 A JP 2004-247671 A Japanese Patent No. 3433802

As disclosed in Patent Document 2, when the unnecessary portion is punched and the printed circuit board portion is temporarily fixed to the frame portion via the straight portions at both ends of the printed circuit board portion, the shape of the printed circuit board portion is extremely complicated. Even if this is the case, it is possible to prevent a dropout accident during automatic mounting.
However, depending on the shape of the printed circuit board and the size of the mounting board, both ends of the printed circuit board may not be supported by the frame portion. In this case, it is possible to temporarily fix only one side of the printed circuit board with the frame by punching out unnecessary portions. However, when the printed circuit board has an elongated shape, when it is temporarily fixed to the frame portion only through the short side of the printed circuit board, only a slight external force acts on the tip of the printed circuit board. A large bending moment is generated at the connection between the circuit board and the frame. This also applies to the case where the printed circuit board is supported through two intersecting sides. Therefore, the tip of the printed circuit board is greatly bent up and down during handling, and in the worst case, the groove portion is broken.
In addition, even if both ends of the printed circuit board can be supported by the frame portion, if both ends of the elongated printed circuit board are supported by the frame portion, the center portion will be greatly bent during handling, which hinders automatic mounting. The

  The problem to be solved by the present invention is that the product board (printed circuit board) can be stably supported by the frame portion regardless of its shape, and the processed board does not fall off during handling. (Mounting substrate) and manufacturing method thereof, mold for manufacturing a base plate for manufacturing such a processed plate, and a manufacturing method of a product plate for separating the product plate from the processed plate thus obtained It is to provide.

In order to solve the above problems, the processed plate according to the present invention is:
A frame,
One or more product plates temporarily fixed to the frame portion via at least one side thereof;
One or more support plates punched from a region adjacent to the product plate in the mother board including the frame portion, and fitted into the original hole;
Comprising one or two or more concave grooves formed along the border line of the product plate or the vicinity thereof;
At least one of the tips of the support plates is inside the concave groove;
In the adjacent region including the region from the tip of the support plate to the concave groove is punched ,
At least one of the product plates is
(A) Only one side thereof is temporarily fixed to the frame portion through the concave groove, or
(B) The gist is that two intersecting sides are temporarily fixed to the frame portion via the concave groove .

The first of the mother board machining molds according to the present invention is:
A support plate region, which is disposed upstream of the conveyance direction of the mother plate and includes a support plate in an area adjacent to the product plate in the mother plate, is punched out, and the punched support plate region is the original hole. A push-back means for fitting,
An outer shape cutting means for cutting a processed plate including the support plate region, which is disposed downstream of the conveyance direction of the mother plate and includes the product plate and the pushback, from the mother plate;
The outer shape cutting means is for punching all or part of an adjacent region including a region extending from a tip of the support plate to a boundary line between the product plate and the frame portion or a groove formed in the vicinity thereof. The adjacent area punching means is further provided ,
The pushback means includes at least one product plate,
(A) Only one side thereof is temporarily fixed to the frame portion through the concave groove, or
(B) Two intersecting sides are temporarily fixed to the frame portion via the concave groove
Thus, the gist is to push back the support plate region .
In this case, a blanking region corresponding to one processed plate may be further provided between the pushback unit and the outer shape cutting unit.

In addition, the second of the mother board processing mold according to the present invention,
A pushback means for punching a support plate region including a support plate therein from an area adjacent to a product plate in the mother plate , and fitting the punched support plate region into an original hole;
A continuous vertical slit serving as a reference side of the processed plate is formed by sequentially forming vertical slit pieces parallel to the conveying direction of the base plate on at least one side of the punched support plate region. A vertical slit forming means for
It is arranged on the downstream side of the pushback means with respect to the conveying direction of the base plate, and extends from the tip of the support plate to a groove formed at or near the boundary line between the product plate and the frame portion. e Bei the adjacent region punching means for punching the whole or part of an adjacent region including the region,
The pushback means includes at least one product plate,
(A) Only one side thereof is temporarily fixed to the frame portion through the concave groove, or
(B) Two intersecting sides are temporarily fixed to the frame portion via the concave groove
Thus, the gist is to push back the support plate region .
In this case, two or more transverse slit pieces that are perpendicular to the longitudinal slit and aligned in a straight line are provided in front of or behind the punched support plate region, and at least of the transverse slit pieces. One may further comprise a horizontal slit forming means for forming a horizontal slit communicating with the vertical slit.

The first method for producing a processed plate according to the present invention includes the following steps.
(A) In the pushback means, the support plate region (A) is punched out from the region adjacent to the product plate in the mother plate , and the support is punched out by using the mother board processing mold according to claim 4 A pushback process for fitting the plate area (A) into the original hole.
(B) transporting the base plate so that the region including the support plate region (A) is on the outer cutting means, and punching out the support plate region (B) from the base plate in the pushback means; At the same time as inserting the punched support plate region (B) into the original hole,
In the outer shape cutting means, a processed plate including the support plate region (A) is cut out from the mother plate,
In the adjacent region punching means, an outer shape cutting step of punching out all or a part of the adjacent region.
(C) A groove forming step of forming a groove along a boundary line between the cut-out frame portion of the processed plate and the product plate or in the vicinity thereof.

A second method for manufacturing a processed plate according to the present invention includes the following steps.
(A) In the pushback means, the support plate region (A) is punched out from the region adjacent to the product plate in the mother plate, and the support is punched out by using the mother plate processing mold according to claim 5 A pushback process for fitting the plate area (A) into the original hole.
(B) The base plate is transported so that the region including the support plate region (A) is located in the blanking region, and the support plate region (B) is newly punched from the base plate by the pushback means, At the same time as inserting the extracted support plate region (B) into the original hole,
A blanking step of blanking the support plate region (A) pushed back by the immediately preceding press in the blanking region.
(C) conveying the mother board so that the region including the support plate region (A) and the region including the support plate region (B) are on the outer cutting means and the blanking region, respectively; In the pushback means, the support plate area (C) is newly punched from the base plate, the punched support plate area (C) is fitted into the original hole, and pushback is performed with the immediately preceding press in the blanking area. At the same time as performing the blanking of the support plate area (B),
In the outer shape cutting means, a processed plate including the support plate region (A) is cut out from the mother plate,
In the adjacent region punching means, an outer shape cutting step of punching out all or a part of the adjacent region.
(D) A groove forming step of forming a groove along a boundary line between the cut-out frame portion of the processed plate and the product plate or in the vicinity thereof.

The third method for manufacturing a processed plate according to the present invention includes the following steps.
(A) In the pushback means, the support plate region (A) is punched out from the region adjacent to the product plate in the mother plate, and the support is punched out by using the mother plate processing mold according to claim 6. At the same time as inserting the plate area (A) into the original hole,
In the vertical slit forming means, a first pressing step of forming a vertical slit piece (A) parallel to the conveying direction of the mother plate on at least one side of the punched support plate region (A). .
(B) The base plate is transported by a predetermined feed width, and the support plate region (B) is newly punched from the base plate in the pushback means, and the punched support plate region (B) is returned to the original hole. At the same time,
In the vertical slit forming means, at least one side of the punched support plate region (B) is in parallel with the conveying direction of the mother plate and communicates with the vertical slit piece (A). The vertical slit piece (B) is formed as follows, and a continuous vertical slit serving as the reference side of the processed plate is formed,
A second pressing step of punching all or part of the adjacent region in the adjacent region punching means;
(C) A groove forming step of forming a groove along a boundary line between the cut-out frame portion of the processed plate and the product plate or in the vicinity thereof.

A fourth method for manufacturing a processed plate according to the present invention includes the following steps.
(A) In the pushback means, the support plate region (A) is punched out from the region adjacent to the product plate in the mother plate, and the support is punched out by using the mold for processing the mother plate according to claim 7. At the same time as inserting the plate area (A) into the original hole,
In the longitudinal slit forming means, on at least one side of the punched support plate region (A), a longitudinal slit piece (A) is formed in parallel to the conveying direction of the mother plate,
In the horizontal slit forming means, a continuous vertical length obtained by sequentially forming the vertical slit pieces parallel to the conveying direction of the mother plate in front of or behind the punched support plate region (A). A horizontal slit (A) which is composed of two or more horizontal slit pieces (A) which are perpendicular to the slit and arranged in a straight line, and at least one of the horizontal slit pieces (A) communicates with the vertical slit. 1st press process which forms).
(B) The base plate is transported by a predetermined feed width, and the support plate region (B) is newly punched from the base plate in the pushback means, and the punched support plate region (B) is returned to the original hole. At the same time,
In the longitudinal slit forming means, at least one side of the punched support plate region (B) is parallel to the conveying direction of the mother plate and communicates with the longitudinal slit piece (A). The vertical slit piece (B) is formed as follows, and a continuous vertical slit serving as the reference side of the processed plate is formed,
In the horizontal slit forming means, two or more horizontal slit pieces (B) that are perpendicular to the vertical slit and aligned in a straight line are provided in front of or behind the punched support plate region (B). And at least one of the transverse slit pieces (B) forms a transverse slit (B) communicating with the longitudinal slit,
A second pressing step of punching all or part of the adjacent region in the adjacent region punching means;
(C) A groove forming step of forming a groove along a boundary line between the cut-out frame portion of the processed plate and the product plate or in the vicinity thereof.

Furthermore, the manufacturing method of the product board which concerns on this invention makes it a summary to break the said frame part along the said concave groove with which the processed board which concerns on this invention is equipped, and to isolate | separate the said product board from the said frame part. .
The second method of manufacturing the product plate according to the present invention is to break the frame portion along the concave groove provided in the processed plate obtained by the method according to the present invention, and to remove the product plate from the frame portion. The gist is to separate them.

