JP2001015866A - Printed board and method for splitting the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To avoid causing stresses at a part mounting part of a printed board at splitting by providing a groove on a board cutting line while a plurality of board holding holes are arrayed along the groove. SOLUTION: Grooves 1a and 1b of V-shape in cross-section profile are formed linearly at the border of an edge part 1e of a printed board 1. A plurality of board holding holes 1c are arranged along the line formed of the grooves 1a and 2b, near the grooves 1a and 1b on the side of mounting region 1d across the grooves 1a and 1b. At splitting of the printed board 1, firstly a tapered part 2a of a holding pin 2 is inserted into the board holding hole 1c from the rear surface of the printed board 1. Then, the tip end part of the edge part 1e is applied with a force to split and remove the edge part 1e. Here, with a force applied in A direction, the force is supported by a holding part 2b with a contact part B between the holding part 2b of the holding pin 2 and the printed board 1 as a supporting point. Thus, no distortion is generated on the side of a mounting region 1d.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board used in electronic equipment and a method of dividing the same, and more particularly to a printed circuit board on which electronic components are mounted and a method of dividing the same.

[0002]

2. Description of the Related Art Generally, a printed wiring board using a resin material such as a glass epoxy base material or BT resin is used for a wiring pattern in an electronic device. This printed wiring board is formed by punching a plurality of printed boards on a certain fixed-size board in consideration of production efficiency. In addition, in order to adjust the size to the fixed-size substrate, there may be a case where a remaining portion where a circuit pattern is not formed is provided at an edge portion of the printed circuit board. A plurality of electronic components are mounted on the fixed-size substrate on which the plurality of printed boards and the remaining margin are provided. After the mounting of the electronic components, division for each printed board and division and removal of the remaining margin are performed. It will be. The division of each printed circuit board and the division and removal of the remaining portion are performed by cutting the fixed-size substrate along a V-shaped groove provided in the fixed-size substrate.

FIG. 8 is a structural diagram showing the operation of a dedicated machine for cutting such a fixed-size substrate. Here, FIG. 8A shows a side view of the special-purpose machine 110, and FIG. 8B shows a cross-sectional view taken along line XX of FIG. 8A. As shown in the figure, V-shaped cutting lines 100a and 100b, which are V-shaped grooves, are provided on the front and back surfaces of the fixed-size substrate 100, and the dedicated machine 110 is provided with guide plates 112a and 112b included in the dedicated machine 110. , 112c and 112d, the circular blades 111a and 111b are rotated while tracing the V-shaped cutting lines 100a and 100b,
Cut 0.

[0004] The cutting of the fixed-size substrate 100 is performed along the V-shaped cutting lines 100a and 100b. Parts for customer operation such as switches and parts for operation confirmation such as LEDs are printed wiring boards. In many cases, some of these components are arranged on the V-shaped cutting lines 100a and 100b.
When the components are arranged on the V-shaped cutting lines 100a and 100b as described above, the cutting by the dedicated machine 110 shown in FIG. 8 cannot be performed. Therefore, when forming a wiring pattern having such a configuration, the V-shaped cutting lines 100a and 100
b, only the components to be placed on the substrate are manually soldered, or after the components are mounted, the fixed-size substrate 100 is connected to the V-shaped cutting line 100.
a, 100b, or split the fixed-size board 100 for each printed board before mounting all components,
Each of the components must be soldered to the divided printed circuit board by flow, or one of these methods must be adopted.

[0005]

However, when only the components arranged on the V-shaped cutting lines 100a and 100b are to be retrofitted by hand soldering, a soldering process is once performed, and then a manual soldering process is added. Therefore, there is a problem that the number of production steps increases.

After the components are mounted, the fixed-size substrate 100 is
The method of manually splitting along the mold cutting lines 100a and 100b has a problem that the printed board and the mounted components are distorted by the force applied at the time of the manual splitting, and this destroys the surface mounted components.

Further, in the case of a method in which the fixed-size substrate 100 is divided for each printed circuit board before all the components are mounted, and each component is soldered to the divided printed circuit board by a flow,
Since the flow is performed for each printed circuit board having various sizes, there is also a problem that it takes time to set up the flow process.

