JP3976448B2 - Method for dividing printed circuit board - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method of dividing the printed circuit board to be used for electronic devices, and more particularly to a method of dividing the printed board on which an electronic component is mounted.
[0002]
[Prior art]
Generally, a printed wiring board using a resin material such as a glass epoxy base material or a BT resin is used for the configuration of a wiring pattern in an electronic device. In consideration of production efficiency, this printed wiring board is formed by punching a plurality of printed boards on a fixed board. Further, in order to adjust the size to the standard board, there is a case where a remaining margin part where a circuit pattern is not formed is provided at the edge part of the printed board. A plurality of electronic components are mounted on such a fixed board provided with a plurality of printed boards and a remaining margin, and after mounting the electronic components, division for each printed board and division removal of the remaining margin portions are performed. It will be. The division for each printed board and the division removal of the remaining margin are performed by cutting the fixed board along a V-shaped groove provided on the fixed board.
[0003]
FIG. 8 is a structural diagram showing the operation of a dedicated machine for cutting such a standard substrate. Here, (a) of FIG. 8 shows a side view of the dedicated machine 110, and (b) of FIG. 8 shows an XX sectional view shown in (a) of FIG. As shown in this figure, V-shaped cutting lines 100a and 100b, which are V-shaped grooves, are provided on the front and back surfaces of the standard substrate 100, and the dedicated machine 110 has guide plates 112a and 112b that the dedicated machine 110 has. , 112c and 112d, the circular blades 111a and 111b are rotated while tracing the V-shaped cutting lines 100a and 100b to cut the standard substrate 100.
[0004]
As described above, the standard substrate 100 is cut along the V-shaped cutting lines 100a and 100b. The parts for customer operation such as switches and the operation confirmation parts such as LEDs are the edge portions of the printed wiring board. In this case, some of these components are arranged on the V-shaped cutting lines 100a and 100b. In this way, when the parts are arranged on the V-shaped cutting lines 100a and 100b, cutting with the dedicated machine 110 shown in FIG. 8 is not possible. Therefore, when forming a wiring pattern having such a configuration, only the components placed on the V-shaped cutting lines 100a and 100b are retrofitted by hand soldering, or after mounting the components, the standard substrate 100 is attached to the V-shaped cutting line. Either split along the lines 100a and 100b, or divide the standard board 100 for each printed circuit board before mounting all the components, and solder each component to the divided printed circuit board by flow. You must take the method.
[0005]
[Problems to be solved by the invention]
However, when only the components arranged on the V-shaped cutting lines 100a and 100b are retrofitted with the manual soldering, after the soldering by the flow is once performed, a further manual soldering process is added. There is a problem that it increases.
[0006]
In addition, in the method in which the fixed board 100 is manually split along the V-shaped cutting lines 100a and 100b after the parts are mounted, the printed board and the mounted parts are distorted by the force applied during the splitting, and this destroys the surface mounted parts. There is a problem that it will.
[0007]
Furthermore, in the case of a method in which the standard substrate 100 is divided for each printed circuit board before mounting all the components, and each component is soldered to the divided printed circuit board in a flow, the flow is each printed circuit board having various sizes. Therefore, there is a problem that it takes time to set up the flow process.
[0008]
In addition, since there are parts that protrude from the edge of the printed circuit board at the edge part of the printed circuit board, when flowing after dividing each printed circuit board, the components that protrude from the edge of the printed circuit board are the edges of the conveyor in the flow process. There is also a problem that interference occurs and a defect occurs in the flow process.
[0009]
The present invention has been made in view of such a point, and even when components are arranged on a V-shaped cutting line, the mounted components are not destroyed without increasing the number of production steps. Another object of the present invention is to provide a method for dividing a printed circuit board that does not require a special flow process.
[0011]
[Means for Solving the Problems]
In the present invention, in order to solve the above problems, in a method for dividing a printed circuit board on which electronic components are mounted , a groove is formed on a substrate cutting line, a plurality of substrate holding holes are formed along the groove, A printed circuit board characterized in that a holding pin whose outer diameter is larger than the inner diameter of the substrate holding hole is inserted into the board holding hole, and the printed board is divided by applying a force to the printed board using the holding pin as a fulcrum. Are provided.
[0013]
By dividing in this way, the force applied during the division can be concentrated on the holding pins, and the component mounting portion of the printed circuit board is not distorted.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
First, a first embodiment of the present invention will be described. The printed circuit board according to the first embodiment has an edge portion where a circuit pattern is not formed. In this embodiment, the edge portion is divided and removed.