  In the case where at least one side of the product plate is temporarily fixed to the frame portion through the concave groove, instead of punching out the region (unnecessary portion) adjacent to the product plate, the unnecessary portion is pushed back, and the original support plate is used. When fitted into the hole, the portion of the outer periphery of the product plate that is not temporarily fixed to the frame portion is reliably supported by the support plate. Therefore, even when the product plate is temporarily fixed to the frame part through only one side, two intersecting sides, or two opposite sides, the product plate may be greatly bent up and down during handling. Alternatively, the product plate does not fall off because the groove portion is broken. Furthermore, since the adjacent region is punched, the product plate can be easily separated by breaking the frame portion along the concave groove.

  Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. In the following description, a printed circuit board and a mounting board in which the printed circuit board is supported by a frame will be described. However, the present invention is not limited to a printed wiring board, but a "work board" other than a mounting board. And “product boards” other than printed circuit boards.

First, the mounting substrate according to the first embodiment of the present invention will be described. 1A and FIG. 1B to FIG. 1E, respectively, a plan view of a mounting substrate according to the first embodiment of the present invention, and BB ′ to E thereof. -E 'sectional view taken on the line is shown. In FIG. 1, the dimensions of each part are appropriately enlarged and reduced from the actual dimensions for easy viewing.
In FIG. 1, a mounting board (processed board) 10 includes printed circuit boards (product boards) 12a to 12c, a frame portion 14, support plates 16a to 16c, and concave grooves 18a to 18c.

The printed circuit board 12a is temporarily fixed to the frame portion 14 through both ends and the upper side. Further, the printed circuit boards 12b and 12c are temporarily fixed to the frame portion 14 through two opposing sides. Each printed circuit board 12a-12c is arrange | positioned at fixed intervals so that it may not contact | adhere mutually. Each of the printed circuit boards 12a to 12c is formed with through holes 13a, 13a... Used as component holes or the like as necessary.
The shapes of the printed circuit boards 12a to 12c shown in FIG. 1 are merely examples, and the shape of the printed circuit board is not limited to this. However, since it is necessary to temporarily fix the printed circuit boards 12a to 12c to the frame portion 14 via the concave grooves 18a to 18c, the printed circuit boards 12a to 12c need to include at least one straight line.
In FIG. 1, the mounting board 10 including a total of three printed circuit boards 12a to 12c is shown, but this is also merely an example, and the number of printed circuit boards is not particularly limited. The present invention can be applied to a mounting board including one or more printed circuit boards.

The frame portion 14 is for supporting these until the automatic mounting on the printed circuit boards 12a to 12c is completed. Here, the “frame portion” refers to a portion other than the printed circuit board and the support plate, which is a continuous body. In the present embodiment, the frame portion 14 is provided on the entire circumference of the mounting substrate 10. In the left corner and the right corner of the upper side of the frame portion 14, through holes 14 a and 14 a that serve as reference holes or sub-reference holes for automatic mounting are formed.
Note that one reference hole and one sub reference hole are sufficient for each, but a plurality of reference holes and sub reference holes may be provided. Providing a plurality of reference holes and sub-reference holes is advantageous in that automatic mounting can be performed from a plurality of directions.
Further, the frame portion 14 may be formed with one or more slits that communicate with the outer periphery of the frame portion 14 and that do not communicate with the printed circuit boards 12a to 12c. When the slit is provided, it is possible to reduce the warpage that occurs during the pushback processing of the support plates 16a to 16c. In this case, the optimum number and length of the slits are selected according to the degree of warpage generated in the mounting substrate 10. Moreover, the formation location of the slit is not particularly limited, and may be either the upper or lower end or the left and right ends of the mounting substrate 10. In addition, when there is little curvature, you may abbreviate | omit a slit.

The support plates 16a to 16c are printed wiring board including the frame portion 14, and are punched from an area adjacent to the printed circuit boards 12a to 12c (unnecessary portions that do not constitute the printed circuit boards 12a to 12c). It is made of something that is inserted into the hole.
The left and right ends of the support plates 16a to 16c are inside the concave grooves 18a to 18c. Here, the “tips of the support plates 16a to 16c” are portions facing the concave grooves 18a to 18c, and by breaking the concave grooves 18a to 18c, the portion opens to the left and right, and the printed circuit board 12a. A portion having a function of separating ~ 12c.
In addition, as illustrated in FIG. 1, the support plates 16a to 16c may have all the tips inside the concave grooves 18a to 18c, but if at least one tip is inside the concave grooves 18a to 18c. good. In this case, the other tip may be on or near the boundary line between the printed circuit boards 12 a to 12 c and the frame part 14, or crosses the boundary line between the printed circuit boards 12 a to 12 c and the frame part 14. Also good.

A substantially triangular punching hole 17a is provided at the right end of the support plate 16a. The punching hole 17a is formed by punching the entire adjacent region at the right end of the support plate 16a. Here, the “adjacent region” refers to a region including a region from the tip of the support plate to the concave groove. In the example shown in FIG. 1, the adjacent region on the right side of the support plate 16a refers to a region including a region surrounded by the right end of the support plate 16a, the outer periphery of the printed circuit boards 12a and 12b, and the concave groove 18a. . As shown in FIG. 1, the right end of the punching hole 17a may be outside the concave groove 18a, or may be almost directly above the concave groove 18a.
Similarly, substantially triangular punching holes 17b to 17d formed by punching all of the adjacent regions are provided at the left end of the support plate 16a, the right end of the support plate 16b, and the left end of the support plate 16b, respectively. Yes.
An elongated straight punching hole 17e is provided at the right end of the support plate 16c. The punching hole 17e includes a region adjacent to the right end of the support plate 16c (a region surrounded by the right end of the support plate 16c, the outer periphery of the printed circuit board 12c, the concave groove 18a, and the inner periphery of the frame portion 14). It is formed by punching out the entire area. As shown in FIG. 1, the right end of the punching hole 17e may be outside the concave groove 18a, or may be almost directly above the concave groove 18a.
Similarly, at the left end of the support plate 16c, an elongated linear punching hole 17f formed by punching the entire adjacent region is provided.
Note that “the adjacent region is punched out” as shown in FIG. 1 may be a through hole in which the entire adjacent region has nothing, or as described later (see FIG. 9). This means that all or part of the punched residue remaining after punching the adjacent region may be fitted into the punched hole.

Further, punched holes 17g and 17h for determining the shapes of the upper right end and the upper left end of the printed circuit board 12a are formed in the upper right end and the upper left end of the printed circuit board 12a, respectively. As shown in FIG. 1, the leading ends of the punching holes 17g and 17h may be outside the concave grooves 18a to 18c, or may be almost directly above the concave grooves 18a to 18c.
As will be described later, the punched holes 17a to 17h may be formed when the support plates 16a to 16c are pushed back, or may be formed in advance on the printed wiring board.

  The boundary lines between the support plates 16a to 16c and the punching holes (adjacent regions) 17a to 17f, that is, the positions of the tips of the support plates 16a to 16c are not particularly limited, and the printed circuit boards 12a to 12c and the support plate What is necessary is just to select an optimal position according to the shape of 16a-16c, and these arrangement | positioning. In particular, as shown in FIG. 1, the width of the region where the support plate is combined with the adjacent region (for example, in the case of the support plate 16a, the region where the support plate 16a is combined with the left and right punching holes 17a and 17b) changes. In this case, it is preferable that the tip of the support plate comes to the narrowest part. If the shape of the support plate is optimized so that the tip of the support plate comes to the narrowest part of the combined area of the support plate and the adjacent area, the force that supports the printed circuit board by the support plate is weakened. Therefore, the separation of the printed circuit board can be facilitated.

The concave grooves 18 a to 18 c are so-called “V cuts”, and are formed in the frame portion 14 so that both ends thereof communicate with the outer periphery of the frame portion 14. The cross-sectional shapes of the concave grooves 18a to 18c are usually V-shaped, but may be other shapes such as a U-shape.
The concave grooves 18a to 18c are formed on or near the boundary line between the frame portion 14 and the printed circuit boards 12a to 12c.
Here, “in the vicinity of the boundary line” means a position that does not hinder the separation of the frame portion 14 and the printed circuit boards 12a to 12c. The concave grooves 18a to 18c are most preferably formed immediately above the boundary line between the frame portion 14 and the printed circuit boards 12a to 12c. However, as long as the separation of the printed circuit boards 12a to 12c is not hindered, It means that it may be slightly off line.
As shown in FIG. 1, the concave grooves 18 a to 18 c are most preferably formed on the upper and lower surfaces of the mounting substrate 10. It may be formed only on the surface.

Next, the operation of the mounting substrate 10 according to the first embodiment of the present invention will be described.
In the case where at least one side of the printed circuit boards 12a to 12c is temporarily fixed to the frame portion 14 via the concave grooves 18a to 18c, instead of punching out an area (unnecessary part) adjacent to the printed circuit boards 12a to 12c, When the unnecessary portions are pushed back and inserted into the original holes as the support plates 16a to 16c, the outer periphery of the printed circuit boards 12a to 12c and the portions that are not temporarily fixed to the frame portion 14 are surely secured by the support plates 16a to 16c. Supported by
Therefore, as shown in FIG. 1, when the printed circuit boards 12 a to 12 c have an elongated shape when the printed circuit boards 12 a to 12 c are temporarily fixed to the frame portion 14 via two opposite sides. Although not shown, even when the printed circuit boards 12a to 12c are temporarily fixed to the frame portion 14 via only one side or two intersecting sides, the printed circuit boards 12a to 12c are not handled during handling. The printed circuit board is not bent up and down, or the concave grooves 18a to 18c are not broken and the printed circuit board is not dropped.
Moreover, since the adjacent area | region in the front-end | tip of the support plate 16a is punched out, if the frame part 14 is fractured | ruptured along the concave grooves 18a-18c, the printed circuit boards 12a-12c can be isolate | separated easily.
Further, when the support plates 16a to 16c are pushed back, the mounting substrate 10 may be warped depending on the shape of the support plates 16a to 16c. On the other hand, when the slit is formed in the blank portion of the frame portion 14, the warp generated in the mounting substrate 10 can be reduced.

