JP2005109301A - Substrate dividing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate dividing method with which preprocessing working for division can be efficiently and speedily performed by laser working and a substrate can be suppressed or prevented from being cracked in a later step of handling the substrate. <P>SOLUTION: In a region X1 (and X2) near the terminal of at least one side of a substrate surface, the region where a dividing line L (L1) for dividing a substrate 1 passes at least, a laser reflection electrode (film) 10 is formed along with the side, a laser beam is radiated along with the dividing line L from the outside of the one terminal of the substrate 1 through the surface of the substrate 1 to the outside of the other terminal to apply preprocessing working for division to the substrate 1 (to form a groove 20, for example), and the substrate 1 is divided along with the dividing line L (groove 20) to which preprocessing working for division is applied. No electrode is formed in a region (outer-most terminal region) R close to the outer-most terminal on the substrate surface, and preprocessing working for division is also applied to the outer-most terminal region R. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a substrate dividing method, and more particularly to a substrate dividing method using a laser processing method.

  Conventionally, for example, when manufacturing an electronic component such as a printed circuit board through a process of dividing a substrate made of a ceramic material such as alumina, a single mother board is divided into a plurality of sub-boards, and a large number of electronic components are simultaneously formed. A so-called multi-cavity manufacturing method for manufacturing is generally used.

  In this multi-cavity manufacturing method, when a mother substrate (hereinafter simply referred to as “substrate”) is divided, a dividing groove or the like (hereinafter simply referred to as “divided groove”) at a predetermined position (division line) of the substrate. It should be noted that the “divided groove” here is not limited to a literal groove, but a through perforation in which through holes are continuously formed at predetermined intervals, and a non-through hole is defined as a predetermined groove. Including a non-penetrating perforation formed continuously at intervals, etc.), forming a predetermined circuit pattern on the substrate, or arranging a resistance element, A method of breaking a substrate along the dividing groove and dividing the substrate into individual electronic component elements (products) is widely used.

By the way, as a method of forming the above dividing grooves,
(1) A method of forming a dividing groove with a mold or the like in advance when forming a substrate,
(2) There is a method of forming divided grooves on the formed substrate by a method such as laser processing.

  However, as shown in FIG. 8, when the dividing groove L is formed from one end 52a, 53a of the substrate 51 to the other end 52b, 53b facing each other, the strength of the substrate 51 after forming the dividing groove is increased. There is a problem that the substrate 51 is broken in a process such as component mounting before the division.

  Therefore, as shown in FIG. 9, the dividing grooves L excluding the dividing grooves La and Lb on both ends in the vertical direction are formed from the one end portions 52a and 53a of the substrate 51 to the other end portions 52b and 53b facing each other. Instead, a method of stopping at a slightly forward portion has been proposed (see, for example, Patent Document 1).

However, in the case of this method, although the strength of the substrate is ensured, there is a problem that it takes time and effort for processing. That is, for example, when forming the dividing groove by laser processing, if the moving speed of the laser beam (relative moving speed of the substrate and the laser beam) is increased, the end point position varies and the dividing groove is formed to the end. Therefore, there is a problem that the machining speed is slowed to suppress the variation in the end point position, and the machining speed is slow and the productivity is low.
Further, at the start and end positions of the laser beam irradiation, there is a problem that an excessive laser beam is irradiated and the substrate strength is lowered.
Japanese Utility Model Publication No. 5-31270

  The present invention has been made in view of the above circumstances, and it is possible to efficiently and quickly perform pre-processing for division (processing for forming a substrate dividing groove or slit) by a laser processing method. In addition, it is an object of the present invention to provide a method for dividing a substrate that can suppress or prevent the substrate from being cracked in a subsequent process of handling the substrate.

In order to solve the above problems, a substrate dividing method according to the present invention (Claim 1) includes:
Forming a film for laser reflection along the side at least in a region through which a dividing line to divide the substrate passes, in a region near the end of at least one side of the substrate surface;
A step of performing pre-processing for division on the substrate by irradiating a laser beam from the outside of one end portion of the substrate to the outside of the other end portion along the dividing line where the substrate is to be divided;
And a step of dividing the substrate along the dividing line.

