JP2006013004A - Plate shape member dividing method and substrate manufactured using the method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method that enables a plate shape member to be accurately divided along desired break lines while suppressing the occurrence of fractures during handling, and to provide a dimensionally accurate substrate. <P>SOLUTION: After a plurality of break holes 3 are intermittently formed in such a way that the plane shape of an opening is polygonal and 2 vertices S of the polygon are positioned on the assumed break lines 2a, 2b of a plate shape member 1, the plate shape member 1 is divided along the break lines 2a, 2b. The angle of 2 vertices S positioned on the assumed each break line is set at 90° or less. The break holes are formed such that the assumed each break line is the equiangular bisector of the two vertices positioned on the assumed each break line. A laser beam is used that has a top hat type energy density distribution. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a plate member dividing method and a substrate manufactured by using the method, and more specifically, a dividing method for dividing a plate member along an intended break line, and manufacturing using the dividing method. Related to the substrate.

  Boards such as printed wiring boards and multilayer ceramic boards are usually manufactured through a process of breaking a plate-like member (parent board) along a predetermined break line and dividing it into a large number of boards (child boards). Yes.

  As a method for dividing the plate-like member, for example, as shown in FIGS. 9A and 9B, a ceramic green sheet (substrate before firing) 51 is irradiated with a laser beam 52 such as a carbon dioxide laser. A method of forming a scribe break line (break groove) 53 is known (see Patent Document 1).

  According to this method, it is possible to prevent the occurrence of micro cracks generated in the deep part of the notch groove due to the physical pressing action of the blade, compared to the method of cutting the ceramic green sheet by pressing the blade. As a result, it is possible to obtain a homogeneous and highly stable ceramic substrate that can withstand the printing pressure and firing heat stress during thick film formation.

  However, in the case of the method of Patent Document 1 in which a scribe break line (break groove) 53 is formed by irradiating the surface of a ceramic green sheet with a laser beam so that the holes overlap, the scribe break line (break groove) is formed. Compared with the case where 53 is not formed, the strength of the ceramic green sheet (plate-like member) is reduced, and cracking is likely to occur along the scribe break line (break groove) 53 in the handling process during or after firing. There is a problem of becoming.

  Further, Patent Document 1 discloses that a ceramic green sheet is irradiated with a laser beam such as a carbon dioxide laser to pass through holes such as long holes (holes whose plane shape is an ellipse) and short holes (holes whose plane shape is a circle). A method is also proposed in which a scribe break line is formed in a perforated manner. In this case, it is possible to divide into individual substrates (sub-substrates) after firing while suppressing the occurrence of cracks due to firing shrinkage.

However, in the case of the method of forming a scribe break line in the form of a perforation, the through hole formed by irradiating the laser beam has a rounded planar shape, so that a crack is generated and progresses during the break. As shown in FIG. 10, large concave portions 61 and convex portions 62 are formed between the plurality of partial through holes 53a in which the through holes 53 are divided, as shown in FIG. There is a problem that the dimensional accuracy is lowered.
That is, when the concave portion 61 or the convex portion 62 is formed on the end surface of the daughter board 60, there is no problem as long as the dimension of the daughter board 60 is smaller than the target dimension indicated by the line L in the concave portion 61. In 62, there is a case where the size of the sub board 60 becomes larger than the target dimension indicated by the line L (the dimension exceeds the target dimension by E by being broken so as to swell outward). There is a problem that the dimensions are out of specification.
JP-A-62-2232187

  The invention of the present application solves the above-described problems, and is a plate-like member capable of accurately dividing a plate-like member along a desired break line while preventing the occurrence of cracks during handling. It is an object of the present invention to provide a dividing method and a substrate with high dimensional accuracy manufactured using the method.

In order to solve the above-described problem, the plate member dividing method of the present invention (Claim 1) includes:
A step of intermittently forming a plurality of break holes on the assumed break line of the plate-like member so that the planar shape of the opening is a polygon and two vertices of the polygon are located on the assumed break line; ,
Dividing the plate-like member along the assumed break line.

  Further, the plate-like member dividing method according to claim 2 is characterized in that the angles of the two apexes located on the assumed break line of the break hole are both 90 ° or less.

  Further, in the method for dividing the plate-like member according to claim 3, the break hole is formed so that the assumed break line is an equiangular bisector of the two apexes located on the assumed break line of the break hole. It is characterized by forming.

  The plate member dividing method according to claim 4 is characterized in that the break hole is formed by laser light.

  The plate member dividing method according to claim 5 is characterized in that a laser beam having a top hat type energy density distribution is used as the laser beam.

