JP3465901B1 - Mounting board - Google Patents

Abstract

Abstract: PROBLEM TO BE SOLVED: To facilitate removal of a printed circuit board from a mounting board, to reduce warpage of the mounting board, to improve product yield, and to suppress the printed circuit board from falling off during automatic mounting. thing. SOLUTION: A mounting substrate 10 according to the present invention is formed by stamping a printed wiring board and fitting it into an original hole, a first printed circuit board 12, a second printed circuit board 14, and a second printed circuit board 14. 14 and the first printed circuit board 1
.. Or the second printed circuit boards 14, 14...
, And the frame portion 16 obtained by punching the second printed circuit boards 14, 14,.
And one or more Vs formed on the frame portion 16 along a line on or near the common tangent line and parallel to the common tangent line.
Cuts 18a to 18d are provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting board, and more specifically, for automatically mounting electronic parts on a printed circuit board, soldering, etc. while holding the printed circuit board pushed back. A mounting substrate.

[0002]

2. Description of the Related Art With the recent miniaturization of electronic equipment, there is an increasing demand for miniaturization and modification of printed circuit boards used in electronic equipment. On the other hand, an automatic electronic component mounting machine such as a chip mounter or an automatic insertion machine for mounting electronic components on a printed circuit board (hereinafter referred to as a "self-mounting machine") has a size of a work due to a transportation relation. Has an upper limit and a lower limit. Further, it is required that the outer shape of the work used for the self-mounting machine is substantially rectangular, that is, at least one side is a straight line and all or part of the sides perpendicular to this is a straight line. It

Therefore, when electronic components are mounted on a small-sized and odd-shaped printed circuit board by using a self-mounting machine, first, a plurality of printed circuit boards are formed on a printed wiring mother board, and a V-cut method, The printed circuit board is temporarily fixed to the original printed wiring board using the pushback method, and then the printed wiring board is of a size and shape that can be transported by a self-mounting machine (hereinafter , This is called a "mounting substrate").

Among them, the V-cut method inserts a V-shaped groove (V-cut) along a boundary line of a printed circuit printed on a printed wiring board and mounts electronic parts on the printed circuit, It is a method of breaking along the V-cut. Therefore, the V-cut method can be applied only to a printed circuit board whose outline is linear.

On the other hand, in the pushback method, the printed circuit board is sandwiched between the upper die and the lower die, and the printed circuit board is punched using a blade having a predetermined shape, and then the punched printed circuit board is punched. It is a method to fit in the original hole. The pushback method is particularly effective for automatically mounting electronic components on a deformed printed circuit board because the shape of the printed circuit board is not limited.

However, when the printed circuit board is punched out from the printed wiring board, a non-uniform force acts on the printed circuit board. A convex spherical warp may occur. If this warp becomes significant, it will be difficult to position the printed wiring board when cutting the outer shape, and it will be difficult to smoothly transfer the mounting board when the mounting board after cutting the outer shape is mounted on the machine. It becomes difficult to remove the printed circuit board after mounting the electronic components from the circuit board.

To solve this problem, various methods have heretofore been proposed. For example, in Patent Document 1, a tie bar push-back type pin hole in which slits are provided inward from the left and right side edges of the tie bar substrate at positions between the pushed back printed circuit boards and dead holes are provided around four corners of each printed circuit board. A processed printed circuit board is disclosed.

Further, Patent Documents 2 and 3 disclose a pushback method in which a wiring pattern is formed on an original plate and then a long hole is formed around a substrate portion along a punching line. Further, in Patent Document 4, a printed circuit board punched from a printed wiring board is fitted into the original hole, and a printed wiring board provided with a plurality of slits at the ears of the printed wiring board. Is disclosed by the present applicant.

[0009]

[Patent Document 1] Claim 1 of Japanese Patent Laid-Open No. 3-46291
And FIG.

[Patent Document 2] Claim 1 of Japanese Patent Application Laid-Open No. 3-60091
And FIG.

[Patent Document 3] Claim 1 of Japanese Patent Laid-Open No. 4-96290
And FIG.

[Patent Document 4] Claim 1 of Japanese Patent Application Laid-Open No. 2001-267700 and FIG.

