JPH06310821A - Ceramic package assembly, dividing and fabrication of ceramic package - Google Patents

Abstract

PURPOSE:To provide a ceramic package aggregate, on which a large quantity of burrs are never generated and in which a break is never generated, and a method of splitting the aggregate. CONSTITUTION:A plurality of independent package parts 12, 14, 16 and 18 are formed on a sheetlike laminated ceramic board 10, dividing grooves, consisting of surface side groove 20a cut from the side of the surface mounted with an element, and rear side groove 20b cut from side of the rear of the board 10 are formed on the boundary parts 20 between the parts 12, 14, 16 and 18 and the groove depth of the grooves 20b is formed in such a way that it is deeper than that of the grooves 20a. By applying such a force as to extend the grooves 20a in the boundary parts 20, the parts 20 are broken and the board 10 is split into the individual package parts 12, 14, 16 and 18.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic package assembly in which a plurality of independent package parts are formed on a sheet-shaped laminated ceramic substrate, a method of dividing the same, and a method of assembling the ceramic package.

[0002]

2. Description of the Related Art Conventionally, an alumina ceramic package has been used as a package for a surface mount crystal oscillator or the like. A ceramic package assembly in which a plurality of independent package parts are provided on a sheet-shaped laminated ceramic substrate is used. A conventional ceramic package assembly is shown in FIG. 3A is a plan view of the ceramic package assembly, and FIG. 3B is a sectional view.

The laminated ceramic substrate 10 used in a surface mount type crystal oscillator or the like is usually formed by laminating 3 to 4 layers. A circuit pattern is formed on the first-layer green sheet with tungsten or molybdenum, two or three layers of green sheets are stacked, laminated and pressed, and then sintered at about 1600 ° C. As shown in FIG. 3A, each package portion 12, 14, 16, 18 of the monolithic ceramic substrate 10 has an element cavity 12a, 1 for accommodating an element.
4a, 16a, 18a are formed, a circuit pattern is formed in each element cavity 12a, 14a, 16a, 18a, and a crystal oscillator, an IC, a capacitor, etc. are mounted. Cavities 12a, 14a, 16a, 18 for each element
A seam ring 12b, 14b, 16 is provided around the outer periphery of a.
b and 18b are formed.

A boundary portion 20 is provided between the package portions 12, 14, 16 and 18 of the laminated ceramic substrate 10.
In the boundary portion 20, as shown in FIG. 3B, the dividing groove 2 for dividing each package portion 12, 14, 16, 18 is formed.
0a and 20b are formed. Multilayer ceramic substrate 1
For 0, it is necessary to perform electrolytic gold plating in the subsequent process in order to reduce the conductor loss of the pattern. Therefore, the dividing grooves 20a and 20b formed in the boundary portion 20 of the multilayer ceramic substrate 10 have a shallow rear surface dividing groove 20b and a deep front surface dividing groove 20a so as not to cut the circuit pattern of the first layer. Had formed.

Such a conventional monolithic ceramic substrate 10
In order to divide, the boundary portion 20 is destroyed by applying a force F to the multilayer ceramic substrate 10 so that the division groove 20a on the front surface side is expanded, and the package portions 12, 14,
Divide 16 and 18.

[0006]

However, when the laminated ceramic substrate 10 is divided by breaking the boundary portion 20, the brittle material characteristic of the laminated ceramic substrate 10 causes a large amount of burrs and chips during the division. There was a problem. Since the operator is required to have a considerable degree of skill in manually dividing the laminated ceramic substrate 10, an automatic machine for dividing the laminated ceramic substrate 10 has been developed.

When dividing by an automatic machine, the back surface of the laminated ceramic substrate 10 is fixed and the seam rings 12b, 14
A method is applied in which a force is applied from the surface side where b, 16b, and 18b are formed, and division is performed by a bending moment.
However, conventionally, the dividing groove 2 on the back surface side of the boundary portion 20 is used.
Since 0b is shallow, even if a crack is generated in the boundary portion 20 from the front side dividing groove 20a by applying a force, the rear side dividing groove 20
There is a problem that it does not properly match with b, the boundary portion 20 cannot be properly divided, and a large amount of burr or chipping occurs.

It is an object of the present invention to provide a ceramic package assembly and a method of dividing the same, in which a large amount of burrs and chips are not generated. An object of the present invention is to provide a method of assembling a ceramic package in which defects due to burrs and chips at the time of division are less likely to occur.