  The substrate dividing method according to claim 2 is characterized in that the laser reflecting film is formed at least in a region in the vicinity of the ends on the two sides facing each other on the substrate surface.

  According to another aspect of the substrate dividing method of the present invention, when the laser reflecting film is formed in the region near the edge of the substrate surface, the film is formed in a region excluding the outermost region of the region near the edge of the substrate surface. It is characterized by forming.

  Further, in the method for dividing a substrate according to claim 4, in the step of forming the laser reflecting film, the unnecessary region has an unnecessary region in a region inside the outermost region of the end portion of the substrate. Among them, a film for laser reflection is formed in at least a part of a region through which a division line inside the outermost division line of the substrate passes.

  The substrate dividing method according to the present invention (Claim 1) is for laser reflection along the side of at least one side of the substrate surface in the vicinity of the edge of the substrate surface along the side where the dividing line for dividing the substrate passes. The substrate is subjected to pretreatment for division by irradiating a laser beam from the outside of one end portion of the substrate to the outside of the other end portion along the dividing line where the substrate is to be divided. Since processing is performed and the substrate is divided along the dividing line where the pretreatment for division is performed, it is possible to increase the pretreatment speed for division by irradiating the laser beam, Subsequent cracking of the substrate in the processing step until the substrate is divided can be efficiently prevented.

That is, when a film for laser reflection is formed along the side at least in a region in the vicinity of the edge on the side of the substrate side where a dividing line for dividing the substrate passes, Because it is reflected, when performing pre-processing for division on the substrate by irradiating the laser beam, high-speed from one end of the substrate to the other end without causing a problem in the position variation of the start point and end point of laser beam irradiation It is possible to irradiate with a laser beam, and it is possible to perform pre-processing for dividing to form a dividing groove, a non-through hole, a through hole, etc. in the substrate quickly, and the film Since the formed region is kept in a state where the pretreatment for division is not performed and is reinforced by the film, it becomes possible to ensure the mechanical strength of the substrate, It is possible to prevent cracking of the substrate efficiently in the process after the split pretreatment processing steps.
Therefore, by applying the present invention to a method for manufacturing an electronic component manufactured through the process of dividing the substrate, it is possible to efficiently manufacture the electronic component.

In the substrate dividing method of the present invention, after dividing the substrate along the dividing line after performing the pretreatment for dividing the substrate on which the laser reflecting film is formed, the substrate is divided. At this stage, by dividing and removing the region where the film for laser reflection is formed, the pre-processing for dividing such as grooves is applied to the edge of the substrate, and then the substrate The remaining portion can be easily and reliably divided along a predetermined dividing line.
In the present invention, it is also possible to form a belt-like pattern film along a predetermined side in a region near the edge of the substrate as the laser reflecting film, and a plurality of lines through which each divided line passes. It is also possible to form a plurality of films at regular intervals along a predetermined side of the region near the edge of the substrate so as to be located on the region.

In the present invention, the pre-processing for division is
(1) Processing that forms a perforated hole by irradiating a pulsed laser at regular intervals,
(2) Processing for forming perforated through holes in the same manner as in (1) above,
(3) Dividing the substrate at a predetermined position, such as processing to form grooves by a method of continuous laser irradiation or a method of irradiating a pulsed laser so that non-through holes are continuously formed This is a broad concept including various processing processes for enabling the processing, and the specific shape of the processed part is not particularly limited.
In addition, examples of the laser reflecting film in the present invention include an electrode (film) made of a metal such as Ag.

In addition, when the film for laser reflection is formed at least in the vicinity of the end portions on the two sides facing each other on the surface of the substrate as in the method for dividing a substrate according to claim 2, the two sides facing each other Since the region near the end on the side is kept in a state where the pre-processing for dividing is not performed, the strength of the substrate can be held more reliably and the reliability can be improved. .
In addition, for example, when the substrate is divided at a plurality of positions in one direction and in a direction perpendicular thereto (that is, in the vertical direction and the horizontal direction), the laser reflection is performed on the region near the edges on the two opposite sides of the substrate surface. It is possible to improve the overall strength of the substrate simply by forming a film for use, and when handling the substrate, by holding the substrate in consideration of the position and direction where the strength of the substrate is high The substrate can be handled easily and safely without causing any cracks in the substrate.
In some cases, it is also possible to form a film for laser reflection in each of the vicinity of the end portions on the four sides of the substrate having a square planar shape. In this case, the substrate is divided at a desired position by removing the regions near the end portions on the four sides where the film is formed before actually dividing, and then dividing along the dividing line. be able to.

