CN210676585U - Rib cutting forming device of semiconductor device - Google Patents
Rib cutting forming device of semiconductor device Download PDFInfo
- Publication number
- CN210676585U CN210676585U CN201920992657.9U CN201920992657U CN210676585U CN 210676585 U CN210676585 U CN 210676585U CN 201920992657 U CN201920992657 U CN 201920992657U CN 210676585 U CN210676585 U CN 210676585U
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- groove
- punching
- product
- forming
- cutting
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- 238000005520 cutting process Methods 0.000 title claims abstract description 91
- 239000004065 semiconductor Substances 0.000 title claims abstract description 13
- 238000004080 punching Methods 0.000 claims abstract description 79
- 238000005452 bending Methods 0.000 claims abstract description 39
- 239000000463 material Substances 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000003754 machining Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
- 210000003205 muscle Anatomy 0.000 description 1
- 210000002435 tendon Anatomy 0.000 description 1
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Abstract
A bar cutting and forming device for semiconductor devices, which can meet the bar cutting and forming of MSP40-GDF or MSP-GDR two product frames by one device, can greatly save resources and reduce production cost, is provided with a bar cutting device on a processing table, and one side of the bar cutting device is provided with a bending forming device, and is characterized in that a first rail arranged in parallel is arranged between the bar cutting device and the bending forming device, the first rail comprises a plurality of strip-shaped first through grooves arranged in parallel, the bar cutting device comprises a cutting plate and a punching machine correspondingly arranged above the cutting plate, a strip-shaped second through groove is arranged on the cutting plate, the width of the second through groove is larger than the diameter of a columnar piece on a product, the second through groove is arranged in the middle part of the first through groove, the second through groove extends along the first through groove, and is communicated with the first rail and the bending forming device, and a cutter of the punching machine, And the stamping male die of the bending forming device is respectively provided with a cylindrical part placing position matched with the cylindrical part, and the cylindrical part placing position is a third through groove or a positioning hole.
Description
Technical Field
The utility model relates to a semiconductor chip produces technical field, specifically is a semiconductor device's eager muscle forming device.
Background
At present, when an MSP40-GDF or MSP-GDR product is processed, the rib cutting and forming of the two products are respectively realized by adopting different dies, the MSP40-GDF or MSP-GDR product is of a lead frame structure before rib cutting, the MSP40-GDF or MSP-GDR product is respectively arranged on respective lead frames in an array mode, the MSP40-GDF or MSP-GDR product respectively comprises a base island, columnar pieces arranged on the base island and pins symmetrically arranged on two sides of the base island, the pins are connected through connecting ribs, the columnar pieces of the MSP40-GDF product and the pins on two sides are in the same direction, the columnar pieces of the MSP-GDR product and the pins on two sides are in the opposite direction, see figures 1 and 2, two punching machines are required to be configured for production in the rib cutting process, the connecting ribs among the pins on the MSP40-GDF or MSP-GDR product are cut, the MSP40-GDF or MSP-GDR product is punched and separated in a lead frame, then the pins are bent and formed, the whole processing process can be finished by adopting at least two sets of equipment, and more resources such as manpower, equipment and the like are occupied.
SUMMERY OF THE UTILITY MODEL
Aiming at the problems of more resource occupation and high production cost of the rib cutting and the product forming of the two frames of MSP40-GDF and MSP-GDR existing in the prior art, the utility model provides a rib cutting and forming device of a semiconductor device, which adopts one device to meet the rib cutting and forming of the two frames of MSP40-GDF or MSP-GDR, thereby greatly saving the resource and reducing the production cost.
A rib cutting and forming device of a semiconductor device comprises a processing table, wherein a rib cutting device is arranged on the processing table, and a bending and forming device is arranged on one side of the rib cutting device, and is characterized in that a first rail arranged in parallel is arranged between the rib cutting device and the bending and forming device, the first rail comprises a plurality of strip-shaped first through grooves arranged in parallel, the rib cutting device comprises a cutting plate and a punching machine correspondingly arranged above the cutting plate, a strip-shaped second through groove is arranged on the cutting plate, the width of the second through groove is larger than the diameter of a cylindrical part on a product, the second through groove is arranged in the middle of the first through groove, extends along the first through groove and is communicated with the first rail and the bending and forming device, a punching cutter of the punching machine and a punching male die of the bending and forming device are respectively provided with a cylindrical part placing position matched with the cylindrical part, the cylindrical part placing position is a third through groove or a placing hole.
