JPS62234686A - Cutting method for working material - Google Patents
Cutting method for working materialInfo
- Publication number
- JPS62234686A JPS62234686A JP61076360A JP7636086A JPS62234686A JP S62234686 A JPS62234686 A JP S62234686A JP 61076360 A JP61076360 A JP 61076360A JP 7636086 A JP7636086 A JP 7636086A JP S62234686 A JPS62234686 A JP S62234686A
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- holes
- processed material
- processing
- processed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 26
- 238000000034 method Methods 0.000 title claims description 21
- 239000008207 working material Substances 0.000 title abstract 3
- 239000000463 material Substances 0.000 claims abstract description 30
- 238000012545 processing Methods 0.000 claims abstract description 29
- 238000010894 electron beam technology Methods 0.000 claims description 2
- 230000006866 deterioration Effects 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 240000002834 Paulownia tomentosa Species 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000035876 healing Effects 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明はプリント基板等の加工材料を非接触で切断す
る切断方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cutting method for cutting processed materials such as printed circuit boards without contact.
第５図、第６図及び第７図は各々従来の加工材料の切断
方法を示す斜湿図であり、第５図は機械的方法により割
線として■溝加工が施された加工桐料の一部を拡大して
示したものであり、第６図は■溝加工が施された加工材
料全体を、また第７図は■溝加工後に割断して分離した
加工材料を示すものである。図において、（１）はプリ
ント基板等の加工材料、（２）は機械加工により加工さ
れた■溝。Figures 5, 6, and 7 are diagonal diagrams showing conventional cutting methods for processed materials, and Figure 5 shows a sample of processed paulownia material that has been machined with grooves as parting lines by a mechanical method. Fig. 6 shows (1) the entire processed material that has been subjected to groove processing, and Fig. 7 shows (2) the processed material that has been cut and separated after groove processing. In the figure, (1) is a processed material such as a printed circuit board, and (2) is a groove processed by machining.
（４）は■溝（２）に沿って割断された割断面、（５）
は分離後のプリント基板である。(4) is ■A fractured surface cut along groove (2), (5)
is the printed circuit board after separation.
従来、プリント基板を小さく分離する場合にはプリント
基板（１）の表面の分離割断すべき部分、即ち加工線に
沿って９機械的に■溝（２）全加工後、力を加えてＶ溝
（２）に沿って割って必要な寸法にプリント基板を切断
していた。Conventionally, when separating a printed circuit board into small pieces, mechanically cut the parts of the surface of the printed circuit board (1) to be separated and cut, that is, along the processing line, into the V-groove (9). (2) The printed circuit board was cut along the lines to the required dimensions.
従来の加工方法は以上のように■溝をカッタなどを用い
て機械的に加工していた。しかしながら例えばプリント
基板の材質はガラス繊維強化エポキシ樹脂積層板が多く
、ガラス繊維のため、カンタの刃など工具の消耗がはげ
しく、かつ切りくず。In the conventional processing method, as described above, the grooves were mechanically processed using a cutter or the like. However, for example, printed circuit boards are often made of glass fiber-reinforced epoxy resin laminates, and because of the glass fibers, tools such as canter blades are subject to rapid wear and tear, and produce chips.
粉塵が発生するため作業性が悪いという問題点があった
。There was a problem in that workability was poor due to the generation of dust.
また、このような従来の方法では複雑な形状の外形加工
はできないという問題があり、複雑な形状の加工にはプ
レスによる打ち抜き加工が行なわれているが部品の実装
後など後工程では加工できないといった問題点があった
。In addition, there is a problem that conventional methods cannot process the external shape of complex shapes, and although punching with a press is used to process complex shapes, it cannot be processed in subsequent processes such as after mounting the parts. There was a problem.
この発明は上記のような問題点を解消するためになされ
たもので、非接触で加工することにより。This invention was made to solve the above-mentioned problems by performing non-contact processing.
工具の消耗の問題がなく、切りくずなどが発生せず、か
つ部品の実装後など後工程が加工できる加工材料の切断
方法を提供すること全目的とする。The overall purpose of the present invention is to provide a method for cutting workpieces that does not cause the problem of tool wear, does not generate chips, and allows post-processing such as after mounting parts.
