JP3372247B2 - Manufacturing method of printed wiring motherboard processing mold and mounting substrate - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a die for processing a printed wiring mother board and a mounting substrate , and more specifically, punching a printed circuit board from the printed wiring mother board and a printed wiring mother board. The present invention relates to a method for manufacturing a printed wiring mother board processing die used for cutting the outer shape and a mounting substrate .

[0002]

2. Description of the Related Art With the recent miniaturization of electronic equipment, there is an increasing demand for miniaturization and modification of printed circuit boards used in electronic equipment. On the other hand, an automatic electronic component mounting machine such as a chip mounter or an automatic insertion machine for mounting electronic components on a printed circuit board (hereinafter referred to as a "self-mounting machine") has a size of a work due to a transportation relation. Has an upper limit and a lower limit. Further, it is required that the outer shape of the work used for the self-mounting machine is substantially rectangular, that is, at least one side is a straight line and all or part of the sides perpendicular to this is a straight line. It

Therefore, when electronic components are mounted on a small-sized and odd-shaped printed circuit board by using a self-mounting machine, first, a plurality of printed circuit boards are formed on a printed wiring mother board, and a V-cut method, The printed circuit board is temporarily fixed to the original printed wiring board using the pushback method, and then the printed wiring board is of a size and shape that can be transported by a self-mounting machine (hereinafter , This is called a "mounting substrate").

Among them, the V-cut method inserts a V-shaped groove (V-cut) along a boundary line of a printed circuit printed on a printed wiring board and mounts electronic parts on the printed circuit, It is a method of breaking along the V-cut. Therefore, the V-cut method can be applied only to a printed circuit board whose outline is linear.

On the other hand, in the pushback method, the printed circuit board is sandwiched between the upper die and the lower die, and the printed circuit board is punched using a blade having a predetermined shape, and then the punched printed circuit board is punched. It is a method to fit in the original hole. The pushback method is particularly effective for automatically mounting electronic components on a deformed printed circuit board because the shape of the printed circuit board is not limited.

Conventionally, the processing of the printed wiring board using the pushback method is generally performed by the following procedure. That is, first, as shown in FIG.
Printed wiring mother board 1 on which an electric circuit (not shown) is printed
0 is formed with reference holes 12, 12 ... For pushback. Next, as shown in FIG. 4B, the pushback die is used to perform pushback of the printed circuit boards 14a to 14e and perforation of the component holes 16, 16 ... Further, as shown in FIG. 4C, the outer shape of the printed wiring mother board 10 is cut by using an outer shape cutting die, and the mounting board 18 including a predetermined number of printed circuit boards 14a to 14e is cut out.

[0007]

However, since the conventional processing method requires two types of molds for pushback and for contour cutting, the cost of the mold increases and the processing cost increases. There is. In addition, when it is necessary to perform pushback processing and outer shape cutting processing using the same press machine, it is necessary to replace the mold, which lowers workability.

In addition, when performing contour cutting after pushback processing, it is necessary to position the printed wiring mother board with respect to the contour cutting die. This positioning is usually
Positioning pins are provided upright on the lower die of the outer shape cutting die, and the pins are inserted into the pushback reference holes 12, 12 ... Provided in the printed wiring mother board.

However, when the printed circuit board is punched out from the printed wiring board, a non-uniform force acts on the printed wiring board, and as shown in FIG. 5, the printed wiring after the pushback process is finished. The mother plate 10 may have an upwardly convex spherical warp. If this warp becomes remarkable and the height of the bottom surface of the printed wiring board 10 exceeds the height of the positioning pin, the positioning pin cannot be inserted into the reference hole, which makes positioning difficult when cutting the outer shape. is there.

Further, after the cutting of the outer shape, the mounting substrate also warps. If this warp becomes remarkable, there is a problem that the mounting board is not smoothly transported when the mounting board is transported to the self-mounting machine. Further, the clearance between the printed circuit board punched from the printed wiring board and the hole formed in the printed wiring board by punching the printed circuit board is extremely small. Therefore, if the mounting substrate is significantly warped, it becomes difficult to remove the printed circuit board that has been fitted, and the workability is reduced.

