JP2002313613A - Method of manufacturing chip electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chip electronic part manufacturing method capable of cutting scribing grooves without hindrance in a ceramic board on which strip-like forms have been outlined with slits. SOLUTION: Slits 3 are cut as longitudinal board splitting grooves in a ceramic board 1, and scribe grooves 14 are cut as lateral board splitting grooves in the ceramic board 1 by irradiating the board 1 with a laser beam 11 while it sweeps the board 1, so that the latticed board splitting grooves can be formed with a peripheral part left as a frame. Thereafter, the ceramic board 1 is split along the splitting grooves into pieces for the formation of chip electronic parts.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a chip electronic component by dividing a ceramic substrate on which elements as electronic components are formed in regions divided in a matrix in a matrix direction to form individual chip electronic components. It is about.

[0002]

2. Description of the Related Art Conventionally, resistors, capacitors, inductors,
Chip electronic components such as filters and various sensors form V-cut grooves as substrate dividing grooves in a matrix direction in a ceramic green sheet using a mold, and each element forming region divided by the substrate dividing grooves serves as an electronic component. After the element is formed, a method has been adopted in which individual chips are formed according to the V-cut grooves to obtain chip electronic components. However,
In this conventional method, the dimensional accuracy of the element forming region is not so good and the dimensional variation is large because the ceramic substrate shrinks when the green sheet is fired.

In recent years, chip electronic components have been required to have smaller dimensions in order to increase the mounting density on printed wiring boards. In order to obtain such a chip electronic component of a smaller size, an element as an electronic component is formed for each element forming region of the ceramic substrate divided in a matrix in a matrix direction, and then the substrate is formed on the ceramic substrate by a blade disk. A dicing method is conceivable in which a dividing groove is formed in the matrix direction, and the ceramic substrate is divided into individual pieces according to the substrate dividing groove to obtain chip electronic components.

[0004]

However, when the ceramic substrate is divided into individual pieces by the above-mentioned dicing method to obtain chip electronic components, first, for example, a board dividing groove in a row direction is formed on the ceramic substrate by a blade disk. Since the scribe groove is formed in the column direction after forming as a slit hole, at the time of forming this scribe groove in the column direction, the strip piece already stripped by the slit hole in the row direction resonates and the blade disk causes There is a problem that it is difficult to form the scribe grooves in the column direction, and a part of the strip is broken as an individual piece when the scribe grooves in the column direction are formed by the blade disk.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problem, and a scribe groove in a column direction can be formed without any trouble on a ceramic substrate in which a substrate division groove in a row direction is formed as a slit hole. It is an object of the present invention to provide a method of manufacturing a chip electronic component that can be singulated as a chip electronic component.

[0006]

According to a first aspect of the present invention, an element forming region as an electronic component is divided into a matrix in a matrix direction, and end face electrodes are arranged in a column direction in each element forming region. In forming a lattice-shaped substrate dividing groove for singulating each element forming region in the ceramic substrate to be divided, at least the column direction substrate dividing groove dividing the element forming region in the row direction is formed on the ceramic substrate. Is formed as a scribe groove by sweeping irradiation with a laser beam, and thereafter, the ceramic substrate is divided into individual pieces for each element formation region by the lattice-shaped substrate division groove, Since the scribe groove as the substrate division groove in the column direction is etched by the laser beam, unlike the case where the scribe groove is formed by the dicing blade disk, a strip piece is formed. No resonance phenomenon, an effect that can form a scribe groove in the column direction without hindrance.

According to a second aspect of the present invention, in the first aspect of the present invention, of the lattice-shaped substrate division grooves formed in the substrate ceramic substrate, the substrate division grooves in the row direction are scribed in the column direction by the laser light. It is formed as a slit hole by dicing before forming the groove, and has the same function as the first aspect.

According to a third aspect of the present invention, in the second aspect of the present invention, the scribe grooves in the column direction by the laser beam are formed from the back side of the element forming surface as an electronic component. This has the effect that the scribe grooves in the column direction can be formed without disturbing the element formation surface.

According to a fourth aspect of the present invention, in the second or third aspect, the substrate dividing groove in the row direction formed by the slit hole formed by the dicing is replaced with the row direction of the scribe groove in the column direction by the laser beam. In this case, the chip electronic components separated by the scribe grooves in the column direction can be surely divided.

According to a fifth aspect of the present invention, in the first aspect of the present invention, among the lattice-shaped substrate division grooves formed in the ceramic substrate, the row-direction substrate division grooves are also arranged in the column direction by the laser light. Before forming the scribe groove, the laser light is swept and irradiated to form slit holes, and both the scribe grooves in the column direction and the slit holes in the row direction are formed by the laser light. This has the effect that the effective range of the element formation region divided in the ceramic substrate can be expanded.

