JP2012243883A - Method of manufacturing multiple patterning wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a multiple patterning wiring board, for not easily causing failures of breakage, cracking or the like by division grooves formed in a lattice shape in a product region.SOLUTION: The multiple patterning wiring board includes: a product region 4 composed of ceramic, where a plurality of wiring board parts 1 provided with a front surface 2 and a back surface 3 that are rectangular in the plan view are provided together adjacently in a matrix; an ear part 5 similarly composed of ceramic, positioned around the product region 4, and provided with the front surface 2 and the back surface 3 that are in a rectangular frame shape in the plan view; and the division grooves formed in the lattice shape in the plan view on the front surface 2 along a boundary of the adjacent wiring board parts 1 and 1 and a boundary of the product region 4 and the ear part 5. The method of manufacturing the multiple patterning wiring board includes the steps of: arranging a shield plate 10 for shielding a laser beam L on the front surface 2 of the ear part 5 in a green sheet laminate gs; and forming the division grooves in the product region 4 by performing scanning while irradiating the product region 4 of the green sheet laminate gs and the shield plate 10 with the laser beam L.

Description

  The present invention relates to a method for manufacturing a multi-piece wiring board made of ceramic and having a plurality of wiring board portions adjacent to each other vertically and horizontally.

  In general, a ceramic wiring board is manufactured by dividing a ceramic multi-piece wiring board into individual wiring boards along lattice-shaped dividing grooves provided on the front surface and the back surface thereof. Therefore, there has been proposed a method for manufacturing a dividing ceramic substrate having a dividing groove having a required cross-sectional shape by irradiating a laser beam along a planned cutting position in a product region in a green sheet laminate (for example, Patent Documents). 1).

  However, when grooving by laser beam irradiation of the manufacturing method described in Patent Document 1 is performed on the green sheet laminate, each end of a plurality of divided grooves formed in a lattice shape in the product region in plan view However, it may reach even within the region of the ear portion located on the outer peripheral side of the product region. For this reason, there has been a problem that the green sheet laminate may be damaged when the green sheet laminate is conveyed, or the ceramic laminate fired in the firing step may break.

JP 2004-276386 A (pages 1-7, FIGS. 1-4)

  The present invention solves the problems described in the background art, and a large number of pieces that are less likely to be damaged or broken by a division groove formed in a lattice shape in a product area provided with a plurality of wiring board portions. It is an object to provide a method for manufacturing a wiring board.

Means for Solving the Problems and Effects of the Invention

In order to solve the above problems, the present invention forms a grid-like divided groove in a product area of a green sheet to be a multi-piece wiring board, and each end of the divided groove is formed in an ear portion surrounding the product area. The idea was made with the idea that the part entered at a minimum.
That is, the method for manufacturing a multi-piece wiring board according to the present invention (Claim 1) is a product region comprising a plurality of wiring board parts which are made of ceramic and have a rectangular front and back surfaces, adjacent to each other vertically and horizontally. And an ear having a rectangular frame-shaped front and back surface, which is made of the same ceramic as described above, and located around the product region, a boundary between adjacent wiring board portions, and the product region and the ear And a dividing groove formed in a lattice shape in plan view on at least one of the front surface and the back surface, and a surface of the ear portion in the green sheet A step of disposing a shielding plate for shielding laser light on at least one of the upper and rear surfaces, and scanning the product region of the green sheet and the shielding plate while irradiating the laser light, And forming a dividing groove to pass, and characterized in that.

  According to this, the laser beam is scanned while irradiating the shielding plate and the product region disposed on the ear portion on at least one of the front surface and the back surface of the green sheet. As a result, divisional grooves having a lattice shape in plan view are formed along the boundary between the wiring board portions in the product region, excluding the ear portion where the shielding plate is disposed, and the boundary between the product region and the ear portion. In addition, no split groove is formed in the ear portion shielded from the laser beam by the shielding plate. Therefore, the end portion (part) of the dividing groove is not formed in the ear portion, or only a very small portion is formed, so that it is possible to prevent problems such as breakage during conveyance of the green sheet and cracking in the firing process. Therefore, it becomes possible to efficiently manufacture a ceramic multi-cavity wiring board.

