JP3166924B2 - Manufacturing method of ceramic electronic components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a ceramic electronic component, and more particularly, to a method for manufacturing a ceramic electronic component, the method comprising cutting at least a ceramic block to obtain a plurality of chips from a ceramic block before firing. The present invention relates to a method for manufacturing a part.

[0002]

2. Description of the Related Art For example, when manufacturing a multilayer ceramic electronic component such as a multilayer ceramic capacitor or a ceramic multilayer substrate, a plurality of chips are obtained from a plate-like ceramic block which has not been fired through a pressure bonding step. Cutting is performed.

In such a cutting process, dicing and
In general, a saw is used, or a method of operating the cutting blade in a direction perpendicular to the main surface of the ceramic block is applied.However, the latter method is usually used mainly from the viewpoint of high speed and eventually cost. Has been adopted.

[0004]

However, in the above-mentioned method of operating the latter cutting blade in the direction perpendicular to the main surface of the ceramic block, for example, the thickness is 1.0 m.
When cutting a ceramic block as thick as m or more, a so-called oblique cut may occur, in which the cut surface becomes oblique.

[0005] This oblique cut can occur, for example, in the following case. 4 and 5 each show a typical form of a cutting blade capable of producing an oblique cut. Cutting blades 1a and 1b shown in these drawings
Both have non-uniform cutting edge angles. That is,
In the cutting blade 1a shown in FIG. 4, the cutting edge is located at the center of the thickness of the cutting blade 1a, but α1 is different from α2 at the cutting edge angle, and α1 <α2. In the cutting blade 1b shown in FIG. 5, the cutting edge is shifted from the center of the thickness of the cutting blade 1b, and β1 and β2 are different at the cutting edge angle, and β1 <β2. Such non-uniformity of the cutting edge angle often occurs during the manufacturing process of the cutting blade.

According to the cutting blade 1a or 1b having the above-mentioned nonuniform cutting edge angle, as shown in FIG. 6, when the ceramic block 2 is cut, the cutting blade 1a or 1b escapes in the direction of arrow 3; Causes a diagonal cut.
If the relationship between α1 and α2 or the relationship between β1 and β2 in the above-described cutting blade 1a or 1b is opposite,
An oblique cut occurs in the opposite direction.

[0007] In addition, as shown in FIG.
It can also be caused by the influence of the guide 4 for positioning the ceramic block 2.

That is, when the ceramic block 2 is cut, one side or the orthogonal
The ceramic block 2 is positioned by applying the two sides to the guide 4. In this state, the cutting blade 1
When entering into the ceramic block 2, escape occurs as shown by arrows 5 and 6 in the ceramic block 2 due to the thickness of the cutting blade 1. However, since the escape in the direction of arrow 5 is smaller than the escape in the direction of arrow 6 due to positioning by the guide 4, the cutting edge of the cutting blade 1 is
Deviation in direction, resulting in a diagonal cut.

Actually, these oblique cut factors are superimposed, and when cutting a ceramic block having a thickness of 1.0 mm, for example, an oblique cut of 3 ° to 6 ° may occur.

Such an oblique cut not only lowers the dimensional accuracy of the chip obtained by cutting the ceramic block, but also causes troubles in the subsequent steps.
It is desirable that some measures be taken.

It is therefore an object of the present invention to provide a method for manufacturing a ceramic electronic component which can suppress the above-described oblique cut.

[0012]

SUMMARY OF THE INVENTION According to the present invention, in order to obtain a plurality of chips from a plate-shaped ceramic block before firing, at least one side of the ceramic block is brought into contact with a guide, and the main surface of the ceramic block is contacted. At least comprising a step of cutting the ceramic block by operating the cutting blade in the vertical direction, it is directed to a method of manufacturing a ceramic electronic component, in order to solve the above technical problems, the cutting blade, That
Use different cutting edge angles between both sides and the cutting edge,
In the cutting step, the cutting blade is moved by the guide
Located parallel to the contact surface with the ceramic block
So that the cutting edge side is on the guide side.
Pressing the ceramic block at a predetermined angle
In, the cutting blade in the ceramic block,
Depending on the pushing depth, gradually move in the direction opposite to the guide.
It is characterized by being implemented so that it can be pressed and bent .

[0013]

In the present invention, the inclination imparted to the cutting blade has an effect of correcting an oblique cut that occurs when the cutting blade is not tilted.

