JPH02197388A - Laser bean machining method - Google Patents

Abstract

PURPOSE:To eliminate the process of sorting to a cutting material and material to be cut by scanning laser light along the side face of a through-hole provided by piercing. CONSTITUTION:The through-hole 6 is first formed by piercing. The converging position of the laser light is then determined at the edge in the proper position of the through-hole 6 and thereafter, a machining point 7 is moved in an arrow A direction along the edge thereof to attain a desired shape. While the material to be cut 2 is made into powder by the laser cutting, the hole part is expanded until finally the hole 8 of the prescribed shape is formed. The material 2 is previously shape-cut as powder if the shape-cut material 2 is not necessary. The stage for sorting to the cutting material and the material to be cut is eliminated and the productivity is improved.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a laser processing method for performing hole drilling using a laser beam.

(Prior art) Generally, when drilling with a laser beam, a condensing lens is provided in the optical path of the laser beam emitted from a laser oscillator, and a condensed spot is irradiated onto the workpiece. This is done by scanning a spot in a predetermined shape on the workpiece. In the case of a workpiece that has been cut into shape, it is transported by free fall, and in the case of a workpiece that has been cut into a shape with only a portion remaining, it is removed into a predetermined shape in the next step.

(Problem to be Solved by the Invention) However, in the conventional laser processing method described above, when cutting a complicated shape, such as box-shaped cutting, the workpiece that has been cut into the shape gets caught in the hole, and the cut workpiece and the workpiece There were many cases where it was difficult to sort the workpieces to be cut, resulting in small drips during the cutting process, which had a negative impact on productivity.

Therefore, when the shape-cut workpiece is not needed, the present invention eliminates the step of sorting the cut workpiece and the cut workpiece by cutting the workpiece into a powder shape in advance, The purpose is to provide a laser processing method that improves productivity.

[Configuration of the Invention (Means for Solving the Problems and Their Effects) Therefore, in order to achieve the above object, the present invention involves cutting and removing a part of the workpiece by irradiating a laser beam from a processing head. In the laser processing method, a through hole is provided in advance or by piercing, and the diameter of the through hole is enlarged by scanning the laser beam along the side surface of the through hole to form a predetermined shape. A laser processing method for forming holes is provided.

(Example) An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 shows a processing state according to the present invention. Reference numeral 1 denotes a processing head in which a lens for condensing laser light is housed. 2 indicates a workpiece, and 3 indicates a machined hole. 5 is the laser focus point; 4
is the dross generated by laser processing.

Next, the machining situation will be explained with reference to FIGS. 2, 3, and 4. 6 is a through hole that is first drilled as a piercing hole. Next, after positioning the focal point of the laser beam on the edge of the piercing hole 6 at an appropriate position, the laser beam is focused along the edge as shown in FIG.
The processing point 7 is moved in the direction of arrow A, and the hole is enlarged while the workpiece 2 is turned into dross, that is, powdered, in the same manner as laser cutting, until the desired shape is obtained. As shown, a hole 8 having a predetermined shape is formed.

Note that the processing according to the present invention is the piercing hole 6 of the above embodiment.
Needless to say, the present invention can also be applied to cases in which machining is continued from a pre-processed hole, for example, after pressing, rather than starting from scratch.

[Effects of the Invention] As described above, according to the present invention, there is no need to separate the workpiece to be cut and the workpiece to be cut, so this step is no longer necessary, and the productivity of laser processing can be improved. .

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram showing one embodiment of the present invention, and FIGS. 2 to 4 are diagrams showing through holes formed according to one embodiment of the present invention. 1... Processing head, 2... Workpiece. 3.8... Machining hole, 6... Piercing hole agent Patent attorney Nori Chika Ken Yu Doichi Ken Maru Figure 1

Claims (1)

[Claims] 1. In a laser processing method in which a part of a workpiece is cut and removed by irradiating a laser beam from a processing head, a through hole is provided by piercing, and the A laser processing method characterized in that the diameter of the through hole is expanded by scanning a laser beam to form a hole of a predetermined shape. 2. In a laser processing method in which a part of the workpiece is cut and removed by irradiating a laser beam from a processing head, the through hole is A laser processing method characterized by expanding the diameter of a hole to form a hole of a predetermined shape.