According to a sixth aspect of the present invention, in the first aspect of the present invention, the sweep irradiation of the laser light is performed by recognizing an element position as an electronic component provided on the ceramic substrate by a recognition camera. This has the effect that the scribe grooves in the column direction can be accurately formed in the element formation region.

According to a seventh aspect of the present invention, in the sixth aspect of the present invention, when the recognition of the element position by the recognition camera, the illumination from the element forming surface and the ceramic substrate for discriminating the element position as an electronic component. It is characterized by using illumination that transmits light at the same time, and has the effect that the element position can be recognized reliably and with high accuracy.

[0013]

Embodiment 1 Hereinafter, a method for manufacturing a chip electronic component according to Embodiment 1 of the present invention will be described with reference to the drawings. FIG. 1 shows Embodiment 1 of the present invention.
2 is a plan view of the ceramic substrate in the manufacturing process of the chip electronic component, FIG. 2 is a sectional view of the same, FIG. 3 is a side view in the same manufacturing process, and FIG. 4 is an enlarged view of the main part.

1 to 4, reference numeral 11 denotes a laser beam generated by a laser light generator (not shown), and reference numeral 12 denotes a control unit which performs condensing, intensity setting, ON / OFF, sweep irradiation and the like of the laser beam 11. Reference numerals 13 and 13 denote one or a plurality of alignment recognition marks provided on the peripheral frame 5 of the ceramic substrate 1 on the same surface as the element 2a.

Reference numeral 16 denotes a processing surface on which a scribe groove 14 is provided by sweeping irradiation of the laser beam 11, reference numeral 20 denotes an element forming surface on which the element 2a is formed and opposite to the processing surface 16, and reference numeral 17 denotes a ceramic irradiated from the processing surface side. Reference numeral 18 denotes an illumination light source that transmits through the substrate 1, and is an illumination light source that emits light from an element formation surface to allow the recognition camera 19 to recognize the recognition mark 13 and the element 2 a.

The above-mentioned ceramic substrate 1 is divided into element forming regions 1a as electronic parts so as to form a lattice shape in a matrix direction, and in each of these element forming regions 1a, an element 2a as an electronic part is formed. At the same time, the end face electrodes 2b are arranged in the direction in which the element forming regions are arranged in the column direction. The ceramic substrate 1 is provided with a plurality of slit holes 3 as a substrate dividing groove in a row direction at predetermined intervals so as to divide each element formation region, and has a scribe groove 14 as a substrate dividing groove in a column direction. Are provided at intervals of. Here, the above-mentioned end face electrode 2b
2 is a front base electrode 2b-1 provided on the element formation surface 20 side, a back base electrode 2b-2 provided on the processing surface 16 side opposite to the element formation surface 20 as shown in FIG.
The end base electrode 2b-3 provided on the hole wall in the slit hole 3 so as to connect between the base base electrode 2b-2 and the back base electrode 2b-2, and the above-described base electrodes 2b-1, 2b-2 and 2b-3 It is formed of a plating electrode 2b-4 provided on the surface.

Next, a procedure for manufacturing the chip electronic component will be described. First, on the element forming surface 20 of the fired ceramic substrate 1, elements 2a as electronic components are formed in each of the element forming regions 1a divided into a lattice. When the element 2a is formed, the recognition mark 13 is also formed on the element forming surface side of the peripheral frame 5 of the ceramic substrate 1 at the same time.

After the formation of the element 2a and the recognition mark 13, a surface base electrode 2b-1 is formed on the element formation surface 20 of the ceramic substrate 1 with reference to the recognition mark 13 described above. A back ground electrode 2b-2 is formed on the processing surface 16 side of the ceramic substrate 1 with reference to the recognition mark 13 thus obtained.

After the formation of the back base electrode, a plurality of slit holes 3 as substrate dividing grooves in the row direction are formed on the basis of the recognition mark 13 so as to divide the element forming region 1a in the column direction. A plurality of strips are formed in the substrate 1. After the formation of the slit hole 3, the end surface base electrode 2 b-is formed on the hole wall of the slit hole 3 in a state where the element forming surface including the element 2 a of the ceramic substrate 1 is masked so as to remove the slit hole 3 and the surface base electrode 2 b-1. 3 is formed by a vapor deposition method, and then the surface base electrode 2b- is formed by a plating method.
1, back base electrode 2b-2 and end face base electrode 2b-3
The plating electrode 2b-4 is formed so as to include
b is formed.

Next, with the masking removed, a protective coat (not shown) is applied to each of the elements 2a on the element forming surface side.
Is formed, the recognition mark 13 described above is recognized by the recognition camera 19, and the processed surface 1 of the ceramic substrate 1 is formed.
Scribing grooves 14 as substrate dividing grooves in the column direction from the 6 side
Are formed in the row direction. At this time, the scribe grooves 14
The outermost position of the slit 3
It is needless to say that it is within the formation region.

