JPS61169188A - Cutting and welding method using laser beam - Google Patents
Cutting and welding method using laser beamInfo
- Publication number
- JPS61169188A JPS61169188A JP60009366A JP936685A JPS61169188A JP S61169188 A JPS61169188 A JP S61169188A JP 60009366 A JP60009366 A JP 60009366A JP 936685 A JP936685 A JP 936685A JP S61169188 A JPS61169188 A JP S61169188A
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- pipe
- gas
- laser light
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/009—Working by laser beam, e.g. welding, cutting or boring using a non-absorbing, e.g. transparent, reflective or refractive, layer on the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
この発明は、箱状の材料や、パイプ状(角、丸など)の
材料やあるいはコの字形材料などのように上下、又は左
右に、材料(板など)が対向した形状を、レーザ光を用
いて、切断、穴あけ、溶接等の加工を行なう方法に関す
るものである。This invention uses a laser beam to produce a shape in which materials (plates, etc.) face each other vertically or horizontally, such as a box-shaped material, a pipe-shaped material (square, round, etc.), or a U-shaped material. This relates to a method for performing processing such as cutting, drilling, welding, etc.
炭酸ガスレーザやYAGレーザは、金属や非金属の切断
、穴あけ、溶接、熱処理、などの加工用として使用され
ていることは、既に公知の事実である。
レーザビームを用いて加工を行なう場合、例えば、切断
や穴あけなどでは、通常、被加工材が金属の場合は、レ
ーザビームと同軸に酸素ガスを材料にふぎつけて、加工
を行ない、非金属では、空気や窒素などをふきつける。
また金属の溶接では、同様にレーザビームと同軸にアル
ゴンガスやヘリ ゛ラムガスなどの不活性ガスをふき
つけて溶接する。
レーザビームを用いて穴あけや切断を行なう過程におい
て、穴あけでは被加工物に穴が、切断では責通した溝が
形成されるが、レーザビームは、穴や溝を通過して被加
工物の裏側へぬける。
また薄板を完全述部みで溶接する場合にも、溶り
接中はキーホールという微小な穴を形成しながら溶接が
進行するので、レーザビームのある比率分が裏側へぬけ
る。
このような、過程で、切断穴あけ、溶接が良好に行なわ
れるのであるが、前記箱状の材料や、パイプ状の材料を
加工する場合には、裏側にぬけたビームが、加工された
材料と対向する板にあたり、その部分を、溶融させたり
、損傷させたりする。
あるいは同時に、その部分付近に、加工された部分の材
料の切削粉が堆積し、同様に損傷させたり、材料の商品
価値を著しく、そこなうなどの問題があった。It is already a well-known fact that carbon dioxide lasers and YAG lasers are used for processing such as cutting, drilling, welding, and heat treatment of metals and nonmetals. When processing using a laser beam, such as cutting or drilling, normally when the workpiece is metal, oxygen gas is blown into the material coaxially with the laser beam, while when processing non-metals, , spray with air or nitrogen. Similarly, when welding metals, welding is performed by blowing an inert gas such as argon gas or helium gas coaxially with the laser beam. In the process of drilling or cutting using a laser beam, a hole is formed in the workpiece when drilling, and a groove is formed when cutting. Go through. Also, when welding thin plates with perfect predication, welding progresses while forming a tiny hole called a keyhole, so a certain percentage of the laser beam passes through to the back side. In this process, cutting, drilling, and welding are performed well, but when processing the box-shaped material or pipe-shaped material, the beam that passes through the back side may not match the processed material. It hits the opposing plate and melts or damages that part. Alternatively, at the same time, cutting powder from the material of the processed part may accumulate near that part, causing similar damage or significantly reducing the commercial value of the material.
