CN102256739A - Cleaving device and cleaving method for manufacturing electronic components - Google Patents
Cleaving device and cleaving method for manufacturing electronic components Download PDFInfo
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- CN102256739A CN102256739A CN200980151217XA CN200980151217A CN102256739A CN 102256739 A CN102256739 A CN 102256739A CN 200980151217X A CN200980151217X A CN 200980151217XA CN 200980151217 A CN200980151217 A CN 200980151217A CN 102256739 A CN102256739 A CN 102256739A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 51
- 238000000034 method Methods 0.000 title claims abstract description 35
- 239000000758 substrate Substances 0.000 claims abstract description 242
- 238000007789 sealing Methods 0.000 claims abstract description 186
- 239000002184 metal Substances 0.000 claims abstract description 16
- 230000001678 irradiating effect Effects 0.000 claims abstract description 6
- 238000005520 cutting process Methods 0.000 claims description 65
- 239000000463 material Substances 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 8
- 230000005693 optoelectronics Effects 0.000 claims description 5
- 239000000835 fiber Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 abstract description 29
- 229920005989 resin Polymers 0.000 abstract description 29
- 239000000919 ceramic Substances 0.000 abstract description 19
- 238000005336 cracking Methods 0.000 abstract 1
- 230000035882 stress Effects 0.000 description 11
- 230000000694 effects Effects 0.000 description 7
- 238000004806 packaging method and process Methods 0.000 description 5
- 239000002390 adhesive tape Substances 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000009931 harmful effect Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000002040 relaxant effect Effects 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000005007 epoxy-phenolic resin Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
- B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laser Beam Processing (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The issue is to control the adhesion of dross and the occurrence of cracking and chipping of ceramic substrates when cleaving a sealed substrate containing a ceramic substrate or metal substrate with a laser. Disclosed is a cleaving method used when manufacturing multiple electronic components by forming a sealed substrate (1) by sealing chips (3) that have been variously mounted on multiple areas (7) disposed on a circuit board (2) in resin, and then cleaving the sealed substrate (1) along the boundary lines (6) of the multiple areas (7), which cleaving method comprises a step, in which the sealed substrate (1) is affixed to a table (9), and an irradiation step, in which first and second laser lights (12, 18) are irradiated from an irradiation head (10) toward the sealed substrate (1), while the irradiation head (10) and/or sealed substrate (1) are moved relative to one another. In the irradiation step, after perforation holes (17) are formed on the boundary lines (6) by irradiating the first laser light (12), the sealed substrate (1) is cleaved by irradiating the second laser light (18) onto the boundary lines (6).
Description
Technical field
Thereby the present invention relates to a kind ofly employedly when making a plurality of electronic unit by each zone cutting be used for cutter sweep and the cutting method that electronic unit is made by the substrate of finishing sealing that will have a plurality of zones.
Background technology
As one of mode of implementing in order to make a plurality of electronic units expeditiously all the time, following method is arranged.Promptly, use resin-sealed simultaneously with (hereinafter to be referred as " chips ") such as a plurality of shaped like chips capacitors, led chip and semiconductor chips that be installed on the circuit substrate, thereby form the substrate of having finished sealing, and by cutting the substrate that this has finished sealing, thereby carry out singualtion, to make a plurality of electronic units (for example, with reference to patent documentation 1).According to patent documentation 1, when the substrate of finishing sealing is cut, can use cast-cutting saw, or utilize laser cutting.In addition, each electronic unit that the substrate of finishing sealing is carried out obtaining after the singualtion often is called as packaging part.
Yet,, can use glass epoxy substrate as circuit substrate according to patent documentation 1; Can use epoxy resin, phenolic resin or silicones as being used for resin-sealed sealing resin.Hence one can see that, and circuit substrate and sealing resin are the materials of identical systems, also we can say by the resin system material to constitute.Therefore, even have in the cast-cutting saw of rotating blade and the laser under any one the situation, there is not to occur very big problem in use yet.
In recent years, as circuit substrate, except being the resin substrate of representative with the glass epoxy substrate, the substrate (hereinafter to be referred as " metal substrate ") of also bringing into use substrate (hereinafter to be referred as " ceramic substrate ") that base material is made of pottery and base material to constitute by metal.Because ceramic substrate and metal substrate have excellent heat dissipation characteristics, therefore, use in the optoelectronic component of LED, semiconductor laser etc. and power semiconductor etc.
But, the base material of ceramic substrate and metal substrate and sealing resin different in kind.Consequently, under the situation of using laser that the substrate of finishing sealing with ceramic substrate or metal substrate is cut according to the line of cut of supposing, produced following problem.
First problem is: the dregs that form owing to the fusing of the material of forming circuit substrate are easily attached on the packaging part, therefore, from the exterior quality this point, the yield rate reduction.Second problem is as the problem of circuit substrate when using ceramic substrate.That is, owing to the cause of the thermal shock that ceramic substrate is applied produces internal stress, particularly before cutting finishes on the line of cut, because the problem that slight crack or breach appear in ceramic substrate takes place internal stress.
Patent documentation 1:JP spy opens flat 09-036151 communique (the 3rd page, Fig. 2)
Summary of the invention
The technical task that the present invention will solve is: when utilizing laser that the substrate of finishing sealing that comprises the circuit substrate that is made of ceramic substrate or metal substrate is cut, prevent dregs attached on the substrate of finishing sealing, and prevent because slight crack or breach appear in the ceramic substrate that internal stress causes.
In the following description, the symbol in the numeral/symbolic representation accompanying drawing in (), purpose is for term in the explanation and the inscape shown in the accompanying drawing are compared easily.In addition, these numerals and do not mean that " term in will illustrating is defined as the inscape shown in the accompanying drawing ".