  In addition, as in the method for dividing a substrate according to claim 3, when forming a film for laser reflection in a region near the end of the substrate surface, an outermost region (outermost end) When a film is formed in a region excluding (region), it is divided not only into the region inside the region where the film is formed but also into the region outside the region where the film is formed (outermost end region) A pre-processing process (for example, a groove) is performed, and a portion (for example, a part in which a groove or the like is formed) of the edge outermost region absorbs an external stress applied to the substrate. Since the function is fulfilled, it becomes possible to more reliably prevent the substrate from being cracked in the subsequent process, and to further improve the reliability.

  That is, in the case of a substrate that has not been subjected to pretreatment for division in the outermost region of the end portion, when the substrate is cracked by applying stress from the outside, it is not determined from which part of the substrate cracking occurs, When cracks occur, cracks may occur even in the parts (sub-boards) that become the individual elements inside, but when pre-processing for division is applied to the edge of the substrate (grooves are formed) When the external stress is applied, cracks are generated from the part that has been pre-processed for splitting, which makes it possible to absorb external stress to some extent, It is possible to reduce the damage received, and a pretreatment process for division is applied, and a film for laser reflection is formed in a region inside the outermost region of the end where the grooves are formed, and the substrate is It is reinforced and the membrane is cracked To fulfill the function of preventing the line, or cracks occur until the child substrate, it prevents the entire substrate is cracked, it is possible to prevent, it is possible to further improve reliability.

  Further, as in the method for dividing a substrate according to claim 4, in the step of forming an unnecessary region in a region inside the outermost region of the end portion of the substrate and forming a film for laser reflection, If a film for laser reflection is formed in at least a part of the region through which the division line inside the outermost division line of the board passes, the strength of the board can be further improved, and the component It is possible to more reliably prevent the substrate from cracking during mounting or the like, and to further improve the reliability.

  Examples of the present invention will be described below to describe the features of the present invention in more detail.

In the first embodiment, a case will be described as an example in which a circuit board is manufactured by a multi-chip manufacturing method in which a mother board is divided and a large number of circuit boards are manufactured simultaneously.
[Manufacture of mother board with electrodes for laser reflection]
(1) First, a conductive paste for forming a predetermined electrode pattern (circuit pattern) is printed on a substrate made of ceramic such as alumina (mother substrate) (substantially square substrate with a side of 101.6 mm) and fired. To form a circuit pattern.
(2) Next, an Ag-based conductive paste is printed on a region near the ends of the two opposite sides of the substrate surface and baked, whereby Ag is easy to reflect a laser beam with a thickness of 8 to 20 μm. As the film, an electrode for laser reflection made of a thick film electrode is formed.
(3) Then, a resistor paste is printed on a predetermined region of the substrate surface and baked to form a resistor.
(4) Thereafter, a protective film (glass film, resin film, etc.) is formed on the substrate surface.

FIG. 1 is a schematic diagram showing the arrangement of the laser reflecting electrodes on the mother substrate formed with the circuit pattern, the laser reflecting electrode, the resistor, the protective film, and the like formed in the above-described procedure. FIG. 2 is an enlarged view of a main part thereof.
In FIG. 1 and FIG. 2, the circuit pattern, resistance, and protective film are not shown.

As shown in FIGS. 1 and 2, a mother substrate (hereinafter also simply referred to as “substrate”) 1 includes two regions 2 a and 2 b facing each other, near end portions (width W = 4 mm) X 1, X 2 and Regions near the ends (width W = 4 mm) X3 and X4 on the sides 2c and 2d orthogonal to the sides 2a and 2b are blank portions that are not products.
In the end vicinity regions X1 and X2, a plurality of laser reflecting electrodes 10 are arranged at predetermined intervals along the sides 2a and 2b. Each electrode 10 is disposed so as to cover a region in which the dividing line L (L1) to divide the substrate 1 passes through the end vicinity regions X1 and X2, and the dimensions of each electrode 10 are in the horizontal direction. The dimension A (see FIG. 2) is 3 mm, and the longitudinal dimension B (see FIG. 2) is 2 mm.
Further, the region (end outermost region) R between the electrode 10 and the end of the substrate 1 is configured such that the electrode 10 is not formed, and the width C of the end outermost region R is 0. .3 mm.
Furthermore, in the first embodiment, the distance D between the adjacent electrodes 10 is about 2 mm.
It is also possible to reduce the distance D to zero, that is, to form all or part of each electrode 10 continuously in the arrangement direction.