[0010]

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention As described in Patent Documents 1 to 4, (1) slits (elongate cuts) communicating with the outer periphery of a mounting substrate and not communicating with a push-back printed circuit board. ), And a method of forming both of the waste holes communicating with the printed circuit board and not communicating with the outer circumference of the mounting board, (2) the outer circumference of the mounting board provided along the outer circumference of the printed circuit board, and A method of forming an elongated hole that does not communicate with any of the printed circuit boards, or (3) only slits (elongated cuts) that communicate with the outer periphery of the mounting board and do not communicate with the push-back printed circuit board The warp of the mounting substrate can be reduced by using any one of the above methods.

However, as described in Patent Document 1, when both the slit and the waste hole are provided in the mounting board, a part of the outer periphery of the printed circuit board is supported by the frame portion. . Therefore, the force with which the frame portion holds the printed circuit board becomes small, and there is a problem that the printed circuit board falls off during automatic mounting or soldering.

Further, as described in Patent Documents 2 and 3, the same is true in the case where a long hole is provided along the outer periphery of the printed circuit board, and between the punched long hole and the pushed back printed circuit board. Since the remaining elongated connecting portion is bent, the frame portion has a problem that the force for holding the printed circuit board becomes small.

On the other hand, as described in Patent Document 4, if only the slit is formed on the outer periphery of the mounting board and the waste holes around the printed circuit board are eliminated, the warp of the mounting board can be reduced. You can Moreover, since the distance between the printed circuit boards can be made as close as possible, the product yield is improved. Furthermore, since the entire circumference of the printed circuit board is supported by the frame part, the force of the frame part to support the printed circuit board becomes large, and the printed circuit board does not come off during automatic mounting or soldering. Almost nothing can be done.

However, even if the size of the warp does not hinder automatic mounting or soldering, depending on the shape and arrangement of the printed circuit board, the thickness of the mounting board, etc. Large residual stress may remain on the substrate. Therefore, it is difficult to remove the printed circuit board after the automatic mounting is completed, and there is a problem that work efficiency is significantly reduced.

The problem to be solved by the present invention is to provide a mounting board in which the printed circuit board is pushed back, and the printed circuit board can be easily removed after completion of automatic mounting. is there.

The problem to be solved by the present invention is as follows.
(EN) It is possible to provide a mounting board in which a printed circuit board can be easily removed after completion of automatic mounting, has no warp, has a high product yield, and is unlikely to drop off during automatic mounting.

[0017]

In order to solve the above-mentioned problems, a mounting board according to the present invention is a single piece having the same or different shape punched from a printed wiring board and fitted in the original hole. Alternatively, two or more printed circuit boards and at least one outer circumference of all or part of the printed circuit boards are at least one.
A frame portion obtained by punching the printed circuit board from the printed wiring board so as to contact one tangent line ,
The gist of the present invention is to include one or more first V-cuts formed in the frame along the tangent line or a line in the vicinity thereof and parallel to the tangent line.

If the first V-cut is formed on or near the tangent line with which the outer circumference of the pushed-back printed circuit board is in contact, the frame portion can be easily broken along the first V-cut. Further, at this time, since the frame portion releases the force for tightening the printed circuit board, the printed circuit board can be easily removed. Further, when only the slit is provided on the outer periphery of the frame part, the printed circuit board can be easily removed, and there is no warp, the product yield is high, and the accidental drop during automatic mounting does not easily occur. A mounting board is obtained.

The second mounting board according to the present invention is that two or more printed circuit boards having the same or different shapes punched from the printed wiring board and fitted in the original holes form a shared straight line portion. A printed circuit board assembly connected in a shared manner, a frame portion obtained by punching the printed circuit board assembly from the printed wiring board so that the shared linear portions are aligned, and the shared linear portion. A printed circuit board assembly and one or more second V-cuts formed on the frame portion along a line above or in the vicinity thereof and parallel to the shared straight line portion; Use as a summary.

When a second V-cut is formed along the shared straight line portion of the push-backed printed circuit board assembly,
The mounting board can be easily broken along the second V-cut. At this time, the printed circuit board assembly is separated into individual printed circuit boards, and at the same time, the frame portion releases the force for tightening the printed circuit board assembly, so that the printed circuit board can be easily removed. Further, when only the slit is provided on the outer periphery of the frame part, the printed circuit board can be easily removed, and there is no warp, the product yield is high, and the accidental drop during automatic mounting does not easily occur. A mounting board is obtained.

