JP4601228B2 - Multilayer electronic component cutting device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a cutting apparatus for multilayer electronic components such as multilayer electronic components such as multilayer ceramic capacitors, multilayer LC composite components, and multilayer substrates.
[0002]
[Prior art]
In the manufacture of multilayer ceramic capacitors and the like, a step of printing a plurality of internal electrodes on the surface of the ceramic green sheet, a plurality of the ceramic green sheets are stacked, and these are pressed and adhered to form an unfired ceramic multilayer block. Press forming step, cutting the ceramic multilayer block according to the arrangement of the internal electrodes, cutting the individual multilayer ceramic chips, firing the cut multilayer ceramic chips, and external electrodes on the fired multilayer ceramic chips The process of forming is performed sequentially.
[0003]
Here, the conventional cutting process is performed as follows using, for example, a cutting apparatus described in JP-A-7-164422. The conventional cutting device 51 shown in FIG. 3 schematically includes a table 1, a cutting blade 2, a first guide 4, a second guide 5, a cutting blade driving actuator 10 that moves the cutting blade 2 in the direction of arrow K1, and a first guide. 4 includes a first guide driving actuator 11 that moves 4 in the arrow K2 direction, a table driving actuator 13 that moves the table 1 in the arrow K4 direction, and the like.
[0004]
A ceramic laminated block 25 configured by laminating ceramic sheets provided with a plurality of electrodes is arranged on the table 1 of the cutting device 51 and fixed by a suction device provided on the table 1 or the like.
[0005]
On the other hand, the second guide 5 is fixed to the base material 52 on the cutting blade 2 side. The actuator 11 presses the cutting blade 2 against the second guide 5 with a predetermined pressure via the first guide 4. In this state, the actuator 10 lowers the cutting blade 2 and presses it against the ceramic multilayer block 25 to sequentially shear cut the ceramic multilayer block 25.
[0006]
It is desirable that the sliding resistance between the side surface of the cutting blade 2 and the guide surfaces 4a and 5a of the guides 4 and 5 is small. Thereafter, the table 1 is rotated by 90 degrees, and similarly, the ceramic laminated block 25 is cut in a direction orthogonal to the previously cut direction. Thereby, a multilayer ceramic chip is obtained.
[0007]
[Problems to be solved by the invention]
By the way, when the conventional cutting device 51 shears and cuts the ceramic laminated block 25 with the cutting blade 2, since the reaction force from the ceramic laminated block 25 to the cutting edge 2 a of the cutting blade 2 is large, the cutting edge 2 a is the resistance of the ceramic laminated block 25. I was defeated. That is, the ceramic laminated block 25 is cut obliquely, and the ceramic laminated block 25 may not be cut vertically.
[0008]
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a multilayer electronic component cutting device capable of cutting a ceramic multilayer block vertically and cutting a multilayer ceramic chip with high accuracy.
[0009]
[Means and Actions for Solving the Problems]
In order to achieve the above object, a multilayer electronic component cutting device according to the present invention comprises:
(A) a table for mounting and fixing the ceramic laminated block;
(B) a cutting blade disposed above the table;
(C) first driving means for moving the cutting blade in the thickness direction of the ceramic laminated block;
(D) a first guide and a second guide disposed on both sides of the cutting blade in the thickness direction in order to regulate the direction of entry of the cutting blade into the ceramic laminated block;
(E) a second driving means and a third driving means for independently moving the first guide and the second guide in the thickness direction of the cutting blade ;
(F) a positioning plate provided so as to come into contact with an end face of the ceramic laminated block ;
( G ) The first guide and the second guide are moved in the direction approaching the positioning plate so as to cancel out the thickness direction component of the cutting blade of the reaction force received by the cutting edge of the cutting blade from the ceramic laminated block side. And by the third drive means, it is moved by a predetermined distance in the thickness direction of the cutting blade to adjust the approach direction of the cutting blade to the ceramic laminated block,
( H ) The cutting edge of the cutting blade is allowed to enter the ceramic laminated block substantially vertically by cutting the ceramic laminated block after adjusting the direction in which the cutting blade enters the ceramic laminated block.
[0010]
To the ceramic laminated block of the cutting blade by moving the first guide and the second guide by a predetermined distance in a direction that cancels the thickness direction component of the cutting blade of the reaction force that the cutting edge receives from the ceramic laminated block side The entering direction of the ceramic laminated block is adjusted, and the ceramic laminated block is cut vertically.
In the multilayer electronic component cutting device according to the present invention,
(G) further comprising a positioning plate provided so as to contact the end face of the ceramic laminated block;
(H) The second driving unit and the third driving unit may move the first guide and the second guide in a direction approaching the positioning plate.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a multilayer electronic component cutting device according to the present invention will be described below with reference to the accompanying drawings. As an electronic component, a multilayer capacitor will be described as an example, but it may be a multilayer electronic component such as a multilayer inductor, a multilayer noise filter, a multilayer LC filter, a high frequency module, a multilayer device, a multilayer substrate, etc. Needless to say.