Next, a mother board machining die according to the first embodiment of the present invention will be described.
2 and 3 show a mother board machining die according to the present embodiment. 2 and 3, a mother board processing mold 1 is a mold for manufacturing the mounting substrate 10 shown in FIG. 1, and includes a lower mold 20 and an upper mold 50. Each of the lower mold 20 and the upper mold 50 has a pushback portion (pushback means) 3 for performing pushback processing of one or more support plate regions on the upstream side with respect to the transport direction of the printed wiring board. Further, an outer cutting section (outer cutting means) 5 for cutting out a printed circuit board and a mounting board including one or more support plate areas pushed back from the printed wiring board with respect to the transport direction. It has become.

As shown in FIG. 2, the lower mold 20 includes a lower mold base plate 22 and a lower mold stripper 24. The pushback portion 3 of the lower mold base plate 22 is provided with first lower punches 22a to 22c for punching out the support plate region.
Here, the “support plate region” refers to a region including the support plate therein.
The support plate area is
(1) An area having the same dimensions as the support plate as the final shape,
(2) A region where the support plate and the adjacent region are combined,
(3) An intermediate region between (1) and (2) above,
Either may be sufficient.
In the present embodiment, the support plate region punched out by the first lower punches 22a to 22c has substantially the same size as the support plate, but has a shape in which the right end and the left end slightly protrude toward the adjacent region. ing.
Further, a second lower punch 22d for cutting out the mounting substrate from the printed wiring board is provided in the outer shape cutting portion 5 of the lower mold base plate 22.
In FIG. 1, three first lower punches 22 a to 22 c are illustrated, but this is merely an example, and the number of first lower punches according to the number of support plates included in the mounting substrate. May be provided in the pushback portion 3.

The lower mold stripper 24 is provided with through holes at positions corresponding to the first lower punches 22a to 22c and the second lower punch 22d, along the peripheral wall surfaces of the first lower punches 22a to 22c and the second lower punch 22d. The lower mold stripper 24 can move up and down.
The lower mold stripper 24 is restricted from moving upward by a plurality of bolts 26, 26... Loosely inserted from below the lower mold base plate 22, and between the lower mold base plate 22 and the lower mold stripper 24. It is urged | biased upwards by the elastic members 28 and 28 ... inserted. The material of the elastic members 28, 28... Is not particularly limited, but urethane rubber is a preferred example. Further, posts 30 a to 30 d inserted from below the lower mold base plate 22 are erected at the corners of the lower mold stripper 24. The posts 30a to 30d are used for positioning the lower mold 20 and the upper mold 50 during pressing.

  Positioning pins 32a and 32b used for positioning in pushback processing are provided on the upper surface of the lower mold stripper 24 and in the vicinity of the first lower punch 22a. In addition, positioning pins 32c and 32d used for positioning in the outer cutting process are provided on the upper surface of the lower mold stripper 24 and in the vicinity of the second lower punch 22d at positions corresponding to the positioning pins 32a and 32b. It has been.

On the upper surface of the second lower punch 22d,
(1) Through hole forming holes (first through hole forming means) 34, 34,... For forming through holes (first through holes) such as component holes in the printed circuit board
(2) Reference hole forming holes 36, 36 for forming a reference hole or sub-reference hole for automatically mounting electronic components
Is provided.

Furthermore, on the upper surface of the second lower punch 22d,
(1) Punching hole forming holes (adjacent area punching means) 38a to 38d for forming substantially triangular punching holes 17a to 17d at the left and right ends of the support plates 16a and 16b,
(2) Punching hole forming holes (adjacent area punching means) 38e, 38f for forming elongated punching holes 17e, 17f on the left and right ends of the support plate 16c,
(3) Punching hole forming holes 38g, 38h for forming the punching holes 17g, 17h for determining the shapes of the left and right upper ends of the printed circuit board 12a
Is provided.
The punching hole forming holes 38a to 38f are for punching the entire adjacent region at the tip of the support plates 16a to 16c, and the left end or the right end thereof is supported by being pushed back by the first lower punches 22a to 22c, respectively. The shape is determined so as to overlap the right end or the left end of the plate region. Therefore, no burr remains between the support plate region pushed back by the first lower punches 22a to 22c and the punching holes 17a to 17f punched by the punching hole forming holes 38a to 38f and the punching hole forming pins described later. It is like that.
When the first lower punches 22a to 22c push back the area where the support plate and the adjacent area are combined, the punching hole forming holes (adjacent area punching means) 38a to 38f punch the entire adjacent area. Alternatively, a part of the adjacent region (that is, a part near the tip of the support plate) may be punched out. This point will be described later.
Further, when one or more slits are formed in the marginal portion around the mounting substrate, a slit forming hole (slit forming means) is provided at a corresponding position of the second lower punch 22d, and the upper die A slit forming pin is provided at the location to be performed.

  As shown in FIG. 3, the upper mold 50 includes an upper mold base plate 52 and four holders 54a to 54d. The upper mold base plate 52 and the holders 54a to 54d are stacked on the basis of knock pins 56, 56 erected on the upper mold base plate 52, and fastened by a plurality of fastening bolts 58, 58. Further, first upper mold strippers 60a to 60c for punching out the support plate region and a mounting substrate are cut out in the pushback portion 3 and the outer shape cutting portion 5 of the holder 54d located at the forefront of the upper die 50, respectively. A second upper mold stripper 60d is attached. The first upper mold strippers 60a to 60c and the second upper mold stripper 60d are provided at positions corresponding to the first lower punches 22a to 22c and the second lower punch 22d provided in the lower mold, respectively.

  The first upper mold strippers 60a to 60c are loosely inserted into the first slide spaces 62a to 62c provided in the holder 54d. Further, the first upper mold strippers 60a to 60c are supported by bolts (not shown) that are loosely inserted from above the holder 54c so that their tips slightly protrude from the surface of the holder 54d, and downward. Movement is regulated. The bolt is movable up and down along a through hole provided in the holder 54b.

The first pressing pins 66a, 66a,... Are for pressing the first upper mold strippers 60a-60c downward, and are loosely inserted into through holes penetrating the holders 54b, 54c in the vertical direction. One end is in contact with the upper surface of the first upper mold strippers 60a to 60c, and the other end is in contact with the lower surface of the first pressing plate 70a disposed in the central space 68 of the holder 54a.
The first pressing plate 70a is for pressing the first pressing pins 66a, 66a,. .. Are inserted between the upper surface of the first pressing plate 70a and the cap bolt 72, and the first pressing plate 70a is urged downward by the elastic members 74, 74 .... ing. The material of the elastic members 74, 74... Is not particularly limited, but urethane rubber is a preferred example.

Similarly, the second upper mold stripper 60d is loosely inserted into the second slide space 62d provided in the downstream holder 54d. Further, the second upper mold stripper 60d is supported by bolts 64, 64... That are loosely inserted from above the holder 54c so that its tip slightly protrudes from the surface of the holder 54d, and the downward movement is restricted. ing.
The second pressing pins 66b, 66b,... Are for pressing the second upper mold stripper 60d downward, and are loosely inserted into through holes penetrating the holders 54b, 54c in the vertical direction. One end is in contact with the upper surface of the second upper mold stripper 60d, and the other end is in contact with the lower surface of the second pressing plate 70b disposed in the central space 68 of the holder 54a. The second pressing plate 70b is for pressing the second pressing pins 66b, 66b,. On the upper surface of the second pressing plate 70b, knockout bushes 76, 76... For pressing the second pressing plate 70b downward are provided. The lengths of the knockout bushes 76 and 76 are determined so that the tip ends slightly protrude from the upper surface of the upper mold base plate 52 in an unloaded state.

  The holder 54d is provided with post guide holes 78a to 78d at positions corresponding to the posts 30a to 30d erected on the lower mold 20, respectively. Further, positioning pin guide holes 80a to 80d are provided on the lower surface of the holder 54d at positions corresponding to the positioning pins 32a to 32d erected on the lower mold 20, respectively.

The through hole forming pins 34, 34,... And the reference hole formed at the positions corresponding to the through hole forming holes 34, 34... And the reference hole forming holes 36, 36 formed on the upper surface of the second lower punch 22d, respectively. Pins 84 and 84 are provided. Further, punching hole forming pins (adjacent area punching means) 86a to 86f and punching hole forming pins 86g and 86h are provided at positions corresponding to the punching hole forming holes 38a to 38f and the punching hole forming holes 38g and 38h. Is provided.
Each of these tips is loosely inserted into a through hole provided in the second upper mold stripper 60d, and the second upper mold stripper 60d moves upward along the second slide space 62d. It protrudes from the lower surface of the two upper mold strippers 60d.

  Next, a method of using the mother board machining die 1 according to the first embodiment of the present invention will be described. FIG. 4 shows a process chart of press working. First, as shown in FIG. 4A, the printed wiring board 8 is placed on the upper surface of the lower mold 20. This printed wiring board 8 is in a state in which the support plate regions (A) 16x, 16x, etc., which have been subjected to pushback processing in the immediately preceding press, are fitted into the original holes of the printed wiring board.

  The printed wiring board 8 is conveyed in the right direction in FIG. 4A after the immediately preceding press is finished, and the part that has been subjected to the pushback process in the immediately preceding pressing step is placed on the outer cutting part 5. And placed on the upper surface of the lower mold 20. The printed wiring board 8 is positioned by inserting positioning pins 32 a to 32 d provided on the upper surface of the lower mold 20 into pushback reference holes provided on the printed wiring board 8.

  When the upper die 50 is lowered from this state, first, the tips of the first upper die strippers 60a to 60c and the second upper die stripper 60d come into contact with the upper surface of the printed wiring mother board 8, and the first upper die strippers 60a to 60c. The second upper mold stripper 60d moves upward along the first slide spaces 62a to 62c and the second slide space 62d, respectively.

  When the upper die 50 is further lowered, as shown in FIG. 4B, the first lower punches 22a to 22c push up the first upper die strippers 60a to 60c upward on the pushback portion 3 side, so that new Punching support plate regions (B) 16y, 16y... At this time, the holder 54d pushes down the printed wiring board 8 and the lower mold stripper 24 after the support plate regions (B) 16y, 16y,... Are punched out against the elastic force of the elastic member 28.