[0021]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described in detail below with reference to the drawings. FIG. 1A and FIG. 1B show a plan view and a sectional view taken along the line AA ′ of the mounting board according to the present embodiment, respectively. In addition,
In FIG. 1B, in order to clarify the V-cut state, the dimension of the mounting substrate in the thickness direction is drawn larger than the actual dimension.

In FIG. 1, the mounting substrate 10 includes a first printed circuit board 12, 12 ... and a second printed circuit board 1.
4, 14, ..., Frame portion 16, and V cuts 18a to 18d
(First V cut).

First printed circuit boards 12, 12 ... and second printed circuit boards
Each of the printed circuit boards 14, 14 ... Has been subjected to pushback processing, is punched from the printed wiring mother board (mounting board 10 before or after cutting the outer shape), and has its original holes. It is in fitted state.

The first printed circuit boards 12, 12 ... Have the same shape as each other, and have two straight line portions 12a, 12b parallel to each other on the left and right sides thereof. Further, the first printed circuit boards 12, 12, ... Are arranged in a line on the left side with respect to the transport direction of the mounting substrate 10 so that their outer circumferences contact a common tangent line . In the example shown in FIG. 1, the first printed circuit boards 12, 12, ...
a and 12b are arranged so as to be lined up on a straight line parallel to the transport direction. Further, component holes 12c, 12c ... For inserting lead wires of electronic components are formed in the first printed circuit boards 12, 12 ... As required.

The second printed circuit boards 14, 14 ...
The same structure as the first printed circuit boards 12, 12 ... Is provided, except that the printed circuit boards 12, 12 ... Have a symmetrical shape. That is, the second printed circuit board 1
4, 14, ... Have the same shape as each other, and on the left and right sides thereof,
It has two linear portions 14a and 14b which are parallel to each other. Further, the second printed circuit boards 14, 14, ... Are arranged in a line on the right side with respect to the transport direction of the mounting board so that the two straight line portions 14a, 14b are arranged on a straight line parallel to the transport direction. Has been done. Further, in the second printed circuit boards 14, 14, ..., If necessary, component holes 14c,
14c ... Are formed.

The first printed circuit board 1 shown in FIG.
2 and 12 and the second printed circuit boards 14 and 14 are merely examples, and the shape, arrangement, number of rows, number per row, etc. are not particularly limited.

For example, the first printed circuit boards 12, 12 ...
And / or the shape of the second printed circuit boards 14, 14 ...
A shape with a convex arc portion on the outside (eg, circle, ellipse, etc.)
And make sure that each of these arcs touches a common tangent line .
The printed circuit boards 12, 12 ... and / or the second printed circuit boards 14, 14 ... may be arranged.

Further, the first printed circuit boards 12, 12 ... and / or the second printed circuit boards 14, 14 ... do not necessarily have to have the same shape, and their outer circumferences contact at least one tangent line. May have different shapes as long as they are arranged in. In addition, in FIG.
There are four first printed circuit boards 12, 12 ... And second printed circuit boards 14, 14 ...
The number of printed circuit boards per row may be 1 to 3 or 5 or more. Further, the number of rows of the printed circuit boards is not limited to two rows, and the printed circuit boards having the same or different shapes may be arranged in one row or three rows or more.

The frame portion 16 includes the printed wiring board, the first printed circuit boards 12, 12, ... And the second printed circuit board 1.
This is the part that remains after punching 4, 14 ... Pushed back first printed circuit boards 12, 12 ... and second
The printed circuit boards 14, 14 ... Are fitted back into the original holes,
It is supported by the frame portion 16.

Reference holes 16a to 16d, which serve as references for automatic mounting, are provided at the four corners of the frame portion 16. Of these, the reference holes 16a and 16d are provided on the left side of the frame portion 16 so that the centers of the reference holes 16a and 16d are on a straight line parallel to the transport direction of the mounting substrate 10. In addition, the reference hole 16b,
16c is provided on the right side of the frame 16 so that its center is on a straight line parallel to the transport direction of the mounting substrate 10.