第5図は、例えばコの字形状の−F側に小穴を多数あけ
る場合の従来の例である、図において(1)はコの字形
材料であり、集光されたレーザビーム(2)によって上
側に小穴(3)をあける。
ところが、穴(3)を形成された直後にレーザビーム(
2)は、穴(3)を通過し、下側の材料上に照射され、
照射部に、穴あきや、溶融などの損傷部(4)を形成す
る。このため、従来の方法では良好な加工ができず、製
品不良が多発する問題があった。
この発明は、上記のような問題点を解消するためになさ
れたもので、対向する材料への損傷がなく、安定した切
断、穴あけ、溶接などの加工ができる方法をえることを
目的とする。Figure 5 shows a conventional example of making a large number of small holes on the -F side of a U-shaped material. Make a small hole (3) on the top. However, immediately after the hole (3) was formed, the laser beam (
2) passes through the hole (3) and is irradiated onto the lower material;
Damaged areas (4) such as holes and melting are formed in the irradiated area. For this reason, the conventional method has a problem in that good processing cannot be achieved and product defects occur frequently. This invention was made to solve the above-mentioned problems, and aims to provide a method that can perform stable cutting, drilling, welding, etc. without damaging opposing materials.
この発明に係る方法は、次に示す5つの方法のうち、1
つ以上を用いることによって前記問題を解決している。
すなわち、この方法は、レーザビームが直接照射される
ことに起用する損傷を防止することと、裏面に付着する
切断を減少または皆無にすることである。
■ 2板の材料の間に空気、窒素、アルゴン、CO2ガ
ス等のガスを流す。The method according to this invention is one of the following five methods.
The above problem is solved by using more than one. That is, this method prevents damage caused by direct laser beam irradiation and reduces or eliminates cuts that adhere to the back surface. ■ Flow a gas such as air, nitrogen, argon, or CO2 gas between the two plates.
■ 2板の材料の間にレーザ光を反射または吸収する物
体を置く。
■ 加工される側と反対の材料の表面に油膜を塗布する
かあるいは溶接用ノンスパッタ材を塗布する。
■ 2板の材料の間にレーザビームを吸収しやすいガス
を充満させる。
成する実実施例として図について説明する。
第1図は前記■の効果を説明する図であり、角パイプ(
5)にレーザビーム、(2)を材料表面上に集光させて
四角穴(6)を形成(切断)する場合、角パイプ(5)
の開口部例から空気(8)を、大量に流すことによって
、従来技術では、裏側に付着する切りくず(9)を他の
開口部00から、はきだすことができる。これによって
裏面にほとんど切りくずのない良好な穴加工ができる。
用いるガスは、第1図では空気を使用したが、ここのほ
か窒素やアルゴンや、CO2等のガスを用いてもよい。
次に第2図は前記■の効果を説明する図である。
角パイプ(5)の内部に、鉄板(11)を入れて、レー
ザビーム(2)を用いて穴加工を行うが、加工中に通過
したレーザビームは全て、鉄板α1)上に照射されるの
で、ビームは鉄板(11)に一部は吸収され、残りは反
射し、角パイプ(5)内部を乱反射するので、角バイブ
を損傷しない。
また、切りくずは、はぼ鉄板01)上に堆積するので、
パイプ内部が切りくずでよごれることもない。
第2図では内部に入れる材料として鉄板(11)を使用
したが、銅などのレーザビームをよく反射する材料を用
いてもよく、あるいはレーザビームをほとんど吸収する
耐火レンガなどの吸収材を用いてもよい。
第3図は前記■の効果を説明する一実施例であり、角パ
イプ(5)の内部の斜線部に油をうずくぬった油膜(1
2)を塗布した後、レーザビームにより四角穴(6)を
切断すると油膜上には、切りくずは付着しにくいため、
製品の損傷を軽減できる。第3図では、油膜02を塗布
したが、アーク溶接などで用いるノンスパッタ塗布材を
用いてもよい。但し、ノンスパッタ塗布材は、あとで除
去する必要がある。
第4図は前記■の効果を説明する一実施例であり角バイ
ブ内部にCO2ガスや6フツ化イオウガスなどのように
炭酸ガスレーザを強く吸収するガスを充てんした後、穴
加工を行なうようにしたものである。
通常は、穴加工中は切断溝をとおして、レーザビーム2
は裏側へ通過し裏面に照射されるが、角パイプ(5)内
にレーザを強く吸収するガスを充てんすると、通過した
レーザビームの強度は急激に減すいし、裏面部の損傷(
例えば穴あき、変色溶融)がなくなる。
最後に前記■は、前記■と類似したものであり、前記■
が、切りくずをふき飛ばす作用であり、前記■は、吸い
こむことにより、同様の効果を得るものである。
以上のこれらの実施例は角パイプに四角穴をあける場合
についてのみ説明したが、被加工物は、角パイプにかぎ
らず、丸パイプコの字形、箱形状などのように、2枚以
上の材料が対向する形状のすべてのものに適用できる。
さらに、加工内容は、四角穴にかぎらず、微小穴、丸穴
、などの穴加工の
全般に加え、切断溶接等に適用しても全く同様効果を奏
する。
また、加工材質は、プラスチック、木材などの非金属材
料鉄板などの金属材料など、全般に適用できる。■ Place an object that reflects or absorbs laser light between the two materials. ■ Apply an oil film or a non-spatter welding material to the surface of the material opposite to the side to be processed. ■ Fill the space between the two plates with a gas that easily absorbs the laser beam. The figures will be described as an example of the implementation. Figure 1 is a diagram explaining the effect of the above (■), and shows the square pipe (