  On the other hand, on the outer cutting part 5 side, the second lower punch 22d pushes up the second upper mold stripper 60d, whereby the mounting substrate 10 is punched. Further, as the second upper mold stripper 60d is pushed upward, the through hole forming pins 82, 82..., The reference hole forming pins 84, 84, and the punched hole forming pins 86a from the lower surface of the second upper mold stripper 60d. The tip of ~ 86h protrudes, and a through hole, a reference hole, a sub reference hole, and a punching hole are formed in the mounting substrate 10, respectively.

  Next, when the upper die 50 is raised after punching is completed, the elastic members 28, 28... Are moved together with the lower die stripper 24 by the restoring force as shown in FIG. Push up. At this time, on the pushback portion 3 side, the first pressing plate 70a biased by the elastic members 74, 74... Pushes the first upper mold strippers 60a to 60c downward via the first pressing pins 66a. Therefore, when the upper die 50 is completely detached from the lower die 20, the newly punched support plate regions (B) 16 y, 16 y... Are the elements of the printed wiring mother board 8 as shown in FIG. It will be in the state of being fitted in the hole.

  On the other hand, the downward biasing force does not act on the second upper mold stripper 60d on the outer cutting part 5 side. Therefore, as shown in FIG. 4 (c), even if the upper mold 50 is detached from the lower mold, the second upper mold stripper 60d does not descend, and the punched mounting substrate 10 remains in the second slide space 62d. Once held. At this time, the knockout bushes 76, 76... Protrude from above the upper mold base plate 52.

  When the upper die 50 is further raised and the upper die 50 approaches the vicinity of the top dead center, the pressing means (not shown) provided in the press machine eventually presses the knockout bushes 76, 76. The second pressing plate 70b pushes down the second upper mold stripper 60d downward via the second pressing pin 66b. Therefore, when the upper die 50 reaches the top dead center, as shown in FIG. 4D, the second upper die stripper 60d is pushed down to the original position, and at the same time, the mounting substrate 10 is moved to the second slide. The space 62d is pushed out.

  Thereafter, the printed wiring board 8 is conveyed rightward so that the newly punched support plate regions (B) 16y, 16y... Then, according to the same procedure as described above, the next support plate region pushback processing and the outer shape cutting processing of the mounting substrate 10 including the support plate region (B) 16y punched out by the immediately preceding press are required times. Just repeat.

FIG. 5 shows a plan view of a mother board pressed by the mother board machining die 1 and a plan view of a mounting substrate cut out from the mother board. In the mother board 8, pushback reference holes 8a, 8a... Are formed in advance.
Pushback processing of the mother board 8 using the mother board machining die 1 is performed according to the following procedure.
First, the positioning pins 32a, 32b are inserted into the pushback reference holes 8a, 8a ... formed on the mother board 8, and the pushback portion 3 performs pushback of the support plate areas (A) 16x, 16x ... (push Back process).
Next, the base plate 8 is transported so that the region including the support plate regions (A) 16x, 16x... Is on the outer cutting portion 5, and the positioning pins 32a to 32d are inserted into the pushback reference holes 8a, 8a. In addition, the support plate regions (B) 16y, 16y,... Are pushed back in the pushback portion 3, and the mounting substrate 10 including the support plate regions (A) 16x, 16x,. (Outline cutting step). At this time, the tips of the through hole forming pins 82, 82..., The reference hole forming pins 84, 84, and the punching hole forming pins 86a to 86h protrude from the lower surface of the second upper mold stripper 60d, Through holes 13a..., Reference holes and sub-reference holes 14a and 14a, and punching holes 17a to 17h are formed.
Further, concave grooves (V cuts) 18a to 18c are formed along or near the border lines between the cut frame portion 14 of the mounting substrate 10 and the printed circuit boards 12a to 12c (concave groove forming step).
The obtained mounting board 10 is sent to an automatic mounting process, and electronic components are automatically mounted on the printed circuit boards 12a to 12c. After completion of the automatic mounting, the frame portion 14 of the mounting substrate 10 is broken to separate the printed circuit boards 12a to 12c.

Next, a mother board machining die according to a second embodiment of the present invention will be described.
Although not shown, the mother board machining mold according to the present embodiment increases the distance between the pushback means 3 and the outer cutting means 5 in the mother board machining mold 1 according to the first embodiment. In the meantime, a blanking region corresponding to one mounting board is provided. Since the other points are the same as those of the base plate machining die according to the first embodiment, the description thereof is omitted.

Next, a method for manufacturing a mounting board using the mother board machining die according to the second embodiment of the present invention will be described.
First, a printed wiring mother board is placed on a mother board machining die in which pushback means, blanking area and outer shape cutting means are provided in this order, and in the pushback means, from the area adjacent to the printed circuit board to the support board area. (A) Pushback is performed (pushback process).
Next, the base plate is transported so that the support plate region (A) is on the blanking region, and at the same time as the support plate region (B) is newly pushed back from the base plate by the pushback means, The blanking of the support plate area (A) pushed back by the immediately preceding press is performed (empty blanking step).
Next, the mother board is conveyed so that the area including the support plate area (A) and the area including the support plate area (B) are on the outer shape cutting means and the blanking area, respectively. The support plate region (C) is newly pushed back from the plate, and the support plate region (B) pushed back by the immediately preceding press is performed in the blanking region. The mounting substrate is cut out from the region including the support plate region (A) pushed back by the press, and all or part of the adjacent region is punched using the adjacent region punching means (outline cutting step).
Further, a groove is formed along the boundary line between the cut-out mounting substrate frame and the printed circuit board or in the vicinity thereof (concave groove forming step).
The obtained mounting board is sent to an automatic mounting process, and electronic components are automatically mounted on the printed circuit board. After completion of the automatic mounting, the frame portion of the mounting board is broken to separate the printed circuit board.

  Next, a mother board machining die according to a third embodiment of the present invention will be described. 6 and 7 show a mother board machining die according to the present embodiment. 6 and 7, the mother board machining mold 100 includes a lower mold 120 and an upper mold 150.

As shown in FIG. 6, the lower mold 120 includes a lower mold base plate 122 and a lower mold stripper 124. The lower mold base plate 122 is provided with lower punches 122a to 122c for punching the support plate region. In the present embodiment, the support plate region punched out by the first lower punches 122a to 122c has substantially the same dimensions as the support plate, but has a shape in which the right end and the left end slightly protrude toward the adjacent region. ing.
In FIG. 6, three lower punches 122 a to 122 c are described, but this is merely an example, and the shape and number of lower punches can be arbitrarily selected according to the purpose. It is not limited.

  On the sides of the lower punches 122a to 122c of the lower mold base plate 122, first slit pins 126a to 126d for standing vertical slit pieces are erected. In addition, second slit pins 128a to 128d for forming a lateral slit piece are erected in front of the lower punch 122a (downstream with respect to the conveyance direction of the printed wiring mother board).

  The first slit pins 126a to 126d (longitudinal slit forming means) sequentially form longitudinal slit pieces parallel to the transport direction of the printed wiring board on the side of the support plate area punched by the lower punches 122a to 122c. By doing so, a continuous vertical slit is formed. Therefore, as long as the 1st slit pin standingly arranged by the lower mold | type 120 is what forms a continuous vertical slit, the number, length, and the arrangement | positioning can be selected arbitrarily.

  In the present embodiment, two first slit pins 126a and 126b erected in a row on the left side of the lower punches 122a to 122c along the conveying direction of the printed wiring board, and the lower punch 122a. A total of four first slit pins, that is, two first slit pins 126c and 126d erected in a line along the conveyance direction of the printed wiring board on the right side of .about.122c are used.

  Further, the lengths of the first slit pins 126a and 126c (first vertical slit piece forming means) erected on the upstream side with respect to the transport direction are both the transport distance of the printed wiring board per press. It is shorter. In addition, in the first slit pins 126a and 126c, the rear ends of the vertical slit pieces (first vertical slit pieces) punched by these are formed by the second slit pins 128a and 128d, respectively, in the next pressing step. The lower slits 122a to 122c are erected so as to be relatively upstream with respect to the centers of the lower punches 122a to 122c so as to communicate with the side ends of the horizontal slit pieces.

  On the other hand, the lengths of the first slit pins 126b and 126d (second vertical slit piece forming means) standing on the downstream side with respect to the transport direction are punched by the first slit pins 126a and 126c. The distance is longer than the distance between adjacent first vertical slit pieces. In addition, the first slit pins 126b and 126d are formed by the first slit pins 126a and 126c at the rear ends of the vertical slit pieces (second vertical slit pieces) punched out by the first slit pins 126a and 126c, respectively. The lower punch 122a communicates with the tip of one longitudinal slit piece, and the tip communicates with the side edge of the horizontal slit piece formed by the second slit pins 128a and 128d in the immediately preceding pressing step. It is erected by being shifted to the downstream side relative to the center of .about.122c.

  The second slit pins 128a to 128d (horizontal slit forming means) are composed of two or more horizontal slit pieces that are perpendicular to the vertical slit formed by the first slit pins 126a to 126d and are aligned in a straight line. In addition, at least one horizontal slit piece forms a horizontal slit that communicates with the vertical slit. The number of the horizontal slit pieces constituting the horizontal slit is not particularly limited as long as it is two or more.

  In the present embodiment, a total of four second slit pins 128a to 128d are used so that a horizontal slit composed of four horizontal slit pieces is formed. The second slit pins 128a to 128d are erected in a row between the first slit pins 126a and 126c and the first slit pins 126b and 126d.

  Among these, the length of the second slit pin 128a at the left end is such that the left end of the transverse slit piece punched out by this is communicated with the vertical slit formed by the first slit pins 126a and 126b. Determined. Similarly, the length of the second slit pin 128d at the right end is determined so that the right end of the transverse slit piece punched out by this is communicated with the vertical slit formed by the first slit pins 126c and 126d. It is done.