In order to solve above-mentioned problem, the cutter sweep that is used for the electronic unit manufacturing of the present invention, when the manufacturing of the electronic unit of the following stated, use, promptly, by carrying out resin-sealed to the chip (3) that is installed in respectively on a plurality of zones (7) that are arranged on the circuit substrate (2), thereby form the substrate (1) of having finished sealing, and finished the substrate (1) of sealing in the cutting of the boundary line (6) of a plurality of zones (7), thus, make a plurality of electronic units, this cutter sweep that is used for the electronic unit manufacturing has: the fixing fixed cell (8) of substrate (1) that will finish sealing; Generate the laser generation unit (11) of laser (12,18); With make substrate (1) and/or the mobile unit (9) that is movable relative to each other of laser (12,18) of finishing sealing, laser generation unit (11) generates first laser (12) and second laser (18), and first laser (12) is used for the hole (17,19) of (6) formation pinprick shape in the boundary line; Second laser (18) is used for having finished in the boundary line (6) of the hole that has formed the pinprick shape (17,19) cutting the substrate (1) of sealing
In addition, in one embodiment, being characterized as of the cutter sweep that is used for the electronic unit manufacturing of the present invention, above-mentioned first laser (12) is the laser of pulse type, and second laser (18) is successional laser.
In addition, in one embodiment, being characterized as of the cutter sweep that is used for the electronic unit manufacturing of the present invention, above-mentioned laser generation unit (11) has fibre laser oscillator or YAG laser oscillator.
In addition, in one embodiment, being characterized as of the cutter sweep that is used for the electronic unit manufacturing of the present invention, the hole of above-mentioned pinprick shape (17,19) are through hole (17).
In addition, in one embodiment, being characterized as of the cutter sweep that is used for the electronic unit manufacturing of the present invention, the hole of above-mentioned pinprick shape (17,19) are blind hole (19).
In addition, in one embodiment, being characterized as of the cutter sweep that is used for the electronic unit manufacturing of the present invention, the material of foregoing circuit substrate (2) is pottery or metal.
In addition, in one embodiment, being characterized as of the cutter sweep that is used for the electronic unit manufacturing of the present invention, above-mentioned electronic unit is optoelectronic component or power semiconductor parts.
The cutting method that is used for the electronic unit manufacturing of the present invention, when the manufacturing of the electronic unit of the following stated, use, promptly, by carrying out resin-sealed to the chip (3) that is installed in respectively on a plurality of zones (7) that are arranged on the circuit substrate (2), thereby form the substrate (1) of having finished sealing, and by finished the substrate (1) of sealing along boundary line (6) cutting of a plurality of zones (7), make a plurality of electronic units, this cutting method that is used for the electronic unit manufacturing comprises: the fixing fixedly operation of substrate (1) that will finish sealing; And irradiation process, on one side to substrate (1) irradiating laser (12,18) of finishing sealing, substrate (1) and/or the laser (12,18) of finishing sealing are movable relative to each other on one side, in above-mentioned irradiation process, by to substrate (1) irradiation first laser (12) of finishing sealing thereby in the boundary line (6) go up form the pinprick shape hole (17,19) afterwards, by cutting the substrate (1) of finishing sealing to boundary line (6) irradiation second laser (18).
In addition, in one embodiment, being characterized as of the cutting method that is used for the electronic unit manufacturing of the present invention, above-mentioned first laser (12) is the laser of pulse type, and second laser (18) is successional laser.
In addition, in one embodiment, being characterized as of the cutting method that is used for the electronic unit manufacturing of the present invention in above-mentioned irradiation process, utilizes fibre laser oscillator or YAG laser oscillator to generate first laser (12) and second laser (18).
In addition, in one embodiment, being characterized as of the cutting method that is used for the electronic unit manufacturing of the present invention, the hole of above-mentioned pinprick shape (17,19) are through hole (17).
In addition, in one embodiment, being characterized as of the cutting method that is used for the electronic unit manufacturing of the present invention, the hole of above-mentioned pinprick shape (17,19) are blind hole (19).
In addition, in one embodiment, being characterized as of the cutting method that is used for the electronic unit manufacturing of the present invention, the base material of foregoing circuit substrate (2) is pottery or metal.
In addition, in one embodiment, being characterized as of the cutting method that is used for the electronic unit manufacturing of the present invention, above-mentioned electronic unit is optoelectronic component or power semiconductor parts.
(invention effect)
According to the present invention, on the boundary line (6) of the substrate of finishing sealing (1), use hole (17,19) that first laser forms the pinprick shape afterwards, the substrate (1) (full cutting) that uses second laser to cut to finish sealing.At this moment, the volume of the part of when forming the hole (17,19) of pinprick shape, removing with by after the volume sum of the part that is removed of cutting (full cutting), the volume of the part that is removed when once cut (cutting entirely) with the substrate (1) that will finish sealing by laser irradiation once in the past equates.In other words, by twice irradiation of the present invention, the volume of the part of removing from this substrate (1) of having finished sealing when the volume of the each several part of removing from the substrate (1) of finishing sealing is all less than substrate (1) cutting that will finish sealing by once irradiating in the past respectively.Therefore, in the present invention, owing to the volume of the part of utilizing the laser irradiation to be removed each time is little, therefore, the amount of the dregs of generation is few, and the growing amount of the dregs during particularly owing to irradiation second laser is few, so the amount that finally is attached to the dregs on the cutting part is few.In addition, if the amount of the dregs that the irradiation of each laser is produced is few, then in the laser irradiation, can easily remove dregs by gas jet etc.Therefore, dregs and can obtain the high cut surface of cut quality attached on the substrate of finishing sealing (1) in the time of can being suppressed at cutting and having finished the substrate of sealing (1).