The green sheet will later become the ceramic sheet, and the green sheet includes a large and single-layer green sheet, or a large and large-sized green sheet laminate. .
The shielding plate has a rectangular frame shape in plan view and has one or a plurality of openings (through holes), and a combination of a plurality of sets of flat plates surrounding a single product region with a plurality of shielding plates. Including. The plurality of openings are opened adjacent to each other.
Further, the laser light includes a YAG laser, a YVO ₄ laser, a CO ₂ laser, an excimer laser, or a semiconductor laser.
Further, before the step of disposing the shielding plate, a through hole is formed in one or a plurality of green sheets, and a via conductor is filled in the through hole, and a conductor layer is formed on the front and back surfaces of the green sheet. A step of forming, and further, a step of stacking a plurality of green sheets to form a green sheet laminate.
Further, the step of forming the dividing groove includes a post-process of removing the shielding plate after forming the dividing groove by irradiating the laser beam.
In addition, after the step of forming the dividing grooves, a step of firing a green sheet or a green sheet laminate in which the dividing grooves are formed, and a metal portion on a conductor portion for each wiring board portion in the obtained ceramic laminate, etc. And a step of performing plating.

Further, according to the present invention, in the step of arranging the shielding plate, a distance between an end of the shielding plate on the product region side and a dividing groove formed at a boundary between the product region and the ear portion is 0. A method of manufacturing a multi-piece wiring board in which the shielding plate is arranged so as to be 5 mm or less (claim 2) is also included.
According to this, since the laser beam is not blocked even at a position outside the dividing groove, the dividing groove that is parallel to the end portion on the product region side of the shielding plate and that is closest to the end portion is also surely formed. be able to. And the length of each edge part of the division | segmentation groove | channel which approachs into the area | region of the ear | edge part located outside a product area | region is suppressed to 0.5 mm or less in planar view. As a result, problems such as breakage and cracking can be reliably prevented.

The end of the shielding plate on the product region side constitutes the side of the shielding plate that is closest to the product region of the green sheet among the shielding plates arranged on the surface of the ear or the like, or the opening. Refers to any inner side. The shield plate includes a mouth shape.
In addition, the reason why the distance is set to 0.5 mm or less is that when the length of the dividing groove entering the region of the ear portion exceeds 0.5 mm, the strength of the ear portion in the portion is reduced. This is because the possibility of breakage or cracking may occur.
Further, the distance of 0.5 mm or less may be a distance between the end of the shielding plate on the product region side and a planned division position (a center line of the division groove) where the division groove is formed.
In addition, 0.2 mm is recommended as the lower limit of the distance.

Furthermore, the present invention includes a method for manufacturing a multi-piece wiring board (Claim 3), wherein the shielding plate is made of metal or ceramic.
According to this, a shielding plate obtained by punching a metal plate into a required shape or laminating and baking a plurality of green sheets having a required shape is disposed on the ear portion of the green sheet, thereby And the product region of the green sheet can be subjected to the dividing groove forming step of scanning while continuously irradiating the laser beam. As a result, a dividing groove can be formed in the product area of the green sheet to which the laser beam is directly irradiated, and the ear portion shielded from the laser beam by the shielding plate has the ear portion removed from the shielding plate. Only the end portion of the dividing groove having a length of 0.5 mm or less enters only the portion along the product region side. Therefore, the damage and cracking can be reliably prevented.

The thickness of the shielding plate is recommended to be 1.5 mm or more (for example, 2.0 mm).
Further, it is necessary to select a material having a low absorptance at the wavelength of the laser to be used as the metal constituting the shielding plate. For example, aluminum (including aluminum alloy), nickel (including nickel alloy), and brass (copper-zinc alloy, so-called brass) are recommended.
Further, a high-temperature fired ceramic such as alumina, aluminum nitride, mullite, etc. is recommended as the ceramic constituting the shielding plate.