  Furthermore, the lengths of the intermediate second slit pins 128b and 128c are set so that the length of the connecting portion between the horizontal slit pieces formed by the second slit pins 128a to 128d becomes a predetermined length. Determined. The length of the connecting portion between the horizontal slit elements is not particularly limited, but is preferably 1 to 2 times the thickness of the printed wiring board. If the length of the connecting portion is less than 1 times the thickness of the printed wiring board, the strength of the connecting portion is not preferable. On the other hand, if the length of the connecting portion exceeds twice the thickness of the printed wiring board, it is difficult to break the connecting portion. The length of the connecting portion is more preferably 1.3 times or more and 1.7 times or less.

  Each of the first slit pins 126 a to 126 b has a horizontal portion at the lower end thereof as shown in FIG. 6B, and the horizontal portion is provided with a counterbore hole provided on the upper surface of the lower mold base plate 122. And fixed to the lower mold base plate 122 by bolting. Although not shown, the second slit pins 128a to 128d are also fixed to the lower mold base plate 122 by the same means.

  The fixing method of the first slit pins 126a to 126d and the second slit pins 128a to 128d is not limited to this, and a counterbore hole is provided on the lower surface of the lower mold base plate 122, and the lower mold base plate 122 is fixed. A slit pin may be inserted and fixed from the lower surface.

  The lower mold stripper 124 is provided with through holes at positions corresponding to the lower punches 122a to 122c, the first slit pins 126a to 126d, and the second slit pins 128a to 128d. The stripper 124 can move up and down.

  Further, the lower mold stripper 124 is restricted from moving upward by a plurality of bolts 130, 130... Which are loosely inserted from below the lower mold base plate 122, and the lower mold base plate 122 and the lower mold stripper 124. It is urged | biased upward by the elastic members 132, 132 ... inserted in between. The material of the elastic members 132, 132... Is not particularly limited, but urethane rubber is a preferred example.

  Further, at the four corners of the lower mold stripper 124, post guide holes 124a, 124a,... For guiding the posts 178, 178,. Similarly, post guide holes 122d, 122d,... Are also provided at corresponding positions on the lower mold base plate 122.

Positioning pins 134a and 134b used for positioning during pushback processing are provided upright on the upper surface of the lower mold stripper 124 and on the left and right sides of the lower punch 122a, respectively. In addition, positioning pins 134c and 134d are erected on the downstream side of the positioning pins 134a and 134b at positions corresponding to the transport distance of the printed wiring board.
Furthermore, on the downstream side of the lower punches (pushback means) 122a to 122c with respect to the conveying direction of the mother board,
(1) Through-hole forming holes (first through-hole forming means) 136, 136,... For forming through holes (first through holes) such as component holes in the printed circuit board
(2) Reference hole forming holes 138, 138 for forming a reference hole or a sub reference hole when electronic parts are automatically mounted.
(4) Punching hole forming holes (adjacent area punching means) 140a to 140d for forming substantially triangular punching holes 17a to 17d at the left and right ends of the support plates 16a and 16b,
(5) Punching hole forming holes (adjacent area punching means) 140e, 140f for forming elongated punching holes 17e, 17f on the left and right ends of the support plate 16c,
(6) Punching hole forming holes 140g and 140h for forming the punching holes 17g and 17h for determining the shapes of the upper left and right ends of the printed circuit board 12a
Is provided.
The punching hole forming holes 140a to 140f are for punching the entire adjacent region at the tip of the support plates 16a to 16c, and the left end or the right end thereof is supported by being pushed back by the first lower punches 122a to 122c, respectively. The shape is determined so as to overlap the right end or the left end of the plate region.

  As shown in FIG. 7, the upper mold 150 includes an upper mold base plate 152 and four holders 154a to 154d. The upper mold base plate 152 and the holders 154a to 154d are stacked on the basis of knock pins 156 provided upright on the upper mold base plate 152, and fastened by a plurality of fastening bolts 158.

  In addition, a slide space 162 is provided in the holder 154d located at the forefront of the upper die 150, and upper die strippers 160a to 160c for punching the support plate region are loosely inserted into the slide space 162. The upper mold strippers 160a to 160c are provided at positions corresponding to the lower punches 122a to 122c provided to the lower mold 120.

  Further, the upper mold strippers 160a to 160c are supported by bolts 164, 164... Which are loosely inserted from above the holder 154c so that their tips slightly protrude from the surface of the holder 154d, and are moved downward. It is regulated. Further, the bolts 164, 164... Can move up and down along a through hole 166 provided in the holder 154b.

  The pressing pins 168, 168... Are used to press the upper mold strippers 160a to 160c downward, and are loosely inserted into through holes penetrating the holders 154b, 154c in the vertical direction. One end is in contact with the upper surface of the upper mold strippers 160a to 160c, and the other end is in contact with the lower surface of the pressing plate 172 disposed in the central space 170 of the holder 154a.

  The pressing plate 172 is for pressing the pressing pins 168, 168. .. Are inserted between the upper surface of the pressing plate 172 and the cap bolt 174, and the pressing plate 172 is urged downward by the elastic members 176, 176. The material of the elastic members 176, 176... Is not particularly limited, but urethane rubber is a preferred example.

  In the four corners of the holder 154d, posts 178, 178,... Are provided at positions corresponding to the post guide holes 124a,. The posts 178, 178... Are used for positioning the lower mold 120 and the upper mold 150 during pressing. In addition, positioning pin guide holes 180a to 180d are provided on the lower surface of the holder 154d at positions corresponding to the positioning pins 134a to 134d erected on the lower mold 120, respectively.

  Furthermore, first guide holes (vertical slit forming means) 184a to 184d are provided at positions corresponding to the first slit pins 126a to 126d erected on the lower mold 120, respectively. The first guide holes 184a to 184d are for guiding the tips of the first slit pins 126a to 126d, and have a length penetrating the holders 154b to 154d.

  Further, the holder 154a communicates with the distal ends of the first guide holes 184a and 184b, and passes through the upper mold 150 in the horizontal direction along the longitudinal direction of the cross section thereof, and a first cut residue discharge path 186a, A first cut residue discharge path 186b that communicates with the leading ends of the guide holes 184c and 184d and penetrates the upper mold 150 in the horizontal direction along the longitudinal direction of the cross section thereof is provided. Furthermore, nozzles (first air supply means) 188a and 188b for supplying air are provided at one ends of the first cut residue passages 186a and 186b, respectively.

  Second guide holes (lateral slit forming means) 190 a to 190 d are provided at positions corresponding to the second slit pins 128 a to 128 d erected on the lower mold 120, respectively. The second guide holes 190a to 190d are for guiding the tips of the second slit pins 128a to 128d, and have a length penetrating the holders 154c and 154d.

  In addition, the holder 154b is provided with a second cut residue discharge path 192 that communicates with the tips of the second guide holes 190a to 190d and penetrates the upper mold 150 in the horizontal direction along the longitudinal direction of the cross section. That is, the length from the bottom surface of the upper die 150 to the second cut residue discharge path 192 is shorter than the length from the bottom surface of the upper die 150 to the first cut residue passages 186a, 186b. The two cut residue passages 192 and the first cut residue discharge passages 186a, 186b are three-dimensionally crossed. Further, a nozzle (second air supply means) 194 for supplying air is provided at one end of the second cut residue discharge path 192.

Further, the holder 154d has through holes formed at positions corresponding to the through hole forming holes 136, 136..., The reference hole forming holes 138, 138, the punching hole forming holes 140a to 140f, and the punching hole forming holes 140g, 140h, respectively. Hole forming pins 196, 196..., Reference hole forming pins 198, 198, punched hole forming pins (adjacent area punching means) 200a to 200f, and punched hole forming pins 200g, 200h are provided.
All of these pins are fixed to the upper mold 50, and the tips of the pins protrude from the lower surface of the upper mold 50 by the thickness of the base plate.

  Next, push-back processing of a printed circuit board using the printed wiring board processing die 100 according to the third embodiment of the present invention will be described. First, a printed wiring mother board is placed on the upper surface of the lower mold 120. At this time, the printed wiring board is positioned by inserting positioning pins 134a to 134d into pushback reference holes provided in the printed wiring board.

  Further, at this time, the first guide hole 184a provided in the upper mold 150 is in a state of being clogged with cutting scraps punched in the previous pressing process by the first slit pin 126a. The other first guide holes 184b to 184d and the second guide holes 190a to 190d are also in the same state as the first guide hole 184a.

When the upper die 150 is lowered from such a state, first, through hole forming pins 196, 196... Projecting from the lower surface of the upper die 50, reference hole forming pins 198, 198, punching hole forming pins (adjacent region punching means) ) 200a to 200f and punching hole forming pins 200g and 200h punch a printed wiring board, and form a through hole, a reference hole, and a punching hole, respectively.
When the upper mold 150 is further lowered, the lower punches 122a to 122c push up the upper mold strippers 160a to 160c against the urging force of the elastic member 176. As a result, the support plate region is punched from the printed wiring board.

  On the other hand, as the upper mold strippers 160a to 160c slide upward, the holder 154d pushes down the lower mold stripper 124 against the urging force of the elastic member 132, so that the first slit pin 126a is moved to the lower mold stripper. It protrudes from the upper surface of 124. As a result, the first slit pin 126 a penetrates the printed wiring board 8 and a vertical slit piece is formed on the printed wiring board 8.

  Further, the cut residue punched at this time is pushed into the first guide hole 184a, whereby the cut residue at the uppermost end of the first guide hole 184a is discharged to the first cut residue discharge path 186a. Therefore, when air is blown from the nozzle 188 a provided at one end of the first cut residue discharge path 186 a at this time, the cut residue is blown away and discharged from the upper mold 150. Cut chips clogged in the other first guide holes 184b to 184d and the second guide holes 190a to 190d are also discharged from the upper mold 150 by the same method.

  When the upper die 150 is raised after the press is completed, the urging force of the elastic member 176 is transmitted to the upper die strippers 160a to 160c via the pressing plate 172 and the pressing pin 168, and the upper die strippers 160a to 160c are pushed downward. . At the same time, the elastic member 132 pushes the lower mold stripper 124 upward. Therefore, the punched support plate region is fitted into the original hole of the printed wiring board.