[0008] Further, at the edge of the printed circuit board, there are also parts that protrude from the edge of the printed circuit board.
There is also a problem that components protruding from the edge of the printed circuit board interfere with the edge of the conveyor in the flow process, causing a problem in the flow process.

The present invention has been made in view of such a point, and even when components are arranged on a V-shaped cutting line, the mounted components can be destroyed without increasing the number of production steps. It is an object of the present invention to provide a printed circuit board that does not require a special flow step.

[0010] Another object of the present invention is to prevent a mounted component from being destroyed without increasing the number of production steps even when components are arranged on a V-shaped cutting line. It is another object of the present invention to provide a method for dividing a printed circuit board which does not require a special flow step.

[0011]

According to the present invention, in order to solve the above-mentioned problems, in a printed circuit board on which electronic components are mounted, a groove provided on a substrate cutting line and a plurality of grooves arranged along the groove are provided. A printed circuit board having a board holding hole is provided.

Here, the groove is provided on the substrate cutting line, a holding pin is inserted into the substrate holding hole, and division is performed by applying force using the holding pin as a fulcrum. In the method of dividing a printed circuit board on which electronic components are mounted, a groove is formed on a substrate cutting line, a plurality of substrate holding holes are formed along the groove, and a part of the outer diameter is an inner diameter of the substrate holding hole. A method for dividing a printed board is provided, wherein a larger holding pin is inserted into the board holding hole, and a force is applied to the printed board using the holding pin as a fulcrum to divide the printed board.

By performing the division as described above, the force applied at the time of the division can be concentrated on the holding pin.
No distortion occurs in the component mounting portion of the printed circuit board.

[0014]

Embodiments of the present invention will be described below with reference to the drawings. First, a first embodiment of the present invention will be described. The printed circuit board according to the first embodiment has an edge portion where a circuit pattern is not formed. In the present embodiment, the edge portion is divided and removed.

FIG. 2 is a structural view showing the printed circuit board 1 in the present embodiment. Here, FIG. 2A is a plan view of the printed circuit board 1, and FIG. 2B is a plan view of FIG.
10 is a sectional view taken along line CC in FIG.

The printed board 1 has a mounting area 1d in which a circuit pattern is formed and electronic components are mounted, and an edge 1e formed in an edge portion of the printed board 1. V-shaped grooves 1a and 1b are formed linearly at the boundary of the edge portion 1e on the printed circuit board 1 to divide the edge portion 1e. Here, the groove 1a is formed on the front surface of the printed circuit board 1, and the groove 1b is formed on the back surface of the printed circuit board 1. The grooves 1a and 1b are arranged such that the vertices of the V-shape face each other. Mounting area 1 separated by grooves 1a and 1b
In the vicinity of the d-side grooves 1a and 1b, a plurality of substrate holding holes 1c are arranged along a line formed by the grooves 1a and 1b. The distance L from the grooves 1a and 1b of the board holding hole 1c, the inner diameter φD of the board holding hole, and the pitch P between the board holding holes 1c are determined by conditions such as the thickness of the printed circuit board 1, the number of layers, and the depth of the grooves 1a and 1b. To select the optimal value. As an example, the thickness of the substrate is 1.6 mm, and the depth of each of the grooves 1a and 1b is 0.6 m.
m = L = 3 mm, P = 10 mm, φD = 2 m
m is preferable. Also, in FIG.
Although c is formed so as to penetrate the front and back surfaces of the printed circuit board 1, it may be formed so as not to penetrate the front and back surfaces. Further, in FIG. 2, the substrate holding hole 1c has a cylindrical shape, but may have a rectangular hexahedron, a regular hexagonal prism, or another shape.

FIG. 3 is a structural view showing the holding pin 2 used in the present embodiment. FIG. 2A is a side view of the holding pin 2, and FIG. 2B is a plan view of the holding pin 2. The holding pin 2 has a cylindrical holding portion 2b having an outer diameter larger than the inner diameter of the substrate holding hole 1c shown in FIG. 2, and a tapered structure in which at least a part of the outer diameter is smaller than the inner diameter of the substrate holding hole 1c. It is constituted by a tapered portion 2a. The material forming the holding pin 2 can be used without particular limitation as long as it has a certain degree of hardness.