The punching die is further characterized in that the third through groove is respectively arranged at the middle parts of the punching cutter and the punching male die, the third through groove corresponds to the second through groove, and the punching cutter is driven by a punching driving device;
two ends of the first rail respectively extend to two sides in a straight line, one end of the first rail penetrates through a material cutting plate on the rib cutting device, and the other end of the first rail is communicated with a forming female die of the bending forming device;
the width of the first through groove is larger than that of the product;
the punching cutter is arranged corresponding to the frame at the edge of the product, the shapes of the punching cutter and the material cutting plate are matched with the structure of the frame, and the width of the third through groove is consistent with that of the second through groove;
the placing holes correspond to the columnar pieces below the placing holes, the number of the placing holes on each punching cutter is consistent with the number of the products on the frame, the shape of the placing holes is matched with that of the columnar pieces, and the diameter of the placing holes is larger than that of the columnar pieces
The bending forming device is arranged at a position, close to the edge, on the machining table, and further comprises a punching machine corresponding to the upper part of the forming female die, the forming female die comprises a second through groove located in the middle of the forming female die, first convex plates symmetrically arranged are arranged on the forming female die on two sides of the second through groove, the first convex plates correspond to pins on two sides of the base island, the first convex plates correspond to the positions, close to the base island, of the pins, the punching machine comprises a punching male die, second convex plates symmetrically arranged are arranged on the punching male die, the two second convex plates correspond to the pins on two sides of the base island, the width between the two second convex plates is larger than the width between the two first convex plates, and the punching male die is driven by a punching driving device;
adopt the above structure of the utility model, when placing the product of taking the frame on the flitch, divide the product into two directions and place: when the product is an MSP40-GDF product, the columnar piece of the product is correspondingly placed with a second through groove on a blank plate, when the product is an MSP-GDF product, the columnar piece of the product is correspondingly placed with a third through groove or a placing hole on a punching machine, the punching machine is adopted to carry out rib cutting operation on a frame corresponding to the edge of the MSP40-GDF or MSP-GDR product, so that the MSP40-GDF or MSP-GDR product is punched and separated from the frame, the ribbed product is pushed to a bending forming device along a first rail to carry out bending forming operation, a third through groove or a placing hole is arranged on a punching male die, the placement of the MSP40-GDF product or the MSP-GDR product can be realized through the second through groove, the third through groove or the placing hole, so that the placement, rib cutting and bending forming operation of the MSP40-GDF product and the MSP-GDF product frame can be realized, namely, one device can meet the requirements of the rib cutting, the MSP40-GDF product, the, Bending and forming operations greatly save resources and reduce production cost.
Drawings
FIG. 1 is a schematic top view of a framed MSP40-GDF or MSP-GDR product;
FIG. 2 is a schematic top view of a MSP40-GDF or MSP-GDR product after a tendon cutting operation;
FIG. 3 is a schematic front view of a curved MSP40-GDF product;
fig. 4 is a schematic front view of the MSP-GDR product after bending forming;
fig. 5 is a left-side view schematically illustrating the structure of the present invention;
FIG. 6 is a schematic cross-sectional view of the AA-oriented structure of FIG. 5;
fig. 7 is an enlarged schematic view of a bottom view of the punching knife of the present invention, which is provided with a third through groove;
fig. 8 is an enlarged schematic view of the punching blade of the present invention with a placement hole;
fig. 9 is an enlarged schematic top view of the forming punch of the present invention.
