JPH10270813A - Ceramic substrate with breaking groove and electronic part manufactured from the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a ceramic substrate with breaking groove which can be prevented from being broken in a secondary breaking direction when the sub strate is subjected to prmiary breaking. SOLUTION: Longitudinal and transversal breaking grooves 2 and 3 are formed on the surface of a substrate 1 and the substrate 1 is divided into individual substrates by a primary breaking of the substrate 1 along the groove 2 formed in the longitudinal direction, and then, the substrate 1 is given a secondary breaking along the grove 3 formed in the transversal direction which is perpendicular to the longitudinal direction. The substrate 1 is prevented from being broken in the secondary breaking direction when the substrate 1 is subjected to the primary breaking.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic substrate having break grooves suitable for dividing a single base material into a plurality of substrates, and an electronic component manufactured from the ceramic substrate.

[0002]

2. Description of the Related Art Conventionally, as a ceramic substrate having a break groove of this type, as described in Japanese Patent No. 2,548,664, a hard base material having vertical and horizontal break grooves formed on the surface is used. It is known that burrs are prevented from being generated on the cut surface at the end portion of the break groove by gradually increasing the depth of the end portion of each break groove forming the boundary line.

The conventional break grooves have the same processing conditions in the vertical and horizontal directions, and therefore have the same width and depth. In order to break from such a base material to a plurality of substrates, the base material is subjected to a primary break in one direction (for example, a vertical direction), and then the broken strip-shaped base material is subjected to a secondary break in a perpendicular direction (for example, a horizontal direction). It is common to break.

[0004]

However, if the vertical and horizontal break grooves have the same depth as described above, when the base material is broken in the vertical direction for the primary break, it is cracked in the horizontal or oblique direction. In some cases, there is a problem that the working process is deteriorated and the yield is reduced.

Accordingly, an object of the present invention is to provide a ceramic substrate with a break groove which can prevent the substrate from breaking in another direction at the time of a primary break. Another object is to provide a high-quality electronic component by using the ceramic substrate.

[0006]

In order to achieve the above-mentioned object, the present invention provides a method in which a break groove is formed on a surface in a vertical and horizontal direction, a primary break is performed in one direction, and then a secondary break is performed in a direction orthogonal to this. In a ceramic substrate that is divided into individual substrates, the depth of the break groove in the direction of the primary break is greater than the depth of the break groove in the direction of the secondary break.

[0007] The depth of the break groove in the primary break direction is
If it is deeper than the depth of the break groove in the secondary break direction,
The break strength in the secondary break direction is larger than the break strength in the primary break direction, and it is possible to prevent the substrate from breaking in the secondary break direction or the oblique direction at the time of the primary break.

In the meantime, a crack may run obliquely in the vicinity of the intersection of the vertical and horizontal break grooves at the time of a break, which causes burrs and a lack of a right-angled corner. In order to solve such a problem, it is desirable that the depth near the intersection of the vertical and horizontal break grooves is made larger than the vertical and horizontal break grooves. In this case, when the crack approaches the intersection at the time of the break, the depth near the intersection is deep, so that the vehicle travels straight without going obliquely, and the corner can be a clean right-angled surface without burrs.

It is desirable that the ceramic substrate of the present invention is applied to a surface mount type electronic component. That is, the ceramic substrate according to claim 1 or 2, wherein the electronic component elements are respectively mounted on the portions divided by the vertical and horizontal break grooves, and the ceramic substrates are individually broken by breaking along the vertical and horizontal break grooves. If divided, surface-mounted electronic components can be easily obtained. In this case, since the ceramic substrate does not break in an unexpected direction at the time of the primary break, there is no risk of damaging the electronic component elements mounted on the ceramic substrate, and an electronic component of stable quality can be obtained.

There are various methods for forming a break groove, such as a method of forming a green sheet with a press die, a method of forming a groove on a hardened ceramic substrate with a dicer, and a method of processing a groove with a laser. Conceivable. In the present invention, the ceramic substrate is not limited to a single ceramic substrate, but may be a multilayer substrate. Alumina is generally used as the ceramic material, but is not limited thereto.

[0011]

1 and 2 show an example of a ceramic substrate having a break groove according to the present invention. The ceramic substrate 1 is formed of, for example, an alumina substrate having a thickness of 635 μm. On the surface thereof, electrodes (not shown) are formed, and a number of electronic component elements (not shown) are arranged vertically and horizontally. It is installed. V-shaped break grooves 2 and 3 are formed vertically and horizontally on the surface of the ceramic substrate 1 so as to partition between mounted electronic component elements. The peripheral portion 4 defined by the outermost break grooves 2a and 3a is called a dummy portion and is a discarded portion not used for a product.

Of the break grooves 2 and 3, processing conditions are set so that the groove 2 (the vertical groove in this example) in the direction in which the break occurs first has a width of, for example, 100 μm and a depth of 220 μm. Have been scribed. On the other hand, the groove 3 in the direction to be broken later (the groove in the lateral direction in this example) is scribed by setting the processing conditions so that the width is, for example, 100 μm and the depth is 180 μm. Further, the intersection 5 of the vertical and horizontal break grooves 2 and 3 is formed deeper than the other portions of the break grooves 2 and 3 as shown in FIG.
It is formed to a depth of 40 μm.