The number and position of the reference holes are not particularly limited, and the first printed circuit boards 12, 12 ...
The optimum one is selected according to the arrangement of the second printed circuit boards 14, 14, ... For example, when electronic components are automatically mounted on the entire surface of the mounting substrate 10 by one-time automatic mounting, the reference hole 16a at the upper left end and the reference hole 1 at the lower left end are provided.
6d is used as a main reference hole and a sub reference hole, respectively.

Further, in the first automatic mounting, automatic mounting is performed on the first printed circuit boards 12, 12 ... Which are arranged in a line on the left side, and then the mounting substrate 10 is rotated by 180 ° and arranged in a line on the right side. When performing the automatic mounting of the second printed circuit boards 14, 14, ..., In the first automatic mounting, the reference hole 16a at the upper left end and the reference hole 16d at the lower left end are respectively the main reference hole and the sub reference hole. In the second automatic mounting, the reference hole 16c at the lower right end and the reference hole 16b at the upper right end are used as the main reference hole and the sub reference hole, respectively.

Pushback reference holes 16e, 1 are arranged in a line at regular intervals at both left and right ends of the frame portion 16, respectively.
6e ... are provided. This pushback reference hole 1
6e, 16e ... Are used as reference holes when the pair of first printed circuit board 12 and second printed circuit board 14 arranged side by side are sequentially pushed back.

The outer periphery of the frame portion 16 is cut linearly. Further, in order to perform the automatic mounting accurately, at least one set of two intersecting two of the four sides forming the outer periphery of the frame 16 is intersected.
The sides must be orthogonal. For example, the reference hole 16a
And 16d are used as the main reference hole and the sub reference hole, respectively, and all the first printed circuit boards 1 can be formed by one automatic mounting.
When mounting electronic components on 2, 12, ... And the second printed circuit boards 14, 14, ..., At least the corners where the reference holes 16a are provided may be right angles.

On the other hand, in the case where the mounting substrate 10 is turned over 180 ° and automatically mounted in two steps, at least:
It is necessary that the two corners where the reference holes 16a and 16c are provided have a right angle. Further, all four corners may be right angles.

A plurality of left and right ends of the frame 16 communicate with the outer periphery of the frame 16 and do not communicate with the first printed circuit boards 12, 12 ... And the second printed circuit boards 14, 14. Slits (long and narrow cuts) 16f, 16f ... Are provided. The slits 16f, 16f ... Are for reducing the warp of the mounting substrate 10 (or the printed wiring mother board) that occurs after pushback.

In place of or in addition to the slits 16f, 16f, ... (1) The slits 16f, 16f ... Are not communicated with the outer periphery of the frame portion 16, and the first printed circuit boards 12, 12 ... "Disposal holes" communicating with the outer peripheries of the circuit boards 14, 14 ... and / or (2) the outer perimeter of the frame portion 16,
The first printed circuit boards 12, 12, ... And the second printed circuit boards 14, 14 ,.
The printed circuit boards 12, 12 ... Or the second printed circuit boards 14, 14 ... May be provided with “oblong holes” provided close to the outer circumference.

However, at the same time as reducing the warp of the mounting substrate 10, the product yield of the first printed circuit boards 12, 12 ... And the second printed circuit boards 14, 14 ... Is increased, and at the time of automatic mounting or soldering. In order to prevent accidental dropouts, the dead holes and oblong holes are eliminated and the slits 16f, 16f ...
It is preferable to provide only one.

Further, the frame portion 16 is on or near a common tangent line of the first printed circuit boards 12, 12 ... And the second printed circuit boards 14, 14 ... Which are lined up in a line along the carrying direction. V cut 18a along a line parallel to the tangent line
.About.18d are formed.

Here, "near the tangent line " means the first printed circuit boards 12, 12 ... And the second printed circuit boards 14, 1.
4 ... A position that does not hinder the quality and removal.
That is, the V cuts 18a to 18d are most preferably formed right above the tangent line , but it means that they may be slightly deviated from the tangent line .

For example, the first printed circuit boards 12, 12 ...
Alternatively, when the external dimensions of the second printed circuit boards 14, 14 ... Are not so important, the V cuts 18a to 18d are formed on the surfaces of the first printed circuit boards 12, 12 ... And the second printed circuit boards 14, 14 ... forming print circuit, and in a range that does not damage the electronic components mounted on the surface, tangent
It may be formed on the inner side of the line (on the side of the printed circuit board).