[Pre-processing and division for dividing mother board]
(1) Along the dividing line (horizontal dividing line in FIGS. 1 and 2) L (L1) of the mother substrate (substrate) 1 having the laser reflecting electrode 10 formed as described above, A laser beam is irradiated from the outside of one end of the substrate 1 to the outside of the other end through the substrate 1, and a dividing line perpendicular to the dividing line L (L1) (the vertical direction in FIGS. 1 and 2). The substrate 1 is subjected to pre-processing for division by irradiating a laser beam from one end to the other end of the substrate 1 along the dividing line L (L2). In the first embodiment, as the pre-processing for division, the laser beam is continuously irradiated so that the cross-sectional shape is substantially V-shaped, the width is about 0.15 mm, and the depth is about 0.1 to 0. A groove 20 of 25 mm was formed.
In the step of irradiating the laser beam, since the laser beam is reflected from the surface of the electrode 10, when the substrate 1 is subjected to the pre-processing for division by irradiating the laser beam, variations in the start point and end point of the laser beam irradiation are performed. Can be irradiated at high speed from one end of the substrate 1 to the other end.

  In the first embodiment, as a method of irradiating the laser beam from the outside of one end of the substrate 1 to the outside of the other end through the substrate 1, for example, the laser beam is transmitted along a path indicated by an arrow Y in FIG. The so-called bidirectional scribing method of irradiating the substrate is used to perform the pre-processing for division, and the conventional pre-processing for division is not formed from one end of the substrate to the other end facing each other. Compared with the method of stopping at the front part, the pretreatment for division was performed in a short time.

In addition, since the portion where the electrode 10 is formed is kept in a state where the pre-processing for division is not performed, it is possible to ensure the mechanical strength (such as bending strength) of the substrate 1, and It becomes possible to prevent the substrate 1 from being cracked in the process after the pre-processing for use.
Furthermore, since the electrode 10 is not formed in the outermost region (outermost region) R of the edge of the surface of the substrate 1, not only the region inside the electrode 10 but also the outer side of the electrode 10. Grooves 20 are also formed in this region (endmost outermost region R), and this groove 20 functions to absorb external stress applied to the substrate 1, so that the substrate can be more reliably prevented from cracking in the subsequent process. It becomes possible to further improve the reliability.

(2) Then, the substrate is divided along the dividing lines L (L2 _a , L2 _b ) on the left and right ends of the vertical dividing line L (L2), and the left and right end vicinity regions (margin portions) X1 , X2 and the substrate 1 is divided along the dividing lines L (L1 _a , L1 _b ) on both the upper and lower ends of the horizontal dividing line L (L1), so that the upper and lower end vicinity regions (margins) Part) X3 and X4 are removed. As a result, as shown in FIG. 4, the marginal portion of the peripheral portion of the substrate 1 is removed, and the grooves 20 are formed from one end portion to the other end portion of the substrate 1 for all the dividing lines L (L1, L2). The substrate 1 (1a) in the state of being formed (having been subjected to the pretreatment for division) is obtained. In the substrate 1 (1a) in this state, the substrate 1 can be divided along a desired dividing line L (L1, L2).

(3) Next, the substrate 1 (1a) is divided along the respective dividing lines L (L1, L2) to be divided into individual elements.
As a result, it becomes possible to efficiently manufacture a circuit board manufactured through a process of dividing the mother board by a so-called multi-chip method.

  In Example 1, the strength of the substrate 10 is improved by forming the electrode 10 in the region excluding the outermost region of the end portion of the surface of the substrate 1, and the depth of the groove 20 is reduced to the conventional depth. It became possible to deepen from 60 to 120 μm to 100 to 150 μm, and it was possible to improve the breakability of the substrate.