[0009]

In the ceramic package assembly in which a plurality of independent package parts are formed on a sheet-shaped laminated ceramic substrate, the elements of the package parts are provided at the boundaries of the plurality of package parts. A dividing groove formed by a front side groove that is dug from the front side to be mounted and a back side groove that is dug from the back side of the package is formed,
This is achieved by a ceramic package assembly characterized in that the groove depth of the rear surface side groove is formed to be deeper than the groove depth of the front surface side groove.

Further, the above object is to apply a force for expanding the surface side groove of the boundary part to the adjacent package parts in the above-mentioned ceramic package assembly,
This is achieved by a method of dividing a ceramic package assembly, which is characterized by breaking the boundary portion and dividing the package portion. Further, the above-mentioned object is, in the method of assembling a ceramic package using the above-mentioned ceramic package assembly, mounting an element in the element cavity formed on the surface side of each package portion of the ceramic package assembly, After sealing with a lid,
This is achieved by a method of assembling a ceramic package, characterized in that the ceramic package assembly is divided into package parts by the above-mentioned dividing method.

[0011]

According to the present invention, the boundary portion of the plurality of package portions is divided into a front surface side groove dug from the front surface side on which the elements of the package portion are mounted and a back surface side groove dug from the back surface side of the package portion. Since the groove is formed and the depth of the back side groove is deeper than the depth of the front side groove, the boundary area is destroyed by applying a force that expands the front side groove. Even if the package portion is divided, the cracks generated from the front surface side dividing groove always reach the rear surface side dividing groove, and the package portion can be divided without causing a large amount of burrs and chips.

Further, according to the present invention, the element is mounted in the element cavity formed on the surface side of each package portion of the ceramic package assembly, and the element cavity is sealed with the lid, and then the ceramic package assembly. Since the package is divided for each package portion, it is possible to prevent the occurrence of defects due to burrs and chips at the time of division.

[0013]

EXAMPLE A ceramic package assembly according to an example of the present invention will be described with reference to FIG. 1A is a plan view of the ceramic package assembly, and FIG. 1B is a sectional view. As shown in Fig. 1 (a), the width is 22.1m.
The package portions 12, 14, 16 and 18 having a width of 11.0 mm and a length of 6.4 mm are provided on the laminated ceramic substrate 10 having a length of m, a length of 13.0 mm and a thickness of 2.1 mm.
2,14,16,18, width 11.0mm, height 6.4m
m, depth 2.1 mm for element cavities 12a, 14
a, 16a, 18a are provided.

Cavities 12a, 14a, 16 for each element
A circuit pattern is formed in each of a and 18a, and a crystal oscillator, an IC, a capacitor and the like are mounted therein. Seam rings 12b, 14b, 16b, 18b are formed on the outer peripheral edges of the element cavities 12a, 14a, 16a, 18a. Each package part 1 of the laminated ceramic substrate 10
A boundary portion 20 is provided between the two, 14, 16, and 18, and the boundary portion 20 has a dividing groove for dividing each package portion 12, 14, 16, 18 as shown in FIG. 20
a and 20b are formed. The groove depth t1 of the division groove 20a on the front surface side is 0.48 mm, and the division groove 20 on the back surface side
The depth t2 of b is 1.325 mm, and the dividing groove 20b on the back surface side is deeper than the dividing groove 20a on the front surface side (t
2> t1).

Since the dividing groove 20b on the back surface side is formed deep, the circuit pattern of the first layer of the laminated ceramic substrate 10 is cut. Therefore, in this embodiment, the package unit 1
In order to secure the electrical connection of the circuit patterns between 2, 14, 16 and 18, the second layer of the laminated ceramic substrate 10 electrically connects between the circuit patterns of the first layer. Therefore, in order to reduce the conductor loss of the pattern, electrolytic gold plating can be performed on the entire laminated ceramic substrate 10 that is a ceramic package assembly.

Next, a method of assembling a ceramic package using the ceramic package assembly according to this embodiment will be described. First, a ceramic package assembly, which is the laminated ceramic substrate 10 formed as shown in FIG. 1, is prepared. Next, the package portions 12, 14 of the laminated ceramic substrate 10 which is a ceramic package assembly,
16, 18 element cavities 12a, 14a, 16
Necessary parts such as a crystal oscillator, an IC, and a capacitor are mounted in a and 18a.