Further, the V cuts 18a to 18d may be formed on the outer side (frame side) with respect to the tangent line . In this case, only by breaking the mounting substrate 10 along the V cuts 18a to 18d, the first printed circuit boards 12, 12, ...
In some cases, the second printed circuit boards 14, 14 ... Are not completely separated.

However, V cuts 18a-18d
And the tangent line is relatively short, the connecting portion is easily broken only by bending the elongated strip-shaped mounting substrate 10 obtained after breaking along the V cuts 18a to 18d. However, the first printed circuit boards 12, 12 ... And the second printed circuit boards 14, 14 ... Can be easily separated.

However, if the distance between the V cuts 18a to 18d and the tangent line is too long, it is difficult to break the connecting portion. Therefore, when the V cuts 18a to 18d are formed outside the tangent line , The distance between the V-cuts 18a to 18d and the tangent is determined by the thickness of the mounting substrate 10, the first printed circuit board 12,
12 and the second printed circuit boards 14, 14 ... It is preferable to select an optimum value according to the shape, arrangement, and the like. Generally, if the distance between the V-cuts 18a to 18d and the tangent line is ¼ or less of the thickness of the mounting substrate 10, the connecting portion can be relatively easily broken.

The V cuts 18a to 18d are shown in FIG.
As shown in (b), it is most preferable that the mounting substrate 10 is formed on both surfaces, but it may be formed on only one surface as long as it does not hinder the breakage of the V cuts 18a to 18d.

Further, as illustrated in FIG. 1A, the first
By providing two parallel V-cuts 18a, 18b in contact with the printed circuit boards 12, 12, ..., The first printed circuit board 1
Although separation of 2, 12, ... Is extremely easy, when the lengths of the straight line portions 12a, 12b of the first printed circuit boards 12, 12, ... Are relatively long, only one of the V cuts 18a or 18b is provided. The first printed circuit boards 12, 12 ... Can be easily separated only by forming the. This also applies to the second printed circuit boards 14, 14 ...

On the other hand, the first printed circuit boards 12, 12 ... Have an arc portion or the like, and the first printed circuit boards 12, 12 ... and the V-cut are in point contact with each other via the arc portion or the like. 1st printed circuit board 12, 1
It is preferable to provide two or more V cuts in contact with 2. This also applies to the second printed circuit boards 14, 14 ...

Further, in the example shown in FIG. 1, the V-cuts 18a to 18d are provided in parallel to the carrying direction of the mounting board 10, but the V-cut is carrying the mounting board 10. It may be provided in a direction perpendicular to the direction, or in an oblique direction.

Further, as shown in FIG. 1, all the first printed circuit boards 12 and 1 arranged in parallel to the carrying direction.
2 (or second printed circuit boards 14, 14 ...) in contact with V cuts 18a, 18b (or V cuts 18c, 1)
8d) may be formed, but in particular, the first printed circuit boards 12, 12 ... (Or the second printed circuit boards 14, 14)
...) have different shapes from each other, the first V-cut which is in contact with or close to a part of the first printed circuit boards 12, 12 ... Which are vertically aligned and the remaining first
A second V-cut that is in contact with or close to the printed circuit boards 12, 12, ... May be formed.

The mounting substrate 10 according to this embodiment can be manufactured by the following method. First, N
Pushback reference holes 16e, 16e ... Are formed in the printed wiring board by using C or the like. Next, the printed wiring mother board is placed on the pushback mold, and the first printed circuit board 1 is set with the pushback reference holes 16e, 16e ...
2 and the second printed circuit board 14 are sequentially pushed back. At this time, the component holes 12c and 12 are formed in the printed wiring board.
It is preferable to form c ... And the slits 16f, 16f.

All the first printed circuit boards 12, 12 ...
After finishing the pushback of the second printed circuit boards 14, 14, ..., The outer shape of the frame 16 is cut to adjust the outer shape. In addition, before or after the outer shape cutting or at the same time as the outer shape cutting, the reference holes 16a to 16d which serve as a reference in the automatic mounting are formed. Further, the first printed circuit boards 12, 12 ...
If the V cuts 18a to 18d are formed along the common tangent line of the printed circuit boards 14, 14 ... Or the parallel lines in the vicinity thereof, the mounting substrate 10 according to the present embodiment is obtained.