In addition,, comprise under the situation of ceramic substrate, use first laser to finish the last hole (17,19) that forms the pinprick shape of substrate (1) of sealing, and then use second laser that it is cut at the substrate of finishing sealing (1) according to the present invention.Like this, by in the local hole (17,19) that forms the pinprick shape in advance that will cut, thereby when cutting, can finish cutting with the relatively shorter time.In addition, because the cause in the hole (17,19) of pinprick shape, so near the surface area the cutting part is big, the heat that is produced by the laser irradiation is dispelled the heat easily.Therefore, near the hole (17,19) of pinprick shape, be difficult to accumulate heat, make that the thermal stress that irradiation produced by second laser obtains relaxing.Therefore, near the hole (17,19) of pinprick shape, the suffered suffered stress of stress, particularly ceramic substrate of substrate (1) of having finished sealing reduces.Therefore, because the situation of slight crack or breach appears in the ceramic substrate that causes of internal stress is inhibited.
Description of drawings
Fig. 1 is the cutter sweep that is used for the electronic unit manufacturing of expression embodiment 1 forms the hole of pinprick shape on the substrate of finishing sealing the cutaway view of state.
Fig. 2 (1) is that the cutter sweep that is used for the electronic unit manufacturing of expression embodiment 1 has formed the cutaway view as the state of the through hole in the hole of pinprick shape on the substrate of finishing sealing; Fig. 2 (2) is the cutaway view of the substrate of finishing sealing that expression has formed the through hole of pinprick shape; Fig. 2 (3) is the cutaway view that the state after the substrate cut of sealing will be finished in expression.
Fig. 3 (1) is that the cutter sweep that is used for the electronic unit manufacturing of expression embodiment 2 has formed the cutaway view as the state of the blind hole in the hole of pinprick shape on the substrate of finishing sealing; Fig. 3 (2) is the cutaway view of the substrate of finishing sealing that expression has formed the blind hole of pinprick shape; Fig. 3 (3) is the cutaway view that the state after the substrate cut of sealing will be finished in expression.
Fig. 4 (1) is the cutter sweep that is used for the electronic unit manufacturing of expression embodiment 3 has formed the state of groove on sealing resin a cutaway view; Fig. 4 (2) is the cutaway view that is illustrated in the state of the through hole that has formed the pinprick shape on the circuit substrate; Fig. 4 (3) is the cutaway view that this cutter sweep of expression will be finished the state after the substrate cut of sealing.
The specific embodiment
The cutting method that is used for the electronic unit manufacturing of the present invention is to use when the manufacturing of the electronic unit of the following stated, promptly, by carrying out resin-sealed to the chip (3) that is installed in respectively on a plurality of zones (7) that are arranged on the circuit substrate (2), thereby form the substrate (1) of having finished sealing, by finished the substrate (1) of sealing along boundary line (6) cutting of a plurality of zones (7), make a plurality of electronic units, this cutting method that is used for the electronic unit manufacturing comprises: the substrate (1) that will finish sealing is fixed on the fixedly operation on the board (9); And irradiation process, on one side from irradiation head (10) to substrate (1) irradiation first laser (12) or second laser (18) of finishing sealing, make on one side irradiation head (10) and/or finished sealing substrate (1) be movable relative to each other.In irradiation process, the hole (17) that go up to form the pinprick shape in by irradiation first laser (12) thereby in the boundary line (6) afterwards, by cutting the substrate (1) of finishing sealing to boundary line (6) irradiation second laser (18).
With reference to Fig. 1 the embodiment 1 that is used for the cutter sweep of electronic unit manufacturing of the present invention is described.Fig. 1 is the cutter sweep that is used for the electronic unit manufacturing of expression present embodiment has formed the hole of pinprick shape on the substrate of finishing sealing the summary cutaway view of state.Cutter sweep shown in Figure 1 is the cutter sweep that substrate 1 monolithic that will finish sealing turns to a plurality of electronic units.In addition, about the accompanying drawing arbitrarily that is comprised in the present specification, for the ease of understanding the schematic representation of all having carried out suitable omission or exaggeration.At this, " hole of pinprick shape " is meant the interval of vacating regulation and the hole that is spaced apart both comprised that through hole also comprised blind hole.
As shown in Figure 1, the substrate 1 of having finished sealing has: circuit substrate 2, the sealing resin 4 that is installed in a plurality of chips 3 on the circuit substrate 2 and forms in the mode that a plurality of chips 3 are covered simultaneously.In Fig. 1, ceramic substrate or metal substrate have been used as circuit substrate 2; Used silicones as sealing resin 4 with light transmission; Used led chip as chip 3.Therefore, we can say that the substrate 1 of finishing sealing is the composite that is made of ceramic substrate or metal substrate and plastics.In addition, metal substrate comprises: metal core substrate, Metal Substrate substrate and hollow substrate.
In addition, Fig. 1 represents that lens section 5 constitutes convex lens, and lens section 5 example corresponding one to one with chip 3.Moreover, lens section 5 can also have optically focused function, make light become the function of directional light or make light diffusing function.In addition, lens section 5 can have a plurality of lens, also can be Fresnel Lenses etc.
The substrate 1 of having finished sealing is fixed on the board 9 by adhesive tape 8.Board 9 is designed to move on directions X shown in the figure, Y direction and the Z direction, and can rotate to the θ direction.Irradiation head 10 is configured in the top of the substrate 1 of finishing sealing.In addition, also be provided with and this irradiation head 10 optical laser oscillators that are connected 11.The laser that irradiation head 10 will be generated by laser oscillator 11 as first laser 12 to substrate 1 irradiation of finishing sealing.In addition, irradiation head 10 also can be with the laser that generates by laser oscillator 11 as second laser (back can be mentioned) to substrate 1 irradiation of finishing sealing.At this, laser oscillator 11 can generate first laser 12 and second laser.And first laser 12 is the laser of pulse type; Second laser is successional laser.