Detailed Description
Referring to fig. 1 to 6, 7 and 9, in a first embodiment, a bar cutting and forming device for a semiconductor device includes a processing table 1, a bar cutting device 2 is disposed on the processing table 1, a bending and forming device 3 is disposed on one side of the bar cutting device 2, a first rail 4 disposed in parallel is disposed between the bar cutting device 2 and the bending and forming device 3, two ends of the first rail 4 respectively extend to two sides in a straight line, one end of the first rail 4 passes through a cutting plate 21 on the bar cutting device 2, the other end of the first rail 4 is communicated with the bending and forming device 3, the first rail 4 includes a plurality of first strip through grooves 41 disposed in parallel, in this embodiment, eight first through grooves 41 are included, the width of the first through grooves is greater than that of a product 5, the bar cutting device 2 includes a cutting plate 21 and a die cutting machine 22 disposed above the cutting plate 21, a second strip through groove 23 is disposed on the cutting plate 21, the width of the second through groove 23 is greater than the diameter of the cylindrical member 51 on the product 5, the second through groove 23 is arranged in the middle of the first through groove 4, the second through groove 23 extends along the first through groove 4 and is communicated with the first rail 4 and the bending forming device 3, a third through groove 2524 is arranged in the middle of a punching knife 24 of the punching machine 22, the punching knife is arranged corresponding to a frame at the edge of the product, the shapes of the punching knife 24 and the blanking plate 21 are matched with the structure of the frame, the number of the punching knife 24 is consistent with the number of the blanking plate 21 and the first rail 4, the width of the third through groove 25 is consistent with the width of the second through groove 23, the punching knife 24 is arranged corresponding to the blanking plate 21 and is used for cutting off the frame at the edge of the product, and the third through groove 25 is corresponding to the second through groove; the bending forming device 3 is arranged on the processing platform 1 at a position close to the edge, the bending forming device 3 comprises a forming female die 31 and a punching machine 32 corresponding to the upper part of the forming female die 31, the forming female die 31 comprises a second through groove 23 positioned in the middle of the forming female die 31, first convex plates 34 symmetrically arranged are arranged on two sides of the second through groove 23 on the forming female die 31, the first convex plates 34 correspond to pins 53 on two sides of a base island 52, the first convex plates 34 correspond to the positions of the pins 53 close to the base island 52, the punching machine 32 comprises a punching male die 35, the shapes of the punching male die 35 and the forming female die 31 are matched with the shape of a product 5, the punching male die 35 comprises a third through groove 25 arranged in the middle of the punching male die 35, second convex plates symmetrically arranged are arranged on two sides of the third through groove 25 on the punching male die 35, the two second convex plates correspond to the pins 53 on two sides of the base island 52, and the width between the two second convex plates is slightly larger than the, the stamping male die 35 is driven by a stamping driving device (not shown in the figure), and positioning blocks are respectively arranged on one sides of the material cutting plate 21 and the forming female die 31 and used for realizing the positioning of the product 5.
The machining of the MSP40-GDF or MSP-GDR product by adopting the rib cutting forming device comprises the following specific steps: s1, cutting ribs, namely placing the product 5 with the frame 54 on a material cutting plate 21 of a rib cutting device 2, performing rib cutting operation by adopting a die cutting machine 22 corresponding to the frame 54 at the edge of the MSP40-GDF or MSP-GDR product, realizing die cutting separation of the MSP40-GDF or MSP-GDR product and the frame, enabling the product separated from the frame to fall into a first through groove, and placing the product in two directions when placing the product with the frame on the material cutting plate 21: when the product is an MSP40-GDF product, the columnar piece 51 of the product is correspondingly placed with the second through groove 23 on the material cutting plate 21, and when the product is an MSP-GDR product, the columnar piece 51 of the product is correspondingly placed with the third through groove 25 on the blanking machine 22, and by adopting the structure, the placement and the rib cutting operation of two frames of the MSP40-GDF and the MSP-GDR can be realized, namely, one device can meet the rib cutting processing of the two frames of the MSP40-GDF or the MSP-GDR;
and S2, bending and forming, namely manually pushing the MSP40-GDF or MSP-GDR product separated in the step S1 to a forming female die of a bending and forming device through a first rail, starting a punching machine, wherein a punching male die on the punching machine corresponds to pins on two sides of the MSP40-GDF or MSP-GDR product, and the pins are bent downwards under the punching action of the punching machine to finish the bending and forming operation.