この発明に係る加工材料の切断方法は、パルス状の高密
度エネルギービームを用い、加工線に沿って穴の中心が
移動していくように複数個の穴を加工線上に形成する工
程、及び加工線上に形成された穴に沿って加工材料を切
断する工程を施すものである。The method for cutting a processed material according to the present invention includes the steps of forming a plurality of holes on a processing line using a pulsed high-density energy beam so that the center of the hole moves along the processing line; This process involves cutting the processed material along holes formed on a line.
この発明における加工材料の切断方法は、パルス状の高
密度エネルギービームにより、−パルスで一穴づつ穴を
明け、パルス周波数及び加工材料とビームとの相対的移
動速度を調節してミシン目状の穴加工を行うので、ビー
ム照射部の変質がほとんどな（、かつ力を加えることに
より簡単にミミン目状の穴に治って割ることができる。The method of cutting the material to be processed in this invention uses a pulsed high-density energy beam to make holes one by one in pulses, and by adjusting the pulse frequency and the relative movement speed of the material to be processed and the beam, perforations are made. Since the hole is machined, there is almost no change in the quality of the beam irradiation area (and by applying force, it can easily be broken into a hole in the shape of a millimeter).
以下、この発明の実施例を図について説明する。 Embodiments of the present invention will be described below with reference to the drawings.
第１図はこの発明の一実施例に係る加工材料の切断方法
の一工程により加工された加工材料の一部分を示す斜視
図、第２図は第１図に示された加工材料の全体を示す斜
視図、及び第３図はこの発明の一実施例に係るレーザ加
工装置を示す斜視図である。FIG. 1 is a perspective view showing a part of the workpiece processed by one step of the workpiece cutting method according to an embodiment of the present invention, and FIG. 2 shows the entire workpiece shown in FIG. 1. The perspective view and FIG. 3 are perspective views showing a laser processing apparatus according to an embodiment of the present invention.
図において、Ｈはパルス００２レーザ発ＳＨ，Ｑｌ）は
パルス状のレーザビーム、 ａ’ａはレーザビームＱｌ
＋を反射し折り曲げるペンドミラー、α騰はレーザビー
ムＱｌｌプリント基板（１）の表面に集光する集光レン
ズ、０４１は集光されたレーザビームと同軸状にアシス
トガスを噴射するノズル、 （１５１はノズルα唖への
アシストガスの入口である。またαｅはプリント基板を
移動させる加工テーブル、αηは加工テーブル駆動モー
タである。In the figure, H is a pulsed laser beam SH, Ql) is a pulsed laser beam, a'a is a laser beam Ql
041 is a nozzle that injects assist gas coaxially with the focused laser beam, (151 is This is the entrance of the assist gas to the nozzle α.Also, αe is a processing table for moving the printed circuit board, and αη is a processing table driving motor.
レーザ発振器Ｑ（Ｉより取り出したレーザビームαＢは
、ベンドミラー０２で折り曲げられ、集光レンズαＪに
よってプリント基板（１＋の加工線上に集光する。A laser beam αB taken out from a laser oscillator Q (I) is bent by a bend mirror 02 and focused onto the processing line of a printed circuit board (1+) by a condensing lens αJ.
プリント基板（１）全加工テーブルσＧにより移動させ
るごとによって、所望のパターンの加工ができる。Printed circuit board (1) A desired pattern can be processed by moving the entire processing table σG.
この場合、レーザビームσＢが連続出力のビームである
と、プリント基板（１）は加熱しすぎて切断面は黒くな
り品質のよいものが得られない。In this case, if the laser beam σB is a continuous output beam, the printed circuit board (1) will be heated too much and the cut surface will become black, making it impossible to obtain a high quality product.
なお一般的なレーザ切断に関しては、溶接学会誌第４３
巻（＋９７４）第８号、Ｐ８２〜８９に示されている。Regarding general laser cutting, please refer to the Welding Society Journal No. 43.
