JPS63299881A - Condensing apparatus for laser beam - Google Patents

Condensing apparatus for laser beam

Info

Publication number
JPS63299881A
JPS63299881A JP62136314A JP13631487A JPS63299881A JP S63299881 A JPS63299881 A JP S63299881A JP 62136314 A JP62136314 A JP 62136314A JP 13631487 A JP13631487 A JP 13631487A JP S63299881 A JPS63299881 A JP S63299881A
Authority
JP
Japan
Prior art keywords
laser beam
lens
divided
machining
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62136314A
Other languages
Japanese (ja)
Inventor
Seiichi Katsuragi
葛城 誠一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP62136314A priority Critical patent/JPS63299881A/en
Publication of JPS63299881A publication Critical patent/JPS63299881A/en
Pending legal-status Critical Current

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  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To improve the efficiency of laser beam machining and to obtain a smoother machined surface by dividing a condensing lens into a plurality of pieces and setting different focal lengths peculiar to them. CONSTITUTION:The condenser lens 5 of laser beam is divided into a plurality of lenses 5a-5c, etc., and their focal lengths are set so that they are longer and longer from the lens 5a to the lens 5c. The laser beam 1 enters the divided condenser lenses and is condensed respectively into 5a, 5b and 5c. In this case, when a material 3 to be worked is moved from right to left, first the surface of the material 3 to be worked 3 is cut at the focal position 4a. Then, it is cut in sequence at focal lengths 4b, 4c and machining is finished at a focal position 4c. Since each simple lens 5a-5c takes charge of its own machining section, the efficiency of laser beam machining is improved to obtain smooth machined surfaces.

Description

【発明の詳細な説明】 [発明の目的] (産業上の利用分野) この発明は、レーザ加工装置に使用して好適なレーザ光
集光装置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a laser beam focusing device suitable for use in a laser processing device.

(従来の技術) 一般にレーザ加工装置においては、レーザ発振器より伝
送されたレーザ光を、レンズホルダーに保持された集光
レンズで集光して被加工物に照射し、加工を行なってい
るが、上記レンズホルダーと集光レンズによりレーザ光
集光装置が構成されている。
(Prior Art) Generally, in a laser processing device, a laser beam transmitted from a laser oscillator is focused by a condensing lens held in a lens holder and irradiated onto the workpiece to perform processing. A laser beam focusing device is configured by the lens holder and the focusing lens.

従来、この種のレーザ光集光装置は、第2図に示すよう
に構成され、図示しないレーザ発振器と被加工物3との
間に設けられている。そして動作時には、レーザ発振器
より伝送されたレーザ光1は、レンズホルダー(図示せ
ず)に保持された集光レンズ2にて被加工物3上の焦点
位It4に集光され、被加工物3を切断したり、溶接し
たりする。
Conventionally, this type of laser beam focusing device is configured as shown in FIG. 2, and is provided between a laser oscillator (not shown) and a workpiece 3. During operation, the laser beam 1 transmitted from the laser oscillator is focused at a focal point It4 on the workpiece 3 by a condenser lens 2 held in a lens holder (not shown), and cutting or welding.

(発明が解決しようとする問題点) 上記のような従来のレーザ光集光装置では、集光レンズ
2が1つであり、レーザ光の集光位置も1つである。そ
のため、厚い被加工物3を切断する際、大出力のレーザ
光が必要となり、加工効率が悪い。更に、その切断面が
ギザギザになったり、切断幅が被加工物3の表と裏で異
なったりする。
(Problems to be Solved by the Invention) In the conventional laser beam focusing device as described above, there is one focusing lens 2, and there is also one focusing position of the laser beam. Therefore, when cutting the thick workpiece 3, a high-output laser beam is required, resulting in poor processing efficiency. Furthermore, the cut surface may be jagged or the cutting width may be different between the front and back sides of the workpiece 3.