  In the substrate of the present invention (Claim 6), the planar shape is polygonal, and the two vertices have a plurality of notches located at the ridge line portion, which is the boundary between the break end surface and the upper surface, with a predetermined distance from the peripheral portion. It is characterized by being formed.

The method for dividing a plate-shaped member of the present invention (Claim 1) assumes that the planar shape of the opening is a polygon and that the two vertices of the polygon are positioned on the assumed break line. Since a plurality of break holes are intermittently formed on the break line and the plate member is divided along the assumed break line, the position and direction in which cracks occur and progress during breaks are determined (break holes) The stress concentrates on the two vertices located on the assumed break line of the plate, cracks occur from there, and proceed toward the vertices located on the assumed break line of the other break hole) It is possible to prevent a large unevenness from being formed on the break end face of the member (for example, the child substrate), and to obtain a divided plate member (for example, the child substrate) with high dimensional accuracy.
In addition, since a plurality of break holes are intermittently formed on the assumed break line, the strength of the plate-like member is higher than when a continuous scribe break line (break groove) is formed as in the prior art. It is possible to prevent the occurrence of cracks in the handling process.

  In the plate member dividing method according to claim 1 of the present application, “the two vertices of the polygon are located on the assumed break line” means that two vertices of one break hole on one assumed break line. For example, when there is another assumed break line orthogonal to the one assumed break line, the one break break line on the one assumed break line It is not excluded that the other two vertices other than the two vertices located in the above are located on the other one assumed break line.

  In the method for dividing a plate-like member according to claim 1 of the present application, the break hole may not penetrate the plate-like member or may penetrate the plate-like member. However, from the viewpoint of keeping the strength of the plate-like member high until the plate-like member is broken, it is desirable to form a break hole that does not penetrate the plate-like member.

  Moreover, when the angle of the two apexes located on the assumed break line of the break hole is 90 ° or less as in the plate member dividing method of claim 2, the stress is located on the assumed break line of the break hole. It becomes easy to concentrate by the two vertices to be performed, and it becomes possible to advance the crack along the assumed break line more reliably at the time of the break, so that it becomes possible to obtain a divided plate-like member with higher dimensional accuracy.

  Further, as in the plate member dividing method according to claim 3, when the assumed break line is an equiangular bisector of two vertices located on the assumed break line of the break hole, In addition, it becomes possible to cause the crack to proceed along the assumed break line more reliably, and it becomes possible to obtain a divided plate-like member with high dimensional accuracy.

  Further, as in the method for dividing a plate-like member according to claim 4, by forming the break hole with a laser beam, the plane shape of the opening is a polygon and two vertices of the polygon are assumed. A plurality of break holes can be intermittently formed so as to be positioned on the break line, and the present invention can be more effectively realized.

  Further, as in the method for dividing the plate-like member according to claim 5, by using a laser beam having an energy density distribution of a top hat type, it becomes possible to make the apex of the break hole sharper and to reduce the stress. Since the cracks can be more reliably advanced along the assumed break line at the time of the break, it is possible to obtain a divided plate-like member with high dimensional accuracy.

Further, the substrate of the present invention (Claim 6) has a notch located at a ridge line portion where the planar shape is a polygon and two vertices are boundaries between the break end surface and the upper surface, with a predetermined distance from the peripheral portion. A plurality of the substrates according to the present invention can be manufactured by using the method according to any one of claims 1 to 5 of the present application, and any one of claims 1 to 5 of the present application. By manufacturing using this method, it is possible to provide a substrate with high dimensional accuracy with little unevenness on the end face.
In addition, the board | substrate in this-application invention (Claim 6) is a thing of the wide concept containing various board | substrates, such as a printed wiring board and a multilayer board | substrate.

  The features of the present invention will be described in more detail below with reference to examples of the present invention.

In this embodiment, a case where a plate-like member (parent substrate) made of alumina having a thickness of 0.8 mm is divided and divided into a plurality of child substrates will be described as an example.
1 is a perspective view showing a method of dividing a plate-like member (parent substrate) according to an embodiment of the present invention, FIG. 2 is an enlarged plan view showing a main part of the parent substrate in FIG. 1, and FIG. 3 is a break hole. FIG. 4 and FIG. 5 are diagrams showing the relationship between the type of laser light and the shape of the break hole formed, and FIG. 6 is a diagram schematically showing the divided child substrate.

In this example, first, a ceramic green sheet made of alumina was laminated and fired as a plate-like member (parent substrate) to produce a laminate having a thickness of 0.8 mm.
Then, using a CO ₂ laser, as shown in FIG. 1, a plurality of break holes (with a predetermined interval) are formed on the assumed break lines 2a and 2b of the plate member (parent substrate) 1 orthogonal to each other. Non-through hole) 3 was formed.
In this embodiment, in consideration of a product dimension (target dimension: 5 mm × 4 mm), one of the assumed break lines 2a and 2b orthogonal to each other (vertical direction in FIG. 2) is assumed. The distance M between the two is assumed to be 5 mm, and the distance N between the other assumed break lines 2b and 2b (in the horizontal direction in FIG. 2) is 4 mm.

