JPH02295688A - Laser beam machining method for film coating material and laser beam machining head used for the method - Google Patents

Abstract

PURPOSE:To simultaneously carry out melting of a film and cutting of base metal by melting and evaporating the film by a laser beam condensed by a flat part of a condenser lens and cutting the base metal by the laser beam condensed by a convex part of the condenser lens. CONSTITUTION:The laser beam LB is condensed by the condenser lens 13. Vinyl W is molten and evaporated by irradiating film coating material W with the laser beam LB condensed by the flat part 13A of the condenser lens. At the same time, the base metal W is cut by the laser beam LB condensed by the convex part 13B of the condenser lens 13. Further, the melting width of the vinyl W is made larger than the cutting width of the base metal W. By this method, since melting and cutting is carried out at the same time, laser beam machining is performed in a short time and since the film is not turned over and machining is performed stably, the external appearance is not soiled and at the time of piercing, machining can be performed without causing a balloon.

Description

[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to a method for laser processing a film coating material such as a vinyl coating material, and a laser beam used in the method. Regarding processing heads.

(Prior Art) Conventionally, vinyl coating materials, for example, have been known as film coating materials in which a film made of resin or the like is laminated onto the surface of a base material such as stainless steel.

The laser processing method of laser processing this vinyl coating material with a laser processing machine is to defocus the laser beam focused by a condensing lens, first melt only the vinyl, and then focus the condensing lens on the base material. There are two known methods: cutting the vinyl coating material, and melting the vinyl and cutting the base material at the same time by irradiating the vinyl coating material with a laser beam.

(Problem to be Solved by the Invention) By the way, among the above-mentioned conventional techniques, in the former method,
The problem is that the laser processing time is about twice as long as the normal laser time because the focus of the condensing lens is defocused to first melt the vinyl and then the focus is adjusted to cut the base material. was there.

In addition, in the latter method, laser gas enters between the vinyl and the base material, which causes the vinyl to turn over, resulting in unstable processing and a clean appearance.Furthermore, the vinyl becomes a balloon when pierced.

The purpose of this invention is to perform laser processing on film coating materials without causing the film to turn over, making the processing stable, preventing the appearance from becoming dirty, preventing balloons from forming during piercing, and allowing rough laser processing to be performed in a shorter time than in the past. An object of the present invention is to provide a method of laser processing a film coating material and a laser processing head used in the method.

[Structure of the Invention] (Means for Solving the Problems) In order to achieve the above object, the present invention provides a method for using a condenser lens when performing laser cutting by irradiating a laser beam onto a film coating material in a laser processing device. This is a laser processing method for film coating materials in which the film is melted and evaporated by a laser beam focused on a flat part, and the base material is cut by a laser beam focused on a convex part of a condensing lens.

Further, the present invention provides a laser processing head for condensing a laser beam with a condensing lens and irradiating the condensed laser beam onto a film coating material to perform laser processing, wherein the condensing lens The laser processing head was formed by a flat part that melts and evaporates the film, and a convex part that cuts the base material with a laser beam.

<<Operation>> By employing the laser processing method for film coating materials of the present invention, when laser processing is performed on the film coating material with a laser beam, the laser beam focused by the flat part of the condenser lens will cause the film coating material to be processed by the laser beam. The film is melted and evaporated, and the base material of the film coating material is cut by the laser beam focused by the convex portion of the condenser lens.

In addition, by using the laser processing head of this invention, the flat part of the condenser lens melts and evaporates the film of the film coating material, and the convex part of the condenser lens melts and evaporates the base material of the film coating material. Cutting is done at the same time.

As a result, the laser processing can be performed in a shorter time than in the past, and the processing can be performed stably without turning over the film, so that the appearance does not get dirty. In addition, the piercing process is performed without creating a balloon.

In addition, since the condensing lens is made up of a flat part and a convex part, the intensity distribution of the laser beam can be divided into strong and weak parts, allowing the melting of the film and the cutting of the base material to occur almost simultaneously. .

(Example) Hereinafter, an example of the present invention will be described in detail based on the drawings.

Referring to FIG. 3, the laser processing device 1 guides, for example, a vinyl coating material W as a film coating material onto a fixed XY table 3 laid horizontally,
This vinyl coating material W is thermally cut with a laser beam LB.

The laser beam LB is oscillated by a laser oscillation device 5 provided in the main body of the laser processing apparatus 1, and guided to the laser processing head 11 via an intensity adjustment device 7 and a pend mirror 9. A condensing lens 13 is installed inside the laser processing head 11.
is provided, the laser beam LB is condensed by this condensing lens 13, and a vinyl coating is applied at the focal position. The material W is thermally cut.