In addition, the present invention includes a method for manufacturing a multi-piece wiring board in which the shielding plate has a lattice frame shape (Claim 4).
According to this, in the green sheet, a plurality of product regions having a rectangular shape (square or rectangular) in plan view in which a plurality of wiring board portions are adjacently arranged vertically and horizontally are similar to the rectangle and the product region. By arranging a shielding plate having a plurality of openings that can surround the surface of the green sheet on the surface of the green sheet or the like, the process of forming the dividing groove can be continuously performed on a plurality of product regions, so that further production is achieved. Efficiency can be improved.
The lattice frame shape includes a mouth shape, a day shape, an eye shape, or a rice field shape.

The top view which shows the green sheet laminated body used as the object of this invention. The top view which shows the process which has arrange | positioned the shielding board to the ear | edge part of the said green sheet laminated body. FIG. 3 is a vertical sectional view including a step of forming a dividing groove along the line XX in FIG. 2. FIG. 4 is an enlarged cross-sectional view showing a part of FIG. 3 and a process of forming a dividing groove following FIG. 3. The enlarged plan view which shows the formation process of the division groove following FIG. FIG. 6 is a vertical sectional view similar to FIG. The expanded sectional view which shows the formation process of the division | segmentation groove | channel in FIG. The enlarged plan view which shows the formation process of the division | segmentation groove | channel in FIG. FIG. 9 is a vertical cross-sectional view similar to FIG. 6, illustrating a process for forming a dividing groove following FIGS. 6 to 8. The vertical sectional view which shows the green sheet laminated body in which the division | segmentation groove | channel was formed. The top view which shows the said green sheet laminated body in which the division | segmentation groove | channel was formed. The top view which shows the shielding board of a different form. Furthermore, the top view which shows the shielding board of a different form.

Hereinafter, modes for carrying out the present invention will be described.
FIG. 1 is a plan view showing a green sheet laminate gs that is an object of the present invention.
A plurality of green sheets (not shown) were manufactured in advance by mixing an appropriate amount of a resin binder, a solvent, and the like into alumina powder to form a ceramic slurry, and forming the ceramic slurry into a sheet by a doctor blade method.
Next, a predetermined position for each of the plurality of green sheets is punched, and the obtained through hole is filled with a conductive paste containing W or Mo powder to form an unfired via conductor (not shown), A conductive paste similar to the above is disposed by printing at a predetermined position on at least one of the front surface and the back surface of each of the plurality of green sheets, and an unfired internal wiring layer or surface wiring layer (neither is shown) Formed.
Next, a plurality of green sheets having the via conductor and the wiring layer were stacked and pressure-bonded along the thickness direction.

As a result, as shown in FIG. 1, a product region 4 having a plurality of wiring board portions 1 having a front surface 2 and a back surface 3 (not shown) having a square (rectangular) shape in plan view, adjacent to each other vertically and horizontally, Ear portions 5 having a front surface 2 and a rear surface 3 (not shown) having a rectangular frame shape around the product region 4, a boundary between the wiring board portions 1, 1, and the product region 4 and the ear portion 5. A green sheet laminate gs having a thickness of 0.6 mm was obtained.
In addition, the division | segmentation planned surface 6 shown with a broken line in FIG. 1 is a virtual line arrange | positioned along the thickness direction of the green sheet laminated body gs. Moreover, the division | segmentation which crosses into the both ends of each division | segmentation surface 6 orthogonally to the division | segmentation plane 6 along the boundary of the product area | region 4 and the ear | edge part 5, and enters into the area | region of the ear | edge part 5 by 0.5 mm or less in length. An end 7 of the planned surface 6 extends. Further, the front surface 2 and the back surface 3 are commonly used for the wiring board portion 1, the product region 4, and the ear portion 5 of the green sheet laminate gs.

Further, as shown in FIG. 2, a shielding plate 10 having a rectangular frame shape in plan view is arranged on the surface 2 of the ear portion 5 in the green sheet laminate gs. The shielding plate 10 is made of an aluminum alloy plate or a nickel alloy plate having a plate thickness of about 2 mm, and includes a frame body 11 having a square shape in plan view and an opening 13 having a square shape in plan view provided inside thereof. Yes. The opening 13 has four sides 12 that surround the product region 4 of the green sheet laminate gs, and includes a splitting plane 6 that is located at the boundary between the product region 4 and the ear 5, and each side 12. A gap (width) of a distance s of 0.5 mm or less is set between them. That is, each side 12 of the opening 13 is an end of the shielding plate 10 on the product region 4 side.
In addition, as shown in the vertical sectional view of FIG. 3, each outer side of the frame body 11 of the shielding plate 10 coincides with each side surface 8 of the green sheet laminate gs, but outside the side surface 8. You may be made to be located in.