  In addition, since the laser beam is reflected in the region where the electrode 10 is formed, when the substrate 1 is subjected to the pre-processing for division by irradiating the laser beam, variations in the starting point and end point of the laser beam irradiation are a problem. In addition, it was possible to irradiate the laser beam at high speed from the outside of one end of the substrate to the outside of the other end through the substrate 1, thereby improving productivity.

Furthermore, since the electrode 10 is not formed in the outermost region (outermost region) R of the edge of the surface of the substrate 1, not only the region inside the electrode 10 but also the outer side of the electrode 10. Grooves 20 are also formed in this region (endmost outermost region R), and this groove 20 functions to absorb external stress applied to the substrate 1, so that the substrate 1 in the subsequent process is not reduced without reducing breakability. It was possible to more reliably prevent cracking and further improve the reliability.
In the first embodiment, the electrodes 10 are formed only on the two sides opposite to each other on the surface of the substrate 1. In this way, the electrodes are formed only on the two sides opposite to each other on the substrate surface. It is possible to improve the overall strength of the substrate 1, and when the substrate is handled, the substrate 1 is cracked by holding the substrate in consideration of the position and direction where the strength of the substrate is high. Thus, the substrate 1 can be handled easily and safely.

  In the first embodiment, the groove 20 having a substantially V-shaped cross section is formed by continuously irradiating a laser beam as the pre-processing for dividing. For example, a pulsed laser beam is formed at a constant interval. Irradiation is performed every time, and as shown in FIG. 5, it is also possible to form non-through holes 21 having a length of about 130 mm and a width of about 0.15 mm like perforations at a pitch of about 0.12 mm. Although not particularly shown, a through hole can be formed instead of the non-through hole 21.

FIG. 6 is a diagram schematically showing a mother substrate provided with a laser reflecting electrode formed in the substrate dividing method according to another embodiment of the present invention.
In the second embodiment, as shown in FIG. 6, the substrate 1 has two adjacent edges X1 and X2 on the sides 2a and 2b and ends on the sides 2c and 2d orthogonal to the sides 2a and 2b. The portion vicinity regions X3 and X4 are blank portions that are not products.
In the end vicinity regions X1, X2, and X3, X4, a plurality of laser reflecting electrodes 10 are arranged along the sides 2a, 2b and the sides 2c, 2d at predetermined intervals. . Each electrode 10 is disposed so as to cover the region through which the dividing line L (L1, L2) for dividing the substrate 1 passes through the end vicinity regions X1, X2, and X3, X4. It should be noted that electrodes are not formed on the dividing lines L (L2 _a , L2 _b ) on the left and right ends so that the substrate 1 can be finally divided along the predetermined dividing lines L1, L2.
Other configurations are the same as in the case of the first embodiment, and in FIG. 6, portions denoted by the same reference numerals as those in FIG. 1 indicate the same or corresponding portions.
Then, the laser beam is applied to the mother substrate (substrate) 1 formed as described above along the dividing line (horizontal dividing line in FIG. 6) L (L1) of the mother substrate (substrate) 1. Irradiation from the outer side of one end of 1 to the outer side of the other end through the substrate 1, and a dividing line (vertical dividing line in FIG. 6) L (L2) in a direction orthogonal to the dividing line L (L1) ), The substrate 1 is subjected to pre-processing for division by irradiating the laser beam from the outside of one end portion of the substrate 1 to the outside of the other end portion.
Also in this Example 2, the pre-processing for division was performed in the same manner as in Example 1 above.

Then, the substrate is divided along the dividing lines L (L2 _a , L2 _b ) on the left and right ends of the vertical dividing line L (L2), and the left and right end vicinity regions (margin portions) X1, X2 are In addition to the removal, the substrate 1 is divided along the dividing lines L (L1 _a , L1 _b ) on the upper and lower ends of the horizontal dividing line L (L1), so that the upper and lower end vicinity regions (margin portions) X3 , X4. As a result, the marginal portion of the peripheral portion of the substrate 1 is removed, and the grooves 20 are formed from one end portion to the other end portion of the substrate 1 for all the dividing lines L (L1, L2) (before dividing). The substrate 1 (1a) in a state in which the processing is performed is obtained. In the substrate 1 (1a) in this state, the substrate 1 can be divided along a desired dividing line L (L1, L2).