Further, the vinyl coating material W is gripped by a clamp 15 and moved horizontally on the XY table 3 so that the position to be cut is directly below the laser processing head 11.

The clamp 15 is configured to be driven in the plane X and Y axis directions by XY axis servo motors while gripping the vinyl coating material W. The laser processing head 11 is Z
It is designed to be driven vertically by a servo motor for the shaft. Further, the laser processing device 1 is equipped with an NC@ station 17, and the operation section of this NG device 17 is equipped with a so-called manual pulse generator 19.

With the above configuration, the laser beam LB oscillated by the laser oscillator 5 passes through the intensity adjustment device 7 , is bent by the pendulum mirror 9 , and is further focused by the condensing lens 13 . The laser beam 1B focused by the condensing lens 13 is irradiated toward the vinyl coating material W, and the clamp 15
The vinyl coating material W clamped to X. The vinyl coating material W is thermally cut at a desired position by moving and positioning it in the Y-axis direction under control by the NG device 17.

As shown in FIG. 1, the condenser lens 13 is composed of a flat central portion 13A and a convex portion 13B that is an outer peripheral portion of the central portion. In addition, the film coating material W includes a base material W1 such as stainless steel,
It is formed of, for example, vinyl W2 as a film made of resin laminated on this base material W1.

With the above configuration, the laser beam LB bent by the pend mirror 9 is condensed by the condenser lens 13. The film coating material W is irradiated with the laser beam LB focused by the flat portion 13A of the condensing lens 13, thereby melting and vaporizing the vinyl W2. At the same time, the base material W1 is cut by the laser beam 1B focused by the convex portion 13B of the condenser lens 13. Note that the melting width of the vinyl W2 is larger than the cutting width of the base material W1.

Therefore, since the vinyl W2 is melted and the base material W1 is cut at the same time, the film coating material W can be laser processed in a shorter time than in the past. Furthermore, since the vinyl W2 is stably processed without turning over during laser processing, the appearance is not contaminated, and furthermore, the processing can be performed without causing balloons during piercing.

As shown in FIG. 2, the condensing lens 13 is composed of a convex portion 13B at the center and a flat portion 13A at the outer periphery of the center. That is, the configuration is opposite to that shown in FIG. 1 described above.

With the above configuration, the flat portion 13 of the condenser lens 13
At A, the vinyl W2 is melted and evaporated, and at the same time, the base material W is cut at the convex portion 13B of the condenser lens 13.

Therefore, the effect is almost the same as that of the embodiment described above.

Note that this invention is not limited to the embodiments described above, and can be implemented in other forms by making appropriate changes. In this embodiment, a vinyl coating material is used as an example of the film coating material, but any other film may be used.

[Effects of the Invention] As understood from the above description of the embodiments, according to the present invention, the film of the film coating material is melted and evaporated by the laser beam focused on the flat part of the condenser lens. At the same time, the base material of the film coating material is cut by the laser beam focused by the convex portion of the condenser lens.

Thus, laser processing of the film coating material can be performed in a shorter time than in the past. Furthermore, since the processing is performed stably without the film turning over, the appearance does not get dirty, and furthermore, the processing can be performed without causing balloons during piercing.

Since the condensing lens of the laser processing head is formed of a flat part and a convex part, the intensity distribution of the laser beam can be divided into strong and weak parts, which can melt the film of the film coating material and cut the base material. It can be done almost simultaneously.

[Brief explanation of drawings]

Figure 1 shows the main part of the invention, and is an explanatory diagram showing the configuration of the condenser lens and the state in which the film coating material is irradiated with the laser beam focused by the condenser lens, and Figure 2 is similar to Figure 1. Another explanatory diagram, FIG. 3, is a side view of a laser processing apparatus according to an embodiment of the present invention. 1... Laser processing device 13... Condensing lens 13
A...Flat part 13B...Convex part W...
Vinyl coating material W+...Base material W2...Vinyl L
B...Laser beam

Claims (2)

[Claims] (1) When performing laser cutting by irradiating a laser beam onto a film coating material using a laser processing device, the laser beam focused on the flat part of the condenser lens melts and evaporates the film, and at the same time A method for laser processing film coating materials, characterized by cutting a base material with a laser beam focused on a convex portion. (2) A laser processing head that focuses a laser beam with a condensing lens and irradiates a film coating material with the focused laser beam to perform laser processing, and the condensing lens melts the film with the laser beam. A laser processing head is characterized in that it is formed of a flat part that is evaporated by the laser beam, and a convex part that cuts the base material with a laser beam.