[0012]
In the present embodiment, the present invention is applied to the conventional cutting device 51 shown in FIG. The cutting device 31 is roughly composed of the table 1, the cutting blade 2, the first guide 4, the second guide 5, the cutting blade driving actuator 10 for moving the cutting blade 2 in the direction of the arrow K1, and the first guide 4 in the direction of the arrow K2. The first guide driving actuator 11 is moved, the second guide driving actuator 12 is moved in the arrow K3 direction, the table driving actuator 13 is moved in the arrow K4 direction, and the like. . Each actuator 10-13 consists of a hydraulic cylinder, an air cylinder, or a motor.
[0013]
The cutting blade 2 has a wall thickness of 0.1 to 0.5 mm (representative value: 0.2 mm) and a tip angle of the cutting edge 2a of 5 to 20 degrees (representative value: 5 degrees). As the material of the cutting blade 2, carbide, SK (carbon tool steel), SUS (stainless steel), or the like is used. The upper part of the cutting blade 2 is held by the holder 3. The holder 3 is fixed to the tip of the rod 10 a of the actuator 10.
[0014]
A first guide 4 and a second guide 5 are disposed on both sides of the cutting blade 2. The guides 4 and 5 have guide surfaces 4 a and 5 a for regulating the cutting direction of the cutting blade 2. The guide surfaces 4a and 5a are parallel to each other and extend in a direction perpendicular to the main surface 25a of the ceramic laminated block 25.
[0015]
The guides 4 and 5 extend in the paper surface-paper back direction in FIG. The guides 4 and 5 are fixed to the tips of the rods 11a and 12a of the actuators 11 and 12, respectively. The table 1 is fixed to the tip of the rod 13a of the actuator 13.
[0016]
Next, operation | movement of the cutting device 31 is demonstrated with the cutting procedure of a ceramic laminated block.
[0017]
A ceramic multilayer block 25 for producing a multilayer ceramic capacitor is disposed on the table of the cutting device 31 shown in FIG. 1 and fixed by a suction device or the like provided on the table 1. The size of the ceramic laminated block 25 is, for example, 100 mm square to 1000 mm square, and the thickness is about 0.5 mm to 3 mm. Further, the positioning plate 21 is brought into contact with the end face of the ceramic laminated block 25 so that the positional deviation does not occur at the time of cutting.
[0018]
The ceramic multilayer block 25 is a mother substrate from which a plurality of multilayer ceramic capacitor chips can be cut out. A ceramic green sheet on which a plurality of predetermined conductor patterns (internal circuit elements) are formed is laminated and pressure-bonded by a method such as printing. It will be. However, the ceramic laminated block 25 may be one in which a plurality of conductor patterns are formed on one ceramic green sheet, and a dummy ceramic green sheet is provided on the upper surface or the upper and lower surfaces as necessary.
[0019]
In the initial state, the guides 4 and 5 are away from the side surface of the cutting blade 2. Actuators 11 and 12 are driven to move guides 4 and 5 to the cutting blade 2 side. The guide surfaces 4 a and 5 a of the guides 4 and 5 are pressed against the side surface of the cutting blade 2 with a constant force.
[0020]
In this state, the actuator 10 is driven to lower the cutting blade 2 with a predetermined force (for example, 100 kgf), and the ceramic laminated block 25 is sequentially sheared from the right end. The lowering speed (cutting speed) of the cutting blade 2 is 10 to 100 mm / second. It is desirable that the sliding resistance between the guide surfaces 4a and 5a of the guides 4 and 5 and the side surface of the cutting blade 2 is small.
[0021]
In this case, after the lower surfaces 4b and 5b of the guides 4 and 5 are brought into contact with the main surface 25a of the ceramic laminated block 25, the cutting blade 2 may be lowered.
[0022]
Then, as shown in FIG. 2, the actuator 11, the reaction force from the ceramic laminated block 25 side to the cutting edge 2 a of the cutting blade 2 starts to increase, that is, the region where the amount of diagonal cutting starts to increase. 12 is driven to move the guides 4 and 5 in a direction to cancel the horizontal component of the reaction force (thickness direction component of the cutting blade 2). In the present embodiment, since the reaction force works in a direction away from the positioning plate 21, the guides 4 and 5 are moved in a direction approaching the positioning plate 21.
[0023]
The cutting edge 2a side of the cutting blade 2 is regulated and slightly bent by the guide surfaces 4a and 5a, and the cutting edge 2a enters the ceramic laminated block 25 obliquely toward the positioning plate 21 side. That is, the force by the actuator 10 has a horizontal component (force acting toward the positioning plate 21 side) at the cutting edge 2a. On the other hand, when the reaction force from the ceramic laminated block 25 side (force acting in the direction away from the positioning plate 21) acts on the cutting edge 2a, it is offset by the horizontal component of the force by the actuator 10, and the cutting edge 2a becomes ceramic. The cutting edge 2a enters the ceramic laminated block 25 in the vertical direction without losing the resistance of the laminated block 25.