Next, as shown on the left side in FIG. 3, the thickness of the shielding plate 10 and the surface 2 of the product region 4 of the green sheet laminate gs exposed in the opening 13 of the shielding plate 10 is increased in these thickness directions. The laser beam L was continuously irradiated to the right side and scanned toward the right side.
The laser light L is irradiated from a light source such as UV-YAG, YVO ₄ , or a semiconductor, and is irradiated under certain conditions while keeping the focal point F near the surface 2 of the green sheet laminate gs by the condenser lens 9. It was. For example, when the YAG laser beam L is used, when the feed rate is constant (about 100 mm / second), the depth of the dividing groove 14 to be formed is about 200 μm, and the width of the opening is about 50 μm, the laser beam The irradiation condition of L was set to frequency: about 30 to 100 Hz, and repetition frequency: 2 to 5 times. Note that white arrows in FIG. 3 and subsequent figures indicate the scanning direction of the laser light L.

As shown in the partially enlarged cross-sectional view of FIG. 4 following FIG. 3, the laser light L crossing the frame body 11 of the shielding plate 10 along the width direction is one side that forms the opening 13 of the shielding plate 10. Immediately after passing through 12, the surface 2 of the green sheet laminate gs was irradiated. As a result, due to the radiant energy of the laser beam L, the concave portion 17 including the spherical surface 16 is closest to the side 12 on the surface 2 of the green sheet laminate gs adjacent to the side 12 of the shielding plate 10. It was formed so as to be orthogonal to the planned splitting surface 6. The spherical surface 16 is presumed to have been formed by the laser light L blocked by the shielding plate 10 abruptly increasing the radiant energy to the surface 2 of the green sheet laminate gs.
Subsequently, scanning was performed while irradiating the laser beam L toward the center side in the product region 4 of the green sheet laminate gs under the above conditions. As a result, as shown in the partially enlarged plan view of FIG. 5 following FIG. 4, the bottom portion 15 having a V-shaped cross section and a linear shape along the direction perpendicular to the side 12 in the opening portion 13 of the shielding plate 10. A dividing groove 14 having a spherical surface 16 at the start end adjacent to the side 12 is formed.

Further, as shown in FIG. 6, scanning was performed while irradiating the laser beam L across the product region 4 of the green sheet laminate gs and irradiating the opposite frame body 11 of the shielding plate 10 under the above conditions. As a result, between the pair of sides (ends) 12, 12 facing each other in the opening 13 of the shielding plate 10, a cross section that penetrates the surface 2 side of the wiring board 1 adjacent to each other in FIG. Is formed with a split groove 14 composed of a V-shaped and straight bottom 15 and a pair of left and right spherical surfaces 16 positioned substantially symmetrically at both ends thereof.
As shown in the partial enlarged cross section of FIG. 7 in which the right side portion in FIG. 6 is enlarged and the partial enlarged plan view of FIG. 8, along the surface 2 of the four wiring board parts 1 adjacent in the product region 4, The laser beam L having the V-shaped dividing groove 14 is blocked by the right frame body 11 of the shielding plate 10 and, at the same time, its radiant energy is rapidly reduced. Part) A spherical surface 16 was also formed at a position adjacent to 12.