An object of the present invention is to provide a method for manufacturing a mold for processing a printed wiring mother board and a mounting substrate which can reduce the cost of the mold and which is excellent in workability. Further, another problem to be solved by the present invention is
It is to provide a method for manufacturing a printed wiring mother board processing die and a mounting substrate capable of easily cutting the outer shape of the printed wiring mother board. Furthermore, another object to be solved The present invention is pushed back after processing with small warpage mounting substrate of the possible manufacturing printed wiring mother board processing mold 及
And a method of manufacturing a mounting substrate .

[0012]

In order to solve the above-mentioned problems, a mold for processing a printed wiring mother board according to the present invention is arranged on the upstream side with respect to the conveying direction of the printed wiring mother board, A pushback means for punching a printed circuit board from the board and fitting the punched printed circuit board into the original hole, and a pushback means arranged downstream of the printed wiring board in the conveying direction.
Alternatively, it is a gist that an outer shape cutting means for cutting out a mounting board including two or more of the printed circuit boards from the printed wiring board is provided. Also,
The mounting board manufacturing method according to
Pushback hand located upstream of the transport direction
And a downstream side with respect to the conveyance direction of the printed wiring board
And a printed wiring board provided with external cutting means
Use the processing mold to remove the pushback means.
Punch out the first printed circuit board from the printed wiring board.
The punched first printed circuit board into the original hole.
Push back process and push back
So that the cut portion is on the contour cutting means.
And a pushback process for carrying the wiring board.
A second print from the printed wiring board;
The second pudding is newly punched out of the circuit board.
When the circuit board is fitted into the original hole,
Push back in the last press in the dan
For mounting including one or more first printed circuit boards
Outer shape cutting step of cutting the board from the printed wiring board
The gist is to have and.

A mold for processing a printed wiring board according to the present invention
Also, in the method of manufacturing the mounting substrate , since the pushback process and the outer shape cutting process can be performed with one die, the die cost can be reduced as compared with the case where two dies are used. In addition, since there is no need to replace the mold,
Workability is improved.

Further, since the push-back processing of the printed circuit board and the outer shape cutting of the portion subjected to the push-back processing by the immediately preceding press are performed by one press, the internal stress generated during the push-back processing is reduced. It is alleviated, and the warpage that occurs in the subsequent printed wiring board is reduced. Therefore, it is possible to easily perform the outer shape cutting as compared with the case where the pushback processing and the outer shape cutting processing are performed using separate molds.

Further, at the time of cutting the outer shape or pushing back , one or more first or more first areas are provided in a margin portion around the mounting substrate .
When the first slit forming means for forming the slit is provided, the internal stress introduced into the mounting substrate is also relieved at the same time. Therefore, the warp generated on the mounting substrate can be reduced to the extent that it can be conveyed by the self-mounting machine.
Moreover, the removal of the printed circuit board is facilitated and the workability is improved.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described in detail below with reference to the drawings. 1 and 2
FIG. 1 shows a mold for processing a printed wiring board according to the present embodiment. The printed wiring board mother die 1 comprises a lower die 20 and an upper die 50. Further, in the lower mold 20 and the upper mold 50, the upstream side with respect to the conveyance direction of the printed wiring board is, respectively,
A push-back section (push-back means) 3 for performing push-back processing of the printed circuit board, and an outer shape cutting section (outer shape cutting means) for cutting the outer shape of the mounting board on the downstream side in the transport direction. It is 5.

As shown in FIG. 1, the lower die 20 includes a lower die base plate 22 and a lower die stripper 24. First lower punches 22a to 22e for punching the printed circuit board are provided in the pushback portion 3 of the lower die base plate 22, and the outer shape cutting portion 5 of the lower die base board 22 is mounted from the printed wiring mother board. A second lower punch 22f for cutting out the substrate for use is provided. In FIG. 1, a total of five first lower punches 22a to 22e having different shapes are shown, but this is merely an example, and the shape and number of the first lower punches are arbitrary according to the purpose. Can be selected and is not particularly limited.

