JPH02284782A - Method for converging laser beams having different wavelengths - Google Patents

Method for converging laser beams having different wavelengths

Info

Publication number
JPH02284782A
JPH02284782A JP1105743A JP10574389A JPH02284782A JP H02284782 A JPH02284782 A JP H02284782A JP 1105743 A JP1105743 A JP 1105743A JP 10574389 A JP10574389 A JP 10574389A JP H02284782 A JPH02284782 A JP H02284782A
Authority
JP
Japan
Prior art keywords
laser
laser beam
axis
incident
lasers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1105743A
Other languages
Japanese (ja)
Inventor
Shozo Asano
浅野 省三
Yoshiaki Kuroda
黒田 芳明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Komatsu Ltd
Original Assignee
Komatsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Komatsu Ltd filed Critical Komatsu Ltd
Priority to JP1105743A priority Critical patent/JPH02284782A/en
Publication of JPH02284782A publication Critical patent/JPH02284782A/en
Pending legal-status Critical Current

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  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To improve machining characteristic by making a laser beam among plural laser beams having different wavelengths incident on a condense lens while having hollow state intensity distribution and making the other laser beam incident on the condense lens through the hollow part thereof and converging and irradiating these on the same optical axis. CONSTITUTION:The axis of a first laser beam 1 is arranged on an axis at the incident side of the condense lens 3 and the axis of a second laser beam 2 having different wavelength is arranged in a crossing direction to the axis at the incident side of the condense lens 3. The first laser beam 1 is made incident on the condense lens 3 as the laser beam having the hollow intensity distribution with a conical outer face mirror 4 and a conical inner face mirrors 5. The second laser beam 2 is made incident on the axis of the condense lens 3 from the side part with a bending mirror 6 positioned at the hollow part of the first laser beam. Both laser beams made incident on the condense lens 3, are converged to the same machining spot 8 on a work 7. By this method, the same spot on the work at the same time can be irradiated with the laser beams having different characteristics and the machining speed and the machining depth can be improved.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、レーザ加工において、波長の異なるレーザを
同一スポットに集光照射する方法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method of condensing laser beams of different wavelengths onto the same spot in laser processing.

〔従来の技術〕[Conventional technology]

波長の異なるレーザを同一光軸上に集光するための従来
の方法としては、第6図に示すように、ベンディングミ
ラーaにて反射した第2レーザCと、第2レーザCとを
ダイクロイックミラdにて同軸上に合流し、これを集光
レンズeを経てワークfに照射するようになっている。
As shown in FIG. 6, a conventional method for focusing lasers with different wavelengths on the same optical axis is to combine the second laser C reflected by the bending mirror a and the second laser C with a dichroic mirror. The light converges coaxially at point d, and the workpiece f is irradiated with this light through a condenser lens e.

また上記方法のほかに、特公昭80−33595号公報
に示された方法、すなわち、複数台の発振器から発振さ
れるパルスレーザビームを光路切換えにより交互にワー
クに導くようにした方法もある。
In addition to the above method, there is also a method disclosed in Japanese Patent Publication No. 80-33595, in which pulsed laser beams emitted from a plurality of oscillators are alternately guided to a workpiece by switching optical paths.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上記第6図で示された方法では、第2レーザ2と第2レ
ーザCの波長が異なると、集光レンズeで集光したとき
に、それぞれのレーザb。
In the method shown in FIG. 6 above, if the wavelengths of the second laser 2 and the second laser C are different, when the light is focused by the condensing lens e, the respective lasers b.

Cの焦点が異なり、レーザ加工特性が劣化するという欠
点がある。また同・−時に両レーザb。
The disadvantage is that the focus of C is different and the laser processing characteristics are deteriorated. Also, at the same time, both lasers b.

Cを照射すると、ダイクロイックミラーdとワークfの
間で両レーザb、cが同じ空間を通るため、レーザ同志
の干渉が起り、位相性がくずれるなどレーザ加工にとっ
てははなはだ好ましくないこととなり、事実上加工はう
まく行なえない。
When C is irradiated, both lasers B and C pass through the same space between the dichroic mirror d and the workpiece F, which causes interference between the lasers and destroys the phase, which is extremely unfavorable for laser processing. Processing cannot be performed properly.