On irradiation head 10, be provided with pipe arrangement 13, provide assist gas 14 to the inside of irradiation head 10 by this pipe arrangement 13.Be provided with nozzle 15 in the bottom of irradiation head 10.Finish illuminated 16 irradiation first laser 12 of the substrate 1 of sealing to from the opening of this nozzle 15, and spray assist gas 14.
Below, see figures.1.and.2, the action of the cutter sweep that is used for the electronic unit manufacturing of present embodiment is described.Fig. 2 (1) is the cutter sweep that is used for the electronic unit manufacturing of expression present embodiment has formed the through hole of pinprick shape on the substrate of finishing sealing the cutaway view of state; Fig. 2 (2) is the cutaway view of the substrate of finishing sealing that expression has formed the through hole of pinprick shape; Fig. 2 (3) is the cutaway view that the state after the substrate cut of sealing will be finished in expression.
At first, shown in Fig. 1 and Fig. 2 (1), on one side to first laser 12 of the boundary line 6 radiation pulses shapes of the substrate 1 of finishing sealing, make on one side board 9 with respect to irradiation head 10 to figure+directions X moves.In addition, finish boundary line 6 irradiations first laser 12 of the substrate 1 of sealing to, and spray assist gas 14.By spraying assist gas 14, the dregs that produce can be blown away and remove.Set the illuminate condition of first laser 12 in advance, so that can on the substrate of finishing sealing 1, leave through hole as composite.Thus, shown in Fig. 2 (2), in the boundary line 6 of the substrate 1 of finishing sealing on a boundary line 6 of directions X, can leave the hole 17 of the pinprick shape that forms by through hole.
Next, in the boundary line 6 of the substrate 1 of finishing sealing on remaining all boundary lines 6 of directions X, leave the hole 17 of the pinprick shape that forms by through hole.Thus, in boundary line 6 on all boundary lines 6 of directions X, form the hole 17 of the pinprick shape that forms by through hole.
Next, in the boundary line 6 of lattice-like on the boundary line 6 of Y direction, leave the hole 17 of the pinprick shape that forms by through hole.Particularly, on one side to a boundary line 6 irradiation first laser 12 along the Y direction, make on one side board 9 with respect to irradiation head 10 to figure+Y (or-Y) direction moves.Then, in the boundary line 6 of the substrate 1 of finishing sealing on all remaining boundary lines 6 of Y direction, leave the hole 17 of the pinprick shape that forms by through hole.By above operation, on all boundary lines 6 of the substrate 1 of finishing sealing, form the hole 17 of the pinprick shape that forms by through hole.
Next, shown in Fig. 2 (3), on one side to successional second laser 18 of the boundary line of the substrate 1 of finishing sealing 6 irradiations, make on one side board 9 with respect to irradiation head 10 to figure+directions X moves.In addition, finish boundary line 6 irradiations second laser 18 of the substrate 1 of sealing to, and spray assist gas 14 (with reference to Fig. 1).Set the illuminate condition of second laser 18 in advance, so that can cut the substrate of finishing sealing 1 in the hole 17 that has formed the pinprick shape that forms by through hole fully.Thus, in the boundary line 6 of the substrate 1 of finishing sealing on a boundary line 6 of directions X, can cut the substrate 1 that (full cutting) finished sealing fully.
Next, in the boundary line 6 of the substrate 1 of finishing sealing on remaining all boundary lines 6 of directions X, the substrate 1 of sealing has been finished in cutting fully.
Next, in the boundary line 6 of lattice-like on all boundary lines 6 of Y direction, the substrate 1 of sealing has been finished in cutting fully.Particularly, on one side to a boundary line 6 irradiation second laser 18 along the Y direction, make on one side board 9 with respect to irradiation head 10 to figure+Y (or-Y) direction moves.Then, in the boundary line 6 of the substrate 1 of finishing sealing on all remaining boundary lines 6 of Y direction, the substrate 1 of sealing has been finished in cutting.By operation hereto, can on all boundary lines 6, cut the substrate 1 of having finished sealing.Therefore, the substrate 1 of having finished sealing is changed into by monolithic and a plurality of regional 7 corresponding respectively a plurality of packaging parts.
Can obtain following effect according to present embodiment.First effect is: suppress the generation of dregs when the substrate 1 of sealing has been finished in cutting.In the present embodiment, the irradiation by twice by the volume of the each several part of removing from the substrate 1 of finishing sealing respectively all less than the volume of the part of when having finished the substrate 1 of sealing by irradiation cutting once, having removed from this substrate of having finished sealing.Thus, owing to making on the substrate 1 of finishing sealing the part of fusing become, twice irradiation is easy to be removed by assist gas.Therefore, when cutting has been finished the substrate 1 of sealing, can suppress dregs attached on the substrate 1 of finishing sealing.
Second effect is: can obtain good cut quality at cut surface.As mentioned above, owing to making on the substrate 1 of finishing sealing the part of fusing become, twice irradiation is easy to be removed by assist gas.Therefore, the cut surface at the electronic unit of manufacturing can obtain good cut quality.
The 3rd effect is: using as circuit substrate 2 under the situation of ceramic substrate, suppressing because the situation of slight crack or breach appears in the ceramic substrate that internal stress causes.In the present embodiment, use the laser of pulse type, on the substrate 1 of finishing sealing, form the hole 17 of pinprick shape, then, use successional laser to cut this substrate of having finished sealing 1.Thus, near the hole 17 of pinprick shape, obtain relaxing because of shining the thermal stress that successional laser produces.Thus, near the substrate 1 of having finished sealing suffered stress, circuit substrate 2 suffered stress that particularly are made of the ceramic substrate hole 17 of pinprick shape reduce.Therefore, the circuit substrate 2 that causes because of internal stress situation that slight crack or breach occur has obtained inhibition.