The lower die stripper 24 has two lower punches 2
Through holes are provided at positions corresponding to 2a to 22f, and the lower die stripper 24 is vertically movable along the side wall surfaces of the lower punches 22a to 22f. Further, the lower die stripper 24 is restricted from moving upward by a plurality of bolts 26, 26 ... Which are loosely inserted from below the lower die base plate 22, and the lower die base plate 22 and the lower die stripper 2 are provided.
4 are urged upward by elastic members 28, 28. The material of the elastic members 28, 28 ...
Although not particularly limited, urethane rubber is mentioned as a suitable example. Furthermore, the lower stripper 24
Posts 30a to 30d that are inserted from below the lower mold base plate 22 are erected at the four corners of the. Posts 30a-30
d is used for positioning the lower mold 20 and the upper mold 50 during pressing.

Positioning pins 32a and 32b used for positioning at the time of pushback processing are provided on the upper surface of the lower die stripper 24 and near the first lower punches 22a and 22c. Further, on the upper surface of the second lower punch 22f, positioning pins 32c and 32d used for positioning at the time of outer shape cutting are provided at positions symmetrical to the positioning pins 32a and 32b, respectively.

Further, on the upper surface of the second lower punch 22f,
Accessory holes formed holes 34, 34 for forming the component holes ..., a
First slit forming hole 36 for forming one slit
a, 36a ..., Second pickpocket for forming second slit
A hole forming hole 36b, a reference hole forming hole 38a for forming a reference hole for automatically mounting an electronic component, and a sub reference hole forming hole 38b for forming a sub reference hole.

As shown in FIG. 2, the upper die 50 is provided with an upper die base plate 52 and four holders 54a to 54d. The upper die base plate 52 and the holders 54a to 54d are
The knock pins 56, which are erected on the upper base plate 52, are stacked on the basis of each other, and are fastened by a plurality of fastening bolts 58 ,. In addition, the push-back portion 3 and the outer shape cutting portion 5 of the holder 54d located at the extreme end of the upper die 50.
The first is for punching printed circuit boards, respectively.
The upper die strippers 60a to 60e and the second upper die stripper 60f for cutting out the mounting substrate are attached. First upper die strippers 60a-60e and second
The upper die stripper 60f includes first lower punches 22a to 22e and second lower punch 22f, which are provided in the lower die, respectively.
Is provided at a position corresponding to.

The first upper strippers 60a-60e are
First slide space 62a provided in holder 54d
~ 62e is loosely inserted. Further, the first upper die strippers 60a to 60e are supported by bolts 64, 64 ... Which are loosely inserted from above the holder 54c so that the tips thereof slightly project from the surface of the holder 54d, and the first upper strippers 60a to 60e extend downward. Movement is restricted. Also, the bolts 64, 64
Can be moved up and down along a through hole 65 provided in the holder 54b.

The first pressing pins 66a, 66a, ... Are for pressing the first upper die strippers 60a-60e downward, and are loosely inserted into the through holes penetrating the holders 54b, 54c in the vertical direction. One end thereof is in contact with the upper surfaces of the first upper die strippers 60a to 60e, and the other end is in contact with the lower surface of the first pressing plate 70a arranged in the central space 68 of the holder 54a.

The first pressing plate 70a has the first pressing pin 66.
It is for pressing a, 66a ... First
Between the upper surface of the pressing plate 70a and the cap bolt 72,
The elastic members 74, 74 ... Are inserted, and the elastic members 74, 74 are inserted.
The first pressing plate 70a is biased downward by. The material of the elastic members 74, 74 ... Is not particularly limited, but urethane rubber is mentioned as a suitable example.

Similarly, the second upper die stripper 60f is
Second slide space 62f provided in holder 54d
It is inserted in the inside. In addition, the second upper die stripper 60f
Is a bolt 6 that is loosely inserted from above the holder 54c so that its tip slightly projects from the surface of the holder 54d.
It is supported by Nos. 4, 64, and is restricted from moving downward.

The second pressing pins 66b, 66b, ... Are for pressing the second upper die stripper 60f downward, and are loosely inserted into the through holes vertically penetrating the holders 54b, 54c. One end of the second upper stripper 60
It contacts the upper surface of f, and the other end thereof contacts the lower surface of the second pressing plate 70b arranged in the central space 68 of the holder 54a. The second pressing plate 70b has the second pressing pin 66.
This is for pressing b, 66b ... Second
Knockout bushes 76, 76 for pressing the second pressing plate 70b downward are provided on the upper surface of the pressing plate 70b. The lengths of the knockout bushes 76, 76 are determined so that the tips thereof slightly project from the upper surface of the upper mold base plate 52 in the unloaded state.