この発明は、厚い被加工物を切断する場合に、加工効率
を著しく向上させたレーザ光集光装置を提供することを
目的とする。
SUMMARY OF THE INVENTION An object of the present invention is to provide a laser beam focusing device that significantly improves processing efficiency when cutting a thick workpiece.

[発明の構成コ (問題点を解決するための手段) この発明は、レーザ発振器より伝送されたレーザ光を集
光する集光レンズと、この集光レンズを保持するレンズ
ホルダーとを具備するレーザ光集光装置において、上記
集光レンズは2つ以上に分割され、且つそれぞれの焦点
距離が異なっていることを特徴とするレーザ光集光装置
である。
[Configuration of the Invention (Means for Solving the Problems) The present invention provides a laser that includes a condensing lens that condenses laser light transmitted from a laser oscillator, and a lens holder that holds this condensing lens. The laser beam concentrating device is characterized in that the condensing lens is divided into two or more parts, each of which has a different focal length.

(作用) この発明によれば、厚い被加工物を切断する場合に、加
工効率が著しく向上し、更に加工面の形状を滑らかにす
ることが出来る。
(Function) According to the present invention, when cutting a thick workpiece, the processing efficiency is significantly improved and the shape of the processed surface can be made smoother.

(実施例) 以下、図面を参照して、この発明の一実施例を詳細に説
明する。
(Example) Hereinafter, an example of the present invention will be described in detail with reference to the drawings.

この発明によるレーザ光集光装置は、第1図に示すよう
に構成され、従来例(第2図)と同一箇所は同一符号を
付すことにする。
The laser beam focusing device according to the present invention is constructed as shown in FIG. 1, and the same parts as in the conventional example (FIG. 2) are given the same reference numerals.

即ち、レーザ光集光装置は、レーザ光加工装置における
レーザ発振器(図示せず)と被加工物3との間に設けら
れており、集光レンズ5が図示しないレンズホルダーに
保持されてなっている。
That is, the laser beam focusing device is provided between a laser oscillator (not shown) in the laser beam processing device and the workpiece 3, and a focusing lens 5 is held by a lens holder (not shown). There is.

この場合、集光レンズ5は2つ以上に分割され、且つそ
れぞれの焦点距離が異なっている。この実施例では、例
えば3個のレンズ単体5a、5b。
In this case, the condenser lens 5 is divided into two or more parts, each having a different focal length. In this embodiment, for example, there are three single lenses 5a and 5b.

5Cに分割されている。そして、各レンズ単体5a、5
b、5cの焦点位置が夫々4a、4b、4Cの位置にあ
り、順々に焦点距離が長くなっている。
It is divided into 5C. Then, each lens unit 5a, 5
The focal positions of lenses b and 5c are located at positions 4a, 4b, and 4C, respectively, and the focal lengths become longer in order.

さて動作時には、レーザ発振器から伝送されてきたレー
ザ光1は、分割された集光レンズ5により、4a14b
、4cに集光される。そして、被加工物3が第1図で右
から左へ移動すると、先ず焦点位@4aで被加工物3の
表面が切断される。
Now, during operation, the laser beam 1 transmitted from the laser oscillator is divided into 4a14b by the divided condenser lens 5.
, 4c. When the workpiece 3 moves from right to left in FIG. 1, the surface of the workpiece 3 is first cut at the focal point @4a.

次に、焦点位置4bで被加工物3の表面が中程が切断さ
れ、最後に焦点位[4Cで被加工物3の表面の裏側が切
断される。
Next, the middle of the surface of the workpiece 3 is cut at the focal point 4b, and finally the back side of the front surface of the workpiece 3 is cut at the focal point [4C].

(変形例) 上記実施例では、集光レンズ5を3分割した場合を例に
とって説明したが、2分割以上であれば、同様な効果が
得られることは言うまでもない。
(Modification) In the above embodiment, the case where the condensing lens 5 is divided into three parts has been explained as an example, but it goes without saying that similar effects can be obtained if the condensing lens 5 is divided into two parts or more.