FIG. 1 is a cross-sectional view showing how the printed circuit board 1 according to the present embodiment is divided. Here, FIG. 1A shows a state before applying a force for division, FIG. 1B shows a state in which the printed circuit board 1 is being divided, and FIG. Is shown.
The division and removal of the edge portion 1e in the printed board 1 of the present embodiment are performed after the electronic components are mounted on the mounting area 1d, as in the conventional process.

When dividing the printed circuit board 1, first, the tapered portion 2a of the holding pin 2 is inserted into the board holding hole 1c from the back surface of the printed circuit board 1. At this time, since the outer diameter of the holding portion 2b is larger than the inner diameter of the substrate holding hole 1c, the holding portion 2b
Is not stored inside the board holding hole 1c, and the holding section 2b holds the printed board 1 from the back surface of the printed board 1.

After the holding pin 2 is inserted into the board holding hole 1c, a force is then applied to the tip of the edge 1e to
e is divided and removed. At this time, a force is applied in the direction A shown in FIG. 1A, and the force causes division at the grooves 1a and 1b. The edge portion 1e to which the force in the direction A is applied,
This causes distortion. However, the force is
Is held at the holding portion 2b with the contact portion B between the holding portion 2b and the printed circuit board 1 as a fulcrum, so that the force applied to the edge portion 1e is applied to the mounting area 1d side with respect to the holding pin 2 And no distortion occurs in the mounting area 1d.

When the distortion caused by the force applied in the direction A exceeds the mechanical strength of the printed circuit board 1 in the grooves 1a and 1b, the printed circuit board 1 is divided at the grooves 1a and 1b, and is ), The edge portion 1e is divided and removed.

As described above, in this embodiment, the printed circuit board 1
The holding pin 2 is inserted into the board holding hole 1c formed in the vicinity of the groove 1a, 1b, and a force is applied to the edge 1e while holding the back surface of the printed board 1 with the holding portion 2b of the holding pin 2 as a fulcrum. , The edge portion 1e can be divided and removed without breaking the mounted components.

Further, in this embodiment, after the components are mounted on the printed circuit board 1 in the same manner as in the conventional process, the edge portion 1e is divided and removed, so that the number of production steps is increased without increasing the number of production steps. Divided removal can be performed.

Further, in this embodiment, after the components are mounted on the printed circuit board 1 as in the conventional process, the edge portion 1e
Therefore, even when components are arranged on the grooves 1a and 1b, the manufacturing can be performed using the same flow process as in the related art.

Next, a second embodiment of the present invention will be described. The method of dividing the printed circuit board 10 according to the present embodiment is obtained by adding a holding table and a spring 12 for holding the printed circuit board 10 to the dividing method described in the first embodiment.

FIG. 4 is a cross-sectional view showing how the printed circuit board 10 according to the second embodiment is divided. In this embodiment, one end of the printed circuit board 10 on the side of the mounting area 10b is held by a holding base 11, and a spring 12 is attached to the holding base 11.

The division and removal of the edge portion 10a are performed by applying a force in the direction E to the edge portion 10a in the same manner as in the first embodiment. Printed circuit board 1 as in the first embodiment
0 is held with the holding pin 13 as a fulcrum, so that when a force is applied to the edge portion 10a in the direction (E direction) from the front surface to the back surface of the printed circuit board 10, the printed circuit board 1
As shown in FIG. 4B, one end of the 0 mounting area 10b side moves while tilting in a direction (F direction) from the back surface to the front surface of the printed circuit board 10 opposite to the E direction. When the division and removal of the edge portion 10a are completed and the application of force to the printed board 10 is stopped, one end of the printed board 10 on the mounting area 10b side is connected to the printed board 1 opposite to the F direction.
0 in the direction from the front surface to the back surface, and FIG.
The position shown in is reached.

The vertical movement of the printed circuit board 10 on the side of the mounting area 10b at the time of dividing and removing the edge portion 10a is followed by a spring 12, and the holder 11 always holds the printed circuit board 10 during the movement of the printed circuit board 10. Becomes

As described above, in this embodiment, the printed circuit board 1
Since the edge portion 10a is divided and removed while holding the one end of the mounting region 10b on the side of the mounting region 10b with the spring 12, the printed circuit board 10 is inclined when the edge portion 10a is divided and removed. Even so, it is possible to suppress the distortion of the mounting area 10b caused by the weight of the printed circuit board 10 itself.