FIG. 8 is a plan view of a mother board pressed by the mother board machining die 100.
FIG. 8A shows a state in which the first press is completed and the printed wiring board 8 is conveyed downstream by a predetermined feed width. The printed wiring board 8 includes support plate regions (A) 16x, 16x, ... formed by the first press, vertical slit pieces (A) 202a and 206a, and horizontal slit pieces (A) 212a, 214a, 216a and 218a are indicated by solid lines.
In the printed wiring board 8, pushback reference holes 8a, 8a... Are formed in advance.

From this state, when the positioning pins 134a to 134d are inserted into the pushback reference holes 8a and 8a of the printed wiring board 8 and the second press is performed, as shown by the broken line in FIG. The plate regions (B) 16y, 16y... Are pushed back.
At the same time, the longitudinal slit pieces (B) 202b, 204b, 206b, parallel to the side of the punched support plate regions (B) 16y, 16y... 208b is formed, and transverse slit pieces (B) 212b, 214b, 216b, 218b are formed in front of the support plate regions (B) 16y, 16y. At this time, the front end of the vertical slit piece (A) 202a (or 206a) and the rear end of the vertical slit piece (B) 204b (or 208b) communicate with each other, and a continuous vertical slit serving as a reference side of the mounting substrate; Become.
Further, the tips of the newly formed vertical slit pieces (B) 204b and 208b communicate with the side ends of the horizontal slit pieces (A) 212a and 218a formed by the previous press. Similarly, the side ends of the newly formed horizontal slit pieces (B) 212b and 218b communicate with the rear ends of the vertical slit pieces (A) 202a and 206a formed by the previous press.
Prior to the pushback of the support plate regions (B) 16y, 16y, through hole forming pins 196, 196, protruding from the lower surface of the upper die 50, reference hole forming pins 198, 198, punched hole forming pins (adjacent Area punching means) 200a to 200f and punching hole forming pins 200g, 200h punch the printed wiring board 8, and through holes 13a, 13a,..., Through holes 14a, 14a, and reference holes and sub reference holes, respectively, The punching holes 17a to 17h are formed.

Thereafter, as shown in FIG. 8B, the press is repeated while the printed wiring board is conveyed by a certain feed width. Push-back of the Nth support plate area (N) 16n, 16n, and punching of the vertical slit pieces (N) 202n to 208n, the horizontal slit pieces (N) 212n to 218n, and various through holes are completed. After that, the mother board is further conveyed, and the last vertical slit piece (N + 1) 204n + 1, 208n + 1, the last horizontal slit piece (N + 1) 212n + 1 to 218n + 1, and the last through holes 13a, 13a,. The through holes 14a and 14a and the punching holes 17a to 17h, which are sub reference holes, are formed.
After the pressing is completed, the individual connecting portions on the upper and lower sides of the mounting substrate 10 are simply broken or cut by shearing or the like to cut out the mounting substrate 10. Furthermore, when a concave groove is formed along the border line between the cut frame portion of the mounting substrate 10 and the printed circuit board, the mounting substrate 10 shown in FIG. 1 is obtained. In addition, when only the connection part in the uppermost part and the connection part in the lowermost part are broken, a mounting board in which the mounting board 10 is connected via the long side is obtained.
The obtained mounting board is sent to an automatic mounting process, and electronic components are automatically mounted on the printed circuit board. After completion of the automatic mounting, the frame portion of the mounting board is broken to separate the printed circuit board.

  Next, a mother board machining die according to a fourth embodiment of the present invention will be described. Although not shown, the mother board machining die according to the present embodiment is characterized in that the lateral slit forming means is omitted from the mother board machining die according to the third embodiment. Since other points are the same as those in the third embodiment, description thereof is omitted.

Next, a method for manufacturing a mounting board using the mother board working mold according to the fourth embodiment of the present invention will be described.
First, a printed wiring mother board is placed on a mother board processing mold provided with a pushback means and a vertical slit piece forming means for performing a pushback of the support plate area, and the pushback means is adjacent to the printed circuit board. The support plate region (A) is pushed back from the region, and at the same time, in the vertical slit forming means, at least one side of the punched support plate region (A) is vertically parallel along the conveyance direction of the mother plate. A slit piece (A) is formed (first pressing step).
Next, the base plate is conveyed by a fixed feed width, and the support plate region (B) is newly pushed back from the base plate in the pushback means, and at the same time, the support plate region punched out in the vertical slit forming means A vertical slit piece (B) is formed on at least one side of (B) in parallel with the conveying direction of the mother board so as to communicate with the vertical slit piece (A). A continuous vertical slit serving as a reference side is formed, and all or part of the adjacent region is punched by the adjacent region punching means (second pressing step).
Hereinafter, after the necessary number of support plate regions are pushed back and various through holes are formed, the base plate is cut perpendicularly to the vertical slits using means such as shearing to include a predetermined number of support plates. Cut out the mounting board. Further, a groove is formed along the boundary line between the cut frame portion of the mounting substrate and the printed circuit board (a groove forming step).
The obtained mounting board is sent to an automatic mounting process, and electronic components are automatically mounted on the printed circuit board. After completion of the automatic mounting, the frame portion of the mounting board is broken to separate the printed circuit board.

Next, a mounting board according to a second embodiment of the present invention will be described. 9A and 9B to 9E, respectively, a plan view of a mounting substrate according to the second embodiment of the present invention, and BB ′ to E thereof. -E 'sectional view taken on the line is shown. In FIG. 9, the dimensions of each part are appropriately enlarged and reduced from the actual dimensions for easy viewing. Further, in the reference numerals attached to FIG. 9, the same reference numerals are used for the portions corresponding to the mounting substrate 10 shown in FIG.
In FIG. 9, a mounting board (processed board) 10 ′ includes printed circuit boards (product boards) 12a to 12c, a frame portion 14, support plates 16a to 16c, and concave grooves 18a to 18c.

  The mounting substrate 10 ′ is punched in the entire adjacent region at both ends of the support plates 16 a and 16 b, but the adjacent region is not in a state of a through hole, and the support plates 16 a and 16 b and the adjacent region After pushing back the combined region, the punched holes 19a to 19d remaining after the circular punched holes 17a 'to 17d' are formed in the tip portions (a part of the adjacent regions) of the support plates 16a and 16a are the original holes. It is in a state of being inserted. The other points are the same as those of the mounting substrate 10 shown in FIG.

Next, a mother board machining die according to a fifth embodiment of the present invention will be described. FIG. 10 is a plan view of the lower die of the mother board machining die 1 ′ according to the present embodiment. In addition, in the code | symbol attached | subjected to FIG. 10, about the part corresponding to the metal mold | die 1 for mother board processing shown in FIG. 2, the same code | symbol was used.
A mother board processing mold 1 ′ shown in FIG. 10 is a mold for manufacturing the mounting substrate 10 ′ shown in FIG. 9, and among the three first lower punches, the first lower punch 22a ′, 22b 'is adapted to push back the region where the support plate and the adjacent region are combined. Further, the punching hole forming holes 38a ′ to 38d ′ are configured to punch out only the narrowest part (a part of the adjacent area) in a circular shape among the combined area of the support plate and the adjacent area.
The other points are the same as those of the mother board machining mold 1 shown in FIGS.

Next, a manufacturing method of the mounting substrate 10 ′ using the mother board processing mold 1 ′ shown in FIG. 10 will be described. FIG. 11 shows the process diagram.
In the mother board 8, pushback reference holes 8a, 8a... Are formed in advance. Pushback processing of the base plate 8 using the base plate processing mold 1 ′ is performed according to the following procedure.
First, the positioning pins 32a ... are inserted into the pushback reference holes 8a, 8a ... formed in the base plate 8, and the pushback portion 3 performs pushback of the support plate regions (A) 16x, 16x ... (pushback). Process).
Next, the base plate 8 is transported so that the region including the support plate regions (A) 16x, 16x,... Is on the outer cutting portion 5, and the positioning pins 32a, 32c ... are inserted into the pushback reference holes 8a, 8a,. In addition, the pushback portion 3 newly pushes back the support plate regions (B) 16y, 16y..., And at the same time, the outer shape cutting portion 5 includes the support plate regions (A) 16x, 16x. Is cut out (outline cutting step). At this time, the tips of the through hole forming pin, the reference hole forming pin, and the punching hole forming pin protrude from the lower surface of the second upper mold stripper, and the through holes 13a, 13a,. Holes and sub-reference holes 14a and 14a and punching holes 17a 'to 17d' and 17e to 17h are formed.
In the present embodiment, the punching hole forming holes 38a 'to 38d' are formed so as to punch out only the narrowest portion of the combined region of the support plate and the adjacent region. Are in a state in which the punched holes 19a, 19c... Divided by the punched hole forming holes 38a ′ to 38d ′ are still fitted in the original holes.
Further, concave grooves (V cuts) 18a to 18c are formed along or near the boundary lines between the frame portion 14 of the cut mounting substrate 10 ′ and the printed circuit boards 12a to 12c (concave groove forming step).
The obtained mounting board 10 ′ is sent to an automatic mounting process, and electronic components are automatically mounted on the printed circuit boards 12a to 12c. After completion of the automatic mounting, the frame portion 14 of the mounting substrate 10 ′ is broken to separate the printed circuit boards 12a to 12c.

Next, a mother board machining die according to a sixth embodiment of the present invention will be described. FIG. 12 is a plan view of the lower mold of the mother board machining mold 100 ′ according to the present embodiment. In addition, in the code | symbol attached | subjected to FIG. 12, the same code | symbol was used about the part corresponding to the metal mold | die 100 for baseplate processing shown in FIG.
A mother board processing mold 100 ′ shown in FIG. 12 is a mold for manufacturing the mounting substrate 10 ′ shown in FIG. 9, and among the three lower punches, the lower punches 122a ′ and 122b ′ are The shape is such that the area where the support plate and the adjacent area are combined is pushed back. Further, the punching hole forming holes 140a ′ to 140d ′ are configured to punch out only the narrowest portion (a part of the adjacent region) in a circular shape among the combined region of the support plate and the adjacent region.
The other points are the same as those of the mother board machining mold 100 shown in FIGS.