Here, a method of forming the scribe groove 14 which is a substrate division groove of the chip electronic component will be described. As shown in FIG. 3, the ceramic substrate 1 is set on a processing jig (not shown) with the processing surface 16 up and the element formation surface 20 down. The illumination light source 17 and the illumination light source 18 irradiate the processing surface 16 and the element forming surface 20, and the recognition camera 19 reliably recognizes the recognition mark 13 and the element 2a without defocus, reflection and lack of contrast. The processing jig is operated so as to be at a predetermined position.

Next, the laser beam 11 controlled and controlled by the control section 12 is swept onto the processing surface 16 to form a predetermined number of scribe grooves 14 at predetermined intervals as shown in FIG. I do. When the peripheral frame 5 of the ceramic substrate 1 is required for the post-process, the first and last insertion of the scribe grooves 14 are almost linear due to the sweep irradiation processing by the laser beam 11, and the part which cannot be used (peripheral frame) Dimension) becomes smaller.

In this embodiment, the case where the laser beam is moved for sweeping irradiation has been described. However, a processing jig on which the ceramic substrate 1 is mounted is mounted on the XY table and the XY table is operated. May be used for sweeping and irradiating a laser beam.

In the present embodiment, the recognition mark is provided on the peripheral frame portion of the element forming surface, but the element pattern itself as an electronic component may be recognized.

In this embodiment, the slit holes are formed as the substrate dividing grooves in the row direction by the blade disk. However, it is needless to say that the slit holes may be formed by laser light.

[0026]

As described above, according to the present invention, the scribing grooves as the substrate dividing grooves in the column direction are formed by sweeping irradiation of the laser beam, so that the slit holes as the substrate dividing grooves in the row direction are already formed. Therefore, the scribe groove can be formed on the ceramic substrate made into a strip without resonance of the strip itself, and the trouble that a part of the strip is damaged when the scribe groove is formed can be eliminated. You can do it.

[Brief description of the drawings]

FIG. 1 is a plan view of a ceramic substrate in one manufacturing process of a chip electronic component according to a first embodiment of the present invention.

FIG. 2 is an enlarged cross-sectional view of the main part.

FIG. 3 is a side view in the same manufacturing process.

FIG. 4 is an enlarged view of the main part.

[Explanation of symbols]

 Reference Signs List 1 ceramic substrate 2a element 2b end face electrode 3 slit hole 5 peripheral frame 11 laser beam 12 control unit 13 recognition mark 14 scribe groove 16 processing surface 17 illumination light source 18 illumination light source 19 recognition camera 20 element forming surface

 ──────────────────────────────────────────────────の Continuing from the front page (72) Inventor Hiroyoshi Minato 1006 Kazuma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor Mitsunori Yamamoto 1006 Kadoma Kazuma Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd. F-term (reference) 5E032 CA01 CC03

Claims (7)

[Claims] 1. An element forming region as an electronic component is divided into a matrix in a matrix direction, and a ceramic substrate having end face electrodes arranged in a column direction in each element forming region is divided into individual element forming regions. In forming a lattice-shaped substrate division groove for forming a substrate, at least the substrate division groove in the column direction that divides the element formation region in the row direction is formed as a scribe groove by sweeping and irradiating the ceramic substrate with laser light. Thereafter, the ceramic substrate is divided into individual pieces for each element forming region by the lattice-shaped substrate dividing grooves. 2. A semiconductor device according to claim 1, wherein, among the lattice-shaped substrate division grooves formed on the ceramic substrate, the substrate division grooves in the row direction are formed as slit holes by dicing before forming the scribe grooves in the column direction by the laser beam. Claim 1
The manufacturing method of the chip electronic component according to the above. 3. The method of manufacturing a chip electronic component according to claim 2, wherein the scribe groove in the column direction by the laser beam is formed from the back side of the surface on which the element as the electronic component is formed. 4. The substrate dividing groove in the row direction formed by the slit hole formed by the dicing is formed beyond the outermost position in the row direction of the scribe groove in the column direction by the laser beam. Or the method for manufacturing a chip electronic component according to any one of the above items. 5. Among the lattice-shaped substrate division grooves formed on the ceramic substrate, the substrate division grooves in the row direction are also slit by sweeping and irradiating laser light before forming the scribe grooves in the column direction by the laser light. The method according to claim 1, wherein the chip electronic component is formed as a hole. 6. The method of manufacturing a chip electronic component according to claim 1, wherein the sweep irradiation of the laser beam is performed by recognizing an element position as an electronic component provided on the ceramic substrate by a recognition camera. 7. The device according to claim 6, wherein at the time of recognizing an element position by the recognition camera, illumination from an element forming surface for determining an element position as an electronic component and illumination transmitted through a ceramic substrate are used in combination. 3. The method for manufacturing a chip electronic component according to claim 1.