In addition, in the present embodiment, the illuminate condition of first laser 12 is depended at the aperture in the hole 17 of pinprick shape and the interval (center distance) between the center, hole.Illuminate condition is meant: for example, and the translational speed of the kind of laser, energy, frequency, dutycycle, irradiation radius, board 9, the kind of assist gas 14 and pressure etc.In addition, the aperture in the hole 17 of pinprick shape and the interval between the center, hole are set in advance, so that the irradiation by second laser 18 can be cut the substrate of finishing sealing 1 in the hole 17 that has formed the pinprick shape fully.In addition, present embodiment is by according to the material of sealing resin 4 and circuit substrate 2 and thickness etc., and the aperture in the hole 17 of pinprick shape and the interval between the center, hole are suitably set, and can be applied to the circuit substrate 2 of all size.
In the present invention, in order to shine first laser 12, use YAG laser (for example, wavelength 1064nm), optical-fiber laser (for example, wavelength 1070nm) etc.In addition, the illuminate condition about the laser of pulse type is made as 200W with energy, and the translational speed of board 9 is made as 300mm/sec; Illuminate condition about successional laser is made as 300W with energy, and the translational speed of board 9 is made as 50mm/sec.About energy, be made as (energy of successional laser)＞(energy of the laser of pulse type), the translational speed about board 9 is made as (translational speed of successional laser)＜(translational speed of the laser of pulse type), thus, can obtain the good quality of analysing and observe in the part that is cut.
With reference to Fig. 3 the embodiment 2 that is used for the cutter sweep of electronic unit manufacturing of the present invention is described.Fig. 3 (1) is the cutter sweep that is used for the electronic unit manufacturing of expression present embodiment has formed the blind hole of pinprick shape on the substrate of finishing sealing the cutaway view of state; Fig. 3 (2) is the cutaway view of the substrate of finishing sealing that expression has formed the blind hole of pinprick shape; Fig. 3 (3) is the cutaway view that the state after the substrate cut of sealing will be finished in expression.
At first, shown in Fig. 3 (1), on one side to first laser 12 of the boundary line 6 radiation pulses shapes of the substrate 1 of finishing sealing, make on one side board 9 with respect to irradiation head 10 to figure+directions X moves.Set the illuminate condition of first laser 12 in advance, so that can on the substrate of finishing sealing 1, leave blind hole as composite.Thus, shown in Fig. 3 (2), in the boundary line 6 of the substrate 1 of finishing sealing on a boundary line 6 of directions X, can leave the hole 19 of the pinprick shape that forms by blind hole.
Next, in the boundary line 6 of the substrate 1 of finishing sealing on remaining all boundary lines 6 of directions X, leave the hole 19 of the pinprick shape that forms by blind hole.Thus, in boundary line 6 on all boundary lines 6 of directions X, form the hole 19 of the pinprick shape that forms by blind hole.
Next, in cancellate boundary line 6 on all boundary lines 6 of Y direction, leave the hole 19 of the pinprick shape that forms by blind hole.
Next, shown in Fig. 3 (3), on one side to successional second laser 18 of the boundary line of the substrate 1 of finishing sealing 6 irradiations, make on one side board 9 with respect to irradiation head 10 to figure+directions X moves.Thus, in the boundary line 6 of the substrate 1 of finishing sealing on a boundary line 6 of directions X, can cut the substrate 1 that (full cutting) finished sealing fully.
Next, in the boundary line 6 of the substrate 1 of finishing sealing on remaining all boundary lines 6 of directions X, the substrate 1 of sealing has been finished in cutting fully.
Next, in the boundary line 6 of lattice-like on all boundary lines 6 of Y direction, the substrate 1 of sealing has been finished in cutting fully.By operation hereto, can on all boundary lines 6, cut the substrate 1 of having finished sealing.Therefore, the substrate 1 of having finished sealing is changed into by monolithic and a plurality of regional 7 corresponding respectively a plurality of packaging parts.
Being characterized as of present embodiment: by to first laser 12 of the boundary line of the substrate 1 of finishing sealing 6 irradiations, thereby leave the hole 19 of the pinprick shape that forms by blind hole as pulse type.The hole 19 of these pinprick shapes has opening in the side of sealing resin 4, and has inner bottom surface on circuit substrate 2.In other words, the hole 19 of pinprick shape forms in the scope midway of circuit substrate 2 in the side from sealing resin 4 on the thickness direction of the substrate 1 of finishing sealing.And identical with embodiment 1, the illuminate condition of first laser 12 is depended at the aperture degree of depth in the hole 19 of pinprick shape and the interval (center distance) between the center, hole.In addition, set the aperture degree of depth in hole 19 of pinprick shape and the interval between the center, hole in advance, so that can cut the substrate of finishing sealing 1 that has formed the hole 19 of pinprick shape by the irradiation of second laser 18 fully.
Can obtain the effect identical according to present embodiment with embodiment 1.In addition, present embodiment is by according to the material of sealing resin 4 and circuit substrate 2 and thickness etc., and suitable setting is carried out at the aperture degree of depth and the interval between the center, hole in the hole 19 of pinprick shape, can be applied to the circuit substrate 2 of all size.
With reference to Fig. 4 the embodiment 3 that is used for the cutter sweep of electronic unit manufacturing of the present invention is described.Fig. 4 (1) is the cutter sweep that is used for the electronic unit manufacturing of expression present embodiment has formed the state of groove on the sealing resin of the substrate of finishing sealing a cutaway view; Fig. 4 (2) is the cutaway view that is illustrated in the state of the through hole that has formed the pinprick shape on the circuit substrate; Fig. 4 (3) is the cutaway view that this cutter sweep of expression will be finished the state after the substrate cut of sealing.
In the present embodiment, at first, shown in Fig. 4 (1), use rotating blade on the sealing resin 4 of the substrate of finishing sealing, to form groove.Fig. 4 (1) expression: board 9 moves to directions X (left to), forms the situation of groove (no symbol) thus in the left side of rotating blade 20.In addition, in Fig. 4,, represent rotating blade 20 less for the ease of understanding.