When forming (cutting) a square hole (6) by concentrating the laser beam (2) on the material surface in 5), use the square pipe (5).
In the prior art, by flowing a large amount of air (8) through the opening example, the chips (9) adhering to the back side can be expelled from the other openings 00. This allows for good hole machining with almost no chips on the back side. Although air is used as the gas in FIG. 1, other gases such as nitrogen, argon, and CO2 may also be used. Next, FIG. 2 is a diagram illustrating the effect of (2) above. A steel plate (11) is placed inside the square pipe (5) and a hole is machined using a laser beam (2), but all the laser beams that pass through the process are irradiated onto the steel plate α1). A part of the beam is absorbed by the iron plate (11), and the rest is reflected and diffusely reflected inside the square pipe (5), so that it does not damage the square vibrator. In addition, since the chips accumulate on the iron plate 01),
The inside of the pipe will not get dirty with chips. In Figure 2, a steel plate (11) is used as the material to be inserted inside, but a material that reflects the laser beam well, such as copper, may also be used, or an absorbing material such as firebrick, which absorbs most of the laser beam, may be used. Good too. FIG. 3 shows an example for explaining the effect of (2) above, in which an oil film (1
After applying 2), when cutting the square hole (6) with a laser beam, chips are difficult to adhere to the oil film, so
Product damage can be reduced. In FIG. 3, an oil film 02 is applied, but a non-sputter coating material used in arc welding or the like may be used. However, the non-sputter coating material needs to be removed later. Fig. 4 is an example to explain the effect of (2) above, in which the hole is drilled after filling the inside of the square vibrator with a gas that strongly absorbs carbon dioxide laser, such as CO2 gas or sulfur hexafluoride gas. It is something. Normally, during hole drilling, the laser beam 2 passes through the cutting groove.
The laser beam passes through to the back side and is irradiated on the back side, but if the square pipe (5) is filled with a gas that strongly absorbs the laser beam, the intensity of the laser beam that has passed through it will decrease rapidly, causing damage to the back side (
For example, holes, discoloration and melting) are eliminated. Finally, the above ■ is similar to the above ■, and the above ■
This is the action of blowing away the chips, and the above item (2) is the same effect obtained by sucking them in. The above embodiments have been explained only when making a square hole in a square pipe, but the workpiece is not limited to a square pipe, but can also be a round pipe with two or more pieces of material, such as a U-shaped or box-shaped pipe. Applicable to all opposing shapes. Furthermore, the processing contents are not limited to square holes, but can be applied to general hole processing such as micro holes and round holes, as well as cutting and welding, with exactly the same effect. Furthermore, the processing materials can be generally applied to non-metallic materials such as plastics and wood, and metallic materials such as iron plates.