また特公昭60−33595号公報に記載された方法で
は、2種のレーザを同時にワークに照射することはでき
ない。
Further, in the method described in Japanese Patent Publication No. 60-33595, it is not possible to irradiate a workpiece with two types of lasers at the same time.

レーザ加工においては、被加工物の種類、使用するレー
ザのちがいにより、その加工特性が大きく異なり、そこ
で異種のレーザを組合わせることにより、加工対象の拡
大、加工精度、加工速度の向上を図ることが考えられ、
従って異種の1ノーザを同一光軸上へ集光照射する方法
が望まれている。
In laser processing, the processing characteristics vary greatly depending on the type of workpiece and the laser used. Therefore, by combining different types of lasers, it is possible to expand the processing target and improve processing accuracy and processing speed. is considered,
Therefore, a method of condensing and irradiating different types of lasers onto the same optical axis is desired.

本発明は上記のことにかんがみなされたもので、レーザ
同志の干渉が小さく、レーザビームの特性を劣化させず
、また、波長のちがいによる焦点のちがいを防ぐことが
でき、これにより、特性の異なるレーザを同時にワーク
の同一スポットに照射することができる。種々材料の加
工特性を大幅に向上することができる波長の異なるレー
ザの集光方法を提供することを目的とするものである。
The present invention has been developed in consideration of the above-mentioned problems, and it is possible to reduce interference between laser beams, prevent deterioration of the characteristics of the laser beam, and prevent differences in focus due to differences in wavelength. Lasers can be irradiated to the same spot on the workpiece at the same time. The object of the present invention is to provide a method of focusing lasers with different wavelengths, which can significantly improve the processing characteristics of various materials.

〔課題を解決するための手段〕[Means to solve the problem]

上記目的を達成するために、本発明に係る波長の異なる
レーザの集光方法は、波長の異なるレーザのうちの1つ
のレーザを、中空状の強度分布をもたせて集光レンズに
入射し、また他のレーザを、上記中空状の強度分布をも
ったレーザの中空部を通して集光レンズに入射し、各レ
ーザを集光レンズにて同一光軸上に集光照射する。
In order to achieve the above object, the method of condensing lasers with different wavelengths according to the present invention includes making one of the lasers with different wavelengths incident on a condensing lens with a hollow intensity distribution, and The other lasers are incident on the condenser lens through the hollow part of the laser having the hollow intensity distribution, and each laser beam is condensed and irradiated onto the same optical axis by the condenser lens.

上記中空部を通るレーザの集光レンズでの焦点距離を、
このレーザの径路内に介装(7た焦点補正用レンズにて
捕正し、中空部を通るレーザの焦点を任意の同一軸上に
集光できるようにした。
The focal length of the laser passing through the hollow part at the condensing lens is
This laser was captured by a focus correction lens interposed in its path, so that the focus of the laser passing through the hollow part could be focused on the same arbitrary axis.

中空状の強度分布を有する1つのレーザを中央部に穴を
有する穴あき放物面鏡で集光し、穴あき放物面鏡の穴に
他のレーザを通して上記レーザと同一光軸上に集光照射
する。
One laser with a hollow intensity distribution is focused by a parabolic mirror with a hole in the center, and another laser is passed through the hole in the parabolic mirror and focused on the same optical axis as the above laser. Irradiate light.

上記穴あき放物面鏡の穴を通るレーザを穴あき放物面鏡
の手前側で集光レンズにて集光して穴あき放物面鏡にて
集光されたレーザと同一光軸上に集光照射する。
The laser that passes through the hole of the parabolic mirror with a hole is focused by a condensing lens on the front side of the parabolic mirror with a hole, and is on the same optical axis as the laser focused by the parabolic mirror with a hole. irradiate with focused light.

〔作  用〕[For production]

波長の異なったレーザは異なった径路を通ってワークの
同一スポットに集光照射される。
Lasers with different wavelengths pass through different paths and are focused and irradiated onto the same spot on the workpiece.