Next, the substrate 1 (1a) is divided along each dividing line L (L1, L2) to be divided into individual elements.
As a result, it becomes possible to efficiently manufacture a circuit board manufactured through a process of dividing the mother board by a so-called multi-chip method.
In the case of the second embodiment, the dividing line L (L2) of the end vicinity regions X3 and X4 on the sides 2c and 2d orthogonal to the two sides 2a and 2b facing each other of the substrate 1 passes. Since the electrode 10 is disposed so as to cover the region to be processed, the strength of the substrate 1 can be sufficiently improved, and the substrate 1 can be reliably prevented from being cracked in a component mounting process or the like. Thus, the reliability can be further improved.

FIG. 7 is a diagram schematically showing a mother substrate provided with a laser reflecting electrode formed in the substrate dividing method according to still another embodiment of the present invention.
In the third embodiment, as shown in FIG. 7, the substrate 1 is formed on the sides 2c and 2d, which are orthogonal to the two sides 2a and 2b opposite to each other. The edge vicinity regions X3 and X4 are blank portions that are not products, and the vertical belt-like regions X5, X6, X7, X8, and X9 sandwiched between the vertical edge vicinity regions X1 and X2 are provided. It is an unnecessary area that does not become a product.
In the end vicinity regions X1 and X2, a plurality of laser reflecting electrodes 10 are arranged along the sides 2a and 2b at a predetermined interval, and a vertical belt-like region (unnecessary) (Region) X5, X6, X7, X8, and X9 are used for laser reflection in at least a part of the region through which the division line L1 other than the outermost division lines (division lines on both upper and lower ends) L1 _a and L1 _b passes. Electrode 10a is formed.
Other configurations are the same as in the case of the first embodiment, and in FIG. 7, portions denoted by the same reference numerals as those in FIG. 1 indicate the same or corresponding portions.
A laser beam is formed along a division line (horizontal division line in FIG. 7) L (L1) of the mother substrate (substrate) 1 provided with the laser reflecting electrodes 10 and 10a formed as described above. Is irradiated from the outside of one end portion of the substrate 1 to the outside of the other end portion through the substrate 1, and a dividing line (vertical dividing line in FIG. 7) L in a direction orthogonal to the dividing line L (L1). The laser beam is irradiated from the outside of one end of the substrate 1 to the outside of the other end along (L2), thereby subjecting the substrate 1 to pretreatment for division.
In the third embodiment, the pre-processing for dividing was performed in the same manner as in the first and second embodiments.

Then, the substrate is divided along the dividing lines L (L2 _a , L2 _b ) on the left and right ends of the vertical dividing line L (L2), and the left and right end vicinity regions (margin portions) X1, X2 are In addition to the removal, the substrate 1 is divided along the dividing lines L (L1 _a , L1 _b ) on the upper and lower ends of the horizontal dividing line L (L1), so that the upper and lower end vicinity regions (margin portions) X3 , X4. Thereby, the margin part of the peripheral part of the board | substrate 1 is removed. After that, by dividing the substrate 1 (1a) along a predetermined dividing line L (L1, L2), unnecessary areas X5, X6, X7, X8, X9 are removed, and necessary portions are divided to individually The element is obtained.
As a result, it becomes possible to efficiently manufacture a circuit board manufactured through a process of dividing the mother board by a so-called multi-chip method.
In the third embodiment, the electrodes 10 are formed in the end vicinity regions X1 and X2, and the outermost divided lines (on the upper and lower end sides) of the substrate 1 in the unnecessary regions X5, X6, X7, X8, and X9. since so as to form a horizontal split _{line) L (L1 a, L1 b} ) electrode 10a of the laser reflected on at least part of the region division line L1 of the inner passes than, the more the strength of the substrate 1 It is possible to improve the reliability, and it is possible to reliably prevent the substrate 1 from being cracked in the component mounting process and to further improve the reliability.

