JPH10172861A - Manufacture of ceramic electronic parts and method for cutting ceramic block - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent cutting in a slanting direction of a ceramic block. SOLUTION: A ceramic block 2 is cut by moving a cutting blade 1 vertically from one side to another of the ceramic block 2. The cutting blade 1 is stopped at least once during its travel between one side to another of the ceramic block 2. Since the ceramic block is not cut in one stroke but the cut blade 1 is stopped during its travel, the stress produced by the travel of the cutting blade 1 is released at each stop and the direction of travel of the cut blade remains unchanged. This prevents cutting in a slanting direction of the block.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a ceramic electronic component having a step of cutting a ceramic block having a plurality of ceramic sheets stacked or a ceramic block having a predetermined thickness, and a method of cutting a ceramic block. .

[0002]

2. Description of the Related Art For example, when manufacturing ceramic electronic components such as multilayer ceramic capacitors, multilayer ceramic inductors, and ceramic multilayer substrates, a cutting step of cutting the ceramic block is performed to obtain a plurality of chips from the ceramic block. You.

In such a cutting step, a method of cutting by moving a cutting blade in a direction perpendicular to the plane of the ceramic block is generally performed.

[0004]

However, in this conventional method, when cutting a ceramic block having a thickness of, for example, 1.0 mm or more, a so-called oblique cut occurs in which the cutting blade enters obliquely. is there.

[0005] The causes of the oblique cut are considered mainly as follows.

First, as shown in FIG. 2, a cutting edge for cutting a ceramic block is usually difficult to make the angles of the cutting edges α1 and α2 equal to each other. , And oblique cuts may occur.

Another cause is a method of cutting a ceramic block as shown in FIG.

That is, in the cutting method shown in FIG. 3, one side of the ceramic block 2 is positioned against the guide 3, and in this state, the cutting blade 1 is attached to the ceramic block 2.
Is moved from the one surface 2a to the other surface 2b, and at this time, P1, P2,
Each stress of F1 and F2 works. P1 and P2 are horizontal stresses generated by the thickness of the cutting blade. F1 is
This is a reaction from the ceramic block and the guide 3 to P1. F2 is the reaction of the ceramic block to P2. Therefore, when cutting with the cutting blade 1, F 1
> F2, and an oblique cut as shown in FIG. 4 may occur.

The occurrence of such an oblique cut not only lowers the dimensional accuracy of the chip obtained by cutting the ceramic block, but also causes defects in subsequent steps.

Accordingly, an object of the present invention is to provide a method of manufacturing a ceramic electronic component and a method of cutting a ceramic block, which can prevent the above-described oblique cutting.

[0011]

According to the present invention, there is provided a method of manufacturing a ceramic electronic component, comprising a step of vertically moving a cutting blade from one surface of a ceramic block to the other surface to cut the ceramic block. A method for manufacturing a ceramic electronic component, wherein a cutting blade for moving from one surface of a ceramic block to the other surface is stopped at least once in the middle of the cutting blade.

Further, the present invention provides a cutting blade for moving a cutting blade from one surface of the ceramic block to the other surface when moving the cutting blade vertically from one surface to the other surface of the ceramic block to cut the ceramic block. A ceramic block cutting method characterized in that the ceramic block is stopped at least once in the middle thereof.

[0013]

According to the present invention, when cutting the ceramic block, the movement of the cutting blade is stopped at least once in the middle without cutting at once, so that the stress generated by the movement of the cutting blade is released each time. The moving direction of the blade can be made constant, and oblique cutting can be prevented. Even when the cutting edge angle of the cutting blade is different on both sides, the stress applied to the cutting blade is temporarily released, so that the trajectory of the cutting blade is corrected in a desired direction, and oblique cutting can be prevented. The stress caused by the reaction from the guide is released by temporarily stopping the movement of the cutting blade. As a result, the relationship becomes close to the relationship of F1 = F2, and the moving direction of the cutting blade can be performed vertically.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for manufacturing a ceramic electronic component and a method for cutting a ceramic block according to the present invention will be described below using an example in which the method is applied to a multilayer ceramic capacitor.

A multilayer ceramic capacitor was manufactured by the following method.

First, a plurality of ceramic green sheets are prepared, and a plurality of electrode patterns serving as internal electrodes are formed in a matrix on the surface by screen printing.
Next, the required number of the ceramic green sheets were stacked so as to have a desired capacitance value, and further, ceramic green sheets on which no electrode pattern was formed were stacked on top and bottom to obtain a ceramic laminate.

The ceramic laminate was pressed from both sides to form a ceramic block having a thickness of about 3 mm. Thereafter, the following cutting method is performed on the ceramic block.

