JP2005086131A - Method for manufacturing ceramic electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent a mother board with which a plurality of ceramic electronic components can be extracted, from being unexpectedly broken in handling, and to make smooth partition possible when parting the mother board along with a break groove in order to extract the plurality of ceramic electronic components. <P>SOLUTION: A break groove 7 is constituted by arraying a plurality of holes 10, 11, and the comparatively shallow first holes 10 and the comparatively deep second holes 11 are alternately arrayed with a rule such as alternately one by one. With respect to the holes 10, 11, neighboring holes contact with each other. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing a ceramic electronic component, and more particularly to a method for manufacturing a ceramic electronic component comprising a step of taking out a plurality of ceramic electronic components by dividing a mother substrate.

  For example, in order to efficiently manufacture a ceramic electronic component such as a ceramic substrate, a mother substrate is prepared in which a plurality of ceramic electronic components can be taken out by dividing along a predetermined dividing line. A plurality of ceramic electronic components are taken out by forming a break groove at a position along the dividing line on the surface side and dividing the mother substrate along the break groove.

  In order to form the above-mentioned break groove, for example, laser scribing by laser light irradiation is applied (see, for example, “Prior Art” in Patent Document 1).

  As described above, when a break groove is formed by laser scribing, a continuous break groove is usually formed. When such a continuous break groove is formed, when handling a mother substrate, Inconveniences such as inadvertent cracking along the break groove may occur.

  In particular, in the mother substrate, when a dicing groove is formed by dicing at a position along the dividing line on the main surface side facing the main surface on which the break groove is formed (for example, see Patent Document 2). Such inadvertent cracks are likely to occur.

  In order to avoid this inconvenience, break grooves are also formed intermittently (see, for example, “Problems to be Solved by the Invention” in Patent Document 1).

  However, when the break grooves are intermittently formed, uneven portions are formed on the end surface of a ceramic electronic component such as a ceramic substrate obtained by dividing the mother substrate, and the uneven portions are formed at the portions where the dividing lines intersect. We encounter the problem that the part becomes particularly large.

Therefore, in order to solve this problem, it is proposed that the break groove is formed continuously in the vicinity of the part where the dividing line intersects, and the break groove is intermittently formed at a position away from the intersect part. (See, for example, “Claims” and “Means for Solving the Problems” of Patent Document 1).
JP-A-6-87085 JP-A-6-96992

  As described above, in the invention disclosed in Patent Document 1, when viewed along one dividing line, the break groove includes a continuous portion and an intermittent portion.

  However, if an attempt is made to divide along the break groove in the above-described manner, the break direction tends to deviate from the dividing line in the intermittent portion of the break groove, and a break defect is likely to occur. In particular, when a crack due to a break progresses, the break direction tends to deviate from the dividing line at a location where the break groove switches from a continuous portion to an intermittent portion.

  In any case, since the strength is low in the portion where the break groove is continuous, cracks are likely to occur in the continuous portion of the break groove during the handling of the mother substrate, which completely causes the break failure. Cannot be prevented.

  Therefore, an object of the present invention is to provide a method for manufacturing a ceramic electronic component that can solve the above-described problems.

  The present invention provides a step of preparing a mother substrate from which a plurality of ceramic electronic components can be taken out by dividing along a predetermined dividing line, and a first main surface side of the mother substrate by irradiating laser light A method of manufacturing a ceramic electronic component comprising: a step of forming a break groove at a position along the dividing line; and a step of taking out a plurality of ceramic electronic components by dividing the mother substrate along the break groove. The present invention is directed to a method, and is characterized by having the following configuration in order to solve the technical problems as described above.

  That is, according to the present invention, the break groove formed in the step of forming the break groove described above is constituted by an array of a plurality of holes, and these holes are compared with the plurality of relatively shallow first holes. And the second holes are characterized in that the first and second holes are alternately arranged with regularity.