[0024]
That is, considering the balance with the reaction force applied to the cutting blade 2, the positions of the guides 4 and 5 are moved, and the direction in which the cutting blade 2 enters the ceramic laminated block 25 is adjusted, so that the ceramic laminated block 25 is vertically aligned. Will be able to be cut. As a result, a multilayer ceramic chip with good dimensional accuracy can be obtained.
[0025]
The adjustment of the blade edge 2a by the guides 4 and 5 will be described in more detail. For example, one actuator 11 is a motor, and the other actuator is a hydraulic cylinder or an air cylinder. The guide 4 is driven by the actuator (motor) 11 and the guide 4 is moved to the positioning plate 21 side by about 50 μm when the amount to be cut obliquely starts to increase. Accurate position adjustment is possible. Then, the actuator (air cylinder) 12 is driven to press the cutting blade 2 against the guide 4 via the guide 5. The guide 5 presses the cutting blade 2 with an appropriate pressure contact force, and the sliding resistance between the guide surfaces 4a and 5a and the side surface of the cutting blade 2 can be reduced. Thereby, the cutting edge 2a of the cutting blade 2 is bent, and the approach direction to the ceramic laminated block 25 is adjusted. Alternatively, without moving the guide 4 toward the positioning plate 21 at once, the guide 4 is moved by about 5 μm for each cutting, and the bending amount of the blade edge 2a is gradually increased during 10 cuttings. You may make it do.
[0026]
Further, both the actuators 11 and 12 are air cylinders, and the air pressures of both are independently and arbitrarily set to move the positions of the guides 4 and 5 so that the cutting blade 2 enters the ceramic laminated block 25. The direction may be adjusted. Further, both the actuators 11 and 12 may be motors.
[0027]
The multilayer electronic component cutting device according to the present invention is not limited to the above-described embodiment, and can be variously modified within the scope of the gist thereof. For example, the ceramic laminated block of the member to be cut may be in an unfired state or in a sintered state.
[0028]
In addition to forming ceramic laminated blocks by laminating and pressing ceramic sheets, the present invention forms a ceramic laminated block by applying and drying a ceramic slurry and then forming the necessary electrodes on it. It can also be applied to what you do.
[0029]
Further, in the embodiment, the position control operation is not performed while the cutting blade 2 is cutting the ceramic laminated block 25. That is, when the cutting edge 2a enters the ceramic laminated block 25, the first guide 4 and the second guide 5 are not moved. However, if necessary, the position control operation may be performed by moving the first guide 4 and the second guide 5 when the cutting edge 2a enters the ceramic laminated block 25.
[0030]
Further, the positioning plate 21 is not necessarily required and may be omitted depending on circumstances.
[0031]
【The invention's effect】
As is clear from the above description, according to the present invention, the first guide and the second guide are arranged in a direction that cancels the thickness direction component of the cutting blade of the reaction force that the cutting edge of the cutting blade receives from the ceramic laminated block side. By moving each by a predetermined distance, the approach direction of the cutting blade into the ceramic laminated block is adjusted, and the ceramic laminated block can be cut vertically. As a result, a multilayer ceramic chip with good dimensional accuracy can be cut out from the ceramic multilayer block.
[Brief description of the drawings]
FIG. 1 is a schematic configuration diagram showing an embodiment of a multilayer electronic component cutting device according to the present invention.
FIG. 2 is a schematic configuration diagram for explaining a cutting procedure using the cutting apparatus of FIG. 1;
FIG. 3 is a schematic configuration diagram showing a conventional cutting apparatus.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Table 2 ... Cutting blade 4 ... 1st guide 5 ... 2nd guides 10-13 ... Actuator 31 for drive ... Cut device

Claims (1)

In a multilayer electronic component cutting apparatus that cuts a ceramic multilayer block in which a plurality of electrodes are arranged for each predetermined size and cuts a multilayer ceramic chip,
A table for mounting and fixing the ceramic laminated block;
A cutting blade disposed above the table;
First driving means for moving the cutting blade in the thickness direction of the ceramic laminated block;
A first guide and a second guide arranged on both sides of the thickness direction of the cutting blade in order to regulate the direction of entry of the cutting blade into the ceramic laminated block;
Second driving means and third driving means for independently moving the first guide and the second guide in the thickness direction of the cutting blade ;
A positioning plate provided so as to contact the end face of the ceramic laminated block ;
The first guide and the second guide are respectively moved in the direction approaching the positioning plate so as to cancel the thickness direction component of the cutting blade of the reaction force received by the cutting edge of the cutting blade from the ceramic laminated block side. The driving means and the third driving means are moved by a predetermined distance in the thickness direction of the cutting blade to adjust the approach direction of the cutting blade into the ceramic laminated block,
Cutting the ceramic laminated block after adjusting the direction of entry of the cutting blade into the ceramic laminated block, thereby allowing the cutting edge of the cut blade to enter the ceramic laminated block substantially vertically;
A device for cutting laminated electronic components.

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