集光レンズを通って集光される波長の異なるレーザのう
ち、集光レンズの中央部に入射される方のレーザの焦点
距離が焦点補正用レンズにて補正される。
Among the lasers of different wavelengths that are focused through the condenser lens, the focal length of the laser that is incident on the central portion of the condenser lens is corrected by the focus correction lens.

〔実 施 例〕〔Example〕

本発明の実施態様を第1図から第5図に基づいて説明す
る。
Embodiments of the present invention will be described based on FIGS. 1 to 5.

第1図は本発明の第1の実施態様を示すもので、波長の
異なる第ル−ザ1と第2レーザの一方、例えば第ル−ザ
1の軸心を集光レンズ3の入射側の軸心上に配置し、第
2レーザ2の軸心を集光レンズ3の入射側の軸心と交差
する方向に配置する。
FIG. 1 shows a first embodiment of the present invention, in which one of the laser 1 and the second laser having different wavelengths, for example, the axis of the laser 1 is located on the incident side of the condenser lens 3. The second laser 2 is arranged on the axis, and the axis of the second laser 2 is arranged in a direction intersecting the axis of the condenser lens 3 on the incident side.

そして第ル−ザ1を円錐外面ミラー4と、円錐内面ミラ
ー5にて中空強度分布を有するレーザビームとして集光
レンズ3に入射する。
The laser beam 1 enters the condenser lens 3 as a laser beam having a hollow intensity distribution through a conical outer mirror 4 and a conical inner mirror 5.

一方策2レーザ2は上記中空強度分布を何する第1のレ
ーザビームの中空部に位置するベンディングミラー6に
て側方から導入して集光レンズ3の軸心に入射する。
On the other hand, the second laser beam is introduced from the side at the bending mirror 6 located in the hollow part of the first laser beam having the above-mentioned hollow intensity distribution, and is incident on the axis of the condenser lens 3.

集光レンズ3に入射された両レーザビームはワーク7の
同一の加ニスボット8に集光される。
Both laser beams incident on the condensing lens 3 are condensed onto the same slit 8 of the workpiece 7 .

このとき上記第2レーザ2はベンディングミラー6の手
前に位置する焦点補正用レンズ3aを通り、これにより
、第ル−ザ1との波長のちがいによる焦点のちがいが補
正される。
At this time, the second laser 2 passes through a focus correction lens 3a located in front of the bending mirror 6, and thereby the difference in focus due to the difference in wavelength with the first laser 1 is corrected.

第2図は本発明の第2の実施態様を示すもので、第1の
レーザ1aに不安定型レーザ共振器を用いて、中空強度
分布をもつレーザビームとし、これを集光レンズ3に入
射する。
FIG. 2 shows a second embodiment of the present invention, in which an unstable laser resonator is used for the first laser 1a to form a laser beam with a hollow intensity distribution, and this is made incident on the condenser lens 3. .

第2レーザ2は上記第1の実施態様と同様に焦点補正用
レンズ3 a %ベンディングミラー6を介して第2レ
ーザ2の中空部を通って集光レンズ3の軸心に入射され
、両レーザ1,2は集光レンズ3にて同一加工スポット
8に集光される。
The second laser 2 is incident on the axis of the condensing lens 3 through the hollow part of the second laser 2 via the focus correction lens 3a and the bending mirror 6, as in the first embodiment, and both lasers 1 and 2 are focused on the same processing spot 8 by a condensing lens 3.

第3図は本発明の第3の実施態様を示すもので、集光レ
ンズ3の入射軸心上に傾斜して配置するミラー9に、ダ
イクロイックミラーを用い、第1ビーム1bをそのまま
透過して集光レンズ3に入射し、第2ビーム2を反射し
て集光レンズ3に入射する。このとき、第1ビーム1b
はミラー9の軸方向投影面積より大きく、集光レンズ3
の有効面積より小さい強度分布を有するものが用いられ
る。
FIG. 3 shows a third embodiment of the present invention, in which a dichroic mirror is used as the mirror 9 arranged obliquely on the incident axis of the condenser lens 3, and the first beam 1b is transmitted as it is. The second beam 2 is reflected and enters the condenser lens 3 . At this time, the first beam 1b
is larger than the axial projected area of the mirror 9, and the condenser lens 3
A device with an intensity distribution smaller than the effective area of is used.