The present invention is not limited to the above-described embodiments in other respects. The specific shape and constituent material of the substrate to be divided, the position and number of division lines to divide the substrate, the laser Within the scope of the invention, regarding the irradiation method, the type of pre-processing for division, the shape and arrangement position of the electrode for laser reflection, the presence or absence of the electrode in the outermost region of the substrate edge, the electrode formation method, the electrode constituent material, etc. It is possible to add various applications and modifications.
Further, the laser reflecting film is not limited to the electrode, and any material can be used as long as it can reflect the laser. However, it is desirable that it can be formed by printing.

In the present invention, a laser reflecting film is formed along the side in a region through which the dividing line passes, and the laser beam is emitted from the outside of one end of the substrate onto the substrate along the dividing line to be divided. By irradiating to the outside of the other end through the substrate, the substrate is subjected to pre-processing for division, and the substrate is divided along the dividing line where the pre-processing for division is performed. It is possible to perform the pre-processing for division by the method at a high speed, and it is possible to suppress and prevent cracking of the substrate in the subsequent processing steps. Further, when a film is not formed in the outermost area (end outermost area) of the edge of the substrate surface, the pretreatment for division is also applied to the outermost edge, and this edge outermost is processed. The portion of the outer region that has been subjected to the pre-processing for dividing (for example, the portion in which the groove or the like is formed) functions to absorb external stress applied to the substrate, thereby more reliably preventing the substrate from cracking in the subsequent process. It becomes possible to further improve the reliability.
Therefore, the present invention can be widely applied to a method of manufacturing an electronic component manufactured through a step of dividing a substrate that has been subjected to pretreatment for division by a laser processing method.

It is a figure which shows typically the mother board | substrate provided with the electrode (film | membrane) for laser reflection formed in one Example (Example 1) of this invention. It is a principal part enlarged view of FIG. In Example 1 of this invention, it is a figure explaining the method of irradiating a mother substrate with a laser beam. It is a figure which shows the state from which the edge part vicinity area | region (margin part) of the mother board | substrate was removed. It is a figure which shows the other example of the pre-processing process for a division | segmentation in the division | segmentation method of the board | substrate of this invention. It is a figure which shows typically the mother board | substrate provided with the electrode for laser reflection formed in the division | segmentation method of the board | substrate concerning the other Example (Example 2) of this invention. It is a figure which shows typically the mother board | substrate provided with the electrode for laser reflection formed in the division | segmentation method of the board | substrate concerning further another Example (Example 3) of this invention. It is a figure which shows an example of the division | segmentation method of the conventional board | substrate. It is a figure which shows the other example of the division | segmentation method of the conventional board | substrate.

Explanation of symbols

1 Mother board (board)
1a Substrate 2a, 2b Two opposite sides of substrate 2c, 2d Two opposite sides of substrate 10, 10a Laser reflection electrode (film)
20 groove 21 non-through hole L1 _a , L1 _b Horizontal dividing line on both upper and lower ends (outermost dividing line)
L2 _a , L2 _b Vertical division lines L (L1, L2) on both left and right side division lines D Interval between adjacent electrodes R Region on the outermost side of the substrate (endmost outermost region)
X1, X2, X3, X4 Near edge area (margin)
X5, X6, X7, X8, X9 Unnecessary area Y Laser beam path

Claims (4)

Forming a film for laser reflection along the side at least in a region through which a dividing line to divide the substrate passes, in a region near the end of at least one side of the substrate surface;
A step of performing pre-processing for division on the substrate by irradiating a laser beam from the outside of one end portion of the substrate to the outside of the other end portion along the dividing line where the substrate is to be divided;
And a step of dividing the substrate along the dividing line.   2. The method for dividing a substrate according to claim 1, wherein the laser reflecting film is formed at least in a region in the vicinity of the ends on the two sides facing each other on the substrate surface.   The film is formed in a region excluding the outermost region of the region near the end of the substrate surface when forming the laser reflecting film in the region near the end of the substrate surface. 3. The method for dividing a substrate according to 2.   In the step of forming the laser reflecting film in the region inside the outermost region of the edge of the substrate and forming the laser reflecting film, the outermost division line of the substrate in the unnecessary region 4. The method for dividing a substrate according to claim 1, wherein a film for laser reflection is formed in at least a part of a region through which the inner dividing line passes.

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