The holder 54d is provided with post guide holes 78a to 78d at positions corresponding to the posts 30a to 30d provided upright on the lower die 20, respectively. Also,
On the lower surface of the holder 54d and the second upper die stripper 60f, the positioning pins 32a to 32d that are erected on the lower die 20 are provided.
Positioning pin guide holes 80 at the positions corresponding to
a to 80d are provided.

Further, component hole forming holes 34, 34, ..., First slit forming holes formed on the upper surface of the second lower punch 22f.
36a, 36a ..., The second slit forming hole 36b, and the positions corresponding to the reference hole forming hole 38a and the sub reference hole forming hole 38b, respectively, the component hole forming pins 82, 8 respectively.
2 ..., first slit forming pins 84a, 84a ..., 2nd slit
A rit forming pin 84b, a reference hole forming pin 86a, and a sub reference hole forming pin 86b are provided. These tips are loosely inserted into the through holes provided in the second upper die stripper 60f, and the second upper die stripper 60f
Is moved upward along the second slide space 62f, and is projected from the lower surface of the second upper die stripper 60f.

Provided on the second upper die stripper 60f
The first slit forming pins 84a, 84a ... And the corresponding first slit forming holes 36a, 36a ... ( First slit forming means) , and the second slit forming pins 84b.
Corresponding to this, the second slit forming hole 36b (second slit
The number, shape and position of the mounting means) , that is, the number, shape and position of the first and second slits formed in the blank portion of the mounting board are determined by cutting the mounting board from the printed wiring board. It is preferable that the mounting substrate is selected so that the warp thereof is minimized.

For example, when the mounting substrate has a relatively small warpage, the first mounting member is provided on at least one side of the mounting substrate .
All that is required is to form a slit. Further, when the mounting substrate has a relatively large warp, it is preferable to form the first slits at least on two opposing sides of the mounting substrate.

When the mounting board has a large area,
When the warpage that occurs is large, it is preferable to provide the first slits on all four sides of the mounting substrate. Further, when the printed circuit boards are punched over a plurality of rows, or when the printed circuit boards having different shapes are punched in an irregularly arranged state, 1 or 2 is provided around the mounting board.
In addition to forming the first slits described above, it is preferable to form one or two or more second slits in the blank portion at the center of the mounting substrate.

In general, the longer the length of the first and / or the second slit is, the greater the effect of reducing the warpage of the mounting board becomes. For example, when the first slit is formed in the blank portion on the outer periphery of the mounting substrate, the length of the first slit is preferably ⅔ or more of the length of the blank portion. However, if the first slit is too long, the strength of the mounting substrate is reduced. Therefore, it is preferable to select the optimum length of the first slit according to the shape, arrangement, etc. of the printed circuit board so that the strength enough to withstand the automatic mounting is maintained.

The length of each first or second slit is
They may all be the same or different. For example, if the length of the margin that it is intended to create the first or second slit is substantially equal, each first or
The lengths of the second slits may be the same. On the other hand, if the length of the margin varies depending on the location, the first or
Depending on the position where the second slit is formed, each first or second
The length of the slit may be changed. The provision of the mounting substrate
The number of 1 or 2nd slits is also the same, and may be determined in consideration of the degree of warpage and the strength of the mounting substrate.

In FIG. 1, the first and second slit forming means, the component hole forming pins 82, 82 ... And the component hole forming holes 34, 34 ... (Component hole forming means), the reference hole forming hole 3
8a and the reference hole forming pin 86a (reference hole forming means), and the sub reference hole forming hole 38b and the sub reference hole forming pin 86b (sub reference hole forming means) are all provided on the outer shape cutting portion 5 side. However, these means may be provided on the pushback unit 3 side. However, when these means are provided in the pushback unit 3, the punched printed circuit board may come off from the printed wiring board when the pins are pulled out from the printed wiring board after the punching is completed. Both the means are preferably provided on the side of the outer shape cutting portion 5.