  Moreover, the arrangement pitch P (FIG. 2) of the break holes 3 was set to 0.15 mm. In order to reliably divide the parent substrate 1 along the assumed break lines 2a and 2b, the arrangement pitch P of the break holes 3 is preferably in the range of 0.1 to 0.3 mm. In particular, a pitch of 0.1 to 0.2 mm is desirable.

In this embodiment, as the break hole 3, as shown in FIGS. 2 and 3, the break hole 3 having a substantially square opening and a three-dimensional pyramid shape is formed.
In forming the break hole 3, for example, a mask (not shown) having a square-shaped opening (light passage hole) corresponding to the break hole 3 to be formed is disposed in the middle of the optical path. By irradiating the laser beam through the mask, the break hole 3 having a square planar shape of the opening can be formed.

  In addition, the break hole 3 is a break in which two vertices S at diagonal positions are located on the assumed break lines 2a and 2b, and the assumed break lines 2a and 2b are located on the assumed break lines 2a and 2b. The two vertices S and S of the hole 3 were formed to be equiangular bisectors.

  Moreover, it is desirable that the dimension of the break hole 3 is such that the diagonal length X is about 0.1 mm under the above-described conditions. When the diagonal length X is 0.1 mm, the length Y of one side of the break hole 3 is about 0.07 mm.

  The depth of the break hole 3 is preferably selected in consideration of the thickness of the plate-shaped member (parent substrate) 1 to be divided, the constituent material, and the like. For example, in this embodiment, considering that the parent substrate 1 is made of alumina and its thickness is 0.8 mm, the depth of the break hole is about 0.2 mm. In this case, the optimum value of the laser beam processing point energy amount was 5 mJ at a depth of 0.13 mm.

In this embodiment, a laser beam having an energy distribution density of top hat type was used as the laser beam for forming the break hole 3.
As shown in FIG. 4A, when laser light having an energy distribution density of Gaussian distribution is used, as shown in FIG. 4B, the vertex S of the break hole 3 has a rounded shape, and the stress is reduced. Since it becomes difficult to concentrate on the apex S, when the parent substrate 1 is broken, it becomes difficult to cause the cracks to advance along the assumed break lines 2a and 2b (FIGS. 1 to 3), and unevenness is formed on the break end surface. As shown in FIG. 5A, when laser light having a top hat distribution is used as shown in FIG. 5A, apexes S and S of the break hole 3 are set as shown in FIG. It becomes possible to sharpen, and it becomes easy to concentrate the stress on the vertex S when breaking the parent substrate 1, so that it is possible to make the crack progress reliably along the assumed break lines 2a and 2b, There are few irregularities on the break edge. , It is possible to obtain a high dimensional accuracy daughter board (divided plate-like member) 21.

  FIG. 6 shows that a break hole is formed on an assumed break line by using a laser beam having an energy distribution density of a top hat type distribution on a parent substrate (plate member) 1 having a thickness of 0.8 mm by the method of the above embodiment. It is a figure which shows typically the board | substrate (child board | substrate) 21 obtained by dividing the main board | substrate 1 along an assumption break line after forming.

  As shown in FIG. 6, the child substrate 21 obtained by dividing the parent substrate using the plate-shaped member dividing method according to the above embodiment is a rectangular substrate having a planar shape of 5 mm × 4 mm, and has a peripheral edge. The notch 22 in which the planar shape formed by dividing the break hole 3 (FIGS. 2 and 3) is a triangle and the two vertices S ′ are located on the break end surface 21a is arranged at a predetermined interval. It has an established structure.

  According to the method of the above embodiment, by irradiating the laser beam, intermittently so that the two vertices S are positioned on the assumed break lines 2a and 2b on the surface of the plate-like member (parent substrate) 1. Since a plurality of break holes 3 are formed and the plate-like member 1 is divided along the assumed break lines 2a and 2b, a continuous scribe break line (break groove) is provided as in the conventional method described above. Compared to the case of forming the plate member 1, it is possible to keep the strength of the plate-like member 1 high and prevent the occurrence of cracks in the handling process, and the two vertices S of the break hole 3 are assumed to be the break line 2a, Since it is located on 2b, the direction in which the crack progresses is determined at the time of the break, and a large unevenness is generated on the break end surface 21a of the sub board 21 after the plate-like member 1 is divided. To prevent the door, it is possible to obtain a high dimensional accuracy sub board 21.

  In addition, since the assumed break lines 2a and 2b are configured to be equiangular bisectors of the two vertices S of the break hole 3, the crack is caused to advance along the assumed break lines 2a and 2b at the time of the break. Thus, the child substrate 21 with high dimensional accuracy can be obtained.

  Moreover, in the said Example, although the square break shape 3 was formed as the break hole 3, as shown in FIG. 7, the angle of the two vertices located on the assumption break line 2 will be less than 90 degrees. It is also possible to have a rhombus shape (having an acute angle). This makes it easier to concentrate the stress on the two vertices S, and it is possible to make the crack progress more reliably along the assumed break line 2 at the time of break, and to obtain a child substrate with higher dimensional accuracy. Is possible.

Moreover, as a shape of the break hole 3, it is also possible to make it a hexagonal shape as shown in FIG.
The shape of the break hole 3 may be other shapes, and the specific shape is not particularly limited.

  In the above embodiment, laser light having a top hat distribution of energy distribution density is used as the laser light. However, other types of laser light such as Gaussian distribution may be used in some cases.

  Further, in the above embodiment, the case where the plate-like member to be divided is made of alumina has been described as an example. However, in the present invention, there is no particular limitation on the type of plate-like member to be divided, and other various plates. The present invention can be widely applied to the case where the member is divided.

  The present invention is not limited to the above embodiment in other points, and various applications and modifications can be made within the scope of the invention.

As described above, according to the method for dividing a plate-shaped member of the present invention, the direction in which the crack progresses is determined at the time of the break, and large unevenness is formed on the end surface of the divided plate-shaped member (for example, the sub board). Thus, it is possible to efficiently obtain a divided plate-like member with high dimensional accuracy.
Therefore, the present invention can be widely used in a process of dividing a parent substrate in a manufacturing process of an electronic component, a manufacturing process of an electronic component manufactured through a process of dividing a parent substrate, and the like.

It is a perspective view which shows the division | segmentation method of the plate-shaped member concerning one Example of this invention. It is a top view which expands and shows the principal part of the parent board | substrate of FIG. It is an expansion perspective view which shows the shape of the break hole etc. which were formed in one Example of the division | segmentation method of the plate-shaped member of this invention. (a) is a figure which shows the state of the energy density of the laser beam of Gaussian distribution, (b) is a figure which shows the planar shape of the opening part of the break hole formed using the laser beam of Gaussian distribution. (a) is a figure which shows the state of the energy density of the laser beam of top hat type distribution, (b) is a figure which shows the planar shape of the opening part of the break hole formed using the laser beam of top hat type distribution. It is a figure which shows typically the sub-substrate divided | segmented with the division | segmentation method concerning one Example of this invention. It is a figure which shows the modification of the break hole formed in a plate-shaped member in the division | segmentation method of the plate-shaped member of this invention. It is a figure which shows the other modification of the break hole formed in a plate-shaped member in the division | segmentation method of the plate-shaped member of this invention. (a) is a perspective view which shows the division | segmentation method of the conventional plate-shaped member, (b) is sectional drawing which shows the principal part. It is a figure explaining the problem of the division | segmentation method of the conventional plate-shaped member.

Explanation of symbols

1 Plate member (parent substrate)
2, 2a, 2b Assumed break line 3 Break hole (non-through hole)
21 Sub-board (divided plate member)
21a Break end face of sub-board (divided plate member) 22 Notch M, N Assumed break line spacing P Break hole arrangement pitch S Vertex at break hole diagonal position S 'vertex X Break hole diagonal length Length of one side of Y break hole

Claims (6)

A step of intermittently forming a plurality of break holes on the assumed break line of the plate-like member so that the planar shape of the opening is a polygon and two vertices of the polygon are located on the assumed break line; ,
Dividing the plate-like member along the assumed break line. A method for dividing the plate-like member.   The method for dividing a plate-shaped member according to claim 1, wherein the angles of the two apexes located on the assumed break line of the break hole are each 90 ° or less.   The break hole is formed so that the assumed break line is an equiangular bisector of the two vertices located on the assumed break line of the break hole. A method for dividing a plate-like member.   The said break hole is formed with a laser beam, The division | segmentation method of the plate-shaped member in any one of Claims 1-3 characterized by the above-mentioned.   5. The plate member dividing method according to claim 4, wherein a laser beam having a top hat type energy density distribution is used as the laser beam.   A substrate having a polygonal planar shape, and a plurality of notches located at a ridge line portion, which is a boundary between a break end surface and an upper surface, are formed at predetermined intervals on a peripheral edge portion.

Images