The manufacturing method described above is merely an example, and the order of the steps can be changed as long as the property allows. For example, reference holes 16a to 1 for automatic mounting
6e may be formed at the same time as the pushback reference holes 16e, 16e .... Further, the outer shape cutting of the printed wiring board may be performed before the pushback or at the same time as the pushback.

Next, the mounting substrate 10 according to the present embodiment.
The action of will be described. The mounting substrate 10 according to the present embodiment is a push-backed first printed circuit board 1
2, 12 ... and second printed circuit boards 14, 14 ... Common
Since V cuts 18a to 18d are formed on or near the tangent line of V cuts 18a to 1d after the automatic mounting is completed.
The mounting substrate 10 can be easily broken along 8d.

When the mounting substrate 10 is broken along the V cuts 18a to 18d, the frame portion 16 releases the force for tightening the first printed circuit boards 12, 12 ... And the second printed circuit boards 14, 14. It Therefore, the first printed circuit boards 12, 12 ... And the second printed circuit boards 14, 14 ... Can be easily removed, and work efficiency is significantly improved.

Further, when the mounting board 10 is further provided with slits 16f, 16f, ... On the outer periphery thereof, the frame portion 16 clamps the first printed circuit boards 12, 12, ... And the second printed circuit boards 14, 14. The warpage that occurs in the mounting substrate 10 can be reduced without weakening the force. Therefore, it is possible to carry out smoothly during automatic mounting,
The first printed circuit boards 12, 12 ... And the second printed circuit boards 14, 14 ... Can be easily removed. In addition, the material yield is improved, and further, it is possible to prevent a falling accident during automatic mounting or soldering.

Next, a mounting board 20 according to a second embodiment of the present invention will be described. 2 (a) and 2
FIG. 2B shows a plan view and a cross-sectional view taken along the line AA ′ of the mounting board according to the present embodiment, respectively. Note that FIG.
In (b), in order to clarify the V-cut state, the dimension of the mounting substrate in the thickness direction is drawn larger than the actual dimension.

In FIG. 2, the mounting substrate 20 includes printed circuit board combinations 22, 22, ..., A frame 24, and a V cut 26 (second V cut).

The printed circuit board assembly 22, 22, ... Has been subjected to pushback processing, is punched from the printed wiring mother board (the mounting substrate 20 before or after cutting the outer shape), and is the original material. It is in a state of being fitted into the hole.

The printed circuit board assembly 22 is formed by connecting the first printed circuit board 22a and the second printed circuit board 22b, which have a bilaterally symmetrical shape, so as to share the shared straight line portion 22c. Also, the printed circuit board assembly 22, 2
2 ... are arranged in a line in the transport direction so that the shared linear portions 22c, 22c ... Are aligned on a straight line. Further, the printed circuit board assembly 22, 22, ... Has a component hole 22 for inserting a lead wire of an electronic component, if necessary.
d, 22d ... Are formed.

The length of the shared straight line portion 22c connecting the first printed circuit board 22a and the second printed circuit board 22b is not particularly limited, and is a length that does not hinder the punching of the printed circuit board assembly 22. I wish I had it.

The shape of the portion other than the shared straight line portion 22c of the printed circuit board assembly 22 is not particularly limited. For example, the printed circuit board assembly 22 may be a combination of a first printed circuit board 22a and a second printed circuit board 22b having completely different shapes with the shared linear portion 22c interposed therebetween. Also, the printed circuit board assembly 22 is
The invention is not limited to the combination of two printed circuit boards, and three or more printed circuit boards may be connected so as to share one or two or more shared linear portions.

Further, on the mounting substrate 20, there are two printed circuit board combinations 22, 22 ... Having the same or different shapes.
It may be arranged in parallel over more than one row.
Further, the number of rows of the printed circuit board assembly 22, 22, ..., The number per row, etc. are not particularly limited.

The frame portion 24 is a portion that remains after the printed circuit board assembly 22 is punched from the printed wiring board.
The push-backed printed circuit board assembly 22 is fitted back into the original hole and is supported by the frame portion 24.