The spherical surfaces 16 located at the start and end of the dividing groove 14 were located within a distance s of 0.5 mm or less from each side (end) 12 of the shielding plate 10. In other words, the dividing grooves 14 formed in the product region 4 of the green sheet laminate gs consisted of only a V-shaped section with the bottom 15 having a constant depth.
As shown in FIG. 3 to FIG. 8, by scanning along all the planned division surfaces 6 along the left-right direction of the green sheet laminate gs while irradiating the laser beam L in the same manner as described above, A dividing groove 14 similar to the above was formed along each planned dividing surface 6.
Next, as shown in FIG. 9, scanning was performed while irradiating the laser beams L sequentially or simultaneously in parallel in the same manner as described above along the respective scheduled division surfaces 6 along the front-rear direction shown in the figure. Thereafter, the shielding plate 10 was removed from the green sheet laminate gs.

As a result, as shown in the vertical sectional view of FIG. 10 and the plan view of FIG. 11, on the surface 2 of the green sheet laminate gs, the four sides for each of the plurality of wiring board portions 1 constituting the product region 4, and the product region 4 and the boundary between the ears 5, the entire plan view has a lattice shape, and only the spherical surfaces 16 at both ends enter the region of the ears 5 with a length of 0.5 mm or less, In addition, a plurality of dividing grooves 14 perpendicular to the length and breadth were formed in a lattice shape.
9 and 10, the side (end portion) 12 on the product region 4 side of the shielding plate 10 and the outer edge of the dividing groove 14 formed along the boundary between the product region 4 and the ear portion 5. The distance (s) between them was about 0.50 mm.
Further, the green sheet laminate gs in which the dividing grooves 14 are formed on the surface 2 is fired at a firing temperature of alumina, and a conductor portion (not shown) for each wiring board portion 1 in the obtained ceramic laminate. And a step of applying metal plating such as Ni and Au. As a result, it was possible to obtain a multi-piece wiring board made of ceramic and having a plurality of wiring board portions 1 adjacent to each other vertically and horizontally.

Since the dividing groove 14 was hardly formed in the ear portion 5, the green sheet laminate gs before firing was damaged or collapsed in each subsequent step after the forming process of the dividing groove 14 described above. In addition, there was no problem that the firing process and the subsequent ceramic multi-chip wiring substrate were broken.
According to the manufacturing method of the multi-piece wiring board as described above, the boundary between the wiring board parts 1 and 1 in the product area 4 and the product area 4 except the ear part 5 where the shielding plate 10 is arranged. A dividing groove 14 having a lattice shape in a plan view can be reliably formed along the boundary between the edge portion 5 and the ear portion 5, and the dividing groove 14 is formed in the ear portion 5 shielded from the laser beam L by the shielding plate 10. Was not. Therefore, since only the end portion 16 of the dividing groove 14 is formed in the ear portion 5 with a very short length, inadvertent breakage at the time of transporting the green sheet laminate gs, cracking at the time of firing, and thereafter It was possible to reliably prevent such problems.
The dividing groove 14 may also be formed on the back surface 3 side of the green sheet laminate gs.

FIG. 12 is a plan view showing different forms of shielding plates 10a arranged on the surface 2 of the not-shown ear portion 5 of the green sheet laminate gs having a rectangular shape in plan view.
The shielding plate 10a is also made of the same aluminum alloy plate as described above. As shown in FIG. 12, the shielding plate 10a has a pair of left and right frame bodies 11 and an opening 13 located inside each frame body 11, and is adjacent to the frame bodies. An intermediate beam 11a common to the pair of frame main bodies 11 is installed between the openings 13 and 13, and the whole has a Japanese character (lattice frame) shape in plan view. Each opening 13 has four sides 12 that surround each product region 4 of the green sheet laminate gs, and each of the sides to be divided 6 is located at the boundary between the product region 4 and the ear 5. A distance s of 0.5 mm or less is located between the two. The end portions 7 on both sides of each scheduled split surface 6 enter the ear portion 5 having the distance s with a length of 0.5 mm or less.
According to the shielding plate 10 a as described above, in addition to the effect of the shielding plate 10, when scanning while irradiating the laser light L along each of the scheduled division surfaces 6 along the left-right direction in FIG. The laser beam L can be scanned continuously along each scheduled split surface 6 in the pair of openings 13. Therefore, it is used in the step of forming the dividing groove 14 for the green sheet laminate gs having the front surface 2 and the rear surface 3 having a relatively wide area including the two product regions 4 by reducing the number of times of groove processing alignment. Is the best.

