JP4760253B2 - Manufacturing method of ceramic electronic component and fired ceramic mother substrate - Google Patents

Description

  The present invention relates to a method of manufacturing a ceramic electronic component and a fired ceramic mother board, and more particularly, a ceramic electronic manufactured through a process of dividing a fired ceramic mother board into sub-boards by breaking along a break groove. The present invention relates to a method of manufacturing a component and a fired ceramic mother substrate used for the method.

  For example, as a method for manufacturing a ceramic multilayer substrate, as described below, a so-called multi-cavity method is known in which a fired ceramic mother substrate is divided to obtain a large number of ceramic electronic components at the same time.

(1) A ceramic green sheet on which an internal conductor pattern is printed is laminated to produce an unfired ceramic mother board in which a plurality of daughter boards are gathered.
(2) Then, scribe grooves (also referred to as “snap grooves”) are formed in the unfired ceramic mother substrate along the boundaries of the sub-substrates, and then fired.
(3) Next, after mounting components are mounted on the obtained fired ceramic mother substrate, the fired ceramic mother substrate is broken along the scribe grooves to divide each child substrate.

  In forming the above-mentioned scribe groove, it is common to form the scribe groove at the stage of an unfired ceramic mother substrate before firing, from the viewpoint of efficiency and the variety of adoptable methods.

  By the way, when forming the scribe groove on the mother board, if a deep scribe groove is formed around the area of the mother board that becomes the child board, the outer peripheral area that does not become a product, that is, the ear part, the mounting component mounting process after firing In addition, there is a problem that the mother substrate is cracked during handling in a transfer process for transferring the mother board between processes.

So, to solve such problems,
(1) A method of forming a scribe groove shallowly in a dividing line of a ceramic substrate (see Patent Document 1),
(2) A method for forming a scribe groove only in an inner peripheral region inside the ear portion without forming a break groove in the entire break line in the ear portion of the ceramic substrate, and forming a groove only as a trigger at the time of the break. (See Patent Document 2)
Has been proposed.

  However, if priority is given to securing the strength of the mother board as in Patent Document 1 described above, when the mother board is broken to the child board, it cannot be reliably broken at the boundary of each child board, and burrs are generated. There is a problem that.

  In addition, as in Patent Document 2, even if it is a part, if a groove that causes a break is formed in the ear part, the substrate may be cracked in the processing step before the break depending on the situation. However, there is a problem that reliability is low. In addition, if the groove of the ear is formed so as to minimize the possibility of the substrate cracking, it becomes impossible to accurately break the substrate with the break line during the break work, and the reliability is lowered. There is a problem.

On the other hand, the break groove for dividing into the sub board and the break groove for removing the outer peripheral area are not formed until immediately before the break work, and the break groove for dividing into the sub board and the outer circumference are just before the break work. There is an idea that a break groove for removing a region is formed deeply to ensure breakage. In that case, however, all the break grooves to be formed must be formed in the sintered ceramic matrix. Since it is necessary to form on the substrate, the method of forming the break groove is substantially limited to methods such as laser scribing and dicing, which increases costs, complicates the manufacturing process, and reduces productivity. There is a problem of inviting.
JP-A-61-137390 Japanese Patent Laid-Open No. 5-299789

  The invention of the present application solves the above-described problems, and can prevent the mother board from cracking in a mounting component mounting process, a transport process of transporting the mother board between processes, and the like. A method of manufacturing a ceramic electronic component capable of efficiently manufacturing a ceramic electronic component by a so-called multi-cavity method, in which a mother substrate can be reliably divided by a break line when dividing into sub-substrates And a fired ceramic mother substrate used therefor.

In order to solve the above problems, the present invention has the following configuration.
That is, the invention of the method of manufacturing a ceramic electronic component according to claim 1
A mother substrate manufacturing step of manufacturing an unfired ceramic mother substrate comprising an outer peripheral region and a child substrate region to be divided into a plurality of child substrates inside the outer peripheral region;
A first break groove forming step of forming a break groove for dividing a sub board necessary for dividing the sub board area into a plurality of sub boards in the sub board area of the unfired ceramic mother board;
A firing step of firing the unfired ceramic mother substrate on which the break groove for dividing the child substrate is formed,
There is no process in which large stress that may cause cracks in the fired ceramic mother substrate is applied to the outer peripheral region of the fired ceramic mother substrate after firing in the firing step. A second break groove forming step for forming a break groove for removing the outer peripheral region necessary for separating the sub-substrate region and the outer peripheral region at a stage where the sub-substrate region and the outer peripheral region may be separated;
Breaking the ceramic mother board along the break groove for removing the outer peripheral area and the break groove for dividing the sub board, removing the outer peripheral area, and breaking the sub board area into a plurality of sub boards. It is characterized by having.