When all electronic components are automatically mounted on the mounting board at one time, one reference hole and one sub-reference hole are enough, but the electronic components are divided into a plurality of times. In the case of automatic mounting, a plurality of reference holes and sub reference holes are required. Therefore, in such a case, a plurality of sets of reference hole forming means and sub reference hole forming means may be provided on the pushback portion 3 side or the outer shape cutting portion 5 side to form a plurality of reference holes and sub reference holes at the same time. good.

Next, the function of the printed wiring board mother die 1 according to the present embodiment will be described. FIG. 3 shows a process drawing of the press working. First, as shown in FIG. 3A, the printed wiring board 10 is placed on the upper surface of the lower mold 20.
This printed wiring board 10 is
The printed circuit board 14 is subjected to pushback processing. The printed wiring mother board 10 is conveyed rightward in FIG. 3A after the immediately preceding pressing is completed, and the portion subjected to the pushback process in the immediately preceding pressing step comes to the outer shape cutting portion 5, It is placed on the upper surface of the lower mold 20. The printed wiring mother board 10 is positioned by inserting the positioning pins 32a to 32d provided on the upper surface of the lower mold 20 into the pushback reference holes provided on the printed wiring mother board 10.

When the upper mold 50 is lowered from this state, first, the tips of the first upper mold strippers 60a to 60e and the second upper mold stripper 60f come into contact with the upper surface of the printed wiring mother board 10, and the first upper mold stripper is contacted. The first slide spaces 62a to 62e and the second slide space 6 respectively include 60a to 60e and the second upper stripper 60f.
Move up along 2f.

When the upper die 50 is further lowered, FIG.
As shown in (b), on the pushback unit 3 side, the first
The lower punches 22a to 22e are the first upper die stripper 60a.
A new printed circuit board 14 'is punched out by pushing ~ 60e upwards. At this time, the holder 54d
Resists the elastic force of the elastic member 28, and the printed circuit board 1
After the 4'is punched out, the printed wiring board 10 and the lower die stripper 24 are pushed down.

On the other hand, on the side of the outer shape cutting section 5, the second lower punch 22f pushes the second upper die stripper 60f upward to punch out the mounting substrate 18. Further, as the second upper die stripper 60f is pushed upward, from the lower surface of the second upper die stripper 60f, the component hole forming pins 82, 82, ..., The first slit forming pin 84 are formed.
a, 84a ... And the second slit forming pin 84b , and the reference hole forming pin 86a and the sub reference hole forming pin 86.
The tip of b projects, and the component hole, the first and second slits, and the reference hole and the sub-reference hole are formed in the printed wiring board 10, respectively.

Next, when the upper die 50 is raised after the punching is completed, the elastic members 28, 28, ... Push up the printed wiring mother board 10 together with the lower die stripper 24 by its restoring force. At this time, push back unit 3
On the side, the first pressing plate 70a biased by the elastic members 74, 74, pushes down the first upper die strippers 60a to 60e via the first pressing pin 66a. Therefore, when the upper mold 50 is completely separated from the lower mold 20,
As shown in FIG. 3C, the newly punched printed circuit board 14 ′ is fitted in the original hole of the printed wiring board 10.

On the other hand, on the side of the outer shape cutting portion 5, a downward biasing force does not act on the second upper die stripper 60f. Therefore, as shown in FIG. 3C, even when the upper die 50 is separated from the lower die, the second upper die stripper 60f does not descend, and the punched mounting substrate 18 is not moved to the second slide space 6
It is held once in 2f. At this time, the knockout bushes 76, 76, ... Are in a state of protruding from above the upper die base plate 52.

When the upper die 50 is further raised and the upper die 50 approaches the vicinity of the top dead center, the pressing means (not shown) provided in the press machine eventually pushes the knockout bushes 76, 7.
6 is pressed downward. Further, the second pressing plate 70b is connected to the second upper die stripper 60f via the second pressing pin 66b.
Push down. Therefore, when the upper die 50 reaches the top dead center, as shown in FIG. 3D, the second upper die stripper 60f is pushed down to the original position, and at the same time, the mounting substrate 18 is slid by the second slide. The space 62f is pushed out.

After this, the printed wiring board 10 is conveyed rightward so that the newly punched printed circuit board 14 'is directly below the outer shape cutting portion 5. Then, in accordance with the same procedure as described above, the pushback processing of the next printed circuit board and the outer shape cutting processing of the mounting board including the printed circuit board 14 ′ punched by the immediately preceding press are repeated as many times as necessary.