Referring to fig. 1 to 6, 8 and 9, in a second embodiment, a bar cutting and forming device for a semiconductor device includes a processing table 1, a bar cutting device 2 is disposed on the processing table 1, a bending and forming device 3 is disposed on one side of the bar cutting device 2, a first rail 4 disposed in parallel is disposed between the bar cutting device 2 and the bending and forming device 3, two ends of the first rail 4 respectively extend linearly to two sides, one end of the first rail 4 passes through a cutting plate 21 on the bar cutting device 2, the other end of the first rail 4 passes through the bending and forming device 3, the first rail 4 includes a plurality of strip-shaped first through grooves disposed in parallel, the width of the first through grooves is greater than that of a product, the bar cutting device 2 includes a cutting plate 21 and a punching machine 22 disposed above the cutting plate 21 correspondingly, a strip-shaped second through groove 23 is disposed on the cutting plate 21, the width of the second through groove 23 is greater than the diameter of a pillar 51 on the product 5, the second through groove 23 is arranged in the middle of the first through groove 4, the second through groove 23 extends along the first through groove 4 and is communicated with the first rail 4 and the bending forming device 3, a placing hole 26 is arranged in the middle of a punching blade 24 of the punching machine 22, the placing hole 26 corresponds to a cylindrical member 51 below the placing hole 26, the number of the placing holes 26 in each punching blade 24 is consistent with the number of the products 5 on the frame 54, the shape of the placing holes 26 is matched with that of the cylindrical member 51, the diameter of the placing holes 26 is larger than that of the cylindrical member 51, and the punching blade 24 is driven by a punching driving device; the punching cutters 24 are arranged corresponding to the frames 54 at the edges of the products 5, the shapes of the punching cutters 24 and the blanking plates 21 are matched with the structures of the frames 54, the number of the punching cutters 24 is consistent with that of the blanking plates 21 and the first tracks 4, the width of the placing holes 26 is consistent with that of the second through grooves 23, the punching cutters 24 are arranged corresponding to the blanking plates 21 and used for cutting off the frames at the edges of the products, and the placing holes 26 are corresponding to the second through grooves 23; the bending forming device 3 is arranged on the processing platform 1 at a position close to the edge, the bending forming device 3 comprises a forming female die 31 and a punching machine 32 corresponding to the upper part of the forming female die 31, the forming female die 31 comprises a second through groove 23 positioned in the middle of the forming female die 31, first convex plates 34 symmetrically arranged are arranged on two sides of the second through groove 23 on the forming female die 31, the first convex plates 34 correspond to pins 53 on two sides of a base island 52, the first convex plates 54 correspond to the positions of the pins 53 close to the base island 52, the punching machine 32 comprises a punching male die 35, the shape of the punching male die 35 is matched with that of the product 5, the punching male die 35 comprises a placing hole 26 arranged in the middle of the punching male die 35, second convex plates 36 symmetrically arranged are arranged on two sides of the placing hole 26 on the punching male die 35, the two second convex plates 36 correspond to the pins 53 on two sides of the base island 52, the width between the two second convex plates 36 is slightly larger than the width between the two first, the stamping male die 35 drives the material cutting plate 21 and one side of the forming female die 31 to be respectively provided with a positioning block through a stamping driving device (not shown in the figure) for realizing the positioning of the product 5.
The processing of the MSP40-GDF or MSP-GDR product by adopting the tendon-cutting forming device of the second embodiment comprises the following specific steps: s1, cutting ribs, namely placing the product 5 with the frame 54 on a material cutting plate 21 of a rib cutting device 2, performing rib cutting operation by adopting a die cutting machine 22 corresponding to the frame 54 at the edge of the MSP40-GDF or MSP-GDR product, realizing die cutting separation of the MSP40-GDF or MSP-GDR product and the frame, enabling the product separated from the frame to fall into a first through groove, manually taking out the separated frame, and placing the product in two directions when placing the product with the frame on the material cutting plate 21: when the product is an MSP40-GDF product, the columnar piece 51 of the product is correspondingly placed with the second through groove 23 on the material cutting plate 21, and when the product is an MSP-GDR product, the columnar piece 51 of the product is correspondingly placed with the placing hole 26 on the blanking machine 22, and by adopting the structure, the placing and the rib cutting operation of two frames of the MSP40-GDF and the MSP-GDR can be realized, namely, one device can meet the rib cutting processing of the two frames of the MSP40-GDF or the MSP-GDR;
and S2, bending and forming, namely manually pushing the MSP40-GDF or MSP-GDR product separated in the step S1 to a forming female die of a bending and forming device through a first rail, starting a punching machine, wherein a punching male die on the punching machine corresponds to pins on two sides of the MSP40-GDF or MSP-GDR product, and the pins are bent downwards under the punching action of the punching machine to finish the bending and forming operation.