第4図は本発明の第4の実施態様を示すもので、第2レ
ーザ2aを中空状に成形し、この中空状の第2レーザ2
aを、軸心部に穴10を有する穴あき放物面鏡11で反
射及び集光してワーク7に集光照射する。
FIG. 4 shows a fourth embodiment of the present invention, in which the second laser 2a is formed into a hollow shape, and the hollow second laser 2a is formed into a hollow shape.
a is reflected and condensed by a perforated parabolic mirror 11 having a hole 10 at its axial center, and the workpiece 7 is irradiated with condensed light.

一方策ル−ザ1はベンディングミラー6にて上記穴あき
放物面鏡11の穴10に向くように反射してから、この
穴あき放物面鏡11の手前側で集光レンズ3にて集光し
て穴あき放物面#111の穴10を通し、上記第2レー
ザ2aと同一加工スポット8に集光照射する。
On the other hand, the router 1 is reflected by the bending mirror 6 toward the hole 10 of the parabolic mirror 11 with a hole, and then is reflected by the condenser lens 3 in front of the parabolic mirror 11 with a hole. The beam is condensed and passed through the hole 10 of the perforated paraboloid #111, and is condensed and irradiated onto the same processing spot 8 as the second laser 2a.

第5図は上記第4図で示した方法の応用例である第5の
実施態様を示すものであり、第ル−ザ1を光ファイバ1
2にて導き、ファイバ射出ユニット(コリメータ)13
にて穴あき放物面鏡11の穴10を通してワーク7へ集
光照射する。
FIG. 5 shows a fifth embodiment, which is an application example of the method shown in FIG.
2, the fiber injection unit (collimator) 13
At this point, the workpiece 7 is focused and irradiated through the hole 10 of the perforated parabolic mirror 11.

上記第4、第5の実施態様における第2レーザ2aは第
1、第2の実施態様の第ル−ザ1゜]aの場合と同様の
方法にて中空状に成形する。
The second laser 2a in the fourth and fifth embodiments is formed into a hollow shape in the same manner as the laser 1[deg.]a in the first and second embodiments.

〔発明の効果〕〔Effect of the invention〕

本発明によれば、波長の異なったレーザは異なった径路
を通ってワーク7の同一加工スポット8に集光照射され
る。
According to the present invention, lasers with different wavelengths are focused and irradiated onto the same processing spot 8 on the workpiece 7 through different paths.

従って波長の異なるレーザ同志の干渉が小さく、レーザ
ビームの特性を劣化させず、また波長のちがいによる焦
点のちがいを防ぐことができ、これにより、特性の異な
るレーザを同時にワークの同一スポットに照射すること
ができ、種々材料の加工特性、すなわち、加ニスピード
、加工深さを大幅に向上することができる。
Therefore, the interference between lasers with different wavelengths is small, the characteristics of the laser beam are not deteriorated, and the difference in focus due to the difference in wavelength can be prevented.This allows lasers with different characteristics to irradiate the same spot on the workpiece at the same time. It is possible to significantly improve the machining characteristics of various materials, ie, machining speed and machining depth.

従来ではレーザ加工が困難な材料の加工、例えば、A、
9やCu合金のレーザ加工において、エキシマ、YAG
レーザ、C02レーザでは吸収係数がちがい、CO2レ
ーザでは殆ど反射し、レーザ加工は非常に困難である。
Processing of materials that are difficult to laser process using conventional methods, such as A,
In laser processing of 9 and Cu alloys, excimer, YAG
Lasers and CO2 lasers have different absorption coefficients, and CO2 lasers mostly reflect, making laser processing very difficult.