以上のように、この発明によれば、前記■〜■の1つま
たは1つ以上を組合せて、レーザビームを用いて加工す
るようにしたので加工する材料の反対側を損傷すること
がなく、不良のない加工ができる効果がある。As described above, according to the present invention, one or more of the above items (1) to (4) are combined to process the material using a laser beam, so that the opposite side of the material to be processed is not damaged. This has the effect of allowing defect-free machining.
第1図〜4図はこの発明の一実施例による、レーザビー
ムを用いた穴加工例を示す図、第5図は従来方法による
穴加工例を示す図である。
なお、図中、同一符号は同一、又は相当部分を示す、図
中、(1)は加工材料、(2)はレーザビーム、(1j
は鉄板、α2)は油膜である。1 to 4 are diagrams showing an example of hole processing using a laser beam according to an embodiment of the present invention, and FIG. 5 is a diagram showing an example of hole processing using a conventional method. In addition, in the figure, the same reference numerals indicate the same or equivalent parts. In the figure, (1) is the processed material, (2) is the laser beam, (1j
is an iron plate, and α2) is an oil film.
Claims (1)
ような形状を有し、片側をレーザビームによって切断、
あるいは穴明け、溶接などの加工を行なう方法において
、 (1)前記対向した2枚の材料の間に空気、窒素、アル
ゴン、炭酸ガスなどのガスを流す事。 (2)前記対向した2枚の材料の間にレーザ光を反射ま
たは吸収する物体を置く事。 (3)被加工物と対向する非被加工物表面に油膜を塗布
するか溶接用ノンスパッタ材を塗布する事。 (4)前記対向した2枚の材料の間にレーザ光を吸収す
るガスを充満させる事。 (5)前記対向した2枚の材料間にある空気を吸いとる
事。 のいずれか一つ、又は複数を組合せて行なうレーザビー
ムを用いた切断および溶接方法。[Claims] Two materials have a shape such that they face each other vertically or horizontally, and one side is cut by a laser beam,
Or in a method of processing such as drilling or welding, (1) flowing a gas such as air, nitrogen, argon, carbon dioxide, etc. between the two facing materials. (2) Placing an object that reflects or absorbs laser light between the two opposing materials. (3) Apply an oil film or apply a welding non-spatter material to the surface of the non-workpiece that faces the workpiece. (4) Filling the space between the two opposing materials with a gas that absorbs laser light. (5) Sucking the air between the two facing materials. A cutting and welding method using a laser beam that uses one or a combination of the following.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60009366A JPS61169188A (en) | 1985-01-22 | 1985-01-22 | Cutting and welding method using laser beam |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60009366A JPS61169188A (en) | 1985-01-22 | 1985-01-22 | Cutting and welding method using laser beam |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61169188A true JPS61169188A (en) | 1986-07-30 |
Family
ID=11718474
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60009366A Pending JPS61169188A (en) | 1985-01-22 | 1985-01-22 | Cutting and welding method using laser beam |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61169188A (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02258187A (en) * | 1988-12-28 | 1990-10-18 | Mitsui Petrochem Ind Ltd | Method and device for manufacturing pierced tube |
US5994667A (en) * | 1997-10-15 | 1999-11-30 | Scimed Life Systems, Inc. | Method and apparatus for laser cutting hollow workpieces |
US6407362B1 (en) * | 1998-07-22 | 2002-06-18 | Hydraulik-Ring Gmbh | Protective device for producing very small bores in tubular components, and method for producing bores |
JP2002321060A (en) * | 2001-04-23 | 2002-11-05 | Fuji Heavy Ind Ltd | Boring method by fusion cutting-off device and fusion cutting-off device |