Next, the respective package parts 12, 14, 16,
A lid (not shown) is adhered to the seam rings 12b, 14b, 16b, 18b of 18 by welding to seal the element cavities 12a, 14a, 16a, 18a. Next, the package parts 12, 1 of the laminated ceramic substrate 10
The boundary portion 20 is destroyed by applying a force F for expanding the dividing groove 20a on the front surface side of the boundary portion 20 to the package portions 12, 14, 16, 18
Split. This completes the assembly of the surface mount crystal oscillator.

As described above, according to this embodiment, even if the boundary portion is broken and the package portion is divided by applying a force for expanding the dividing groove on the front surface side of the boundary portion, the dividing groove on the front surface side is formed. The cracks generated from the groove always reach the dividing groove on the back surface side, and it is possible to divide without generating a large amount of burrs and chips. Further, according to the present embodiment, the element is mounted in the element cavity formed on the surface side of each package portion of the ceramic package assembly, and the element cavity is sealed by the lid, and then the ceramic package assembly is packaged. Since it is divided into parts, even if burrs or chips are generated during the division, they do not enter the inside of the element, and it is possible to prevent the occurrence of defects due to burrs or chips.

Further, according to this embodiment, since the element is mounted in the element cavity and the element cavity is sealed with the lid, the ceramic package assembly is kept as it is.
Each process can be automated and assembled efficiently. The vertical dimension of the divided ceramic package was measured when the ceramic package assembly of this example (FIG. 1) was divided and when the conventional ceramic package assembly (FIG. 3) was divided. The measurement results are shown in FIG.

In both the present embodiment and the conventional case, 24 ceramic package assemblies were divided. As shown in FIG. 2, in the case of this example, the standard deviation was 1/4 or less as compared with the conventional case, and the dimensional variation was very small.
In the case of this example, the boundary was properly divided, and the amount of burrs and chips generated during the division was very small.

[0021]

As described above, according to the present invention, in the boundary portion of a plurality of package parts, the surface side groove formed from the surface side where the elements of the package part are mounted and the back surface side of the package part are formed. Since a divided groove consisting of the back side groove is formed and the depth of the back side groove is deeper than the depth of the front side groove, it is necessary to apply a force to expand the front side groove at the boundary. Even if the package part is divided by breaking the boundary part, the cracks generated from the front surface side dividing groove always reach the rear surface side dividing groove, and it is possible to divide without causing a large amount of burrs and chips. it can. Also, after mounting the elements in the element cavities formed on the surface side of each package part of the ceramic package assembly and sealing the element cavities with the lid, the ceramic package assembly may be divided into package parts. Because I did
It is possible to prevent defects due to burrs and chips during division.

[Brief description of drawings]

FIG. 1 is a diagram showing a ceramic package assembly according to an embodiment of the present invention.

FIG. 2 is a diagram showing measurement results of vertical dimension of a ceramic package when the ceramic package assembly of the present embodiment is divided.

FIG. 3 is a diagram showing a conventional ceramic package assembly.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Multilayer ceramic substrate 12, 14, 16, 18 ... Package part 12a, 14a, 16a, 18a ... Element cavity 12b, 14b, 16b, 18b ... Seam ring 20 ... Border part 20a ... Front side division groove 20b ... Back side Dividing groove

Claims (3)

[Claims] 1. A ceramic package assembly in which a plurality of independent package parts are formed on a sheet-shaped laminated ceramic substrate, wherein a boundary part of the plurality of package parts is arranged from a surface side on which elements of the package part are mounted. A dug surface gutter,
A dividing groove formed of a back surface side groove dug from the back surface side of the package portion is formed, and the groove depth of the back surface side groove is formed to be deeper than the groove depth of the front surface side groove. Ceramic package assembly. 2. The method of dividing a ceramic package assembly according to claim 1, wherein a force for expanding the surface side groove of the boundary portion is applied to the adjacent package portions. A method for dividing a ceramic package assembly, characterized in that the boundary portion is destroyed and the package portion is divided. 3. A method of assembling a ceramic package using the ceramic package assembly according to claim 1, wherein an element is mounted in an element cavity formed on a surface side of each package portion of the ceramic package assembly,
3. The method for assembling a ceramic package according to claim 2, wherein the ceramic package assembly is divided into package parts by the dividing method according to claim 2, after the element cavity is sealed with a lid.