[0015]
FIG. 2 is a structural diagram showing the printed circuit board 1 in this embodiment. Here, FIG. 2A is a plan view of the printed circuit board 1, and FIG. 2B is a cross-sectional view taken along the line CC in FIG.
[0016]
The printed circuit board 1 has a mounting region 1d where a circuit pattern is formed and an electronic component is mounted, and an edge portion 1e formed at an edge portion of the printed circuit board 1. Grooves 1a and 1b having a V-shaped cross section are formed in a linear shape at the boundary portion of the edge portion 1e in the printed circuit board 1 to delimit the edge portion 1e. Here, the groove 1a is formed on the front surface of the printed circuit board 1, and the groove 1b is formed on the back surface of the printed circuit board 1. The grooves 1a and 1b are arranged so that the V vertices of the grooves 1a and 1b face each other. A plurality of substrate holding holes 1c are arranged in the vicinity of the grooves 1a and 1b on the mounting region 1d side that separate the grooves 1a and 1b, along lines formed by the grooves 1a and 1b. The distance L from the grooves 1a and 1b of the board holding hole 1c, the inner diameter φD of the board holding holes, and the pitch P between the board holding holes 1c are conditions such as the thickness of the printed board 1, the number of layers, and the depth of the grooves 1a and 1b. To select the optimum value. As an example, when the thickness of the substrate is 1.6 mm and the depth of each of the grooves 1a and 1b is 0.6 mm, it is preferable that L = 3 mm, P = 10 mm, and φD = 2 mm. In FIG. 2, the substrate holding hole 1c is formed so as to penetrate the front and back surfaces of the printed circuit board 1. However, the substrate holding hole 1c may be formed so as not to penetrate the front and back surfaces. Further, although the substrate holding hole 1c is cylindrical in FIG. 2, it may be a rectangular parallelepiped, a regular hexagonal cylinder, or other shapes.
[0017]
FIG. 3 is a structural diagram showing the holding pin 2 used in this embodiment. 2A is a side view of the holding pin 2, and FIG. 2B is a plan view of the holding pin 2. The holding pins 2 have a holding portion 2b having a cylindrical shape whose outer diameter is larger than the inner diameter of the substrate holding hole 1c shown in FIG. 2, and a tapered structure in which at least a part of the outer diameter is smaller than the inner diameter of the substrate holding hole 1c. The tapered portion 2a is used. The material constituting the holding pin 2 can be used without particular limitation as long as it has a certain degree of hardness.
[0018]
FIG. 1 is a cross-sectional view showing a state in which the printed circuit board 1 in this embodiment is divided. Here, FIG. 1A shows a state before applying a force for dividing, FIG. 1B shows a state in the middle of dividing the printed circuit board 1, and FIG. 1C shows a printed circuit board 1 after dividing. The state of is shown. The division removal of the edge part 1e in the printed circuit board 1 of this form is performed after the electronic component mounting to the mounting area | region 1d similarly to the conventional process.
[0019]
When dividing the printed circuit board 1, first, the tapered portion 2 a of the holding pin 2 is inserted into the substrate holding hole 1 c from the back surface of the printed circuit board 1. At this time, since the outer diameter of the holding portion 2b is larger than the inner diameter of the substrate holding hole 1c, the holding portion 2b is not accommodated in the substrate holding hole 1c, and the holding portion 2b is printed from the back surface of the printed board 1. The substrate 1 is held.
[0020]
After the holding pin 2 is inserted into the substrate holding hole 1c, a force is then applied to the tip portion of the edge portion 1e, and the edge portion 1e is divided and removed. At this time, force is applied in the direction A shown in FIG. 1A, and the force is used to divide the grooves 1a and 1b. The edge portion 1e to which the force in the A direction is applied is thereby distorted. However, since the force is held by the holding portion 2b with the contact portion B between the holding portion 2b of the holding pin 2 and the printed circuit board 1 as a fulcrum, the force applied to the edge portion 1e is greater than that of the holding pin 2. It is not added to the mounting area 1d side, and no distortion occurs in the mounting area 1d.
[0021]
When the strain due to the force applied in the direction A exceeds the mechanical strength of the printed circuit board 1 in the grooves 1a and 1b, the printed circuit board 1 is divided at the grooves 1a and 1b, as shown in FIG. Thus, the edge portion 1e is divided and removed.
[0022]
Thus, in this embodiment, the holding pin 2 is inserted into the board holding hole 1c formed in the vicinity of the grooves 1a and 1b of the printed board 1, and the back surface of the printed board 1 is held using the holding portion 2b of the holding pin 2 as a fulcrum. Since force is applied to the edge portion 1e and the edge portion 1e is divided, the edge portion 1e can be divided and removed without destroying the mounted components.