FIG. 13 is a plan view showing a further different form of the shielding plate 10b disposed on the surface 2 of the not shown ear portion 5 of the green sheet laminate gs having a square shape in plan view. The shielding plate 10b is also made of the same aluminum alloy plate as described above. As shown in FIG. 13, the left and right and upper and lower pairs and a total of four frame bodies 11 and the same openings located inside the frame bodies 11 are used. A cross-shaped middle rail 11b that is common to the four frame bodies 11 is installed between the adjacent openings 13 and 13, and the entire shape is a rice field (lattice frame in plan view). ) It has a shape.
According to the shielding plate 10b as described above, in addition to the effect of the shielding plate 10, when scanning while irradiating the laser beam L along each of the planned dividing surfaces 6 along the left and right and up and down directions of FIG. The laser beam L can be scanned continuously along each of the planned split surfaces 6 exposed in the pair of left and right and upper and lower openings 13. Accordingly, the number of times of groove processing alignment is reduced, and it is optimal for the process of forming the divided grooves 14 for the green sheet laminate gs having the front and back surfaces 2 and 3 having a relatively large area having the four product regions 4 together. It is.

The present invention is not limited to the embodiments described above.
For example, the object of the present invention includes a single-layer green sheet having the same product region 4 and ear portion 5 on the front surface 2 and the back surface 3 as described above.
The green sheet or the green sheet laminate gs may be made of a material that becomes a high-temperature fired ceramic such as mullite or aluminum nitride or a glass-ceramic that is a kind of low-temperature fired ceramic when fired later. .
Furthermore, the wiring board portion 1 may have a form in which the plan view has a rectangular shape, and accordingly, the entire product region 4 may have a form in the form of a rectangle in the plan view. Or it is good also as a form which the product area | region 4 which has the said some wiring board part 1 which has a square planar view shows a rectangle by planar view.
Further, the dividing groove 14 may be formed so as to be symmetrical with the dividing groove 14 on the front surface 2 side with respect to the back surface 3 side of the green sheet laminate gs.
In addition, the wiring board 1 may have a cavity for mounting electronic components on the surface 2 thereof.

  According to the present invention, it is possible to efficiently manufacture and provide a multi-piece wiring board that is less likely to be damaged or broken by a division groove formed in a lattice shape with respect to a product region provided with a plurality of wiring board portions. It becomes possible to do.

1 ………………………… Wiring board 2 ………………………… Front side 3 ………………………… Back side 4 ………………………… Product Area 5 ………………………… Ear part 6 ………………………… Scheduled plane (position)
10, 10a, 10b ... shielding plate 12 ..................... side of the opening (the end of the shielding plate on the product basin side)
14 ………………………… Dividing groove gs ……………………… Green sheet laminate s ………………………… Distance L ………………………… Laser light

Claims (4)

A product region made of ceramic and having a plurality of wiring board parts vertically and horizontally adjacent to each other having a rectangular front surface and a back surface in a plan view;
Ears having the front and back surfaces of a rectangular frame in a plan view that is made of the same ceramic as described above and is located around the product region;
A plurality of dividing grooves each having a dividing groove formed in a lattice shape on at least one of the front surface and the back surface along a boundary between adjacent wiring board portions and a boundary between the product region and the ear portion. A method for manufacturing a wiring board, comprising:
Arranging a shielding plate for shielding laser light on at least one of the front and back surfaces of the ear part in the green sheet;
Forming a dividing groove in the product region by scanning while irradiating the product region of the green sheet and the shielding plate with a laser beam,
A method of manufacturing a multi-cavity wiring board characterized by the above. In the step of arranging the shielding plate, the distance between the end of the shielding plate on the product region side and the dividing groove formed at the boundary between the product region and the ear portion is 0.5 mm or less. A shielding plate is placed,
The method for manufacturing a multi-piece wiring board according to claim 1. The shielding plate is made of metal or ceramic.
The method for manufacturing a multi-piece wiring board according to claim 1 or 2, wherein: The shielding plate has a lattice frame shape,
The method for manufacturing a multi-piece wiring board according to any one of claims 1 to 3.

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