Reference holes 24a to 24d are provided at four corners of the frame portion 24 as references for automatic mounting. Also,
Pushback reference holes 24e, 24e, ... Are provided in a row at regular intervals at the left and right ends of the frame portion 24, respectively. Further, the outer periphery of the frame portion 24 is linearly cut at four sides so that at least one set of two intersecting sides are orthogonal to each other. Furthermore, the left and right ends of the frame portion 24 communicate with the outer periphery of the frame portion 24, and the printed circuit board assembly 2
A plurality of slits 24f not communicating with 2, 22, ...
24f ... Are provided.

The reference hole 24a provided in the frame portion 24
24d, pushback reference holes 24e, 24e ..., And slits 24f, 24f ... Other configurations are the frame part 16 of the mounting substrate 10 according to the first embodiment.
Since they are the same as the reference holes 16a to 16d, the pushback reference holes 16e, 16e ... And the slits 16f, 16f. Further, all of the two facing corners or four corners of the frame portion 24 may be right angles, as in the first embodiment.

Further, the printed circuit board assembly 22 and the frame portion 24 are arranged on the printed circuit board assembly 22 aligned in a straight line.
The V-cut 26 is formed on the shared straight line portion 22c or along a line in the vicinity thereof and parallel to the shared straight line portion 22c.

Here, "near the shared straight line portion" means the first printed circuit board 22a and the second printed circuit board 22b obtained by dividing the printed circuit board assembly 22 along the shared straight line portion 22c. The position that does not affect the shape and quality. That is, the V cut 26 is most preferably formed right above the shared straight line portions 22c aligned in a straight line, but high shape accuracy is not required for the first printed circuit board 22a and the second printed circuit board 22b. In this case, it means that the printed circuit printed on the surface and the electronic components mounted on the surface may be slightly offset from the shared straight line portion 22c to the left or right within a range that does not damage the printed circuit.

The V-cut 26 is most preferably formed on both sides of the mounting substrate 20 as shown in FIG. 2B, but may be formed on only one side. Further, the V-cut 26 (that is, each shared linear portion 22c) may be formed parallel to the transport direction of the mounting substrate, or
It may be provided in a direction orthogonal to the conveying direction or in an oblique direction. When three or more printed circuit boards are connected via two or more shared straight line portions, two or more V cuts may be formed on or near each shared straight line portion. Good. Furthermore, when forming a plurality of V cuts,
The respective V-cuts do not have to be parallel to each other, and the respective V-cuts may intersect with each other when the arrangement of the printed circuit board combinations is optimized according to the position of the shared straight line portion.

The mounting board 20 according to the present embodiment can be manufactured by a method substantially similar to that of the mounting board 10 according to the first embodiment. That is, first, by using NC or the like, the pushback reference hole 2 is formed on the printed wiring board.
4e, 24e ... Are formed. Next, place the printed wiring board on the pushback mold and pushback reference hole 2
Printed circuit board assembly 22 based on 4e, 24e ...
Push back is performed sequentially. At this time, component holes 22d, 22d ... And slits 24f, 24 are formed in the printed wiring board.
It is preferable to form f ... at the same time.

All printed circuit board combinations 22, 22
After the pushback of ... Is finished, the outer shape of the frame portion 24 is cut to adjust the outer shape. In addition, before and after the outer shape cutting or at the same time as the outer shape cutting, the reference holes 24a to 24a serving as a reference in the automatic mounting.
24d is formed. Further, the printed circuit board assembly 2
V cut 26 along the shared straight line portion 22c of 2, 22 ...
By forming, the mounting substrate 20 according to the present embodiment is obtained. In the manufacturing method described above, the order of the steps may be changed as long as the property allows.
This is the same as the embodiment.

Next, the mounting substrate 20 according to the present embodiment.
The action of will be described. In the mounting substrate 20 according to the present embodiment, the V cut 26 is formed on or near the shared linear portion 22c of the push-back printed circuit board assembly 22, 22, ... The mounting substrate 20 can be easily broken along the cut 26.