[発明の効果] この発明によれば、集光レンズ5は2つ以上に分割され
、且つそれぞれの焦点距離が異なっているので、被加工
物3を切断する場合、夫々の焦点位置で加工する部分を
分担して切断している。その結果、加工効率が著しく向
上する。又、加工面(切断面)の形状も滑らかにするこ
とが出来る。
[Effects of the Invention] According to the present invention, the condenser lens 5 is divided into two or more parts, each having a different focal length, so when cutting the workpiece 3, processing is performed at each focal position. The parts are divided and cut. As a result, processing efficiency is significantly improved. Moreover, the shape of the processed surface (cut surface) can also be made smooth.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの発明の一実施例に係るレーザ光集光装置を
示す構成図、第2図は従来のレーザ光集光装置を示す構
成図である。 1・・・レーザ光、3・・・被加工物、5・・・集光レ
ンズ。 出願人代理人 弁理士 鈴江武彦 第1図 第2図
FIG. 1 is a block diagram showing a laser beam condensing device according to an embodiment of the present invention, and FIG. 2 is a block diagram showing a conventional laser beam concentrating device. 1... Laser light, 3... Workpiece, 5... Condensing lens. Applicant's agent Patent attorney Takehiko Suzue Figure 1 Figure 2

Claims (1)

【特許請求の範囲】 レーザ発振器より伝送されたレーザ光を集光する集光レ
ンズと、この集光レンズを保持するレンズホルダーとを
具備するレーザ光集光装置において、 上記集光レンズは2つ以上に分割され、且つそれぞれの
焦点距離が異なっていることを特徴とするレーザ光集光
装置。
[Scope of Claims] A laser beam focusing device comprising a focusing lens that focuses laser light transmitted from a laser oscillator and a lens holder that holds this focusing lens, wherein the focusing lens includes two focusing lenses. 1. A laser beam condensing device characterized by being divided into the above parts and each having a different focal length.
JP62136314A 1987-05-30 1987-05-30 Condensing apparatus for laser beam Pending JPS63299881A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62136314A JPS63299881A (en) 1987-05-30 1987-05-30 Condensing apparatus for laser beam

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62136314A JPS63299881A (en) 1987-05-30 1987-05-30 Condensing apparatus for laser beam

Publications (1)

Publication Number Publication Date
JPS63299881A true JPS63299881A (en) 1988-12-07

Family

ID=15172308

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62136314A Pending JPS63299881A (en) 1987-05-30 1987-05-30 Condensing apparatus for laser beam

Country Status (1)

Country Link
JP (1) JPS63299881A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04344882A (en) * 1991-05-22 1992-12-01 Matsushita Electric Works Ltd Method for cutting with laser beam
US6175096B1 (en) * 1996-09-30 2001-01-16 Force Instituttet Method of processing a material by means of a laser beam
CN101804505A (en) * 2010-03-31 2010-08-18 苏州市博海激光科技有限公司 Swinging-focal spot roller surface laser texturing method and device
CN101804506A (en) * 2010-03-31 2010-08-18 苏州市博海激光科技有限公司 Swinging-focal spot laser roller surface texturing method and device
WO2017115974A1 (en) * 2015-12-28 2017-07-06 (주)이오테크닉스 Lens optical system and laser processing apparatus comprising same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04344882A (en) * 1991-05-22 1992-12-01 Matsushita Electric Works Ltd Method for cutting with laser beam
US6175096B1 (en) * 1996-09-30 2001-01-16 Force Instituttet Method of processing a material by means of a laser beam
CN101804505A (en) * 2010-03-31 2010-08-18 苏州市博海激光科技有限公司 Swinging-focal spot roller surface laser texturing method and device
CN101804506A (en) * 2010-03-31 2010-08-18 苏州市博海激光科技有限公司 Swinging-focal spot laser roller surface texturing method and device
WO2017115974A1 (en) * 2015-12-28 2017-07-06 (주)이오테크닉스 Lens optical system and laser processing apparatus comprising same

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