First, as shown in FIG. 1A, the ceramic block 2 having a thickness of about 3 mm obtained by the above method is
Place on the table 4 and the ceramic block 2
Of the cutting blade 1
From the one surface 2a of the ceramic block 2 in a direction perpendicular to the surface 2a (down). The amount to enter is about 0.2 m from the surface of the ceramic block 2.
m.

The cutting blade 1 has a thickness of about 0.2 mm. When the cutting blade 1 is inserted, the stresses P1, P2,
F1 and F2 occur. P1 and P2 are horizontal stresses generated by the thickness of the cutting blade. F1 is P
1 is a reaction from the ceramic block 2 and the guide 3. F2 is a reaction of the ceramic block 2 to P2. Each stress at this stage does not increase so much because the amount of penetration of the cutting blade 1 is small, and the cutting blade 1 does not become oblique.

Next, as shown in FIG. 1B, the cutting blade 1 is retracted (raised) by about 0.1 mm. As a result, the cutting blade 1 is temporarily stopped. As a result, the stresses P1, P2, F1, and F2 generated by the penetration of the cutting blade 1 are released.

The depth to which the cutting blade 1 advances can be set as appropriate based on the pressure applied to the cutting blade 1, the hardness and material of the ceramic block 2, and the like.

Thereafter, as shown in FIG. 1C, the cutting blade 1 is made to enter the ceramic block 2 further deeply. In this example, the amount to be further advanced is about 0.2 mm (surface 2a).
From about 0.4 mm). At this time, the stresses P1, P2, F1, and F2 are generated again in the ceramic block 2, but since these stresses are almost the same as when the cutting blade 1 first enters, the cutting blade 1 is inclined. There is not enough power to make it. These stresses are also released by the retraction (elevation) of the cutting blade 1. Thereafter, the same operation was further repeated to complete the cutting of the ceramic block having a thickness of about 3 mm.

As a result of cutting the ceramic block 2 in this manner, individual chips having a cut surface perpendicular to the surface of the ceramic block 2 were obtained as shown in FIG.

In this experiment, it was confirmed that no oblique cut occurred on the entire cut surface of the ceramic block 2.

Each chip thus formed was fired and external electrodes were applied to obtain a multilayer ceramic capacitor. No external defects occurred in the obtained multilayer capacitor.

The above embodiment is merely an example, and various changes can be made. For example, in the above-described embodiment, in the operation of the cutting blade, the advance and retreat of the cutting blade are alternately repeated. However, the cutting blade is intermittently gradually entered, and the cutting blade is not retreated. A method may be employed in which the robot is advanced once and then retracted once. Furthermore, the number of times the cutting blade enters the ceramic block, the speed, the time, and the like may be appropriately set.
In short, the cutting blade temporarily stops in the ceramic block,
Any method can be used as long as the stress can be released. In the above embodiment, the cutting edge has the angle α
Although one having two α1, α2 (see FIG. 2) was used, a similar result can be obtained by using one having a single edge angle. Further, by applying ultrasonic vibration to the cutting blade that has entered the ceramic block, or by performing the cutting blade entry into the ceramic block along with the movement of the cutting blade in the longitudinal direction, higher quality is achieved. We also confirmed that cutting would be possible.

[0027]

According to the present invention, a diagonal cut can be performed even on a relatively thick ceramic block by employing a cutting method in which a cutting blade is moved vertically from one surface of the ceramic block to the other surface. Cuts that do not occur can be made. In particular, in the present invention, the thickness is 3.0.
It is more advantageous when applied to a relatively thick ceramic block such as mm or more.

Further, as a result of preventing such an oblique cut, the dimensional accuracy of a chip obtained by cutting the ceramic block can be improved, and no defect occurs in a later step.

[Brief description of the drawings]

FIG. 1 is an illustrative sectional view showing a cutting step in one embodiment of the present invention.

FIG. 2 is a cross-sectional view showing the included angle of a cutting blade.

FIG. 3 is a guide 3 for positioning the ceramic block 2
FIG. 7 is a schematic cross-sectional view showing a cutting step for explaining a diagonal cut caused by the influence of the above.

FIG. 4 is a cross-sectional view showing a state where an oblique cut has occurred in the ceramic block 2;

[Explanation of symbols]

 1 cutting blade 2 ceramic block 3 guide 4 table

Claims (2)

[Claims] 1. A method for manufacturing a ceramic electronic component, comprising: a step of vertically moving a cutting blade from one surface of a ceramic block to another surface to cut the ceramic block. A cutting blade to be moved at least once in the middle of the process. 2. A cutting blade that moves from one surface of the ceramic block to the other surface when the cutting blade is moved from one surface of the ceramic block to the other surface in the vertical direction to cut the ceramic block. ,
A method for cutting a ceramic block, comprising stopping at least once.