  The method of manufacturing a ceramic electronic component according to the present invention is particularly advantageously applied when manufacturing a multilayer ceramic substrate. In this case, the mother substrate has a multilayer structure including a plurality of laminated ceramic layers.

  In the above-described preferred embodiment, when the mother substrate forms a dicing groove formed by dicing at a position along the dividing line on the second main surface side facing the first main surface. The invention is further advantageously applied.

  The thickness of the mother substrate left in the portion where the second hole is located is preferably 1/2 to 3/4 of the thickness left in the portion where the first hole is located.

  The plurality of holes constituting the break groove may be formed so that adjacent ones partially overlap each other, or adjacent ones may be formed at a predetermined interval, but preferably adjacent ones are formed. It forms so that it may mutually contact.

  The step of forming the break groove is preferably performed using a galvanomirror laser.

  According to the present invention, the break grooves are provided by the plurality of relatively shallow first holes and the plurality of relatively deep second holes that are alternately arranged with regularity. The thickness left in the portion where one hole is located becomes relatively thick, which acts to improve the mechanical strength. On the other hand, in the mother substrate, the thickness left in the portion where the second hole is located is relatively thin, and acts to easily cause a crack due to a break.

  Therefore, the thickness left in the portion where the first hole is located effectively prevents inadvertent cracking during handling of the mother board, while the thickness left in the portion where the second hole is located. Thus, a crack caused by a break can be smoothly advanced along a predetermined dividing line.

  As described above, cracks due to breakage progress along a predetermined dividing line, so that the positional accuracy of the edges of the plurality of ceramic electronic components taken out from the mother substrate can be improved. Therefore, when the ceramic electronic component to be manufactured is a multilayer ceramic substrate, such a multilayer ceramic substrate can be manufactured with a high yield.

  That is, when manufacturing a multilayer ceramic substrate, the mother substrate has a multilayer structure including a plurality of laminated ceramic layers, and a wiring conductor is formed inside the multilayer structure. When a defect occurs, the wiring conductor may be undesirably exposed. However, according to the present invention, the multilayer ceramic substrate can be manufactured with high yield without causing such unwanted exposure of the wiring conductor. Can be manufactured.

  Dicing by dicing is performed on the mother substrate for obtaining the multilayer ceramic substrate as described above on the second main surface side facing the first main surface forming the break groove and along the dividing line. In the case where the groove is formed, inconvenience of being carelessly broken along the dividing line is likely to occur during handling of the mother substrate. Therefore, in such a case, the effect of the present invention that can make it difficult to cause inadvertent cracking as described above is more significantly exhibited.

  In the present invention, when the thickness of the mother substrate left in the portion where the second hole is located is 1/2 to 3/4 of the thickness left in the portion where the first hole is located, The effect by this invention can be exhibited more reliably.

  In this invention, when the plurality of holes constituting the break groove are formed so as to contact each other between adjacent ones, the break in the break groove along the predetermined dividing line can be more smoothly advanced. it can. In addition, it is easier to form the relatively shallow first hole and the relatively deep second hole in a desired form as compared with the case where adjacent ones are formed so as to partially overlap each other.

  In the present invention, when the step of forming the break groove is performed using a galvanomirror laser, the hole can be formed at a more accurate position than when, for example, an XY table moving laser is used. it can. Further, by changing the energy of the laser beam and the number of shots, the depth of the hole formed thereby can be easily controlled, so that the relatively shallow first hole and the relatively deep second hole can be formed. It can be formed easily and efficiently while distinguishing.

  1 to 4 are for explaining a method of manufacturing a ceramic electronic component according to an embodiment of the present invention. In this embodiment, a multilayer ceramic substrate is manufactured as a ceramic electronic component. 1 and 2 show a part of the mother board 1 in a sectional view and a plan view, respectively. 2 shows the mother substrate 1 in an enlarged state from FIG.