Next, shown in Fig. 4 (2), in the boundary line 6 of the substrate 1 of finishing sealing on one boundary line 6 of directions X, to circuit substrate 2 irradiation first laser 12.Thus, on circuit substrate 2, form the hole 21 of the pinprick shape that forms by through hole.Next, on all boundary lines 6 of the substrate 1 of finishing sealing, on circuit substrate 2, form the hole 21 of the pinprick shape that forms by through hole.
Next, shown in Fig. 4 (3), on one side successional second laser of circuit substrate 2 irradiation on the boundary line 6 of the substrate 1 of finishing sealing, make on one side board 9 with respect to irradiation head 10 (with reference to Fig. 1) to figure+directions X moves.Thus, in the boundary line 6 of the substrate 1 of finishing sealing on one boundary line 6 of directions X, can cut the substrate 1 of finishing sealing (full cutting) fully.Then, in the boundary line 6 of the substrate 1 of finishing sealing on remaining all boundary lines 6 of directions X, the substrate 1 of finishing sealing is cut fully.Next, in the boundary line 6 of the substrate 1 of finishing sealing on all boundary lines 6 of Y direction, the substrate 1 of finishing sealing is cut fully.
According to present embodiment, can obtain the effect identical with embodiment 1 and embodiment 2.In addition,, in the cutting of sealing resin 4, can use the rotating blade that is fit to this cutting, in the cutting of circuit substrate 2, can use the laser and the illuminate condition of the kind that is fit to this cutting according to present embodiment.Therefore, can improve the efficient of the operation of the substrate 1 that cutting finished sealing.
In addition, in the present embodiment, the two is arranged on an example on the cutter sweep and is illustrated to the laser oscillator 11 (with reference to Fig. 1) of rotating blade 20 and irradiation first laser 12 and second laser 18.But be not limited to this, the cutter sweep that also can have rotating blade 20 in use, on the sealing resin 4 of the substrate 1 of finishing sealing, form after the groove, this substrate 1 of having finished sealing is transported to the cutter sweep with laser oscillator 11 (with reference to Fig. 1).
In addition, in the present embodiment, also can replace rotating blade 20 and on the sealing resin 4 of the substrate 1 of finishing sealing, form groove with laser.In this case, preferably use laser that easy sealed resin 4 absorbs, for example by CO
2The laser that laser oscillator generates.
In addition, in the present embodiment, the groove that is arranged on the sealing resin 4 also can form in resin-sealed operation.In this case, by in being used for the resin-sealed chamber that mould had, laminar protuberance being set, can on sealing resin 4, form groove with clathrate.
In addition, on the sealing resin 4 of present embodiment, in the set groove, can there be resin 4 fully yet, and the surface of circuit substrate 2 is exposed.And, also can there be sealing resin 4 in the bottom of groove.In the present embodiment, on boundary line 6, as long as make the less thick of sealing resin 4.
In addition, in each embodiment discussed above, after the hole 17,19 that on all boundary lines 6 of directions X, has formed the pinprick shape, in the hole 17,19 that on all boundary lines 6 of Y direction, has formed the pinprick shape.Next, after on all boundary lines 6 of directions X, having cut the substrate 1 of finishing sealing, on all boundary lines 6 of Y direction, cutting the substrate 1 of finishing sealing.
In the present invention, also can after the substrate 1 that will finish sealing cuts into bulk, each piece be cut into a plurality of regional 7 units.Particularly, at first, on all boundary lines 6 of the substrate 1 of finishing sealing, form the hole 17 of pinprick shape.Then, near the boundary line 6 the center line of the directions X of the substrate 1 of finishing sealing and Y direction, the substrate 1 of sealing has been finished in cutting.Thus, the substrate 1 of finishing sealing is divided into 4.Next, cut into a plurality of regional 7 units respectively with 4.According to this method, under the big situation of the distortion (warpage, fluctuating, deflection etc.) of the substrate 1 of finishing sealing,, reduce thereby make because of these are out of shape caused stress by on all boundary lines 6, forming the hole 17 of pinprick shape.Therefore, when cutting has been finished the substrate 1 of sealing, can suppress because of the suffered harmful effect of these distortion.
In addition, also can adopt following method, at first, near the boundary line 6 the center line of the directions X of the substrate 1 of finishing sealing and Y direction, form the hole 17 of pinprick dress.Next, on these boundary lines 6, cut the substrate 1 of having finished sealing.Thus, the substrate 1 of finishing sealing is divided into 4.Next, be respectively object, the hole 17 of formation pinprick shape on all boundary lines 6 with 4.Next, be respectively object with 4, the substrate 1 of sealing has been finished in cutting on all boundary lines 6.By this method, also can when having finished the substrate 1 of sealing, cutting suppress the suffered harmful effect of distortion because of warpage, fluctuating, deflection etc.
In addition, in each above-mentioned embodiment, to having led chip as chip 3 with have silicones that light transmission is arranged and be illustrated as the substrate of finishing sealing 1 of sealing resin 4.But be not limited to this, also can use laser diode chip as chip 3.And by using power semiconductor chip as chip 3, use epoxy resin etc. also can use the present invention as sealing resin 4 when making the power semiconductor parts.
In addition, also a plurality of chips 3 can be installed in a zone 7.For example, a zone 7 of a plurality of led chips has been installed by being brought into play function as area source by singualtion.In addition, a plurality of chips 3 that are installed in the zone 7 also can not have identical functions.For example, light-emitting component and light receiving element are being installed under the situation in 1 zone 7, this zone 7 is passed through by singualtion, and can bring into play the function as optical sensor.