The mold 1 for processing a printed wiring board according to the present invention has a pushback part 3 and an outer shape cutting part 5 in the same mold.
Since it is equipped with, it is possible to perform pushback processing and outer shape cutting processing with one die. Therefore, the die cost can be reduced as compared with the conventional die using two dies. Further, even if it is necessary to perform the pushback process and the outer shape cutting process using a single press machine, the work of exchanging the mold is unnecessary, so that the workability is improved. Furthermore, since the total number of presses is reduced, the productivity is improved and the processing cost can be reduced.

Further, since pushback processing is generally performed by pushing up the lower punch from below while pressing the periphery of the printed wiring mother board with the upper die, during the pushback processing, the printed wiring mother board is Strong shear stress acts. As a result, if only the pushback process is continuously performed, an upwardly convex spherical warp occurs on the printed wiring board at the time when the pushback process is completed. If this warp becomes significant, it becomes difficult to perform positioning during the contour cutting process.

On the other hand, according to the mold 1 for processing a printed wiring board according to the present embodiment, the pushback processing of the printed circuit board and the pushback processing by the immediately preceding press can be performed by one press. Since the outer shape cutting process of the broken portion is performed, the internal stress generated during the pushback process is immediately relieved, and the warp generated in the subsequent printed wiring mother board is reduced. This tendency is particularly caused by holding the mounting substrate cut out from the printed wiring mother board as the outer shape cutting means by the upper die at one end, and pushing out the mounting substrate from the upper die after the upper die is separated from the printed wiring mother board. Remarkably appears when the knockout means is used. Therefore, it is possible to easily perform the outer shape cutting as compared with the case where the pushback processing and the outer shape cutting processing are performed using separate molds.

In order to simultaneously perform pushback processing and outer shape cutting processing by a knockout system with one press, the first upper die stripper 6 for pushback is used.
0a to 60e and a second upper die stripper 6 for cutting the outer shape
It is necessary to perform a separate operation for 0f. In the present embodiment, the pressing plate for pressing the upper die stripper is divided into the first pressing plate 70a and the second pressing plate 70b, so that such an operation can be performed extremely easily. it can.

Furthermore, the printed wiring mother board processing die 1 according to the present embodiment is for forming one or more first slits in the margin portion of the mounting substrate when cutting the outer shape.
To form the first slit forming means and the second slit
Since the second slit forming means is provided, the internal stress introduced into the mounting substrate is also relieved. Therefore, the warp generated on the mounting substrate can be reduced to the extent that it can be conveyed by the self-mounting machine. Further, after mounting the components by the self-mounting machine, the printed circuit board can be easily removed by breaking the mounting board along the first slit or simply pushing the printed circuit board. Workability is also improved.

Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the gist of the present invention. is there.

[0050]

EFFECT OF THE INVENTION In the method of manufacturing the printed wiring mother board processing die and the mounting substrate according to the present invention, since the pushback processing and the outer shape cutting processing can be performed using one die, This has the effect of reducing mold costs and improving workability. Further, since the outer shape cutting process can be performed immediately after the pushback process, there is an effect that the warp generated in the printed wiring mother board is reduced and the outer shape cutting is facilitated. In particular, when the outer shape is cut by the knockout method, there is an effect that the warp generated in the printed wiring board can be significantly reduced.

Furthermore, at the time of cutting the outer shape or pushing back , one or more first or more first areas are provided in the marginal area around the mounting substrate .
When a first slit forming means for forming a slit is further provided , and in addition to the first slit forming means
In the central blank area of the mounting substrate, one or more second
A second slit forming means for forming a slit.
In that case, there is an effect that the warp of the mounting substrate can be reduced.

[Brief description of drawings]

FIG. 1 (a) is a plan view of a lower die of a mold for processing a printed wiring board according to the present invention, and FIG. 1 (b) is a sectional view taken along line AA ′ of FIG. (C) is the BB 'sectional view taken on the line.

FIG. 2 (a) is a bottom view of an upper die of a mold for processing a printed wiring board according to the present invention, and FIG. 2 (b) is a sectional view taken along line AA ′ of FIG. (C) is the BB 'sectional view taken on the line.