Volume (+974) No. 8, pages 82-89.
そこでレーザビームαＤを第４図に示すようにパルス化
し、パルスの周波数とプリント基板の移動速度やレーザ
出力を適当に選ぶことによって第１図に示すようなミシ
ン目状の穴加工、即ち加工線に溢って穴の中心が移動し
てい（ような複数個の穴（３）が加工組上に形成される
。Therefore, the laser beam αD is pulsed as shown in Figure 4, and by appropriately selecting the pulse frequency, the moving speed of the printed circuit board, and the laser output, it is possible to machine perforated holes as shown in Figure 1. A plurality of holes (3) are formed on the machining assembly, with the center of the hole shifting.
第４図はこの発明の一実施例に係るレーザビームのパル
ス波形を示す特性図であり、出力は加工材料の厚さによ
って変わるが、この場合１酊の厚さのプリント基板に対
して５００Ｗのレーザ出力のものが用いられている。FIG. 4 is a characteristic diagram showing the pulse waveform of a laser beam according to an embodiment of the present invention. The output varies depending on the thickness of the processed material, but in this case, the output power is 500 W for a printed circuit board with a thickness of 1 mm. Those with laser output are used.
これにより、−パルスで一つの穴（３）が明き１表面側
（レーザビーム服射面側）の穴の径’ｋｄ（＋ｕ＋φ〕
パルス周波数ｋｆ（Ｈ２）、プリント基板の移動速度を
Ｖ（闘／５ｅｃ）とすると
ｖ−ｄ ｅ ｆ
の時に、プリント基板表面で穴と穴が接するようになる
。As a result, one hole (3) is opened by the − pulse, and the diameter of the hole on the 1 surface side (laser beam receiving surface side) is 'kd(+u+φ)
Assuming that the pulse frequency kf (H2) and the moving speed of the printed circuit board are V (f/5ec), the holes come into contact with each other on the surface of the printed circuit board at v-d e f .
ｖ ） ｄ・ｆ の時には穴と穴とに間隔があき。v) d・f When , there is a gap between the holes.
Ｖ（ｄ−ｆ の時には穴と穴とが重なるようになる。V(d-f When , the holes begin to overlap.
第２図に示すようにミシン目状の穴加工を行なった場合
、ミシン目状の穴と穴との間に間隔があると、第１図に
示すようにプリント基板（１１′８ｆ：割る時に大きな
力が必要である。When cutting perforated holes as shown in Figure 2, if there is a gap between the perforated holes, the printed circuit board (11'8f: A great deal of force is required.
また、穴と穴との重なりが大きいほどプリント基板（１
１’（ｒ割る時に必要な力は小さくなるが、穴と穴が重
なって連なり溝状になった部分にはプリント基板（１）
の成分が熱分解して発生する炭化物が付着するため重な
りを大きくすることはできない。Also, the larger the overlap between holes, the more the printed circuit board (1
1'(rThe force required to split is smaller, but the printed circuit board (1)
It is not possible to increase the overlap because the carbides generated by thermal decomposition of the components adhere.
即ちＶ：；ａ−ｆなる条件、即ち、加工林料の一方の表
面で隣接する穴と穴が接続するような条件で加工するこ
とにより良好な加工品質が得られる。That is, good processing quality can be obtained by processing under the condition of V:;a-f, that is, under the condition that adjacent holes are connected to each other on one surface of the processed forest material.
ちなみに実用的には上述のような問題を生じないｖ／ｄ
−ｆの範囲として
０．８≦ ｄ、ｆ ≦１．１
が適当である。By the way, in practical terms, v/d does not cause the above-mentioned problems.
The appropriate range for −f is 0.8≦d and f≦1.1.
また、ノズルＩからレーザビームと同軸状にアシストガ
スを噴射することによって、プリント基板表面への炭化
物の付着を防止し、集光レンズα湯の汚染を防止するこ
とができるだけでなく、ガスによる冷却効果により、よ
り一層、高品質化を図ることができる。In addition, by injecting assist gas coaxially with the laser beam from nozzle I, it is possible not only to prevent carbide from adhering to the printed circuit board surface and contaminating the condenser lens α, but also to cool the As a result, it is possible to achieve even higher quality.