またエキシマ、YAGレーザの吸収係数は比較的高いが
、出力が小さいため、0.1m■の板厚を越えるような
ものは困難が伴っていた。
Furthermore, although excimer and YAG lasers have relatively high absorption coefficients, their output is small, so it has been difficult to use them with a thickness exceeding 0.1 m.

これに対してエキシマと002レーザ、あるいはYAG
レーザとCO2レーザのような組合せでレーザを同時照
射、あるいは予熱にエキシマ、またはYAGレーザを、
本加工にCO2レーザを照射することにより、今まで困
難であった材料の加工が可能となった。
On the other hand, excimer and 002 laser, or YAG
Simultaneous laser irradiation with a combination such as laser and CO2 laser, or excimer or YAG laser for preheating.
By irradiating CO2 laser during the main processing, it has become possible to process materials that were previously difficult.

CO2レーザでのレーザ加工が困難な材料でも、エキシ
マ、YAGレーザの照射によりワークの温度が上昇する
と吸収係数が増大してCO2レーザでも効率よく吸収す
るようになる。
Even if the material is difficult to laser-process with a CO2 laser, when the temperature of the workpiece increases due to irradiation with an excimer or YAG laser, the absorption coefficient increases and the material can be efficiently absorbed even with a CO2 laser.

【図面の簡単な説明】[Brief explanation of drawings]

第1図、第2図、第3図、第4図、第5図は本発明のそ
れぞれ異なる実施態様例を示す概略的な説明図、第6図
は従来例を示す概略的な説明図である。 1、la、lb、2.2aはレーザ、3は集光レンズ、
3aは焦点補正用レンズ、41よn4[外面ミラー 5
は円錐内面ミラー 6ζよベンディングミラー 7はワ
ーク、8Cよ加エスポ・ント、10は穴、11は穴あき
放物面鏡、12(よ光ファイバ、13はファイノく射出
ユニ・ノド。 出願人  株式会社 小松製作j祈
1, 2, 3, 4, and 5 are schematic explanatory diagrams showing different embodiments of the present invention, and FIG. 6 is a schematic explanatory diagram showing a conventional example. be. 1, la, lb, 2.2a are lasers, 3 is a condensing lens,
3a is a focus correction lens, 41 and n4 [external mirror 5
is a conical inner mirror, 6ζ is a bending mirror, 7 is a workpiece, 8C is a bending mirror, 10 is a hole, 11 is a parabolic mirror with a hole, 12 is an optical fiber, and 13 is a fine injection unit. Company Komatsu Manufacturing J Inori

Claims (4)

【特許請求の範囲】[Claims] (1)波長の異なる複数のレーザのうちの一つのレーザ
を、中空状の強度分布をもたせて集光レンズに入射し、
また他のレーザを、上記中空状の強度分布をもったレー
ザの中空部を通して集光レンズに入射し、各レーザを集
光レンズにて同一光軸上に集光照射することを特徴とす
る波長の異なるレーザの集光方法。
(1) One laser out of a plurality of lasers with different wavelengths is incident on a condensing lens with a hollow intensity distribution,
Further, another laser beam is incident on a condensing lens through the hollow part of the laser having a hollow intensity distribution, and each laser beam is condensed and irradiated on the same optical axis by the condensing lens. different laser focusing methods.
(2)中空部を通るレーザの集光レンズでの焦点距離を
、このレーザの径路内に介装した焦点補正用レンズにて
補正し、中空部を通るレーザの焦点を任意の同軸上に集
光できるようにしたことを特徴とする請求項1記載の波
長の異なるレーザの集光方法。
(2) The focal length of the laser passing through the hollow part with the condensing lens is corrected by a focus correction lens inserted in the path of this laser, and the focus of the laser passing through the hollow part is focused on an arbitrary coaxial axis. 2. The method of focusing lasers of different wavelengths according to claim 1, wherein
(3)中空状の強度分布を有する1つのレーザを中央部
に穴を有する穴あき放物面鏡で集光し、穴あき放物面鏡
の穴に他のレーザを通して上記レーザと同一光軸上に集
光照射することを特徴とする波長の異なるレーザの集光
方法。
(3) One laser with a hollow intensity distribution is focused by a parabolic mirror with a hole in the center, and another laser is passed through the hole of the parabolic mirror with the same optical axis as the above laser. A method of condensing lasers with different wavelengths, which is characterized by condensing irradiation onto the top.
(4)穴あき放物面鏡の穴を通るレーザを穴あき放物面
鏡の手前側で集光レンズにて集光して穴あき放物面鏡に
て集光されたレーザと同一光軸上に集光することを特徴
とする請求項3記載の波長の異なるレーザの集光方法。
(4) The laser that passes through the hole in the parabolic mirror with a hole is focused by a condensing lens on the front side of the parabolic mirror with a hole, and the same light is the same as the laser focused by the parabolic mirror with a hole. 4. The method of focusing lasers of different wavelengths according to claim 3, wherein the focusing is carried out on an axis.
JP1105743A 1989-04-27 1989-04-27 Method for converging laser beams having different wavelengths Pending JPH02284782A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1105743A JPH02284782A (en) 1989-04-27 1989-04-27 Method for converging laser beams having different wavelengths