In addition, in each above embodiment,, board 9 is moved on one side with respect to the directions X or the Y direction of irradiation head 10 to figure on one side to the border of the substrate 1 of finishing sealing 6 irradiation first laser 12 or second laser 18.But be not limited to this, irradiation head 10 is moved with respect to the directions X or the Y direction of board 9 to figure.And, board 9 and irradiation head 10 boths are moved to directions X or the Y direction of figure.In a word, as long as board 9 and irradiation head 10 are movable relative to each other to directions X or the Y direction of figure.
In addition, for example, can also be by changing first laser 12 that shone to the substrate 1 of finishing sealing from irradiation head 10 and the irradiating angle of second laser 18, thereby on the substrate 1 of finishing sealing, the irradiation position of laser is moved, thus, laser and the substrate 1 of finishing sealing are movable relative to each other.At this moment, though can move substrate 1 and the irradiation head 10 of having finished sealing, also can they be movable relative to each other with above-mentioned.
In addition, in each above embodiment, boundary line 6 is illustrated by the situation that line segment constitutes.But be not limited to this, comprise under curve or the situation in boundary line 6 and also can use the present invention by the broken line of many line segments combination.Therefore, the substrate of having finished sealing in a cutting part of making profile comprises that the packaging part of curve or broken line (for example, certain memory card under) the situation, also can use the present invention.In this case, the hole 17,19 of pinprick shape forms in the mode that is arranged in curve-like or polyline shaped.
In addition, in each above-mentioned embodiment, the substrate 1 that will finish sealing by adhesive tape 8 is fixed on the board 9.But be not limited to this, also can be fixed on the board 9 by the substrate 1 that sealing will be finished in sorption.In this case, preferably on the lip-deep of board 9 and each boundary line 6 superposed part, groove is set.Thus, forming the dregs that produced in these two operations of operation (the particularly latter's operation) that operation and the substrate 1 that will finish sealing in the hole 17,19 of pinprick shape cut fully on the substrate 1 of finishing sealing can be removed at an easy rate by these grooves.
In addition, the present invention is not limited to the various embodiments described above, as long as in the scope that does not break away from aim of the present invention, just can carry out any and suitable combination, change or select use as required.
The explanation of Reference numeral:
1 ... finished the substrate of sealing
2 ... circuit substrate
3 ... chip
4 ... sealing resin
5 ... lens section
6 ... the boundary line
7 ... the zone
8 ... adhesive tape (fixed cell)
9 ... board (mobile unit)
10 ... irradiation head
11 ... laser oscillator (laser generation unit)
12 ... first laser (laser)
13 ... pipe arrangement
14 ... assist gas
15 ... nozzle
16 ... illuminated portion
17,21 ... the hole of pinprick shape (through hole)
18 ... second laser (laser)
19 ... the hole of pinprick shape (blind hole)
20 ... rotating blade
Claims (14)
1. one kind is used for the cutter sweep that electronic unit is made, when the manufacturing of the electronic unit of the following stated, use, promptly, by to be installed in respectively chip on a plurality of zones that are arranged on the circuit substrate carry out resin-sealed, thereby form the substrate of having finished sealing, and on the boundary line in a plurality of zones, cut the above-mentioned substrate of having finished sealing, thus, make a plurality of electronic units
This cutter sweep that is used for the electronic unit manufacturing has:
With the above-mentioned fixing fixed cell of substrate of having finished sealing;
Generate the laser generation unit of laser; With
Make the above-mentioned substrate of sealing and/or the mobile unit that above-mentioned laser is movable relative to each other finished,
Above-mentioned laser generation unit generates first laser and second laser, and above-mentioned first laser is used for forming the hole of pinprick shape on the boundary line; Above-mentioned second laser is used for the above-mentioned substrate of having finished sealing of cutting on the above-mentioned boundary line in the hole that has formed above-mentioned pinprick shape.
2. the cutter sweep that is used for the electronic unit manufacturing according to claim 1 is characterized by,
Above-mentioned first laser is the laser of pulse type, and above-mentioned second laser is successional laser.
3. the cutter sweep that is used for the electronic unit manufacturing according to claim 1 and 2 is characterized by,
Above-mentioned laser generation unit has fibre laser oscillator or YAG laser oscillator.
4. according to any described cutter sweep that is used for the electronic unit manufacturing of claim 1～3, it is characterized by,
The hole of above-mentioned pinprick shape is a through hole.
5. according to any described cutter sweep that is used for the electronic unit manufacturing of claim 1～3, it is characterized by,
The hole of above-mentioned pinprick shape is a blind hole.
6. according to any described cutter sweep that is used for the electronic unit manufacturing of claim 1～5, it is characterized by,
The base material of foregoing circuit substrate is pottery or metal.
7. according to any described cutter sweep that is used for the electronic unit manufacturing of claim 1～6, it is characterized by,
Above-mentioned electronic unit is optoelectronic component or power semiconductor parts.
8. one kind is used for the cutting method that electronic unit is made, when the manufacturing of the electronic unit of the following stated, use, promptly, by carrying out resin-sealed to the chip that is installed in respectively on a plurality of zones that are arranged on the circuit substrate, thereby form the substrate of having finished sealing, and, make a plurality of electronic units by the above-mentioned substrate of having finished sealing of boundary line cutting along a plurality of zones
This cutting method that is used for the electronic unit manufacturing comprises: with the above-mentioned fixing fixedly operation of substrate of having finished sealing; And irradiation process, Yi Bian to the above-mentioned substrate irradiating laser of having finished sealing, Yi Bian above-mentioned substrate and/or the above-mentioned laser of having finished sealing is movable relative to each other,
In above-mentioned irradiation process, by shining first laser, thereby on the boundary line, form after the hole of pinprick shape to the above-mentioned substrate of having finished sealing, by shining second laser, cut the above-mentioned substrate of having finished sealing to above-mentioned boundary line.
9. the cutting method that is used for the electronic unit manufacturing according to claim 8 is characterized by,
Above-mentioned first laser is the laser of pulse type, and above-mentioned second laser is successional laser.