アシストガスとしては圧縮空気が適当であるが窒素ガス
、酸素ガス、アルゴンガスなど他のガスであってもよい
。Compressed air is suitable as the assist gas, but other gases such as nitrogen gas, oxygen gas, and argon gas may also be used.
また、アシストガスは必ずしもレーザビームと同軸状に
噴射する必要はなく、サイドから吹き付けるようにして
もよい。Further, the assist gas does not necessarily need to be injected coaxially with the laser beam, and may be injected from the side.
さらに、加工材料はプリント基板の他、繊維強化樹脂板
などの複合材料であってもよい。Furthermore, the processing material may be a composite material such as a fiber-reinforced resin board in addition to a printed circuit board.
また、上記実施例においては、プリント基板を移動させ
る場合について説明したが、レーザビームを移動するよ
うにしても同様の効果が得られる。Further, in the above embodiment, the case where the printed circuit board is moved has been described, but the same effect can be obtained even if the laser beam is moved.
また、レーザビームのかわりに電子ビームを用いても同
様の加工が可能である。Further, similar processing can be performed using an electron beam instead of a laser beam.
以上のように、この発明によれば、パルス状の高密度エ
ネルギービームを用い、加工線に治って穴の中心が移動
していくように複数個の穴を上記加工綴止に形成する工
程、及び上記加工線上に形成された穴に治って加工材料
を切断する工程を施して加工劇料を切断するようにした
ので、非接触で作業性より、シかも高品質な切断ができ
るという効果がある。また部品実装後などの後工程でも
切断加工ができるので生産効率が向上するという効果が
ある。As described above, according to the present invention, a step of forming a plurality of holes in the processing staple using a pulsed high-density energy beam so that the center of the hole moves along the processing line; And since the processing material is cut by applying a process of cutting the processing material by healing the hole formed on the processing line, it is possible to cut the processing material without contact and with higher quality than workability. be. Furthermore, since cutting can be performed in post-processes such as after component mounting, production efficiency is improved.
第１図及び第２図は各々この発明の一実施例に係る加工
材料の切断方法の一工程により加工された加工材料の一
部分及び全体を示す斜視図、第３図はこの発明の一実施
例に係るレーザ加工装置を示す斜視図、第４図はこの発
明の一実施例に係るレーザビームのパルス波形を示す特
性図、並びに第５図、第６図及び第７図は各々従来の加
工材料の切断方法を示す斜視図である。
（１）は加工材料、（３）は穴、Ｏｒ５はレーザ発振器
、 ａｎはレーザビーム、 ｆｉ４１はノズル。
なお９図中、同一符号は同−又は相当部分を示す。1 and 2 are perspective views respectively showing a part and the whole of a processed material processed by one step of a method for cutting a processed material according to an embodiment of the present invention, and FIG. 3 is an embodiment of the present invention. 4 is a characteristic diagram showing the pulse waveform of a laser beam according to an embodiment of the present invention, and FIGS. 5, 6, and 7 are a perspective view showing a laser processing apparatus according to an embodiment of the present invention, and FIG. 5, FIG. 6, and FIG. FIG. 2 is a perspective view showing a cutting method. (1) is the processing material, (3) is the hole, Or5 is the laser oscillator, an is the laser beam, and fi41 is the nozzle. In addition, in FIG. 9, the same reference numerals indicate the same or corresponding parts.