Next, a third embodiment of the present invention will be described. This embodiment is an application example of the first embodiment, in which the method described in the first embodiment is applied to division of a printed circuit board.

FIG. 5 shows a printed circuit board 20 according to this embodiment.
FIG. 4 is a cross-sectional view showing a state where is divided. The printed circuit board 20 of the present embodiment has two mounting areas 20e and 20f on which electronic components are mounted.
Grooves 20a and 20b are provided on the substrate cutting line between e and 20f. Mounting area 20f side of grooves 20a, 20b,
The groove 20a is located on the mounting area 20e side of the grooves 20a and 20b.
A plurality of substrate holding holes 20c and 20d are arranged along the lines a and b, and holding pins 22 and 23 are inserted into the substrate holding holes 20c and 20d.
Holds the back surface of the printed circuit board 20.

As shown in FIG. 5B, the division of the printed circuit board 20 is performed by moving the vicinity of the holding pins 22 and 23 on the back surface of the printed circuit board 20 in the mounting areas 20e and 20f in a direction from the back surface of the printed circuit board 20 to the front surface. This is performed by applying pressure in the direction (G) and bending the grooves 20a and 20b. When such pressurization is performed, the printed circuit board 20 is bent with the groove 20a inside, and the force generated in the bent portion is caused by the holding pins 22 and 23 and the printed circuit board 20.
Are held with the contact portions H and I on the back side of the fulcrum as fulcrums. Therefore, the printed circuit board 10 generated by the bending
Of the groove 20 between the contact portions H and I
a, 20b, only the mounting areas 20e, 20
No distortion occurs in f.

The distortion due to the bending is caused by the groove 20.
When the printed circuit board 20 exceeds the mechanical strength of the printed circuit board 20 at the positions a and 20b, the printed circuit board 20 is divided at the grooves 20a and 20b, and as shown in FIG.
Is divided.

As described above, in this embodiment, the printed circuit board 2
The grooves 20a and 20b are provided on the substrate cutting line 0, a plurality of substrate holding holes 20c and 20d are formed on both sides thereof, and the holding pins 22 and 23 are inserted into the substrate holding holes 20c and 20d. Since the printed circuit board 20 is divided as described above, the printed circuit board 20 can be divided without causing distortion in the mounting regions 20e and 20f, and the components mounted at the time of division are not destroyed.

Next, a fourth embodiment of the present invention will be described. This embodiment is an application example of the first embodiment. FIG. 6 shows a plan view of the printed circuit board 30 in the present embodiment.

The printed circuit board 30 includes grooves 30a and 30b for dividing the printed circuit board, a router processing portion 30c which is a cutout portion of the printed circuit board 30, and a plurality of board holding holes 30d arranged along the groove 30b. I have.

In the case of the printed circuit board 30, first, cutting is performed at the groove 30a. This cutting may be performed by a dedicated machine, or may be performed manually by forming a substrate holding hole along the groove 30a. Next, as in the first embodiment, a holding pin is inserted into the substrate holding hole 30d, and a manual split is performed at the groove 30b.

As described above, in this embodiment, the groove 3 is formed in the substrate dividing portion.
0b, a board holding hole 30d is provided along the groove 30b, and a holding pin is inserted into the board holding hole to make the printed circuit board 3
Since the division of 0 is performed, the substrate can be divided even in a complicated shape that cannot be cut by a dedicated machine.

Next, a fifth embodiment of the present invention will be described. This embodiment is an application example of the first embodiment. FIG. 7 shows a plan view of the printed circuit board 40 in the present embodiment.

In the printed circuit board 40, a groove 40a is formed at a curved substrate dividing portion, and a plurality of substrate holding holes 40b are formed along the groove 40a. As in the first embodiment, a holding pin is inserted into the board holding hole 40b, and the board is divided from the groove 40a using the holding pin as a fulcrum.

As described above, in the present embodiment, the groove 40a is formed in the substrate dividing portion, and the printed circuit board is divided using the holding pins inserted into the plurality of substrate holding holes 40b formed along the groove 40a as fulcrums. Therefore, the substrate can be divided even when the substrate dividing section is configured by a curve that cannot be cut by the conventional dedicated machine.