Next, a method for manufacturing a mounting board (processed board) using a printed wiring board processing mold 100 ′ according to a sixth embodiment of the present invention will be described. FIG. 13 shows a process chart of press working.
In the mother board 8, pushback reference holes 8a, 8a... Are formed in advance. Pushback processing of the base plate 8 using the base plate processing mold 100 ′ is performed according to the following procedure.
First, when the positioning pins 134a ... are inserted into the pushback reference holes 8a, 8a ... formed in the mother board 8 and the first press is performed, as shown in FIG. 13 (a), the support plate region (A) At the same time as 16x, 16x, ... are pushed back, the vertical slit pieces (A) 206a ... and the horizontal slit pieces (A) 216a, 218a ... are punched out.
Next, when the printed wiring board 8 is conveyed downstream, the positioning pins 134a, 134c,... Are inserted into the pushback reference holes 8a, 8a, and the second press is performed, as shown in FIG. In addition, the support plate regions (B) 16y, 16y... Are pushed back.
At the same time, longitudinal slit pieces (B) 206b, 208b,... Are formed in parallel with the direction of conveyance of the printed wiring board 8 on the sides of the punched support plate regions (B) 16y, 16y,. Are formed in front of the support plate regions (B) 16y, 16y,... At this time, the front ends of the vertical slit pieces (A) 206a and the rear ends of the vertical slit pieces (B) 208b communicate with each other to form a continuous vertical slit serving as a reference side of the mounting substrate.
Further, the tip of the newly formed vertical slit piece (B) 208b ... communicates with the side end of the horizontal slit piece (A) 218a ... formed by the previous press. Similarly, the side end of the newly formed horizontal slit piece (B) 218b ... communicates with the rear end of the vertical slit piece (A) 206a ... formed by the previous press.
Prior to the pushback of the support plate regions (B) 16y, 16y..., The through hole forming pins, the reference hole forming pins, and the punching hole forming pins protruding from the lower surface of the upper die 50 are used for the printed wiring board 8. Punching is performed to form through holes 13a, 13a,..., Through holes 14a and 14a serving as reference holes and sub-reference holes, and punch holes 17a 'to 17d' and 17e to 17h, respectively.
In the present embodiment, the punching hole forming holes 140a ′ to 140d ′ are designed to punch out only the narrowest portion of the region where the support plate and the adjacent region are combined. The punched holes 19a to 19d divided by the punched hole forming holes 140a 'to 140d' are still fitted in the original holes.

Thereafter, the press is repeated while the printed wiring board is conveyed by a certain feed width. The pushback of the Nth support plate region (N) 16n, 16n..., The vertical slit pieces (N) 206n, 208n..., The horizontal slit pieces (N) 216n, 218n. After the completion, the mother board is further conveyed, and the last vertical slit piece (N + 1) 208n + 1..., The last horizontal slit piece (N + 1) 216n + 1, 218n + 1.
After the press is completed, the individual connecting portions above and below the mounting substrate 10 ′ are simply broken or cut by shearing or the like to cut out the mounting substrate 10 ′. Further, when a concave groove is formed along the boundary line between the cut frame portion of the mounting substrate 10 ′ and the printed circuit board, the mounting substrate 10 ′ shown in FIG. 9 is obtained. Note that when only the connecting portion at the uppermost portion and the connecting portion at the lowermost portion are broken, a mounting substrate in which the mounting substrate 10 ′ is connected via the long side is obtained.
The obtained mounting board is sent to an automatic mounting process, and electronic components are automatically mounted on the printed circuit board. After completion of the automatic mounting, the frame portion of the mounting board is broken to separate the printed circuit board.

Next, a mounting board according to a third embodiment of the present invention will be described.
14 (a), 14 (b) and 14 (c), respectively, a plan view of a mounting substrate according to the third embodiment of the present invention, a sectional view taken along line BB ′ thereof, and CC 'sectional view taken on the line is shown. In FIG. 14, the dimensions of each part are appropriately enlarged and reduced from the actual dimensions for easy viewing.
In FIG. 14, a mounting board (processed board) 11 includes printed circuit boards (product boards) 12a to 12f, a frame portion 14, a support plate 16, and concave grooves 18a to 18d.

  Each of the printed circuit boards 12a to 12f is temporarily fixed to the frame portion 14 through one side or two intersecting sides. Each printed circuit board 12a-12f is arrange | positioned at fixed intervals so that it may not contact | adhere mutually. Each of the printed circuit boards 12a to 12f is formed with through holes 13a, 13a... Used as component holes or the like as necessary.

The frame portion 14 is for supporting these until the automatic mounting on the printed circuit boards 12a to 12f is completed. The frame portion 14 is provided on the entire circumference of the mounting substrate 10. .. Are formed at the four corners of the frame portion 14 as reference holes or sub-reference holes for automatic mounting. One reference hole and one sub reference hole are sufficient for each. However, if a plurality of reference holes and sub reference holes are provided, there is an advantage that automatic mounting can be performed from a plurality of directions.
Further, at the upper and lower ends of the frame portion 14, one or more slits 14b, 14b,... That communicate with the outer periphery of the frame portion 14 and do not communicate with the printed circuit boards 12a to 12f are formed. The slits 14b, 14b,... Are for reducing warpage that occurs when the support plate 16 is pushed back. Therefore, the optimum number and length of the slits 14b, 14b... Are selected according to the degree of warpage generated on the mounting substrate 10. In addition to or in addition to the upper and lower ends of the mounting substrate 10, slits 14 b, 14 b... May be formed at the left and right ends of the mounting substrate 11. In addition, when there is little curvature, you may abbreviate | omit slit 14b, 14b ....

The support plate 16 is a printed wiring board including the frame portion 14 and is punched from an area adjacent to the printed circuit boards 12a to 12f (unnecessary portions that do not constitute the printed circuit boards 12a to 12f). It is made of something that is inlaid.
Further, punched holes 17 a to 17 f are provided at the respective tips of the support plate 16. The punching holes 17a to 17f are punched from the respective ends of the support plate 16, the outer periphery of the printed circuit boards 12a to 12f, and the region surrounded by the concave grooves 18a to 18d.

The concave grooves 18 a to 18 d are formed in the frame portion 14 so that both ends thereof communicate with the outer periphery of the frame portion 14. The cross-sectional shapes of the concave grooves 18a to 18d are usually V-shaped, but may be other shapes such as a U-shape.
The concave grooves 18a to 18d are formed on or near the boundary line between the frame portion 14 and the printed circuit boards 12a to 12f.

  The mounting substrate 11 shown in FIG. 14 is adjacent to the front end of the support plate after pushing back the support plate region (region having the same dimensions as the support plate to the region combining the support plate and the adjacent region) in the same manner as described above. It can be manufactured by punching a region and forming punched holes 17a to 17f. Alternatively, the adjacent region may be punched in advance, and then the support plate may be pushed back.

Next, a mounting board according to a fourth embodiment of the present invention will be described. 15 (a), 15 (b), and 15 (c), respectively, a plan view of a mounting substrate 11 ′ according to the fifth embodiment of the present invention, a cross-sectional view taken along line BB ′, And the CC 'sectional view taken on the line is shown. In FIG. 15, the dimensions of each part are appropriately enlarged / reduced from the actual dimensions for easy viewing.
In FIG. 15, a mounting board (processed board) 11 ′ includes printed circuit boards (product boards) 12a to 12f, a frame portion 14, a support plate 16, and concave grooves 18a to 18d.
The mounting substrate 11 ′ is punched out entirely in the adjacent region at the tip of the support plate 16, but the adjacent region is not in the state of a through hole having nothing, but is a region that combines the support plate 16 and the adjacent region. After the push back, the punched holes 19a to 19f remaining after the rectangular punched holes 17a 'to 17f' are formed in the front end portion (a part of the adjacent region) of the support plate 16 remain in the original holes. ing. Other points are the same as those of the mounting substrate 10 shown in FIG.

  As described above, the mounting substrate 11 ′ shown in FIG. 15 pushes back the region where the support plate and the adjacent region are combined, and then punches out a part of the adjacent region at the tip of the support plate, thereby forming a rectangular punching hole. It can be manufactured by forming 17a ′ to 17f ′.

Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the present invention.
For example, in FIG. 6 and FIG. 7, first vertical slit piece forming means for forming a vertical slit piece having a length shorter than the transport distance per press is already formed as the vertical slit forming means. Although a base plate processing mold 100 having a second vertical slit piece forming means for forming a second vertical slit piece for communicating between adjacent first vertical slit pieces is shown, a vertical slit is shown. The forming means may be a third vertical slit forming means for forming a third vertical slit piece having a length longer than the conveyance distance of the mother board per press.
Further, for example, in FIGS. 6 and 7, the vertical slit forming means is provided on both sides of the mounting substrate. However, since the mounting substrate only needs to have at least two orthogonal sides, the vertical slit forming means is Alternatively, it may be provided only on either one side.

The processed board and the manufacturing method thereof according to the present invention can be used as a mounting board in which a printed circuit board is temporarily fixed to a frame portion through a concave groove and a manufacturing method thereof.
The mother board processing mold according to the present invention can be used as a mold for manufacturing a mounting board in which a printed circuit board is temporarily fixed to a frame portion through a concave groove.