  The mother substrate 1 has substantially the same configuration as the “mother laminate” described in Patent Document 2 described above, except for the aspect of forming a break groove, which will be described later. The mother substrate 1 can take out a plurality of multilayer ceramic substrates (corresponding to a portion on the left side of the dividing line 2 in FIG. 1) by dividing it along predetermined dividing lines 2 and 3. The mother substrate 1 has first and second main surfaces 5 and 6 that face each other. Although not shown, the mother substrate 1 has a multilayer structure including a plurality of laminated ceramic layers, and a wiring conductor is provided inside the multilayer structure.

  After such a mother substrate 1 is prepared, a break groove 7 is formed at a position along each of the dividing lines 2 and 3 on the first main surface 5 side of the mother substrate 1, and the mother substrate 1. A dicing groove 8 by dicing is formed at a position along the dividing lines 2 and 3 on the second main surface 6 side of one. Either of the break groove 7 and the dicing groove 8 may be formed first.

  As shown in FIG. 1, external terminal electrodes 9 are formed on the side surfaces that appear when the dicing grooves 8 are formed. These external terminal electrodes 9 were obtained as a result of dividing the conductive material by forming a dicing groove 8 in advance by arranging a conductive material in the mother substrate 1 at a position where the dicing groove 8 should be formed. Is.

  On the other hand, the break groove 7 is formed by irradiating laser light to a position along each of the dividing lines 2 and 3 on the first main surface 5 side of the mother substrate 1. FIG. 1 shows a cross section of the mother substrate 1 along the dividing line 3 shown in FIG.

  More specifically, the break groove 7 is constituted by an arrangement of a plurality of holes 10 and 11 as shown in FIGS. 1 and 2. These holes 10 and 11 comprise a plurality of relatively shallow first holes 10 and a plurality of relatively deep second holes 11 as well shown in FIG. In this embodiment, the first holes 10 and the second holes 11 are alternately arranged one by one. As well shown in FIG. 2, the plurality of holes 10 and 11 are formed so that adjacent ones are in contact with each other.

  In order to form the break groove 7 as described above, a galvanomirror laser is preferably used. According to the galvanometer mirror type laser, the laser beam can be irradiated to an accurate position by the control of the galvanometer mirror, and the laser output (energy amount) and the number of shots of the laser beam are determined for each depth of the holes 10 and 11. Can be easily controlled, and the diameter of each of the holes 10 and 11 can be easily controlled by changing the mask diameter. And one each of the hole 10 or 11 is formed for every shot by a galvanometer mirror type laser.

  FIG. 3 is a cross-sectional view showing a part of the mother substrate 1 shown in FIG. 1 in an enlarged manner. 3 and 2 show the mother substrate 1 with the same scale. As best shown in FIGS. 2 and 3, the first and second holes 10 and 11 are formed as circular holes with a tapered cross section.

  As shown in FIG. 3, the mother substrate 1 leaves a thickness T <b> 1 in a portion where the first hole 10 is located and a thickness T <b> 2 in a portion where the second hole 11 is located. The ratio of these thicknesses T1 and T2, that is, T2 / T1, is preferably selected from 1/2 to 3/4. As a result, it is difficult to cause inadvertent cracking during the handling of the mother substrate 1, and the effect that the break can be smoothly broken along each of the dividing lines 2 and 3 in the dividing step to be described later is ensured. Can be achieved.

  Although depending on the thickness of each portion along the dividing lines 2 and 3 of the mother substrate 1, when the thickness is 700 to 900 μm, the depth of the first hole 10 is the depth of the second hole 11. It is preferable that it is about 1/3 of this. Further, in the case of forming continuous break grooves at a uniform depth as in the prior art, when the desired break strength is obtained when the depth of the break grooves is 200 μm, this embodiment Then, it is preferable that the depth of the 1st hole 10 shall be about 100 micrometers, and the depth of the 2nd hole 11 shall be about 300 micrometers.

  After the break grooves 7 and the dicing grooves 8 are formed in the mother substrate 1 as described above, the mother substrate 1 is formed with the break grooves 7 on the dividing lines 2 and 3 as shown in FIG. , Whereby a desired plurality of multilayer ceramic substrates 4 are taken out.