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1105743A JPH02284782A (en) 1989-04-27 1989-04-27 Method for converging laser beams having different wavelengths

Publications (1)

Publication Number Publication Date
JPH02284782A true JPH02284782A (en) 1990-11-22

Family

ID=14415743

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1105743A Pending JPH02284782A (en) 1989-04-27 1989-04-27 Method for converging laser beams having different wavelengths

Country Status (1)

Country Link
JP (1) JPH02284782A (en)

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JP2005313475A (en) * 2004-04-28 2005-11-10 Sumitomo Electric Ind Ltd Resin processing method and resin processing apparatus
US20100264123A1 (en) * 2005-04-13 2010-10-21 Applied Materials, Inc. Annealing apparatus using two wavelengths of continuous wave laser radiation
WO2012073931A1 (en) * 2010-11-30 2012-06-07 Towa株式会社 Laser processing apparatus
JP2012114294A (en) * 2010-11-25 2012-06-14 Gigaphoton Inc Extreme ultraviolet light generation device
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JPH0875947A (en) * 1994-07-06 1996-03-22 Mitsubishi Heavy Ind Ltd Method for coupling optical fibers and its coupling system
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US9839976B2 (en) 2005-04-13 2017-12-12 Applied Materials, Inc. Annealing apparatus using two wavelengths of radiation
US8242407B2 (en) * 2005-04-13 2012-08-14 Applied Materials, Inc. Annealing apparatus using two wavelengths of continuous wave laser radiation
US8653408B2 (en) 2005-04-13 2014-02-18 Applied Materials, Inc. Annealing apparatus using two wavelengths of continuous wave laser radiation
US8765618B2 (en) 2005-04-13 2014-07-01 Applied Materials, Inc. Annealing apparatus using two wavelengths of continuous wave laser radiation
US8890024B2 (en) 2005-04-13 2014-11-18 Applied Materials, Inc. Annealing apparatus using two wavelengths of continuous wave laser radiation
US8907247B2 (en) 2005-04-13 2014-12-09 Applied Materials, Inc. Annealing apparatus using two wavelengths of laser radiation
US20100264123A1 (en) * 2005-04-13 2010-10-21 Applied Materials, Inc. Annealing apparatus using two wavelengths of continuous wave laser radiation
US10857623B2 (en) 2005-04-13 2020-12-08 Applied Materials, Inc. Annealing apparatus using two wavelengths of radiation
US11945045B2 (en) 2005-04-13 2024-04-02 Applied Materials, Inc. Annealing apparatus using two wavelengths of radiation
JP2012114294A (en) * 2010-11-25 2012-06-14 Gigaphoton Inc Extreme ultraviolet light generation device
WO2012073931A1 (en) * 2010-11-30 2012-06-07 Towa株式会社 Laser processing apparatus
JP2012115854A (en) * 2010-11-30 2012-06-21 Towa Corp Laser processing apparatus
WO2023111364A1 (en) * 2021-12-15 2023-06-22 Asml Netherlands B.V. Optical system and method for a radiation source

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