Claims (8)
1. A rib cutting and forming device of a semiconductor device comprises a processing table, wherein a rib cutting device is arranged on the processing table, and a bending and forming device is arranged on one side of the rib cutting device, and is characterized in that a first rail arranged in parallel is arranged between the rib cutting device and the bending and forming device, the first rail comprises a plurality of strip-shaped first through grooves arranged in parallel, the rib cutting device comprises a cutting plate and a punching machine correspondingly arranged above the cutting plate, a strip-shaped second through groove is arranged on the cutting plate, the width of the second through groove is larger than the diameter of a cylindrical part on a product, the second through groove is arranged in the middle of the first through groove, extends along the first through groove and is communicated with the first rail and the bending and forming device, a punching cutter of the punching machine and a punching male die of the bending and forming device are respectively provided with a cylindrical part placing position matched with the cylindrical part, the cylindrical part placing position is a third through groove or a placing hole.
2. The device for cutting ribs and forming of a semiconductor device according to claim 1, wherein the third through groove is respectively disposed at the middle parts of the punching knife and the punching male die, the third through groove corresponds to the second through groove, and the punching knife is driven by a punching driving device.
3. A device for forming a semiconductor device as claimed in claim 1, wherein the placing holes correspond to the pillars below the placing holes, the number of the placing holes on each punching blade corresponds to the number of products on the frame, the shape of the placing holes matches the shape of the pillars, and the diameter of the placing holes is larger than that of the pillars.
4. The apparatus according to any one of claims 1 or 2, wherein two ends of the first rail extend linearly to two sides, one end of the first rail passes through a material cutting plate of the apparatus, and the other end of the first rail passes through a forming die of the apparatus.
5. The apparatus as claimed in claim 3, wherein the first through groove has a width greater than that of the product.
6. A bar cutting and forming device for semiconductor devices as claimed in claim 4, wherein the said punching blade is arranged corresponding to the frame of the edge of the said product, and the shapes of the said punching blade and the said cutting plate are matched with the structure of the frame.
7. The apparatus as claimed in claim 1, wherein the width of the third through groove is the same as the width of the second through groove.
8. The apparatus according to claim 1, wherein the bending apparatus is disposed at a position close to an edge of the processing table, the bending apparatus includes a forming die and a punch corresponding to a position above the forming die, the forming die includes the second through groove located at a middle portion of the forming die, first protruding plates are symmetrically disposed on two sides of the second through groove of the forming die, the first protruding plates correspond to pins on two sides of the product, the first protruding plates correspond to portions of the pins close to the base island, the punch includes a punching male die, second protruding plates are symmetrically disposed on the punching male die, two second protruding plates correspond to the pins on two sides of the base island, a width between the two second protruding plates is greater than a width between the two first protruding plates, the stamping male die is driven by a stamping driving device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920992657.9U CN210676585U (en) | 2019-06-28 | 2019-06-28 | Rib cutting forming device of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920992657.9U CN210676585U (en) | 2019-06-28 | 2019-06-28 | Rib cutting forming device of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210676585U true CN210676585U (en) | 2020-06-05 |
Family
ID=70902548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920992657.9U Withdrawn - After Issue CN210676585U (en) | 2019-06-28 | 2019-06-28 | Rib cutting forming device of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210676585U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110369608A (en) * | 2019-06-28 | 2019-10-25 | 无锡红光微电子股份有限公司 | The Trim Molding device of semiconductor devices |
| CN114769414A (en) * | 2022-06-21 | 2022-07-22 | 四川旭茂微科技有限公司 | Semiconductor forming and separating die |
-
2019
- 2019-06-28 CN CN201920992657.9U patent/CN210676585U/en not_active Withdrawn - After Issue
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110369608A (en) * | 2019-06-28 | 2019-10-25 | 无锡红光微电子股份有限公司 | The Trim Molding device of semiconductor devices |
| CN110369608B (en) * | 2019-06-28 | 2024-05-28 | 无锡红光微电子股份有限公司 | Cutting rib forming device of semiconductor device |
| CN114769414A (en) * | 2022-06-21 | 2022-07-22 | 四川旭茂微科技有限公司 | Semiconductor forming and separating die |
| CN114769414B (en) * | 2022-06-21 | 2022-09-20 | 四川旭茂微科技有限公司 | Semiconductor forming and separating die |
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| GR01 | Patent grant | ||
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| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20200605 Effective date of abandoning: 20240528 |
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| AV01 | Patent right actively abandoned |
Granted publication date: 20200605 Effective date of abandoning: 20240528 |