  According to a second aspect of the present invention, there is provided a method for manufacturing a ceramic electronic component according to the first aspect of the present invention. In the first break groove forming step, the sub-board is formed at a boundary between the sub-board area and the outer peripheral area. It is characterized in that a break groove for dividing a sub board necessary for dividing the region into a plurality of sub boards is formed.

  According to a third aspect of the present invention, there is provided a method for manufacturing a ceramic electronic component according to the first aspect of the present invention, wherein the sub-board is formed at a boundary between the sub-board region and the outer peripheral region in the second break groove forming step. A break groove for removing an outer peripheral region necessary for separating the region from the outer peripheral region is formed.

  According to a fourth aspect of the present invention, there is provided a method for manufacturing a ceramic electronic component according to any one of the first to third aspects of the present invention. In the second break groove forming step, the breaker groove for dividing the sub-substrate having a V-shaped cross section is formed by inserting from one main surface side of the fired ceramic mother substrate to a depth in the middle of the thickness direction. The break groove for removing the outer peripheral region is formed by a laser scribing method.

  According to a fifth aspect of the present invention, there is provided the ceramic electronic component manufacturing method according to any one of the first to fourth aspects, wherein the sub-substrate dividing break groove is substantially orthogonal to the first direction. In the case of forming in two directions of the second direction, in the second break groove forming step, it is a direction along one of the first direction and the second direction, and the outer peripheral region is formed in the break step. It is characterized in that the outer peripheral region removing break groove is formed only in the direction in which the breaking is performed first for removal.

  According to a sixth aspect of the present invention, there is provided a method for manufacturing a ceramic electronic component according to any one of the first to fifth aspects, wherein the component is mounted on the fired ceramic mother substrate before the second break groove forming step. It is characterized by having a process of mounting.

The invention of the fired ceramic mother substrate according to claim 7
A fired ceramic mother board comprising an outer peripheral area and a sub board area to be divided into a plurality of sub boards inside the outer peripheral area,
A break groove for dividing a child substrate having a V-shaped cross-section, which is necessary for dividing the child substrate region into a plurality of child substrates, is formed in the child substrate region by a groove forming blade having a V-shaped section. Prepared,
The outer peripheral area is provided with a break groove for removing the outer peripheral area, which is formed by a laser scribing method and is necessary for separating the outer peripheral area and the daughter board area.

  According to the first aspect of the present invention, there is provided a method for manufacturing a ceramic electronic component comprising: a mother board for producing an unfired ceramic mother board having an outer peripheral area and a sub board area to be divided into a plurality of sub boards inside the outer peripheral area; A first break groove forming step for forming a break groove for dividing the substrate into the plurality of child substrates in the child substrate region of the unfired ceramic mother substrate; There is a risk that the fired ceramic mother board may be cracked in the outer peripheral region of the firing step of firing the unfired ceramic mother board in which the break grooves are formed and the fired ceramic mother board after firing in the firing process. In the stage where the fired ceramic mother substrate may be broken by the break groove for removing the peripheral region without the process of applying a large stress, the sub-substrate region and the peripheral region are separated. The second break groove forming step for forming the outer peripheral region removing break groove necessary for the purpose, and the outer periphery region is removed by breaking the ceramic mother substrate along the outer peripheral region removing break groove and the sub substrate dividing break groove. In addition, since it has a break process that divides the sub-board area into a plurality of sub-boards, cracks occur in the mother board in the mounting component mounting process and the transfer process that transfers the mother board between processes. In addition, it is possible to reliably divide the mother board by the break line when dividing into sub-boards, and efficiently produce ceramic electronic components by a so-called multi-chip method. be able to.