When the mounting substrate 20 is broken along the V-cut 26, the printed circuit board assembly 22 can be divided into the first printed circuit board 22a and the second printed circuit board 22b. Further, at the same time, the frame portion 24 releases the force for fastening the first printed circuit boards 22a, 22a ... And the second printed circuit boards 22b, 22b ... Therefore, the first printed circuit boards 22a, 22a. The printed circuit boards 22b, 22b ... Can be easily removed, and work efficiency is greatly improved.

Further, when the slits 24f, 24f, ... Are further provided on the outer periphery of the mounting board 20, the mounting board 20 is not weakened by the frame portion 24 for tightening the printed circuit board assembly 22, 22 ,. It is possible to reduce the warpage that occurs in the. Therefore, it is possible to smoothly carry the automatic mounting, and the first printed circuit boards 22a and 22a can be carried.
... and the second printed circuit boards 22b, 22b ... Are also easily removed. In addition, the material yield is improved, and further, it is possible to prevent a falling accident during automatic mounting or soldering.

Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above embodiments and various modifications can be made without departing from the gist of the present invention. is there.

For example, in the second embodiment described above, an example in which the V-cut 26 (second V-cut) is formed along the shared straight line portion 22c of the printed circuit board assembly 22 has been described. in addition to the cut 26, one or more V-cut having the same configuration as in the first embodiment (i.e., the printed circuit board conjugates 22, 22 co of
One or more V-cuts (third V-cuts) formed on or near the common tangent line and parallel to the tangent line may be further formed.

[0076]

The first mounting board according to the present invention has the first V-cut formed on or near the tangent line of the pushed-back printed circuit board. The printed circuit board can be easily removed from the frame simply by breaking along the first V-cut.

The second mounting board according to the present invention has the second V-cut formed on or near the shared straight line portion of the push-backed printed circuit board assembly. The printed circuit board assembly can be divided into individual printed circuit boards by simply breaking the mounting board along the second V-cut, and the printed circuit board can be easily removed from the frame portion. effective.

In addition to the second V-cut, a third line is formed on or near the tangent line that contacts the outer periphery of the printed circuit board assembly .
Forming the V-cut has the effect of further facilitating the removal of the printed circuit board.

Further, when the slits are formed on the outer periphery of the mounting board, warpage of the mounting board is reduced, removal of the printed circuit board is facilitated, product yield is improved, and automatic mounting and soldering are performed. This has the effect of almost eliminating accidental dropouts.

[Brief description of drawings]

FIG. 1A is a plan view of a mounting board according to a first embodiment of the present invention, and FIG.
FIG. 6 is a schematic cross-sectional view taken along the line A ′.

FIG. 2A is a plan view of a mounting board according to a second embodiment of the present invention, and FIG.
FIG. 6 is a schematic cross-sectional view taken along the line A ′.

[Explanation of symbols]

10 Mounting board 12 First printed circuit board 14 Second printed circuit board 16 frame 16f slit 18a-18d V cut (first V cut) 20 Mounting board 22 Printed circuit board combination 22a First printed circuit board 22b Second printed circuit board 22c Shared straight line part 24 frame 26 V cut (second V cut)

Continuation of front page (58) Fields surveyed (Int.Cl. ⁷ , DB name) H05K 1/02 H05K 3/00

Claims (4)

(57) [Claims] 1. A die having a same or different shape punched from a printed wiring board and fitted in an original hole.
A printed circuit board assembly in which two or more printed circuit boards are connected to share a shared straight line portion, and the printed circuit board assembly is punched out from the printed wiring board so that the shared straight line portions are aligned. And a frame portion obtained by, and along one or more of the shared straight line portion and a line parallel to the shared straight line portion on or near the shared straight line portion. A mounting substrate having a V cut of 2. 2. The printed circuit board is part of the outer periphery thereof.
Has a straight part and a curved part, The printed circuit board assembly may have the same or different shapes.
Two or more of the printed circuit boards that form the straight line portion
The method according to claim 1, wherein the common straight portions are connected to each other.
Mounting board for mounting. 3. A frame formed along the tangent line that is in contact with the outer periphery of one or more printed circuit board assemblies or is in the vicinity of the tangential line and that is parallel to the tangent line. Or 2
The mounting board according to claim 1 , further comprising the third V cut described above. 4. The mounting board according to claim 1, further comprising a slit that communicates with an outer periphery of the frame portion and does not communicate with the printed circuit board.