  In the step of dividing along the break groove 7 described above, since the thickness T2 left in the portion where the deeper second hole 11 is located is relatively thin, the break can be easily performed. Further, since the adjacent holes 10 and 11 are formed so that the adjacent ones are in contact with each other, cracks caused by breaks are difficult to move away from each of the dividing lines 2 and 3 at the time of division, causing break defects. Can be difficult.

  Although the present invention has been described above with reference to specific embodiments, various other modifications are possible within the scope of the present invention.

  For example, in the above-described embodiment, the first holes 10 and the second holes 11 are alternately arranged one by one. However, if the depths of the holes 10 and 11 are changed, other holes are provided. They may be arranged alternately with regularity. For example, an arrangement such as two first holes 10, one second hole 11, two first holes 10, and one second hole 11 is also possible.

  Further, in the above-described embodiment, the plurality of holes 10 and 11 are formed so that the adjacent ones are in contact with each other. However, even if the adjacent ones are formed in a state of being separated from each other, the adjacent ones are partially adjacent to each other. It may be formed so as to overlap.

  In the above-described embodiment, two types of holes having different depths are formed, such as the first and second holes 10 and 11, but three or more types of holes having different depths are formed. Also good.

  In the above-described embodiment, the break groove 7 is formed on the mother substrate 1 on which the dicing groove 8 is formed. However, the break groove may be formed on the mother substrate on which the dicing groove is not formed.

  In the above-described embodiment, the method for manufacturing the multilayer ceramic substrate 4 has been described. However, unlike a ceramic electronic component other than the multilayer ceramic substrate, for example, a ceramic substrate having a single-plate structure, a ceramic substrate, The present invention can also be applied to the manufacture of ceramic electronic components having functions such as capacitors and inductors that are not scheduled to be mounted.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view illustrating a part of a mother substrate 1 from which a multilayer ceramic substrate 4 as a ceramic electronic component can be taken out for explaining a method for manufacturing a ceramic electronic component according to an embodiment of the present invention. It is a top view which expands and shows a part of mother board | substrate 1 shown in FIG. It is sectional drawing which expands and shows a part of mother board | substrate 1 shown in FIG. It is sectional drawing which shows the state which is implementing the division | segmentation process with respect to the mother board | substrate 1 shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Mother board | substrate 2,3 Dividing line 4 Multilayer ceramic substrate 5 1st main surface 6 2nd main surface 7 Breaking groove 8 Dicing groove 10 1st hole 11 2nd hole T1, T2 Thickness

Claims (6)

Preparing a mother substrate capable of taking out a plurality of ceramic electronic components by dividing along a predetermined dividing line;
Irradiating a laser beam to form a break groove at a position along the dividing line on the first main surface side of the mother substrate;
A step of taking out a plurality of ceramic electronic components by dividing the mother substrate along the break grooves,
The break groove is constituted by an array of a plurality of holes, and the hole includes a plurality of relatively shallow first holes and a plurality of relatively deep second holes, and the first and second holes Is a method of manufacturing a ceramic electronic component, characterized by being arranged alternately with regularity. The method for manufacturing a ceramic electronic component according to claim 1, wherein the ceramic electronic component is a multilayer ceramic substrate, and the mother substrate has a multilayer structure including a plurality of laminated ceramic layers. 3. The ceramic electronic component according to claim 2, wherein the mother substrate has a dicing groove formed by dicing at a position along the dividing line on a second main surface side facing the first main surface. 4. Manufacturing method. 2. The thickness of the mother substrate left in a portion where the second hole is located is 1/2 to 3/4 of the thickness left in a portion where the first hole is located. 4. A method for producing a ceramic electronic component according to any one of 3 above. 5. The method of manufacturing a ceramic electronic component according to claim 1, wherein the plurality of holes constituting the break groove are formed such that adjacent ones are in contact with each other. 6. The method of manufacturing a ceramic electronic component according to claim 1, wherein the step of forming the break groove is performed using a galvanomirror laser.

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