  That is, according to the method for manufacturing a ceramic electronic component according to claim 1 of the present application, in forming the break groove on the mother board, the child substrate region is formed with the break groove for dividing the child substrate before firing, and the outer peripheral region is formed on the outer periphery region. The outer peripheral region removing break groove is formed at the stage where the firing is finished and a process in which a large stress that may cause cracking in the fired ceramic mother substrate is applied, for example, a mounting component mounting process is finished. Therefore, the formation of the break groove for dividing the sub board is suitable for the break work in a short processing time by adopting a suitable formation method, for example, a method using a groove forming blade having a V-shaped cross section. On the other hand, for the formation of the break groove for removing the peripheral region, for example, a laser scribing method suitable for processing a fired ceramic mother substrate is used. There, it is possible to form subsequent without worrying about the occurrence of cracks in the process, the outer peripheral region removing break groove that can reliably remove the outer peripheral region. As a result, ceramic electronic components can be efficiently manufactured by a multi-cavity method.

  Further, as in the invention of the method of manufacturing a ceramic electronic component of claim 2, in the configuration of the invention of claim 1, in the first break groove forming step, at the boundary between the child substrate region and the outer peripheral region, By forming the break groove, it becomes possible to efficiently form the break groove necessary for dividing the sub-board area and the outer peripheral area at the boundary between the sub-board area and the outer peripheral area. It can be announced.

  Further, as in the invention of the method for manufacturing a ceramic electronic component of claim 3, in the configuration of the invention of claim 1, in the second break groove forming step, the outer peripheral region is removed at the boundary between the sub-board region and the outer peripheral region. By forming the break groove, it is possible to reliably separate the sub-board region and the outer peripheral region, and the present invention can be effectively realized.

  Moreover, like the invention of the manufacturing method of the ceramic electronic component of Claim 4, in the structure of any one of Claims 1-3, in a 1st break groove formation process, the cross-section V-shaped groove formation blade, Inserting from one main surface side of the unfired ceramic mother substrate to a depth in the middle of the thickness direction to form a V-shaped child substrate dividing break groove, while reducing costs, It becomes possible to efficiently form the break groove for dividing the sub board. Also, in the second break groove forming step, when the outer peripheral area removing break groove is formed by the laser scribing method, the outer peripheral area removing break groove is efficiently formed on the fired ceramic mother substrate which is difficult to process. This makes it possible to make the present invention more effective.

  Further, as in the invention of the method for manufacturing a ceramic electronic component according to claim 5, in the configuration of any one of claims 1 to 4, the break groove for dividing the sub board is substantially orthogonal to the first direction and the first direction. In order to remove the outer peripheral region in the second break groove forming step, the direction along either the first direction or the second direction in the second break groove forming step. When the second break groove is formed only in the direction in which the break will occur first, the outer peripheral region along the first breaking direction is removed in the first breaking step, and the remaining outer periphery The area can be removed by breaking at the boundary between the outer peripheral area and the sub board area. Therefore, in the second break groove forming step, the outer peripheral area can be reliably removed even when the outer peripheral area removing break groove is formed only in the direction along one of the first direction and the second direction. Ceramic electronic components can be manufactured efficiently and reliably by a multi-cavity method.

  Further, as in the invention of the method for manufacturing a ceramic electronic component of claim 6, in the configuration of any one of claims 1 to 5, the component mounted on the fired ceramic mother board before the second break groove forming step If the second break groove forming step is performed after the mounting component mounting step, the ceramic mother board may be broken after the second break groove forming step. Therefore, it is possible to manufacture ceramic electronic components efficiently and reliably by a multi-cavity method.

  Further, the invention of the fired ceramic mother board according to claim 7 is a fired ceramic mother board having an outer peripheral region and a child substrate region to be divided into a plurality of child substrates inside the outer peripheral region. In addition, there are provided break grooves for dividing the sub board, which are necessary for dividing the sub board area into a plurality of sub boards, and are formed by a groove forming blade having a V-shaped cross section. Since the outer peripheral region removing break groove formed by the laser scribing method and necessary for separating the outer peripheral region and the sub substrate region is provided, the outer peripheral region removing break groove and the sub substrate are provided as necessary. Breaking the ceramic mother board along the dividing break grooves to remove the outer peripheral area and dividing the sub board area into a plurality of sub boards to obtain a large number of ceramic electronic components Allows, it is possible to provide a ceramic electronic component having the required properties at a low cost-effectively.

  The features of the present invention will be described in more detail below with reference to examples of the present invention.

  In the first embodiment, a case where a ceramic electronic component (ceramic substrate) on which a mounting component is mounted is manufactured will be described as an example.