[0023]
Further, in this embodiment, since the edge portion 1e is divided and removed after mounting components on the printed circuit board 1 as in the conventional process, the edge portion 1e can be divided and removed without increasing the number of production steps. Yes.
[0024]
Furthermore, in this embodiment, since the edge portion 1e is removed after mounting the component on the printed circuit board 1 as in the conventional process, even if the component is disposed on the grooves 1a and 1b. The manufacturing can be performed using the same flow process as that of the prior art.
[0025]
Next, a second embodiment of the present invention will be described. The method for dividing the printed circuit board 10 according to this embodiment is obtained by adding a holding base and a spring 12 for holding the printed circuit board 10 to the dividing method described in the first embodiment.
[0026]
FIG. 4 is a cross-sectional view showing how the printed circuit board 10 according to the second embodiment is divided. In the present embodiment, one end of the printed circuit board 10 on the mounting area 10 b side is held by the holding table 11, and a spring 12 is attached to the holding table 11.
[0027]
The division removal of the edge portion 10a is performed by applying a force in the E direction to the edge portion 10a as in the case of the first embodiment. Since the printed board 10 is held with the holding pin 13 as a fulcrum as in the first embodiment, when a force in the direction from the front surface to the back surface of the printed board 10 (E direction) is applied to the edge portion 10a, the printed board 10 is printed. As shown in FIG. 4B, one end of the substrate 10 on the mounting region 10b side moves while being inclined in a direction (F direction) from the back surface to the surface opposite to the E direction. Further, when the divisional removal of the edge portion 10a is completed and no force is applied to the printed circuit board 10, one end on the mounting region 10b side of the printed circuit board 10 is directed from the front surface to the back surface of the printed circuit board 10 opposite to the F direction. To reach the position shown in FIG.
[0028]
The vertical movement on the mounting area 10b side of the printed circuit board 10 when the edge portion 10a is divided and removed is followed by the spring 12, and the holding base 11 always holds the printed circuit board 10 while the printed circuit board 10 is moving.
[0029]
As described above, in this embodiment, the edge portion 10a is divided and removed while holding one end of the printed board 10 on the mounting region 10b side with the holding base 11 to which the spring 12 is attached. Even when the printed circuit board 10 is tilted at the time of removal, it is possible to suppress the distortion of the mounting region 10b caused by the weight of the printed circuit board 10 itself.
[0030]
Next, a third embodiment of the present invention will be described. This embodiment is an application example of the first embodiment, in which the method described in the first embodiment is applied to the division of a printed circuit board.
[0031]
FIG. 5 is a cross-sectional view showing how the printed circuit board 20 in the present embodiment is divided.
The printed circuit board 20 of the present embodiment has two mounting areas 20e and 20f on which electronic components are mounted, and grooves 20a and 20b are provided on a board cutting line between the mounting areas 20e and 20f. . A plurality of substrate holding holes 20c, 20d are arranged along the grooves 20a, 20b on the mounting region 20f side of the grooves 20a, 20b and on the mounting region 20e side of the grooves 20a, 20b. 20d, holding pins 22 and 23 are inserted, and the holding pins 22 and 23 hold the back surface of the printed circuit board 20.
[0032]
As shown in FIG. 5B, the printed circuit board 20 is divided in the direction from the back surface to the front surface of the printed circuit board 20 in the vicinity of the holding pins 22 and 23 on the back surface of the printed circuit board 20 in the mounting regions 20e and 20f (G direction). ) And the grooves 20a and 20b are bent. When such pressurization is performed, the printed circuit board 20 is bent with the groove 20a inside, and the force generated in the bent part is based on the holding pins 22 and 23 and the contact portions H and I on the back surface of the printed circuit board 20 as fulcrums. Retained. Therefore, the distortion of the printed circuit board 10 caused by the bending is limited only to the vicinity of the grooves 20a and 20b sandwiched between the contact portion H and the contact portion I, and no distortion occurs in the mounting regions 20e and 20f.
[0033]
When the distortion caused by the bending exceeds the mechanical strength of the printed circuit board 20 in the grooves 20a and 20b, the printed circuit board 20 is divided at the grooves 20a and 20b, and the printed circuit board 20 is divided as shown in FIG. Will be performed.
[0034]
Thus, in this embodiment, the grooves 20a and 20b are provided on the substrate cutting line of the printed circuit board 20, a plurality of substrate holding holes 20c and 20d are formed on both sides thereof, and the holding pins 22 and 23 are formed in the substrate holding holes 20c and 20d. Since the printed circuit board 20 is divided using the holding pins 22 and 23 as fulcrums, the printed circuit board 20 can be divided without causing distortion in the mounting areas 20e and 20f, and the components mounted during the division are destroyed. It never happens.