JP2008532507A (en) * | 2005-03-08 | 2008-08-21 | クーン ソシエテ アノニム | Method of manufacturing a housing for a cutter bar of a disc type mower and a housing formed by the method |
JP2009028777A (en) * | 2007-07-30 | 2009-02-12 | Honda Motor Co Ltd | Punching method and its device |
US7932479B2 (en) * | 2007-05-31 | 2011-04-26 | Abbott Cardiovascular Systems Inc. | Method for laser cutting tubing using inert gas and a disposable mask |
US8461478B2 (en) | 2009-02-03 | 2013-06-11 | Abbott Cardiovascular Systems, Inc. | Multiple beam laser system for forming stents |
US8530783B2 (en) | 2009-02-03 | 2013-09-10 | Abbott Cardiovascular Systems Inc. | Laser cutting system |
US8779328B2 (en) | 2007-05-31 | 2014-07-15 | Abbott Cardiovascular Systems Inc. | Methods for laser cutting tubing to make medical devices |
US8872062B2 (en) | 2009-02-03 | 2014-10-28 | Abbott Cardiovascular Systems Inc. | Laser cutting process for forming stents |
-
1985
- 1985-01-22 JP JP60009366A patent/JPS61169188A/en active Pending
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02258187A (en) * | 1988-12-28 | 1990-10-18 | Mitsui Petrochem Ind Ltd | Method and device for manufacturing pierced tube |
US5994667A (en) * | 1997-10-15 | 1999-11-30 | Scimed Life Systems, Inc. | Method and apparatus for laser cutting hollow workpieces |
US6407362B1 (en) * | 1998-07-22 | 2002-06-18 | Hydraulik-Ring Gmbh | Protective device for producing very small bores in tubular components, and method for producing bores |
JP2002321060A (en) * | 2001-04-23 | 2002-11-05 | Fuji Heavy Ind Ltd | Boring method by fusion cutting-off device and fusion cutting-off device |
JP2008532507A (en) * | 2005-03-08 | 2008-08-21 | クーン ソシエテ アノニム | Method of manufacturing a housing for a cutter bar of a disc type mower and a housing formed by the method |
US8278593B2 (en) * | 2007-05-31 | 2012-10-02 | Abbott Cardiovascular Systems Inc. | Method for laser cutting tubing using inert gas and a disposable mask |
US7932479B2 (en) * | 2007-05-31 | 2011-04-26 | Abbott Cardiovascular Systems Inc. | Method for laser cutting tubing using inert gas and a disposable mask |
US20110210108A1 (en) * | 2007-05-31 | 2011-09-01 | Abbott Cardiovascular Systems Inc. | Method for laser cutting tubing using inert gas and a disposable mask |
US8779328B2 (en) | 2007-05-31 | 2014-07-15 | Abbott Cardiovascular Systems Inc. | Methods for laser cutting tubing to make medical devices |
JP2009028777A (en) * | 2007-07-30 | 2009-02-12 | Honda Motor Co Ltd | Punching method and its device |
US8461478B2 (en) | 2009-02-03 | 2013-06-11 | Abbott Cardiovascular Systems, Inc. | Multiple beam laser system for forming stents |
US8530783B2 (en) | 2009-02-03 | 2013-09-10 | Abbott Cardiovascular Systems Inc. | Laser cutting system |
US8872062B2 (en) | 2009-02-03 | 2014-10-28 | Abbott Cardiovascular Systems Inc. | Laser cutting process for forming stents |
US8901452B2 (en) | 2009-02-03 | 2014-12-02 | Abbott Cardiovascular Systems, Inc. | Multiple beam laser system for forming stents |
US9006604B2 (en) | 2009-02-03 | 2015-04-14 | Abbott Cardiovascular Systems Inc. | Multiple beam laser system for forming stents |
US9199334B2 (en) | 2009-02-03 | 2015-12-01 | Abbott Cardiovascular Systems Inc. | Multiple beam laser system for forming stents |
US9399267B2 (en) | 2009-02-03 | 2016-07-26 | Abbott Cardiovascular Systems Inc. | Multiple beam laser system for forming stents |
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