  FIG. 1 is a diagram schematically showing the configuration of a ceramic electronic component (ceramic substrate) 1 manufactured by the method of Example 1. The ceramic electronic component 1 has a conductor pattern for circuits and electrodes inside. A mounting component 3 (3a, 3b, 3c) or the like is mounted on the upper surface of the disposed multilayer ceramic sintered body (child substrate) 2a.

Next, a method for manufacturing the ceramic electronic component 1 will be described.
(1) Mother board production process First, the ceramic green sheet which printed the conductor pattern was laminated | stacked, and the unbaking ceramic mother board 11 (FIG. 2) of the state in which the some sub board | substrate gathered was produced.
As shown in FIG. 2, the unfired ceramic mother board 11 includes an outer peripheral area 12 and a sub board area 13 that is to be divided into a plurality of sub boards 2 inside the outer peripheral area 12.

(2) First Break Groove Forming Step Each sub-substrate 2 to be divided into a plurality of sub-substrate regions 13 inside the outer peripheral region 12 of the unfired ceramic mother substrate 11 produced in the step (1). 2, the first direction indicated by the arrow A in FIG. 2 and the second direction indicated by the arrow B in FIG. 2 orthogonal to the first direction. 14b were formed. In the first embodiment, the break grooves 14a and 14b for dividing the sub board are also formed at the boundary portion 21 between the outer peripheral area 12 and the sub board area 13.
Further, in the first embodiment, when forming the break grooves 14a and 14b for dividing the sub board, as shown in FIG. 3A, a groove forming blade 20 having a V-shaped cross section is used and an unfired ceramic mother board 11 is used. The groove forming blade 20 is inserted from one main surface side to a depth in the middle of the thickness direction, and as shown in FIG. 3 (b), the break grooves 14a and 14b for dividing the sub board having a V-shaped cross section are formed. Formed.

(3) Firing step The unfired ceramic mother substrate 11 in which the break grooves 14a and 14b for dividing the sub-substrate are formed in the step (2) is fired under predetermined temperature conditions and atmospheric conditions to obtain an unfired ceramic mother substrate. 11 was sintered.

(4) Mounting component mounting process As shown in FIG. 4, on the area | region used as each sub board | substrate 2a of the sub board | substrate area | region 13 of the baked ceramic mother board | substrate 11a obtained by baking at the process of said (3). The mounting components 3 (3a, 3b, 3c) (see FIG. 1) were mounted.

(5) Second Break Groove Forming Step The mounting component 3 (3a, 3b, 3c) is mounted in the step (4), and a large stress is applied to the fired ceramic mother board 11a. After the mounting process is completed, the fired ceramic mother substrate 11a immediately before the break work, that is, the fired ceramic mother at the stage where the outer peripheral region removing break grooves 15a and 15b may be broken after being formed. The outer peripheral region removing break grooves 15a and 15b necessary for separating the outer peripheral region 12 and the sub-substrate region 13 were formed in the outer peripheral region 12 of the substrate 11a by a laser scribing method. In the first embodiment, the outer peripheral region removing break groove 15a is formed in the vertical direction (first direction indicated by arrow A) in FIG. 4, and the outer periphery in the horizontal direction (second direction indicated by arrow B) in FIG. A region removing break groove 15b was formed.

In the first embodiment, the outer peripheral region removing break grooves 15a and 15b are formed by a laser scribing method, and the outer peripheral region removing break grooves 15a and 15b are conical, as shown in FIG. The concave portions are arranged at a predetermined pitch and have a groove shape. However, the shape of the outer peripheral region removing break grooves 15a and 15b can be controlled by adjusting the shape of the laser and the irradiation conditions, and can have various structures.
In the first embodiment, the break grooves 14a and 14b for dividing the sub board are formed in the boundary portion 21 between the outer peripheral area 12 and the sub board area 13 in the step (2). It is also possible to form the outer peripheral region removing break grooves 15a and 15b in the 13 boundary portions 21.

(6) Breaking Step The fired ceramic mother substrate 11a in which the outer peripheral region removing break grooves 15a and 15b are formed in the step (5) is used as the outer peripheral region removing break grooves 15a and 15b and the sub substrate dividing break grooves 14a, Breaking along 14b, the outer peripheral area 12 was removed, and the sub board area 13 was divided into a plurality of sub boards 2a.