FIG. 3 is a process drawing of a pressing process using a mold for processing a printed wiring board according to the present invention.

FIG. 4 is a process diagram showing a conventional method for processing a printed wiring board.

FIG. 5 is a perspective view showing a printed wiring board after pushback processing.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Mold for printed wiring mother board processing 3 Push back part (push back means) 5 External cutting part (outside cutting means) 10 Printed wiring mother boards 14, 14 'Printed circuit board 18 Mounting board 20 Lower mold 50 Upper mold 60a -60e 1st upper mold stripper 60f 2nd upper mold stripper 70a 1st pressing plate 70b 2nd pressing plate 74 elastic member 76 knockout bush 84 slit formation pin

Continuation of front page (58) Fields surveyed (Int.Cl. ⁷ , DB name) B26F 1/00-1/46

Claims (10)

(57) [Claims] 1. Push-back means, which is arranged on the upstream side with respect to the conveying direction of the printed wiring board, punches the printed circuit board from the printed wiring board, and fits the punched printed circuit board into the original hole. Outline cutting means for cutting out a mounting substrate including one or more push-backed printed circuit boards, which is arranged on the downstream side with respect to the conveyance direction of the printed wiring board, from the printed wiring board. Mold for processing printed wiring mother board with. 2. The outer shape cutting means temporarily holds the mounting substrate cut out from the printed wiring mother board with an upper die of the printed wiring mother board processing die, and the upper die holds the printed wiring mother board. The mold for processing a printed wiring mother board according to claim 1, further comprising knockout means for pushing out the mounting substrate from the upper mold after being separated from the plate. 3. The pushback means includes a first pressing plate for urging the first upper die stripper for pushback loosely inserted into the lower surface of the upper die, and the outer shape cutting means includes: The printed wiring mother board processing according to claim 2, further comprising a second pressing plate for pushing down a second upper die stripper for cutting the outer shape loosely inserted in the lower surface of the upper die at the time of knocking out. Mold for. 4. The outer shape cutting means or the push bag
In click means, in the margin around the mounting substrate 1
Alternatively, the mold for processing a printed wiring mother board according to claim 1, further comprising a first slit forming means for forming two or more first slits. 5. The outer shape cutting means or the push bag
1 in the blank area at the center of the mounting board.
Or a second slip for forming two or more second slits.
The pudding according to claim 4, further comprising a sheet forming means.
Mold for processing wiring mother boards. 6. The outer shape cutting means or the push bag
Forming a component hole in the printed circuit board
Claims further comprising component hole forming means for Items 1 to 5
The mold for processing a printed wiring mother board according to any one of 1 to 3 above. 7. The printed wiring board is mounted on the upper side with respect to the carrying direction.
Push-back means arranged on the flow side, and the print
Outline cutting placed on the downstream side with respect to the transfer direction of the wiring motherboard
Using a mold for processing printed wiring board with cutting means
Then, in the pushback means, the print distribution is
Punching the first printed circuit board from the wire mother board, punching
Push the first printed circuit board into the original hole
Back process, The part where the push back is performed is on the outer shape cutting means.
Conveying process to convey the printed wiring board so that it comes
When, In the pushback means, the printed wiring board
Newly punch out the second printed circuit board from the board
Simultaneously when the assembled second printed circuit board is fitted into the original hole.
In the outer shape cutting means, in the immediately preceding press
One or more of the first prints pushed back
Cut the mounting board including the circuit board from the printed wiring board.
A method of manufacturing a mounting board, the method including a step of cutting out an outer shape. 8. The pushback means or the contour cutting
In the cutting means, 1 is provided in a blank area around the mounting substrate.
Alternatively, a first slit formation for forming two or more first slits
The manufacturing of the mounting substrate according to claim 7, further comprising a step.
Method. 9. The pushback means or the outer shape cutting
In the cutting means, 1 is provided in the central blank area of the mounting substrate.
Or a second slip for forming two or more second slits.
The mounting substrate according to claim 8, further comprising a step of forming a package.
Manufacturing method. 10. The pushback means or the outer shape
Forming component holes in the printed circuit board by the cutting means
10. The method according to claim 7, further comprising a part hole forming step.
A method for manufacturing a mounting substrate according to any one of the above.