[0014]

Therefore, according to the present invention, the oblique cutting is suppressed while maintaining the low cost by the cutting method in which the cutting blade is operated in the direction perpendicular to the main surface of the ceramic block, which is excellent in high speed. It is possible to make a cut. In particular, the present invention is advantageous when applied to a relatively thick ceramic block having a thickness of 1.0 mm or more.

Further, when the oblique cut is suppressed as described above, the dimensional accuracy of the chip obtained by cutting the ceramic block can be improved, and the occurrence of troubles in the subsequent process can be prevented. .

[0016]

FIG. 1 shows a cutting step according to an embodiment of the present invention.

A plate-like ceramic block 2 before firing is positioned by a guide 4. The cutting blade 7 is operated in a direction perpendicular to the main surface 8 of the ceramic block 2 (the direction in which the line 9 extends).

The cutting blade 7 moves in the vertical direction 9
It is attached by being inclined by a predetermined angle α. The size of the angle α depends on the thickness, material,
The optimum value is selected according to the cutting edge angle of the cutting blade 7 and the like.

In the embodiment shown in FIG. 1, the cutting blade 7 is used to suppress the oblique cut which may be caused by the influence of the guide 4.
Of the cutting blade 7 is set in consideration of the above-mentioned non-uniformity of the blade angle.

FIGS. 2 and 3 are enlarged sectional views showing cut surfaces when the same ceramic block 2 is subjected to a cutting step using the same cutting blade in the same cutting machine. Here, FIG. 2 shows a case where the cutting blade is not tilted, and FIG. 3 shows a case where the cutting blade is tilted by α = 0.86 °.

As can be seen from a comparison between FIGS. 2 and 3,
When the cutting blade was not tilted, the cut surface 10a was 3
When the cutting blade is tilted by α = 0.86 °, the cutting surface 10b is tilted by only 0.2 °, and by tilting the cutting blade by a predetermined angle, the oblique cutting is performed. Could be suppressed.

In the present invention, the case where the inclined cutting blade operates in the direction in which the cutting blade extends, that is, in the oblique direction is also included. In other words, since the inclination of the cutting blade is very small, the term `` vertical direction '' with respect to the main surface of the ceramic block, which is the operating direction of the cutting blade, refers to not only the vertical direction with mathematical accuracy but also a certain range. It should be understood that this also includes the vertical direction.

[Brief description of the drawings]

FIG. 1 is an illustrative sectional view showing a cutting step according to an embodiment of the present invention.

FIG. 2 shows a cut surface 10 generated when the cutting blade is not tilted.
It is an expanded sectional view showing a.

FIG. 3 is an enlarged sectional view showing a cut surface 10b generated when the cutting blade is inclined by 0.86 °.

FIG. 4 shows a cutting blade 1 showing an uneven tip angle of the cutting blade.
It is an enlarged front view of a.

FIG. 5 is an enlarged front view of a cutting blade 1b showing another example of a nonuniform cutting edge angle of the cutting blade.

6 shows a cutting blade 1a or 1 shown in FIG. 4 or FIG.
FIG. 4 is an enlarged cross-sectional view of the ceramic block 2 showing an oblique cut caused by b.

FIG. 7 shows a guide 4 for positioning the ceramic block 2.
FIG. 7 is a cross-sectional view illustrating a cutting process for explaining an oblique cut caused by the influence of the above.

[Explanation of symbols]

 2 Ceramic block 7 Cutting blade 8 Main surface 9 Vertical direction 10a, 10b Cutting surface

Continued on the front page (72) Inventor Norio Sakai 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto Inside Murata Manufacturing Co., Ltd.

Claims (1)

(57) [Claims] In order to obtain a plurality of chips from a plate-shaped ceramic block before firing, at least one side of the ceramic block is brought into contact with a guide, and a cutting blade is formed in a direction perpendicular to a main surface of the ceramic block. A method for manufacturing a ceramic electronic component, comprising at least a step of cutting the ceramic block by operating the cutting blade , wherein the cutting edges have a cutting edge angle between both surfaces thereof and a cutting edge.
The cutting step is different from the cutting blade.
On the contact surface of the guide with the ceramic block.
And the blades
With the tip side inclined to the guide side at a predetermined angle,
Push into the ceramic block and
The cutting blade at the
A method for manufacturing a ceramic electronic component, characterized in that the method is performed so as to be gradually pushed and bent in a direction opposite to the direction of the id .