[0035]
Next, a fourth embodiment of the present invention will be described.
This embodiment is an application example of the first embodiment. FIG. 6 shows a plan view of the printed circuit board 30 in the present embodiment.
[0036]
The printed circuit board 30 includes grooves 30a and 30b for dividing the substrate, a router processed portion 30c that is a cut-out portion of the printed circuit board 30, and a plurality of substrate holding holes 30d arranged along the grooves 30b.
[0037]
In the case of the printed circuit board 30, first, cutting is performed at the groove 30a portion. This cutting may be performed by a dedicated machine, or may be performed manually by forming a substrate holding hole along the groove 30a. Next, as in the first embodiment, a holding pin is inserted into the substrate holding hole 30d, and splitting is performed at the groove 30b.
[0038]
In this way, in this embodiment, the board 30 is provided with the grooves 30b, the board holding holes 30d are provided along the grooves 30b, and the holding pins are inserted into the board holding holes to divide the printed board 30. Then, the substrate can be divided even in a complicated shape that cannot be cut.
[0039]
Next, a fifth embodiment of the present invention will be described.
This embodiment is an application example of the first embodiment. FIG. 7 shows a plan view of the printed circuit board 40 in this embodiment.
[0040]
In the printed circuit board 40, grooves 40a are formed in the substrate dividing portion on the curve, and a plurality of substrate holding holes 40b are formed along the grooves 40a. As in the first embodiment, a holding pin is inserted into the substrate holding hole 40b, and the substrate is divided from the groove 40a using the holding pin as a fulcrum.
[0041]
As described above, in this embodiment, the groove 40a is formed in the substrate dividing portion, and the printed board is divided using the holding pins inserted into the plurality of substrate holding holes 40b formed along the groove 40a as fulcrums. The substrate can be divided even when the substrate dividing unit is configured with a curve that cannot be cut by a conventional dedicated machine.
[0042]
【The invention's effect】
As described above, in the present invention, a groove is provided on the substrate cutting line of the printed circuit board, and a plurality of substrate holding holes are formed along the groove. Therefore, the printed circuit board has the holding pins inserted into the substrate holding holes as fulcrums. Even when the components are arranged in a board cutting line shape, the printed circuit board can be divided without destroying the mounted components.
[0044]
Also , since a groove is provided on the board cutting line of the printed board and a plurality of board holding holes are formed along the groove, the printed board can be divided using the holding pins inserted into the board holding holes as fulcrums, and the components are printed on the board. Even if it is a case where it arranges in a cut line shape, it can manufacture using the same flow process as before.
[0047]
Also, a groove is provided on the board cutting line of the printed board, a plurality of board holding holes are formed along the groove, the holding pins are inserted into the board holding holes, and force is applied to the printed board using the holding pins as fulcrums. Since the division is performed, even when the components are arranged in a board cutting line shape, manufacturing can be performed using the same flow process as the conventional one.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing how a printed circuit board is divided.
FIG. 2 is a structural diagram showing a printed circuit board.
FIG. 3 is a structural view showing a holding pin.
FIG. 4 is a cross-sectional view showing a state in which a printed board is divided.
FIG. 5 is a cross-sectional view showing how a printed circuit board is divided.
FIG. 6 is a plan view of a printed circuit board.
FIG. 7 is a plan view of a printed circuit board.
FIG. 8 is a structural diagram showing the operation of a dedicated machine for cutting a fixed-size substrate.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Printed circuit board 1a Groove 1b Groove 1c Substrate holding hole 1d Mounting area 1e Edge part 2 Holding pin 2a Taper part 2b Holding part

Claims (4)

In a method for dividing a printed circuit board on which electronic components are mounted,
Forming a groove on the substrate cutting line,
There along the groove, and forming a plurality of substrate holding holes on at least one side of the circuit pattern is formed,
Insert a holding pin whose outer diameter is larger than the inner diameter of the substrate holding hole into the substrate holding hole,
The printed board is held by the holding pins, and a force is applied to rotate the printed board in the direction opposite to the component mounting surface with the board cutting line as an axis with the position held by the holding pins as a fulcrum. Dividing the printed circuit board by the groove on the substrate cutting line .   2. The method for dividing a printed circuit board according to claim 1, wherein the printed circuit board is divided while holding a part of the printed circuit board with an elastic body. The printed circuit board according to claim 1, wherein a router process is performed from one end of the groove formed on a part of the substrate cutting line to another groove formed to face the groove. How to split. 2. The printed board dividing method according to claim 1, wherein the groove is formed in a curved shape.

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