[0042]

As described above, according to the present invention, a groove is formed on a substrate cutting line of a printed circuit board, and a plurality of substrate holding holes are formed along the groove. Can be used to divide the printed circuit board,
Even in the case where components are arranged in a substrate cutting line, the printed circuit board can be divided without destroying the mounted components.

Further, since a groove is provided on the substrate cutting line of the printed circuit board and a plurality of substrate holding holes are formed along the groove, the printed circuit board can be divided with the holding pin inserted into the substrate holding hole as a fulcrum. Even when the components are arranged in a line along the cutting board, without increasing the production man-hours,
The printed circuit board can be divided.

Further, a groove is provided on the substrate cutting line of the printed circuit board, and a plurality of substrate holding holes are formed along the groove, so that the printed circuit board can be divided with the holding pin inserted into the substrate holding hole as a fulcrum. Even when the components are arranged in a substrate cutting line, the manufacturing can be performed using the same flow process as in the related art.

Further, a groove is provided on the substrate cutting line of the printed circuit board, a plurality of substrate holding holes are formed along the groove, the holding pin is inserted into the board holding hole, and a force is applied to the printed circuit board with the holding pin as a fulcrum. Since the printed circuit board is divided, the printed circuit board can be divided without damaging the mounted components even when the components are arranged in a substrate cutting line shape.

Further, a groove is provided on the substrate cutting line of the printed circuit board, a plurality of substrate holding holes are formed along the groove, the holding pin is inserted into the board holding hole, and a force is applied to the printed circuit board with the holding pin as a fulcrum. Since the printed circuit board is divided, the printed circuit board can be divided without increasing the number of production steps even when the components are arranged in a substrate cutting line.

Further, a groove is provided on the substrate cutting line of the printed circuit board, a plurality of substrate holding holes are formed along the groove, the holding pin is inserted into the board holding hole, and a force is applied to the printed circuit board using the holding pin as a fulcrum. Since the printed circuit board is divided, manufacturing can be performed using the same flow process as before, even when the components are arranged in a substrate cutting line shape.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing how a printed circuit board is divided.

FIG. 2 is a structural diagram showing a printed circuit board.

FIG. 3 is a structural view showing a holding pin.

FIG. 4 is a cross-sectional view showing a state where a printed circuit board is divided.

FIG. 5 is a cross-sectional view showing a state where a printed circuit board is divided.

FIG. 6 is a plan view of a printed circuit board.

FIG. 7 is a plan view of a printed circuit board.

FIG. 8 is a structural diagram showing an operation of a dedicated machine for cutting a fixed-size substrate.

[Explanation of symbols]

 Reference Signs List 1 printed board 1a groove 1b groove 1c board holding hole 1d mounting area 1e edge 2 holding pin 2a taper 2b holding

Continuation of the front page (72) Inventor Fumio Arase 4-1-1, Kamidadanaka, Nakahara-ku, Kawasaki-shi, Kanagawa F-term in Fujitsu Limited (reference) 5E338 AA00 BB02 BB13 BB16 BB47 CC01 EE32

Claims (7)

[Claims] 1. A printed circuit board on which electronic components are mounted, comprising: a groove provided on a substrate cutting line; and a plurality of substrate holding holes arranged along the groove. 2. The printed circuit board according to claim 1, wherein the board holding holes are arranged on both sides of the groove. 3. The printed circuit board according to claim 1, wherein the groove is formed in a polygonal shape. 4. The printed circuit board according to claim 1, wherein the groove is formed only in a part on the substrate cutting line. 5. The printed circuit board according to claim 1, wherein the groove is formed in a curved shape. 6. A method of dividing a printed circuit board on which electronic components are mounted, wherein a groove is formed on a cutting line of the substrate, a plurality of substrate holding holes are formed along the groove, and a part of the outer diameter of the substrate holding hole is reduced. A method of dividing a printed circuit board, comprising: inserting a holding pin larger than the inner diameter of the hole into the board holding hole; and applying a force to the printed board using the holding pin as a fulcrum to divide the printed board. 7. The method according to claim 6, wherein the printed circuit board is divided while holding a part of the printed circuit board with an elastic body.