Claims (1)
線に沿つて穴の中心が移動していくように複数個の穴を
上記加工線上に形成する工程、及び上記加工線上に形成
された穴に沿つて加工材料を切断する工程を施す加工材
料の切断方法。 （２）加工線に沿つて形成された穴は、加工材料の一方
の表面で隣接する穴と穴とが接続する特許請求の範囲第
１項記載の加工材料の切断方法。 （３）高密度エネルギービームの相対的移動速度をｖ、
穴の径をｄ、パルス周波数をｆとした時、上記ｖ、ｄ、
ｆは次の関係を満たす特許請求の範囲第１項又は第２項
記載の加工材料の切断方法。 ０．８≦ｖ／ｄ・ｆ≦１．１ （４）高密度エネルギービームはレーザビームである特
許請求の範囲の第１項ないし第３項のいずれかに記載の
加工材料の切断方法。 （５）レーザビームの照射とともに加工部にアシストガ
スを吹きつける特許請求の範囲第４項記載の加工材料の
切断方法。 （６）高密度エネルギービームは電子ビームである特許
請求の範囲第１項ないし第３項のいずれかに記載の加工
材料の切断方法。[Claims] (1) A step of forming a plurality of holes on the processing line using a pulsed high-density energy beam so that the center of the hole moves along the processing line, and the processing A method of cutting a processed material that involves cutting the processed material along a hole formed on a line. (2) The method for cutting a processed material according to claim 1, wherein the holes formed along the processing line connect adjacent holes on one surface of the processed material. (3) The relative moving speed of the high-density energy beam is v,
When the hole diameter is d and the pulse frequency is f, the above v, d,
The method for cutting a processed material according to claim 1 or 2, wherein f satisfies the following relationship. 0.8≦v/d·f≦1.1 (4) The method for cutting a processed material according to any one of claims 1 to 3, wherein the high-density energy beam is a laser beam. (5) A method for cutting a processed material according to claim 4, in which an assist gas is blown onto the processed portion at the same time as the laser beam is irradiated. (6) The method for cutting a processed material according to any one of claims 1 to 3, wherein the high-density energy beam is an electron beam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61076360A JPS62234686A (en) | 1986-04-02 | 1986-04-02 | Cutting method for working material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61076360A JPS62234686A (en) | 1986-04-02 | 1986-04-02 | Cutting method for working material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62234686A true JPS62234686A (en) | 1987-10-14 |
Family
ID=13603188
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61076360A Pending JPS62234686A (en) | 1986-04-02 | 1986-04-02 | Cutting method for working material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62234686A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6348839A (en) * | 1986-08-19 | 1988-03-01 | Nikon Corp | Laser machining apparatus |
| JP2005059071A (en) * | 2003-08-15 | 2005-03-10 | Yyl:Kk | Machining method and device using machining-beam |
| JP2007158459A (en) * | 2005-11-30 | 2007-06-21 | Kyocera Kinseki Corp | Method for cutting crystal plate |
| JP2009242185A (en) * | 2008-03-31 | 2009-10-22 | Sumitomo Bakelite Co Ltd | Laser cutting method, and object to be cut |
| WO2010073640A1 (en) * | 2008-12-26 | 2010-07-01 | Ｔｏｗａ株式会社 | Cleaving device and cleaving method for manufacturing electronic components |
| TWI566291B (en) * | 2014-09-04 | 2017-01-11 | Towa Corp | A cutting device, an adsorption mechanism and a device having an adsorption mechanism |
-
1986
- 1986-04-02 JP JP61076360A patent/JPS62234686A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6348839A (en) * | 1986-08-19 | 1988-03-01 | Nikon Corp | Laser machining apparatus |
| JP2005059071A (en) * | 2003-08-15 | 2005-03-10 | Yyl:Kk | Machining method and device using machining-beam |
| JP2007158459A (en) * | 2005-11-30 | 2007-06-21 | Kyocera Kinseki Corp | Method for cutting crystal plate |
| JP2009242185A (en) * | 2008-03-31 | 2009-10-22 | Sumitomo Bakelite Co Ltd | Laser cutting method, and object to be cut |
| WO2010073640A1 (en) * | 2008-12-26 | 2010-07-01 | Ｔｏｗａ株式会社 | Cleaving device and cleaving method for manufacturing electronic components |
| CN102256739A (en) * | 2008-12-26 | 2011-11-23 | 东和株式会社 | Cleaving device and cleaving method for manufacturing electronic components |
| TWI566291B (en) * | 2014-09-04 | 2017-01-11 | Towa Corp | A cutting device, an adsorption mechanism and a device having an adsorption mechanism |
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