  Thereby, the ceramic electronic component 1 having a structure in which the mounting component 3 (3a, 3b, 3c) is mounted on the upper surface side of the daughter board 2a as shown in FIG. 1 was obtained.

As described above, when forming the break grooves in the mother board, the break board grooves 14a and 14b for dividing the child board are formed in the child board area 13 before firing, and the fired ceramic mother board 11a is formed in the outer peripheral area. After the mounting process of the mounting component 3 (3a, 3b, 3c), which is a process in which a large stress that may cause a crack is applied, the outer peripheral region removing break grooves 15a, 15b are formed immediately before the break operation. Therefore, the formation of the break grooves 14a and 14b for dividing the sub board adopts a method using the groove forming blade 20 having a V-shaped cross section, and the sub board division suitable for the break work is achieved in a short processing time. Break grooves 14a and 14b can be formed, while the outer peripheral region removing break grooves 15a and 15b can be formed by processing the fired ceramic mother substrate 11a. By using the laser scribing method, the outer peripheral region removing break grooves 15a and 15b capable of reliably removing the outer peripheral region 12 can be formed without worrying about the occurrence of cracks in subsequent processes. .
As a result, the ceramic electronic component 1 (FIG. 1) can be efficiently manufactured by a multi-cavity method.

  FIG. 6 is a diagram showing one step of a method for manufacturing a ceramic electronic component according to Example 2, which is another example of the present invention.

  In the second embodiment, only the outer peripheral region removing break groove 15b in the horizontal direction in FIG. 4 is formed as the outer peripheral region removing break groove, and the vertical outer peripheral region removing break groove 15a in FIG. 4 of the first embodiment is formed. A ceramic electronic component was produced in the same manner as in Example 1 except that the formation of was omitted.

  That is, in the second embodiment, the break grooves 14a and 14b for dividing the sub board are arranged in the first direction (the direction indicated by the arrow A in FIG. 6) and the second direction (the arrow B in FIG. 6) substantially orthogonal to the first direction. In the second break groove forming step, the second direction (arrow B in FIG. 6) is to be broken first to remove the outer peripheral region 12 in the second break groove forming step. The outer peripheral region removing break groove 15b was formed only in the direction along the direction indicated by.

  As in the second embodiment, in the second break groove forming step, the outer region removing break groove 15b is formed only in the direction in which the outer region 12 is first broken in order to remove the outer region 12. In this case, the outer peripheral area 12 (12b) along the first breaking direction is removed in the first breaking step, and the remaining outer peripheral area 12 (12a) is divided into the outer peripheral area 12 and the sub board area 13. It can be removed by breaking at the boundary portion 21. Therefore, in the second break groove forming step, when the outer peripheral region removing break groove is formed only in the break direction of the outer peripheral region that is to be broken first in order to remove the outer peripheral region in the breaking step. However, the outer peripheral region can be reliably removed, and the ceramic electronic component 1 (FIG. 1) can be manufactured efficiently and reliably by a multi-cavity method.

  In Examples 1 and 2, the break groove for dividing the sub-substrate is formed using a groove forming blade having a V-shaped cross section, and the break groove for removing the outer peripheral region is formed using a laser scribing method. However, the break groove for dividing the sub board and the break groove for removing the outer peripheral region can be formed by other methods.

  The invention of the present application is not limited to the first and second embodiments in other respects as well. The material and details of the ceramic mother board, the area ratio and shape of the outer peripheral area and the sub board area, the unfired ceramic mother Various applications and modifications can be made within the scope of the invention with respect to the firing conditions of the substrate, the breaking method in the breaking process, and the like.

As described above, according to the present invention, it is possible to prevent the ceramic mother board from being cracked during handling such as mounting process of mounting parts and inter-process conveyance of the mother board, and the sub board. When dividing into two, it becomes possible to reliably divide by the break line, and it becomes possible to efficiently manufacture the ceramic electronic component by a so-called multi-cavity method.
Therefore, the present invention can be widely applied to the field of manufacturing technology of ceramic electronic components manufactured by a so-called multi-cavity method.