The processing directions of the break grooves 2 and 3 are as follows: a method of forming a green sheet with a press die, a method of forming a groove on a hardened ceramic substrate with a dicer, and a method of forming a groove with a laser. A known method such as a method may be used. In particular, in the groove processing method using a CO ₂ laser, since the width and the depth can be freely adjusted, there is an advantage that a right-angled edge can be formed neatly when a break occurs.

Here, a method of breaking the ceramic substrate 1 will be described. First, as shown in FIG. 4, a primary break is performed on the ceramic substrate 1 along the longitudinal break grooves 2. Similarly, the ceramic substrate 1 is firstly broken along all the vertical break grooves 2 to obtain a strip-shaped ceramic substrate 1a. At this time, since the vertical break groove 2 is deeper than the horizontal break groove 3, it is easily broken in the vertical direction, and there is no possibility of being erroneously broken in the horizontal or oblique direction at the time of the primary break. Therefore, the fracture surface due to the primary break can be cleaned. The portion corresponding to the dummy section 4 is discarded here.

Next, the strip-shaped ceramic substrate 1a broken in the vertical direction is secondarily broken into individual substrates 6 along the horizontal break grooves 3 as shown in FIG. At this time,
Although the break groove 3 is shallower than the break groove 2, the break length at the time of the secondary break is short, so that the bending load is small and the shock applied to the elements mounted on the individual substrates 6 can be reduced. In addition, since the intersection 5 between the vertical and horizontal break grooves 2 and 3 is formed deep, the crack does not run in an oblique direction at the time of the secondary break, and the generation of burrs can be prevented. Therefore, the four corners of the substrate 6 can be formed into a clean right angle plane.

FIG. 6 shows an example of a surface-mounted electronic component obtained from the ceramic substrate 1 as described above. In the figure, strip-shaped electrodes 10 and 11 are formed on the front and back surfaces of a substrate 6, and an oscillator element 12 is connected and fixed to the electrodes 10 and 11 by conductive adhesives 13 and 14. A cap 15 is adhered on the substrate 6 with an insulating adhesive 16, and the oscillator element 12 is sealed. Grooves 6a extending in the front and back directions are formed on both side edges of the substrate 6, and the electrodes 1 on the front and back are formed via electrodes formed on the inner surface of the grooves 6a.
0 and 11 are conducting. The groove 6a is formed by dividing a through hole formed on one of the vertical and horizontal break grooves 2 and 3 of the ceramic substrate 1.

As described above, the electrodes 10 and 11 have already been formed at the stage of the ceramic substrate 1, and the element 12 and the cap 15 are formed in the vertical and horizontal break grooves 2 and
3 (excluding the dummy part 4). When such a ceramic substrate 1 is subjected to a primary break, there is a risk that the direction of the break is not stable or that the element 12 or the cap 15 falls off the substrate 1 due to a shock. Is used, the break direction at the time of the primary break is stabilized, and the above-mentioned problem can be solved.

The electronic component element in the present invention is not limited to an oscillator element as shown in FIG. 6, but may be, for example, a capacitor element, a resistance element, or a combination of a plurality of elements. Good.

[0019]

As is apparent from the above description, according to the present invention, the depth of the break groove in the primary break direction of the ceramic substrate is made deeper than the depth of the break groove in the secondary break direction. The substrate can be prevented from breaking in the secondary break direction. Therefore, work efficiency is improved, and the occurrence rate of defective products can be reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view of an example of a ceramic substrate with a break groove according to the present invention.

FIG. 2 is an enlarged perspective view of a part of the ceramic substrate shown in FIG.

FIG. 3 is a sectional view taken along line AA of FIG. 2;

FIG. 4 is a perspective view of the ceramic substrate during a primary break.

FIG. 5 is a perspective view of the ceramic substrate during a secondary break.

FIG. 6 is an exploded perspective view of an example of a surface-mounted electronic component obtained from the ceramic substrate of the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 ceramic substrate 2 vertical break groove 3 horizontal break groove 5 intersection 6 substrate 12 element

──────────────────────────────────────────────────続 き Continued on front page (51) Int.Cl. ⁶ Identification code FI // B28B 11/14 B28B 11/14

Claims (3)

[Claims] A ceramic substrate in which a break groove is formed vertically and horizontally on a surface, a primary break is performed in one direction, and then a secondary break is performed in a direction orthogonal to the ceramic substrate to divide the substrate into individual substrates. A ceramic substrate with a break groove, wherein the depth of the break groove in the direction in which the secondary groove breaks is made greater than the depth of the break groove in the direction in which the secondary break occurs. 2. The ceramic substrate with break grooves according to claim 1, wherein the depth near the intersection of the vertical and horizontal break grooves is greater than the depth of the vertical and horizontal break grooves. With ceramic substrate. 3. The ceramic substrate according to claim 1, wherein electronic component elements are respectively mounted on portions divided by vertical and horizontal break grooves, and the ceramic substrate is broken along the vertical and horizontal break grooves. An electronic component characterized by being individually divided by: