JP2010149165A - Cutting apparatus for manufacturing electronic component and cutting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress generation of dross and occurrence of cracking and chipping of ceramic substrate, when cutting sealed substrate including a ceramic substrate or a metallic substrate by laser beam. <P>SOLUTION: The cutting method is applied for manufacturing a plurality of electronic components by forming a sealed substrate 1 by applying resin sealing on chips 3 which are arranged respectively in the plurality of zones 7 prepared on a circuit substrate 2, and then cutting the sealed substrate 1 along boundary lines 6 of a plurality of zones 7. The method includes a step of fixing the sealed substrate 1 on a table 9, a step of irradiating a first and a second laser beams 12, 18 from irradiation heads to the sealed substrate 1, and a step of moving the irradiation heads and the sealed substrate 1 relatively each other. In the irradiation step, the sealed substrate 1 is cut by the second laser beam 18 irradiated toward the boundary lines 6 after formation of perforated holes 17 along the boundary lines 6 through irradiation of the first laser beam 12. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a cutting apparatus and a cutting method for manufacturing electronic components, which are used when a plurality of electronic components are manufactured by cutting a sealed substrate having a plurality of regions for each region.

  One of the methods conventionally used for the purpose of efficiently producing a plurality of electronic components is the following method. That is, a plurality of chip capacitors, LED chips, semiconductor chips, etc. (hereinafter referred to as “chips”) mounted on a circuit board are collectively sealed with a resin to form a sealed substrate. In this method, a plurality of electronic components are manufactured by cutting into individual pieces (see, for example, Patent Document 1). According to Patent Document 1, a dicing saw can be used when cutting a sealed substrate, or it can be cut by a laser. An individual electronic component obtained by dividing a sealed substrate is often called a package.

  By the way, according to Patent Document 1, a glass epoxy substrate can be used as a circuit board, and an epoxy resin, a phenol resin, or a silicone resin can be used as a sealing resin used for resin sealing. From this, it can be said that the circuit board and the sealing resin are made of the same material, that is, a resin material. Therefore, no major problem has occurred when using either a dicing saw using a rotary blade or a laser.

  In recent years, as a circuit board, in addition to a resin substrate typified by a glass epoxy substrate, a substrate made of ceramic (hereinafter referred to as “ceramic substrate”) and a substrate made of metal (hereinafter referred to as “metal substrate”). Began to be used. Ceramic substrates and metal substrates have excellent heat dissipation characteristics, and are used for optoelectronic components such as LEDs and semiconductor lasers, power semiconductor elements, and the like.

  However, the base materials of the ceramic substrate and the metal substrate have different properties from the sealing resin. As a result, when a sealed substrate having a ceramic substrate or a metal substrate is cut at a virtual cutting line using a laser, the following problem occurs.

  The first problem is that the dross formed by melting the material constituting the circuit board is likely to adhere to the package, resulting in a decrease in yield in terms of appearance quality. The second problem is a problem when a ceramic substrate is used as a circuit board. It is a problem that internal stress is generated by a thermal shock applied to the ceramic substrate, and cracking and chipping (chip) of the ceramic substrate due to the internal stress occurs particularly just before the cutting is completed at one cutting line. is there.

Japanese Patent Application Laid-Open No. 09-036151 (page 3, FIG. 2)

  The problem to be solved by the present invention is that when a sealed substrate including a circuit substrate made of a ceramic substrate or a metal substrate is cut by a laser, dross is generated and cracking of the ceramic substrate due to internal stress occurs. Or chipping.

  The numerals and symbols in parentheses in the following description indicate the reference numerals in the drawings, and are described for the purpose of facilitating the comparison between the terms in the description and the components shown in the drawings. Further, these numbers do not mean “interpreting the terms in the description limited to the components shown in the drawings”.

  In order to solve the above-described problems, a cutting apparatus for manufacturing an electronic component according to the present invention includes resin-sealing chips (3) mounted in a plurality of regions (7) provided on a circuit board (2). Used to manufacture a plurality of electronic components by forming a sealed substrate (1) and cutting the sealed substrate (1) at the boundary line (6) of the plurality of regions (7). Fixing means (8) for fixing the sealed substrate (1), laser light generating means (11) for generating laser light (12, 18), sealed substrate (1) and laser light (12, 18) and a moving device (9) for relatively moving the electronic component manufacturing cutting device, which is optically connected to the laser beam generating means (11) and directed toward the sealed substrate (1). And an irradiation mechanism (10) for irradiating laser light (12, 18). The mechanism (10) is a boundary where the first laser beam (12) and the perforated holes (17, 19) for forming the perforated holes (17, 19) are formed on the boundary line (6). The line (6) is irradiated with a second laser beam (18) for cutting the sealed substrate (1).

  In the cutting apparatus for manufacturing an electronic component according to the present invention, the first laser beam (12) is a pulse wave and the second laser beam (18) is a continuous wave in the above-described cutting apparatus. It is characterized by that.

  The cutting apparatus for manufacturing an electronic component according to the present invention is characterized in that, in the above-described cutting apparatus, the laser light generating means (11) has a fiber laser oscillator or a YAG laser oscillator.

  The electronic device manufacturing cutting device according to the present invention is characterized in that, in the above-described cutting device, the perforated holes (17, 19) are through holes (17) or blind holes (19). .

  Moreover, the cutting device for manufacturing an electronic component according to the present invention is characterized in that, in the above-described cutting device, the base material of the circuit board (2) is ceramic or metal.

  According to another aspect of the present invention, there is provided a cutting apparatus for manufacturing an electronic component, wherein the electronic component is an optoelectronic component or a power semiconductor component.

  Moreover, the cutting method for manufacturing an electronic component according to the present invention provides a sealed substrate by resin-sealing the chip (3) mounted on each of the plurality of regions (7) provided on the circuit board (2). Formed (1) and used in manufacturing a plurality of electronic components by cutting the sealed substrate (1) along the boundary line (6) of the plurality of regions (7), and the sealed substrate The step of fixing (1), the step of irradiating the sealed substrate (1) with the laser beam (12, 18), and the sealed substrate (1) and the laser beam (12, 18) are relative to each other. A cutting method for manufacturing an electronic component including a step of moving the boundary line by irradiating the first laser beam (12) toward the sealed substrate (1) in the irradiation step. After forming the perforated holes (17, 19) in 6), toward the boundary line (6) Characterized by cutting the sealing already substrate (1) by irradiating the second laser beam (18).

  Further, in the cutting method for manufacturing an electronic component according to the present invention, the first laser beam (12) is a pulse wave and the second laser beam (18) is a continuous wave in the above-described cutting method. It is characterized by that.

  In the cutting method for manufacturing an electronic component according to the present invention, in the above-described cutting method, in the irradiation step, the first laser beam (12) and the second laser beam (18) are applied by a fiber laser oscillator or a YAG laser oscillator. ).

  Moreover, the cutting method for manufacturing an electronic component according to the present invention is characterized in that, in the above cutting method, the perforated holes (17, 19) are through holes (17) or blind holes (19). .

  Moreover, the cutting method for manufacturing an electronic component according to the present invention is characterized in that, in the above-described cutting method, the base material of the circuit board (2) is ceramic or metal.

  The electronic component manufacturing cutting method according to the present invention is characterized in that, in the above-described cutting method, the electronic component is an optoelectronic component or a power semiconductor component.

  According to the present invention, a continuous wave laser is used after forming perforated holes (17, 19) using a pulsed wave laser at the boundary line (6) of the sealed substrate (1). Then, the sealed substrate (1) is cut (full cut). Thus, the perforated holes (17, 19) are compared with the volume of the portion to be removed when the sealed substrate (1) is cut (full cut) by irradiating the laser beam once. Both the volume of the portion removed when forming and the volume of the portion removed by cutting (full cut) are reduced. In other words, the volume of the portion removed from the sealed substrate (1) by each of the two irradiations in the present invention is the sealed volume when the sealed substrate (1) is cut by one irradiation. All are reduced compared with the volume of the part removed from a board | substrate (1). Therefore, generation | occurrence | production of dross is suppressed when cut | disconnecting the sealed substrate (1), and the favorable cutting quality in a cut surface is obtained.

  Further, according to the present invention, when the sealed substrate (1) includes a ceramic substrate, a sealed substrate (17, 19) in which perforated holes (17, 19) are formed using a pulse wave laser. 1) is cut using a continuous wave laser. As a result, thermal stress generated by irradiating the continuous wave laser in the vicinity of the perforated holes (17, 19) is relieved. This reduces the stress that the sealed substrate (1) receives in the vicinity of the perforated holes (17, 19), particularly the stress that the ceramic substrate receives. Therefore, the generation of cracks and chipping of the ceramic substrate due to internal stress is suppressed.

  A sealed substrate (1) is formed by resin-sealing the chip (3) mounted on each of the plurality of regions (7) provided on the circuit board (2), and the boundary between the plurality of regions (7). A cutting method used in manufacturing a plurality of electronic components by cutting a sealed substrate (1) along a line (6), wherein the sealed substrate (1) is placed on a table (9). A fixing step, a step of irradiating the first laser beam (12) or the second laser beam (18) from the irradiation head (10) toward the sealed substrate (1), and the irradiation head (10). And a step of relatively moving the sealed substrate (1). In the irradiating step, a perforated hole (17) is formed in the boundary line (6) by irradiating the first laser light (12), and then the second laser light is directed toward the boundary line (6). The sealed substrate (1) is cut by irradiating (18).

  A first embodiment of a cutting apparatus for manufacturing an electronic component according to the present invention will be described with reference to FIG. FIG. 1 is a schematic cross-sectional view illustrating an irradiation head of a cutting apparatus for manufacturing an electronic component according to the present embodiment and a state in which the cutting apparatus forms a perforated hole in a sealed substrate. The cutting device shown in FIG. 1 is a cutting device that separates a sealed substrate 1 into a plurality of electronic components. In addition, in order to make it easy to understand, any figure included in this application document is schematically omitted or exaggerated as appropriate. Here, the “perforated hole” means a hole provided at a predetermined interval and includes both a through hole and a blind hole.

  As shown in FIG. 1, the sealed substrate 1 is formed so as to cover the circuit board 2, the plurality of chips 3 mounted on the circuit board 2, and the plurality of chips 3 at once. And a sealing resin 4. In FIG. 1, a ceramic substrate or a metal substrate is used as the circuit board 2, a translucent silicone resin is used as the sealing resin 4, and an LED chip is used as the chip 3. Therefore, it can be said that the sealed substrate 1 is a composite material composed of a ceramic substrate or a metal substrate and plastic. The metal substrate includes a metal core substrate, a metal base substrate, and a hollow substrate.

  The sealing resin 4 has lens portions 5 corresponding to the chips 3 respectively. The sealed substrate 1 is divided into a plurality of regions 7 by lattice-like boundary lines 6. Thus, each boundary line 6 is composed of line segments. Therefore, the shape of each region 7 is a rectangle (including a square). FIG. 1 shows an example in which one chip 3 is attached to each of a plurality of regions 7.

  FIG. 1 shows an example in which the lens unit 5 forms a convex lens, and the lens unit 5 and the chip 3 correspond one-to-one. Not only this but the lens part 5 should just have the function to converge light, the function to make parallel light, or the function to diffuse. The lens unit 5 may have a plurality of lenses, and may be a Fresnel lens or the like.

  The sealed substrate 1 is fixed to the table 9 via the adhesive tape 8. The table 9 is provided so as to be movable in the X direction, the Y direction, and the Z direction shown in the drawing and to be rotatable in the θ direction. An irradiation head 10 is disposed above the sealed substrate 1. A laser oscillator 11 is optically connected to the irradiation head 10. The irradiation head 10 irradiates the laser beam generated by the laser oscillator 11 toward the sealed substrate 1 as the first laser beam 12. The irradiation head 10 can also irradiate the laser beam generated by the laser oscillator 11 toward the sealed substrate 1 as a second laser beam (described later). Here, the laser oscillator 11 can generate the first laser beam 12 and the second laser beam. The first laser beam 12 is a pulse wave, and the second laser beam is a continuous wave.

  The irradiation head 10 is provided with a pipe 13, and the assist gas 14 is supplied into the irradiation head 10 through the pipe 13. A nozzle 15 is provided below the irradiation head 10. The first laser beam 12 is irradiated from the opening of the nozzle 15 toward the irradiated portion 16 of the sealed substrate 1 and the assist gas 14 is injected.

  Hereinafter, the operation of the cutting apparatus for manufacturing an electronic component according to the present embodiment will be described with reference to FIGS. 1 and 2. 2 (1) shows a state in which the cutting device for manufacturing an electronic component according to the present embodiment forms a perforated through hole in the sealed substrate, and FIG. 2 (2) shows a perforated through hole. FIG. 2C is a cross-sectional view showing a state where the sealed substrate is cut, and FIG.

  First, as shown in FIG. 1 and FIG. 2 (1), a table is applied to the irradiation head 10 while irradiating the first laser beam 12, which is a pulse wave, toward the boundary line 6 of the sealed substrate 1. 9 is moved in the + X direction in the figure. In addition, the first laser beam 12 is irradiated toward the boundary line 6 of the sealed substrate 1 and the assist gas 14 is injected. By injecting the assist gas 14, the generated dross can be blown off and removed. The irradiation condition of the first laser beam 12 is set in advance so that a through hole can be formed in the sealed substrate 1 that is a composite material. Thereby, as shown in FIG. 2 (2), a perforated hole 17 consisting of a through hole can be formed in one boundary line 6 along the X direction among the boundary lines 6 of the sealed substrate 1. it can.

  Next, perforated holes 17 each having a through hole are formed in all the remaining boundary lines 6 along the X direction among the boundary lines 6 of the sealed substrate 1. As a result, perforated holes 17 including through holes are formed in all the boundary lines 6 along the X direction among the boundary lines 6.

  Next, a perforated hole 17 composed of a through hole is formed in the boundary line 6 along the Y direction among the lattice-shaped boundary lines 6. Specifically, the table 9 is moved in the + Y (or -Y) direction of the drawing with respect to the irradiation head 10 while irradiating the first laser beam 12 toward one boundary line 6 along the Y direction. . Subsequently, perforated holes 17 including through holes are formed in all the remaining boundary lines 6 along the Y direction among the boundary lines 6 of the sealed substrate 1. Through the steps so far, the perforated holes 17 including the through holes are formed in all the boundary lines 6 of the sealed substrate 1.

  Next, as shown in FIG. 2 (3), the table 9 is shown on the irradiation head 10 while irradiating the second laser beam 18 that is a continuous wave toward the boundary line 6 of the sealed substrate 1. Is moved in the + X direction. Further, the second laser beam 18 is irradiated toward the boundary line 6 of the sealed substrate 1 and the assist gas 14 (see FIG. 1) is injected. The irradiation condition of the second laser beam 18 is set in advance so that the sealed substrate 1 in which the perforated hole 17 including the through hole is formed can be completely cut. Thereby, the sealed substrate 1 can be completely cut (full cut) at one boundary line 6 along the X direction among the boundary lines 6 of the sealed substrate 1.

  Next, the sealed substrate 1 is completely cut at all the remaining boundary lines 6 along the X direction among the boundary lines 6 of the sealed substrate 1.

  Next, the sealed substrate 1 is completely cut at all the boundary lines 6 along the Y direction among the lattice-shaped boundary lines 6. Specifically, the table 9 is moved in the + Y (or -Y) direction of the figure with respect to the irradiation head 10 while irradiating the second laser beam 18 toward one boundary line 6 along the Y direction. . Subsequently, the sealed substrate 1 is cut at all the remaining boundary lines 6 along the Y direction among the boundary lines 6 of the sealed substrate 1. Through the steps so far, the sealed substrate 1 can be cut at all the boundary lines 6. Therefore, the sealed substrate 1 is separated into a plurality of packages respectively corresponding to the plurality of regions 7.

  According to the present embodiment, the following effects can be obtained. The first effect is that the occurrence of dross is suppressed when the sealed substrate 1 is cut. In this embodiment, the volume of the portion removed from the sealed substrate 1 by each of the two irradiations is removed from the sealed substrate when the sealed substrate is cut by one irradiation. Both are reduced compared to the volume of the part. Thereby, the melted portion of the sealed substrate 1 by each of the two irradiations is easily removed by the assist gas. Therefore, when the sealed substrate 1 is cut, generation of dross is suppressed.

  The second effect is that a good cutting quality at the cut surface can be obtained. As described above, the melted portion of the sealed substrate 1 by each of the two irradiations is easily removed by the assist gas. Therefore, a good cutting quality can be obtained at the cut surface of the manufactured electronic component.

  A third effect is that when a ceramic substrate is used as the circuit substrate 2, the occurrence of cracking and chipping of the ceramic substrate due to internal stress is suppressed. In this embodiment, the sealed substrate 1 in which the perforated holes 17 are formed using a pulsed wave laser is cut using a continuous wave laser. As a result, thermal stress generated by irradiating the continuous wave laser in the vicinity of the perforated hole 17 is alleviated. As a result, the stress received by the sealed substrate 1 in the vicinity of the perforated hole 17, particularly the stress received by the circuit board 2 made of a ceramic substrate, is reduced. Therefore, the occurrence of cracking and chipping of the circuit board 2 due to internal stress is suppressed.

  In the present embodiment, the diameter of the perforated holes 17 and the interval between the hole centers (inter-center pitch) are determined by the irradiation condition of the first laser beam 12. The irradiation conditions include, for example, the type of laser, energy, frequency, duty ratio, irradiation diameter, moving speed of the table 9, the type and pressure of the assist gas 14. Further, the diameter of the perforated holes 17 and the distance between the hole centers can completely cut the sealed substrate 1 on which the perforated holes 17 are formed by the irradiation of the second laser light 18. As such, it is set in advance. Further, in this embodiment, by appropriately setting the diameter of the perforated holes 17 and the distance between the hole centers according to the material, thickness and the like of the sealing resin 4 and the circuit board 2, various specifications can be obtained. Applicable to the circuit board 2.

  In the present invention, in order to irradiate the first laser beam 12, a YAG laser (for example, wavelength 1064 nm), a fiber laser (for example, wavelength 1070 nm) or the like is used. Further, the energy is 200 W for the pulse wave irradiation condition, the moving speed of the table 9 is 300 mm / sec, the energy is 300 W for the irradiation condition of the continuous wave, and the moving speed of the table 9 is 150 mm / sec. By setting the energy of the continuous wave to the energy of the pulse wave and the moving speed of the table 9 to the moving speed of the continuous wave <the moving speed of the pulse wave, it is possible to obtain a good cross-sectional quality at the cut portion. it can.

  A second embodiment of a cutting apparatus for manufacturing an electronic component according to the present invention will be described with reference to FIG. 3 (1) shows a state in which the cutting apparatus for manufacturing electronic components according to this embodiment forms a perforated blind hole in the sealed substrate, and FIG. 3 (2) shows a perforated blind hole. FIG. 3C is a cross-sectional view showing a state where the sealed substrate is cut, and FIG.

  In this embodiment, first, as shown in FIG. 3 (1), the irradiation head 10 is irradiated while irradiating the first laser beam 12, which is a pulse wave, toward the boundary line 6 of the sealed substrate 1. The table 9 is moved in the + X direction in the figure. The irradiation condition of the first laser beam 12 is set in advance so that a blind hole can be formed in the sealed substrate 1 that is a composite material. As a result, as shown in FIG. 3B, a perforated hole 19 made of a blind hole is formed in one boundary line 6 along the X direction among the boundary lines 6 of the sealed substrate 1. Can do.

  Next, perforated holes 19 made of blind holes are formed in all the remaining boundary lines 6 along the X direction among the boundary lines 6 of the sealed substrate 1. As a result, perforated holes 19 formed of blind holes are formed in all of the boundary lines 6 along the X direction.

  Next, perforated holes 19 made of blind holes are formed in all the boundary lines 6 along the Y direction among the lattice-like boundary lines 6.

  Next, as shown in FIG. 3 (3), the table 9 is shown on the irradiation head 10 while irradiating the second laser beam 18 that is a continuous wave toward the boundary line 6 of the sealed substrate 1. Is moved in the + X direction. Thereby, the sealed substrate 1 can be completely cut (full cut) at one boundary line 6 along the X direction among the boundary lines 6 of the sealed substrate 1.

  Next, the sealed substrate 1 is completely cut at all the remaining boundary lines 6 along the X direction among the boundary lines 6 of the sealed substrate 1.

  Next, the sealed substrate 1 is completely cut at all the boundary lines 6 along the Y direction among the lattice-shaped boundary lines 6. Through the steps so far, the sealed substrate 1 can be cut at all the boundary lines 6. Therefore, the sealed substrate 1 is separated into a plurality of packages respectively corresponding to the plurality of regions 7.

  A feature of the present embodiment is that a perforated hole 19 made of a blind hole is formed by irradiating the first laser beam 12 as a pulse wave toward the boundary line 6 of the sealed substrate 1. . These perforated holes 19 have an opening on the sealing resin 4 side and an inner bottom surface in the circuit board 2. In other words, the perforated hole 19 is formed from the sealing resin 4 side to the middle of the circuit board 2 in the thickness direction of the sealed substrate 1. As in the first embodiment, the diameter and depth of the perforated holes 19 and the distance between the hole centers (inter-center pitch) are determined by the irradiation condition of the first laser beam 12. . The diameter and depth of the perforated holes 19 and the distance between the hole centers are such that the sealed substrate 1 on which the perforated holes 19 are formed is completely cut by irradiation with the second laser light 18. It is set in advance so that it can be performed.

  According to the present embodiment, the same effect as in the first embodiment can be obtained. In addition, according to the present embodiment, the diameter and depth of the perforated holes 19 and the interval between the hole centers are appropriately set according to the material and thickness of the sealing resin 4 and the circuit board 2. It becomes applicable to the circuit board 2 of various specifications.

  A third embodiment of a cutting apparatus for manufacturing an electronic component according to the present invention will be described with reference to FIG. 4 (1) shows a state in which the cutting device for manufacturing electronic components according to this embodiment forms a groove in the sealing resin of the sealed substrate, and FIG. 4 (2) shows a perforated through hole. FIG. 4 (3) is a cross-sectional view showing a state where the circuit board is formed, and FIG. 4 (3) is a state where the cutting device is cutting the sealed substrate.

  In the present embodiment, first, as shown in FIG. 4A, grooves are formed in the sealing resin 4 of the sealed substrate using the rotary blade 20. FIG. 4A shows a state in which a groove (no symbol) is formed on the left side of the rotary blade 20 by the table 9 moving in the −X direction (left direction). In FIG. 4, the rotary blade 20 is shown small for easy understanding.

  Next, as shown in FIG. 4B, the first laser beam 12 is irradiated to the circuit board 2 at one boundary line 6 along the X direction among the boundary lines 6 of the sealed substrate 1. As a result, a perforated hole 21 made of a through hole is formed in the circuit board 2. Subsequently, perforated holes 21 made of through holes are formed in the circuit board 2 at all the boundary lines 6 of the sealed substrate 1.

  Next, as shown in FIG. 4 (3), while irradiating the second laser beam 18 that is a continuous wave toward the circuit board 2 at the boundary line 6 of the sealed substrate 1, the irradiation head 10 (FIG. 1), the table 9 is moved in the + X direction in the figure. Thereby, the sealed substrate 1 can be completely cut (full cut) at one boundary line 6 along the X direction among the boundary lines 6 of the sealed substrate 1. Thereafter, the sealed substrate 1 is completely cut at all the remaining boundary lines 6 along the X direction among the boundary lines 6 of the sealed substrate 1. Subsequently, the sealed substrate 1 is completely cut at all the boundary lines 6 along the Y direction among the boundary lines 6 of the sealed substrate 1.

  According to the present embodiment, the same effects as those of the first and second embodiments can be obtained. Further, according to the present embodiment, a rotary blade suitable for this is used for cutting the sealing resin 4, and a type of laser and irradiation conditions suitable for this are used for cutting the circuit board 2. it can. Therefore, the efficiency of the process of cutting the sealed substrate 1 is improved.

  In this embodiment, both the rotary blade 20 and the laser oscillator 11 (see FIG. 1) for irradiating the first laser beam 12 and the second laser beam 18 are provided in one cutting device. An example was explained. Not limited to this, after a groove is formed in the sealing resin 4 of the sealed substrate 1 using a cutting device having the rotary blade 20, the sealing device having the laser oscillator 11 (see FIG. 1) is sealed. The substrate 1 may be transported.

In this embodiment, the groove may be formed in the sealing resin 4 of the sealed substrate 1 by using laser light instead of the rotary blade 20. In this case, it is preferable to use laser light that is easily absorbed by the sealing resin 4, for example, laser light from a CO ₂ laser oscillator.

  Further, the groove provided in the sealing resin 4 in this embodiment may be formed in the resin sealing step. In this case, grooves can be formed in the sealing resin 4 by providing thin plate-like protrusions in a lattice shape in the cavity of the mold for resin sealing.

  Further, in the groove provided in the sealing resin 4 in the present embodiment, the surface of the circuit board 2 may be exposed without the resin 4 being present at all. Further, the sealing resin 4 may be present at the bottom of the groove. In the present embodiment, it is sufficient that the thickness of the sealing resin 4 is reduced at the boundary line 6.

  In each of the embodiments described so far, the perforated holes 17 and 19 are formed in all the boundary lines 6 along the X direction, and then the perforated holes 17 are formed in all the boundary lines 6 along the Y direction. , 19 was formed. Then, after sealing the sealed substrate 1 at all the boundary lines 6 along the X direction, the sealed substrate 1 was cut at all the boundary lines 6 along the Y direction.

  In the present invention, after the sealed substrate 1 is cut into large blocks, each block may be cut into a plurality of regions 7 units. Specifically, first, perforated holes 17 are formed in all the boundary lines 6 of the sealed substrate 1. Next, the sealed substrate 1 is cut at the boundary line 6 near the center line in the X direction and the Y direction of the sealed substrate 1. Thereby, the sealed substrate 1 is equally divided into four blocks. Next, each of the four blocks is cut into a plurality of area 7 units. According to this method, when the deformation (warping, waviness, deflection, etc.) in the sealed substrate 1 is large, the perforated holes 17 are formed in all the boundary lines 6, thereby causing the deformation. Stress is reduced. Therefore, it is possible to suppress adverse effects caused by the deformation when the sealed substrate 1 is cut.

  Further, the following may be used. First, perforated holes 17 are formed in the boundary line 6 near the center line in the X direction and the Y direction of the sealed substrate 1. Next, the sealed substrate 1 is cut at the boundary line 6. Thereby, the sealed substrate 1 is equally divided into four blocks. Next, perforated holes 17 are formed in all the boundary lines 6 for each of the four blocks. Next, the sealed substrate 1 is cut along all the boundary lines 6 for each of the four blocks. Also by this method, when the sealed substrate 1 is cut, adverse effects caused by deformation such as warpage, undulation, and bending can be suppressed.

  In each of the embodiments so far, the sealed substrate 1 having the LED chip as the chip 3 and the translucent silicone resin as the sealing resin 4 has been described. However, the present invention is not limited to this, and a laser diode chip may be used as the chip 3. Further, by using a power semiconductor chip as the chip 3 and an epoxy resin or the like as the sealing resin 4, the present invention can be applied when manufacturing a power semiconductor component.

  Further, a plurality of chips 3 may be mounted on one region 7. For example, one area 7 to which a plurality of LED chips are attached can function as a surface light source by being separated into pieces. Further, the plurality of chips 3 attached to one region 7 may not have the same function. For example, when the light emitting element and the light receiving element are mounted on one area 7, the one area 7 can be functioned as an optical sensor by being separated into pieces.

  In each of the embodiments so far, the table 9 is applied to the irradiation head 10 while irradiating the first laser beam 12 or the second laser beam 18 toward the boundary 6 of the sealed substrate 1. It was decided to move in the X direction or the Y direction. Not limited to this, the irradiation head 10 may be moved in the X direction or the Y direction in the figure with respect to the table 9. Further, both the table 9 and the irradiation head 10 may be moved in the X direction or the Y direction in the figure. In short, the table 9 and the irradiation head 10 may be relatively moved in the X direction or the Y direction in the figure.

  Moreover, in each Example so far, the case where the boundary line 6 was comprised by the line segment was demonstrated. The present invention is not limited to this, and the present invention is applied to a case where the boundary line 6 includes a curved line or a broken line in which a plurality of line segments are combined. Therefore, the present invention is also applied to the case where a package (for example, a certain type of memory card) in which a sealed substrate is cut to include a curved line or a broken line in a part of the outer shape is manufactured. In this case, the perforated holes 17 and 19 are formed side by side in a curved line or a polygonal line.

  Further, in each of the examples so far, the sealed substrate 1 is fixed to the table 9 via the adhesive tape 8. Not limited to this, the sealed substrate 1 may be fixed to the table 9 by suction. In this case, it is preferable to provide a groove in a portion that overlaps each boundary line 6 on the surface of the table 9. As a result, dross generated in both the step of forming the perforated holes 17 and 19 in the sealed substrate 1 and the step of completely cutting the sealed substrate 1 (particularly the latter step) It becomes easy to be removed toward the groove.

  In addition, the present invention is not limited to the above-described embodiments, and may be arbitrarily combined, changed, or selected as necessary without departing from the spirit of the present invention. It can be done.

FIG. 1 is a cross-sectional view illustrating an irradiation head of a cutting apparatus for manufacturing an electronic component according to Embodiment 1 and a state in which the cutting apparatus forms a perforated hole in a sealed substrate. 2 (1) shows a state in which the cutting device for manufacturing electronic components according to the first embodiment forms through holes, which are perforated holes, in the sealed substrate, and FIG. 2 (2) shows a perforated shape. FIG. 2C is a cross-sectional view showing a state in which the sealed substrate is cut, and FIG. FIG. 3 (1) shows a state in which the cutting device for manufacturing an electronic component according to the second embodiment forms a blind hole which is a perforated hole in the sealed substrate, and FIG. 3 (2) shows a perforated shape. FIG. 3C is a cross-sectional view showing a state where the sealed substrate is cut, and FIG. 4 (1) shows a state in which the cutting apparatus for manufacturing an electronic component according to Example 3 forms a groove in the sealing resin, and FIG. 4 (2) shows a perforated through hole formed in the circuit board. FIG. 4 (3) is a cross-sectional view showing a state where the cutting device is cutting the sealed substrate.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Sealed board | substrate 2 Circuit board 3 Chip | tip 4 Sealing resin 5 Lens part 6 Boundary line 7 Area 8 Adhesive tape (fixing means)
9 Table (moving means)
10 Irradiation Head 11 Laser Oscillator (Laser Light Generation Means)
12 First laser beam (laser beam)
13 Piping 14 Assist gas 15 Nozzle 16 Irradiated part 17, 21 Perforated hole (through hole)
18 Second laser beam (laser beam)
19 Perforated hole (blind hole)
20 Rotating blade

Claims (12)

A sealed substrate is formed by resin-sealing chips each mounted in a plurality of regions provided on the circuit board, and a plurality of substrates are formed by cutting the sealed substrate at boundary lines of the plurality of regions. Used when manufacturing electronic components, fixing means for fixing the sealed substrate, laser light generating means for generating laser light, and movement for relatively moving the sealed substrate and the laser light A cutting device for manufacturing an electronic component comprising means,
An irradiation mechanism that is optically connected to the laser light generating means and irradiates the laser light toward the sealed substrate;
The irradiation mechanism includes a first laser beam for forming a perforated hole in the boundary line and a second laser for cutting the sealed substrate at the boundary line in which the perforated hole is formed. A cutting apparatus for manufacturing an electronic component, characterized by irradiating the laser beam. In the cutting device for electronic component manufacture described in Claim 1,
The cutting apparatus for manufacturing an electronic component, wherein the first laser beam is a pulse wave and the second laser beam is a continuous wave. In the cutting device for electronic component manufacture described in Claim 1 or 2,
The laser beam generating means includes a fiber laser oscillator or a YAG laser oscillator. In the cutting device for electronic component manufacture described in any one of Claims 1-3,
The cutting device for manufacturing an electronic component, wherein the perforated hole is a through hole or a blind hole. In the cutting device for electronic component manufacture described in any one of Claims 1-4,
The substrate for the circuit board is made of ceramic or metal. In the cutting device for electronic component manufacture described in any one of Claims 1-5,
A cutting apparatus for manufacturing an electronic component, wherein the electronic component is an optoelectronic component or a power semiconductor component. Forming a sealed substrate by resin-sealing chips mounted in a plurality of regions provided on the circuit board, and cutting the sealed substrate along a boundary line of the plurality of regions; Used in manufacturing a plurality of electronic components, fixing the sealed substrate, irradiating laser light toward the sealed substrate, and sealing the substrate and the laser light. A cutting method for manufacturing an electronic component comprising a relatively moving step,
In the irradiating step, a perforated hole is formed in the boundary line by irradiating the first laser beam toward the sealed substrate, and then a second laser beam is directed toward the boundary line. A cutting method for manufacturing an electronic component, wherein the sealed substrate is cut by irradiation. In the cutting method for electronic component manufacture described in Claim 7,
The cutting method for manufacturing an electronic component, wherein the first laser beam is a pulse wave, and the second laser beam is a continuous wave. In the cutting method for electronic component manufacture described in Claim 7 or 8,
In the irradiating step, the first laser beam and the second laser beam are generated by a fiber laser oscillator or a YAG laser oscillator. In the cutting method for electronic component manufacture described in any one of Claims 7-9,
The cutting method for manufacturing an electronic component, wherein the perforated hole is a through hole or a blind hole. In the cutting method for electronic component manufacture described in any one of Claims 7-10,
The substrate for the circuit board is made of ceramics or metal. In the cutting method for electronic component manufacture described in Claims 7-11,
A cutting method for manufacturing an electronic component, wherein the electronic component is an optoelectronic component or a power semiconductor component.

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