It is a figure which shows typically the ceramic electronic component manufactured by the manufacturing method of the ceramic electronic component concerning Example 1 of this invention. It is a figure which shows 1 process of the manufacturing method of the ceramic electronic component concerning Example 1 of this invention, Comprising: It is a figure which shows the state which formed the break groove | channel for dividing | segmenting a sub board | substrate in an unbaked ceramic mother board. It is a figure explaining the method of forming the break groove | channel for dividing | segmenting a sub board | substrate in a non-fired ceramic mother board | substrate in 1 process of the manufacturing method of the ceramic electronic component concerning Example 1 of this invention. It is a figure which shows the state which formed the break groove | channel for outer periphery area | region removal in the baking ceramic mother board | substrate in another 1 process of the manufacturing method of the ceramic electronic component concerning Example 1 of this invention. In the manufacturing method of the ceramic electronic component concerning Example 1 of this invention, it is a figure which expands and shows typically the principal part of the sintered ceramic mother board in which the break groove | channel for outer periphery area | region removal was formed. It is a figure which shows 1 process of the manufacturing method of the ceramic electronic component concerning Example 2 of this invention, Comprising: It is a figure which shows the state which formed the break groove | channel for outer periphery area | region removal in the sintered ceramic mother board | substrate.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Ceramic electronic component 2 Sub-board 2a Multilayer ceramic sintered body (sub-board)
3 (3a, 3b, 3c) Mounted parts 11 Unfired ceramic mother board 11a Firing ceramic mother board 12 (12a, 12b) Outer peripheral area 13 Sub-board area 14a, 14b Break groove 15a, 15b Break groove 20 Groove forming blade 21 Boundary part A First direction B Second direction

Claims (7)

A mother substrate manufacturing step of manufacturing an unfired ceramic mother substrate comprising an outer peripheral region and a child substrate region to be divided into a plurality of child substrates inside the outer peripheral region;
A first break groove forming step of forming a break groove for dividing a sub board necessary for dividing the sub board area into a plurality of sub boards in the sub board area of the unfired ceramic mother board;
A firing step of firing the unfired ceramic mother substrate on which the break groove for dividing the child substrate is formed,
There is no process in which large stress that may cause cracks in the fired ceramic mother substrate is applied to the outer peripheral region of the fired ceramic mother substrate after firing in the firing step. A second break groove forming step for forming a break groove for removing the outer peripheral region necessary for separating the sub-substrate region and the outer peripheral region at a stage where the sub-substrate region and the outer peripheral region may be separated;
Breaking the ceramic mother board along the break groove for removing the outer peripheral area and the break groove for dividing the sub board, removing the outer peripheral area, and breaking the sub board area into a plurality of sub boards. A method of manufacturing a ceramic electronic component comprising:   In the first break groove forming step, a break groove for dividing the sub board necessary for dividing the sub board area into a plurality of sub boards is formed at a boundary between the sub board area and the outer peripheral area. A method for manufacturing a ceramic electronic component according to claim 1.   In the second break groove forming step, a break groove for removing the outer peripheral area necessary for separating the sub board area and the outer peripheral area is formed at a boundary portion between the sub board area and the outer peripheral area. A method of manufacturing a ceramic electronic component according to claim 1. In the first break groove forming step, a groove forming blade having a V-shaped cross section is inserted from one main surface side of the unfired ceramic mother substrate to a depth in the middle of the thickness direction, whereby the cross-sectional shape is V-shaped. While forming the break groove for dividing the child substrate,
The method for manufacturing a ceramic electronic component according to any one of claims 1 to 3, wherein, in the second break groove forming step, a break groove for outer peripheral region removal is formed by a laser scribing method. When forming the break groove for dividing the sub board in two directions of a first direction and a second direction substantially orthogonal to the first direction,
In the second break groove forming step, a direction along one of the first direction and the second direction, and a direction that is first broken in order to remove the outer peripheral region in the break step. 5. The method for manufacturing a ceramic electronic component according to claim 1, wherein a break groove for removing the outer peripheral region is formed only on the outer surface.   The method for manufacturing a ceramic electronic component according to claim 1, further comprising a step of mounting a mounting component on the fired ceramic mother substrate before the second break groove forming step. . A fired ceramic mother board comprising an outer peripheral area and a sub board area to be divided into a plurality of sub boards inside the outer peripheral area,
A break groove for dividing a child substrate having a V-shaped cross-section, which is necessary for dividing the child substrate region into a plurality of child substrates, is formed in the child substrate region by a groove forming blade having a V-shaped section. Prepared,
A fired ceramic mother substrate comprising a peripheral region removal break groove formed by a laser scribing method, which is necessary for separating the outer peripheral region and the sub-substrate region, in the outer peripheral region.

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