FIG. 1A and FIG. 1B to FIG. 1E are respectively a plan view of a mounting substrate according to the first embodiment of the present invention and its BB ′ line. It is EE 'line sectional drawing. 2 (a), 2 (b), and 2 (c) are plan views of the lower die of the mother board machining die according to the first embodiment of the present invention, respectively, BB ′. It is a line sectional view and its CC 'line sectional view. 3 (a), 3 (b) and 3 (c) are bottom views of the upper die of the mother board machining die according to the first embodiment of the present invention, respectively, BB ′. It is a line sectional view and its CC 'line sectional view. It is a figure which shows the usage method of the metal mold | die for mother board processing shown in FIG.2 and FIG.3. It is a figure which shows the manufacturing method of the mounting board | substrate using the metal mold | die for mother board processing shown in FIG.2 and FIG.3. FIGS. 6 (a), 6 (b) and 6 (c) are respectively plan views of a lower die of a mother plate working mold according to the third embodiment of the present invention, and BB ′. It is a line sectional view and its CC 'line sectional view. FIG. 7B is a bottom view of the upper die of the base plate processing mold according to the third embodiment of the present invention, and FIG. 7A is a sectional view taken along the line AA ′. . It is a figure which shows the manufacturing method of the mounting board | substrate using the metal mold | die for mother board processing shown in FIG.6 and FIG.7. FIG. 9A and FIG. 9B to FIG. 9E are respectively a plan view of a mounting substrate according to the second embodiment of the present invention and its BB ′ line. It is EE 'line sectional drawing. It is a top view of the lower mold | type of the metal mold | die for mother board processing which concerns on the 5th Embodiment of this invention. It is a figure which shows the manufacturing method of the mounting board | substrate using the metal mold | die for mother board processing shown in FIG. It is a top view of the lower mold | type of the metal mold | die for mother board processing which concerns on the 6th Embodiment of this invention. It is a figure which shows the manufacturing method of the mounting board | substrate using the metal mold | die for mother board processing shown in FIG. FIGS. 14 (a), 14 (b) and 14 (c) are respectively a plan view, a BB ′ line cross-sectional view of the mounting substrate according to the third embodiment of the present invention, and It is CC 'sectional view taken on the line. FIG. 15A, FIG. 15B and FIG. 15C are respectively a plan view, a BB ′ line cross-sectional view of the mounting substrate according to the fourth embodiment of the present invention, and its It is CC 'sectional view taken on the line.

Explanation of symbols

10 Mounting board (processed board)
12a-12c Printed circuit board (product board)
14 Frame portions 16a to 16c Support plates 18a to 18d Groove

Claims (13)

A frame,
One or more product plates temporarily fixed to the frame portion via at least one side thereof;
And stamped from a region adjacent the leading SL product sheets in the base plate, and fitted into the original bore one or more support plates including the frame portion,
Comprising one or two or more concave grooves formed along the border line of the product plate or the vicinity thereof;
At least one of the tips of the support plates is inside the concave groove;
In the adjacent region including the region from the tip of the support plate to the concave groove is punched ,
At least one of the product plates is
(A) Only one side thereof is temporarily fixed to the frame portion through the concave groove, or
(B) A processed plate in which two intersecting sides are temporarily fixed to the frame portion via the concave groove .   The processed plate according to claim 1, wherein a tip of the support plate is located at a narrowest portion in a region where the support plate and the adjacent region are combined. The processed plate according to claim 1 or 2, further comprising one or more slits communicating with the outer periphery of the frame portion and not communicating with the product plate. A support plate region, which is disposed upstream of the conveyance direction of the mother plate and includes a support plate in an area adjacent to the product plate in the mother plate, is punched out, and the punched support plate region is the original hole. A push-back means for fitting,
An outer shape cutting means for cutting a processed plate including the support plate region, which is disposed downstream of the conveyance direction of the mother plate and includes the product plate and the pushback, from the mother plate;
The outer shape cutting means is for punching out all or part of the adjacent region including the region from the tip of the support plate to the boundary line between the product plate and the frame portion or the concave groove formed in the vicinity thereof. The adjacent area punching means is further provided ,
The pushback means includes at least one product plate,
(A) Only one side thereof is temporarily fixed to the frame portion through the concave groove, or
(B) Two intersecting sides are temporarily fixed to the frame portion via the concave groove
A mold for processing a base plate is to push back the support plate region as described above . 5. The mother board machining die according to claim 4, further comprising a blanking region corresponding to one of the machining plates between the pushback means and the outer shape cutting means. A pushback means for punching a support plate region including a support plate therein from an area adjacent to a product plate in the mother plate, and fitting the punched support plate region into an original hole;
A continuous vertical slit serving as a reference side of the processed plate is formed by sequentially forming vertical slit pieces parallel to the conveying direction of the base plate on at least one side of the punched support plate region. A vertical slit forming means for
Arranged on the downstream side of the pushback means with respect to the conveying direction of the base plate, from the tip of the support plate to the boundary line between the product plate and the frame portion or a concave groove formed in the vicinity thereof e Bei the adjacent region punching means for punching the whole or part of an adjacent region including the region,
The pushback means includes at least one product plate,
(A) Only one side thereof is temporarily fixed to the frame portion through the concave groove, or
(B) Two intersecting sides are temporarily fixed to the frame portion via the concave groove
A mold for processing a base plate is to push back the support plate region as described above . Front or rear of the punched support plate region is composed of two or more horizontal slit pieces that are perpendicular to the vertical slit and aligned in a straight line, and at least one of the horizontal slit pieces is the The mold for processing a base plate according to claim 6, further comprising a horizontal slit forming means for forming a horizontal slit communicating with the vertical slit. The manufacturing method of the processed board provided with the following processes.
(A) In the pushback means, the support plate region (A) is punched out from the region adjacent to the product plate in the mother plate, and the support is punched out by using the mother board processing mold according to claim 4 A pushback process for fitting the plate area (A) into the original hole.
(B) transporting the base plate so that the region including the support plate region (A) is on the outer cutting means, and punching out the support plate region (B) from the base plate in the pushback means; At the same time as inserting the punched support plate region (B) into the original hole,
In the outer shape cutting means, a processed plate including the support plate region (A) is cut out from the mother plate,
In the adjacent region punching means, an outer shape cutting step of punching out all or a part of the adjacent region.
(C) A groove forming step of forming a groove along a boundary line between the cut-out frame portion of the processed plate and the product plate or in the vicinity thereof. The manufacturing method of the processed board provided with the following processes.
(A) In the pushback means, the support plate region (A) is punched out from the region adjacent to the product plate in the mother plate, and the support is punched out by using the mother plate processing mold according to claim 5 A pushback process for fitting the plate area (A) into the original hole.
(B) The base plate is transported so that the region including the support plate region (A) is located in the blanking region, and the support plate region (B) is newly punched from the base plate by the pushback means, At the same time as inserting the extracted support plate region (B) into the original hole,
A blanking step of blanking the support plate region (A) pushed back by the immediately preceding press in the blanking region.
(C) conveying the mother board so that the region including the support plate region (A) and the region including the support plate region (B) are on the outer cutting means and the blanking region, respectively; In the pushback means, the support plate area (C) is newly punched from the base plate, the punched support plate area (C) is fitted into the original hole, and pushback is performed with the immediately preceding press in the blanking area. At the same time as performing the blanking of the support plate area (B),
In the outer shape cutting means, a processed plate including the support plate region (A) is cut out from the mother plate,
In the adjacent region punching means, an outer shape cutting step of punching out all or a part of the adjacent region.
(D) A groove forming step of forming a groove along a boundary line between the cut-out frame portion of the processed plate and the product plate or in the vicinity thereof. The manufacturing method of the processed board provided with the following processes.
(A) In the pushback means, the support plate region (A) is punched out from the region adjacent to the product plate in the mother plate, and the support is punched out by using the mother plate processing mold according to claim 6. At the same time as inserting the plate area (A) into the original hole,
In the vertical slit forming means, a first pressing step of forming a vertical slit piece (A) parallel to the conveying direction of the mother plate on at least one side of the punched support plate region (A). .
(B) The base plate is transported by a predetermined feed width, and the support plate region (B) is newly punched from the base plate in the pushback means, and the punched support plate region (B) is returned to the original hole. At the same time,
In the vertical slit forming means, at least one side of the punched support plate region (B) is in parallel with the conveying direction of the mother plate and communicates with the vertical slit piece (A). The vertical slit piece (B) is formed as follows, and a continuous vertical slit serving as the reference side of the processed plate is formed,
A second pressing step of punching all or part of the adjacent region in the adjacent region punching means;
(C) A groove forming step of forming a groove along a boundary line between the cut-out frame portion of the processed plate and the product plate or in the vicinity thereof. The manufacturing method of the processed board provided with the following processes.
(A) In the pushback means, the support plate region (A) is punched out from the region adjacent to the product plate in the mother plate, and the support is punched out by using the mold for processing the mother plate according to claim 7. At the same time as inserting the plate area (A) into the original hole,
In the longitudinal slit forming means, on at least one side of the punched support plate region (A), a longitudinal slit piece (A) is formed in parallel to the conveying direction of the mother plate,
In the horizontal slit forming means, a continuous vertical length obtained by sequentially forming the vertical slit pieces parallel to the conveying direction of the mother plate in front of or behind the punched support plate region (A). A horizontal slit (A) which is composed of two or more horizontal slit pieces (A) which are perpendicular to the slit and arranged in a straight line, and at least one of the horizontal slit pieces (A) communicates with the vertical slit. 1st press process which forms).
(B) The base plate is transported by a predetermined feed width, and the support plate region (B) is newly punched from the base plate in the pushback means, and the punched support plate region (B) is returned to the original hole. At the same time,
In the longitudinal slit forming means, at least one side of the punched support plate region (B) is parallel to the conveying direction of the mother plate and communicates with the longitudinal slit piece (A). The vertical slit piece (B) is formed as follows, and a continuous vertical slit serving as the reference side of the processed plate is formed,
In the horizontal slit forming means, two or more horizontal slit pieces (B) that are perpendicular to the vertical slit and aligned in a straight line are provided in front of or behind the punched support plate region (B). And at least one of the transverse slit pieces (B) forms a transverse slit (B) communicating with the longitudinal slit,
A second pressing step of punching all or part of the adjacent region in the adjacent region punching means;
(C) A groove forming step of forming a groove along a boundary line between the cut-out frame portion of the processed plate and the product plate or in the vicinity thereof. The manufacturing method of the product board which fractures | ruptures the said frame part along the said ditch | groove provided in the processed board in any one of Claim 1 to 3, and isolate | separates the said product board from the said frame part. The manufacturing method of the product board which fractures | ruptures the said frame part along the said concave groove with which the processed board obtained by the method in any one of Claim 8 to 11 is provided, and isolate | separates the said product board from the said frame part.

Images