10. according to Claim 8 or 9 describedly be used for the cutting methods that electronic unit is made, it is characterized by,
In above-mentioned irradiation process, utilize fibre laser oscillator or YAG laser oscillator to generate above-mentioned first laser and above-mentioned second laser.
11. any described cutting method that is used for the electronic unit manufacturing according to Claim 8～10 is characterized by,
The hole of above-mentioned pinprick shape is a through hole.
12. any described cutting method that is used for the electronic unit manufacturing according to Claim 8～10 is characterized by,
The hole of above-mentioned pinprick shape is a blind hole.
13. any described cutting method that is used for the electronic unit manufacturing according to Claim 8～12 is characterized by,
The base material of foregoing circuit substrate is pottery or metal.
14. any described cutting method that is used for the electronic unit manufacturing according to Claim 8～13 is characterized by,
Above-mentioned electronic unit is optoelectronic component or power semiconductor parts.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008-332054 | 2008-12-26 | ||
| JP2008332054A JP5261168B2 (en) | 2008-12-26 | 2008-12-26 | Cutting apparatus and method for manufacturing electronic parts |
| PCT/JP2009/007148 WO2010073640A1 (en) | 2008-12-26 | 2009-12-22 | Cleaving device and cleaving method for manufacturing electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102256739A true CN102256739A (en) | 2011-11-23 |
Family
ID=42287287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200980151217XA Pending CN102256739A (en) | 2008-12-26 | 2009-12-22 | Cleaving device and cleaving method for manufacturing electronic components |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP5261168B2 (en) |
| KR (1) | KR20110110238A (en) |
| CN (1) | CN102256739A (en) |
| SG (1) | SG172318A1 (en) |
| TW (1) | TW201024011A (en) |
| WO (1) | WO2010073640A1 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105269694A (en) * | 2014-07-03 | 2016-01-27 | 松下知识产权经营株式会社 | Wafer manufacturing method and wafer manufacturing device |
| CN106249955A (en) * | 2016-08-03 | 2016-12-21 | 业成科技（成都）有限公司 | Cutting sealing pressure-sensing module method and the pressure-sensing device processed thereof |
| CN107949454A (en) * | 2015-09-15 | 2018-04-20 | 松下知识产权经营株式会社 | The welding structure and welding method of hardware |
| CN108666212A (en) * | 2018-05-02 | 2018-10-16 | 南方科技大学 | A kind of LED chip production method |
| CN110859039A (en) * | 2018-06-25 | 2020-03-03 | 美国工艺品有限责任公司 | Thermal pen for use with electronic cutting and/or drawing systems |
| CN112440006A (en) * | 2019-08-30 | 2021-03-05 | 群创光电股份有限公司 | Method for manufacturing electronic device |
| CN112620965A (en) * | 2019-10-08 | 2021-04-09 | 台湾丽驰科技股份有限公司 | Dual laser processing machine and processing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102368521B (en) * | 2011-10-26 | 2013-11-20 | 深圳市瑞丰光电子股份有限公司 | Cutting method for LED wafer |
| CN102699536A (en) * | 2012-05-11 | 2012-10-03 | 东莞光谷茂和激光技术有限公司 | Laser cutting process for metal thick plate |
| JP6017373B2 (en) * | 2013-05-21 | 2016-11-02 | Ｔｏｗａ株式会社 | Manufacturing method of semiconductor device |
| JP6460704B2 (en) * | 2014-09-30 | 2019-01-30 | 株式会社ディスコ | Method for dividing ceramic substrate |
| JP6377514B2 (en) * | 2014-12-17 | 2018-08-22 | 株式会社ディスコ | Processing method of package substrate |
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- 2009-12-22 KR KR1020117017507A patent/KR20110110238A/en not_active Application Discontinuation
- 2009-12-22 SG SG2011045721A patent/SG172318A1/en unknown
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| JPS62234686A (en) * | 1986-04-02 | 1987-10-14 | Mitsubishi Electric Corp | Cutting method for working material |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105269694A (en) * | 2014-07-03 | 2016-01-27 | 松下知识产权经营株式会社 | Wafer manufacturing method and wafer manufacturing device |
| CN105269694B (en) * | 2014-07-03 | 2019-08-16 | 松下知识产权经营株式会社 | Producing method of chip and chip manufacturing device |
| CN107949454A (en) * | 2015-09-15 | 2018-04-20 | 松下知识产权经营株式会社 | The welding structure and welding method of hardware |
| CN106249955A (en) * | 2016-08-03 | 2016-12-21 | 业成科技（成都）有限公司 | Cutting sealing pressure-sensing module method and the pressure-sensing device processed thereof |
| CN108666212A (en) * | 2018-05-02 | 2018-10-16 | 南方科技大学 | A kind of LED chip production method |
| CN110859039A (en) * | 2018-06-25 | 2020-03-03 | 美国工艺品有限责任公司 | Thermal pen for use with electronic cutting and/or drawing systems |
| CN112440006A (en) * | 2019-08-30 | 2021-03-05 | 群创光电股份有限公司 | Method for manufacturing electronic device |
| US11361998B2 (en) | 2019-08-30 | 2022-06-14 | Innolux Corporation | Method for manufacturing an electronic device |
| CN112440006B (en) * | 2019-08-30 | 2023-03-14 | 群创光电股份有限公司 | Method for manufacturing electronic device |
| CN112620965A (en) * | 2019-10-08 | 2021-04-09 | 台湾丽驰科技股份有限公司 | Dual laser processing machine and processing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20110110238A (en) | 2011-10-06 |
| SG172318A1 (en) | 2011-07-28 |
| JP5261168B2 (en) | 2013-08-14 |
| WO2010073640A1 (en) | 2010-07-01 |
| TW201024011A (en) | 2010-07-01 |
| JP2010149165A (en) | 2010-07-08 |
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