JP2006269725A - Ceramic device and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress deterioration of a characteristic in a manufacturing process of a ceramic device in the ceramic device which is mainly used for high frequency use and in a manufacturing method of the device. <P>SOLUTION: In collective production of a plurality of ceramic devices 1 by dividing a large ceramic substrate 8 into small pieces, an upper division groove 9 and a lower division groove 10 are installed for dividing the large ceramic substrate 8. Opening width and depth of the lower division groove 10 are set to be larger than the upper division groove 9. Division stress is added in a direction where the large ceramic substrate 8 is bent to project to a lower face-side. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a ceramic device mainly used for high frequency applications and a method for manufacturing the same.

  In recent years, a ceramic device in which an internal electrode for forming a predetermined electronic circuit such as a high-frequency filter is appropriately disposed on an inner layer portion of a ceramic substrate is known as a form of an electronic component using a ceramic substrate.

  In addition, such a ceramic device is formed by appropriately stacking large ceramic green sheets with internal electrodes printed thereon to form a large ceramic substrate, and dividing the large ceramic substrate into small pieces to divide a large number of ceramic devices. A batch production method is used.

  In dividing the large-sized ceramic substrate into small pieces, conventionally, dividing grooves are formed in advance on the dividing line of the large-sized ceramic substrate, and the dividing grooves are applied with stress.

As prior art document information relating to the invention of this application, for example, Patent Document 1 is known.
JP-A-7-99263

  However, in such a small piece dividing method, a large stress is applied to the large-sized ceramic substrate at the time of dividing, and this stress affects the internal electrodes forming a predetermined circuit provided in the large-sized ceramic substrate. Thus, there has been a problem that the electrical characteristics of the ceramic device fragmented are deteriorated.

  Therefore, the present invention aims to solve such problems and suppress characteristic deterioration in the manufacturing process of ceramic devices.

  In order to achieve this object, the present invention provides an upper dividing groove provided on the upper surface side of a large-sized ceramic substrate, particularly when dividing a large-sized ceramic substrate having internal electrodes that form a predetermined electronic circuit in the inner layer portion. And a lower dividing groove provided on the lower surface side of the large-sized ceramic substrate and facing the upper dividing groove, the opening width and depth of the lower dividing groove are set larger than those of the upper dividing groove, and the dividing stress is The ceramic substrate was added in a direction to bend so that it protrudes toward the lower surface.

  By manufacturing a ceramic device in this way, stress applied to a large-sized ceramic substrate at the time of dividing a small piece can be suppressed, and as a result, deterioration of electrical characteristics in the manufacturing process of the small-sized ceramic device can be suppressed. is there.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is a cross-sectional view schematically showing a ceramic device 1 of the present invention.

  In the ceramic device 1, an internal electrode 3 is appropriately disposed on an inner layer portion of a ceramic substrate 2, and a predetermined electronic circuit such as a high frequency filter is formed. Further, circuit elements that are difficult to form inside the ceramic substrate 2, such as semiconductor elements, SAW device elements, resistance elements, and the like are appropriately mounted on the upper surface of the ceramic substrate 2 as discrete components 4.

  Note that a terminal electrode 6 electrically connected to the internal electrode 3 is provided on the lower surface of the ceramic device 1, that is, the mounting surface on which the ceramic device 1 is mounted on the circuit board 5.

  And in forming such a ceramic device 1, as shown in FIG. 2, first prepared a large number of green electrodes 7 in an unsintered state and a plurality of internal electrodes 3 formed, A large-sized ceramic substrate 8 is formed by laminating the large-sized green sheets 7 on which the internal electrodes 3 are printed. Dividing grooves 9 and 10 for dividing small pieces are formed on the surface of the large-sized ceramic substrate 8. After the ceramic substrate 8 is fired, the discrete component 4 is mounted as necessary, and thereafter, a small piece is divided into individual ceramic devices 1 by applying stress along the dividing grooves 9 and 10 described above.

  Here, in the method for manufacturing the ceramic device 1, the dividing grooves 9 and 10 for dividing the small piece have a substantially V-shaped cross section, are provided so as to face both the upper and lower sides of the large ceramic substrate 8, and The opening width and depth of the lower dividing groove 10 provided on the lower surface side that is the mounting surface of the device 1 are larger than those of the upper dividing groove 9 provided on the upper surface side on which the discrete component 4 is mounted as necessary. It is set.

  The direction in which the large ceramic substrate 8 bends downward as indicated by the arrow 11 indicates the dividing stress applied when the large ceramic substrate 8 is divided into small pieces using the opposed upper divided groove 9 and lower divided groove 10. In addition to the above, by dividing into small pieces, the length of the side from the opening end of the lower dividing groove 10 to the top portion is increased, and the moment applied to the top portion is increased accordingly. 8 can be divided, and the connection width between the adjacent ceramic devices 1 is reduced, so that the stress required for the division can be reduced, and the deterioration of the electrical characteristics of the ceramic device 1 can be suppressed by this small piece division.

  Further, by providing the upper divided grooves 9 and the lower divided grooves 10 on the upper and lower surfaces of the large-sized ceramic substrate 8 as described above, in the ceramic device 1 manufactured thereby, as shown in FIG. An upper notch portion 12 is formed at the upper ridge line portion with the upper surface, and a lower notch portion 13 is formed at the lower ridge line portion between the side surface and the lower surface, and the upper notch portion 12 and the lower notch portion 13 are formed. Since this is substantially the same as that obtained by chamfering the ceramic device 1, the strength of the ceramic device 1 is improved.

  Further, by setting the opening width and depth of the lower dividing groove 10 shown in FIG. 2 to be larger than that of the upper dividing groove 9, the lower notch portion 13 in FIG. Since the lower surface of the ceramic device 1 provided with the notch portion 13 is a mounting surface to be mounted on the circuit board 5, damage to the corner portion of the ceramic device 1 due to bending of the circuit board 5 due to drop impact or the like is suppressed. It has become.

  In addition, since the upper dividing groove 9 is set to be small, the upper surface of the ceramic substrate 2, that is, the area for mounting the discrete component 4 can be effectively secured, and the mountability of the discrete component 4 is improved.

  In the above-described embodiment, the cross-sectional shapes of the upper dividing groove 9 and the lower dividing groove 10 shown in FIG. 2 are described as being substantially V-shaped, but the present invention is not limited to this cross-sectional shape. Although not particularly illustrated, it may be any shape that can be divided into small pieces such as a V-shaped oblique side or a U-shape, and the upper dividing groove 9 and the lower dividing groove 10 may be formed in this way. As the shape changes, the shapes of the upper notch 12 and the lower notch 13 of the ceramic device 1 shown in FIG. 1 also change, but the lower notch 13 is set larger than the upper notch 12. However, it has the same effect as described above.

  As described above, the ceramic device of the present invention has an effect of suppressing the deterioration of electrical characteristics in the manufacturing process, and is particularly effective as a ceramic device for mobile communication that is being reduced in size like a mobile phone. is there.

Sectional drawing of the ceramic device in one Embodiment of this invention Schematic diagram showing the manufacturing method of the same ceramic device

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Ceramic device 2 Ceramic substrate 3 Internal electrode 8 Large format ceramic substrate 9 Upper division groove 10 Lower division groove 12 Upper notch 13 Lower notch

Claims (2)

A large ceramic substrate having an internal electrode forming a predetermined electronic circuit in the inner layer portion; an upper dividing groove provided on the upper surface side of the large ceramic substrate for dividing the large ceramic substrate into small pieces; A lower divided groove provided on the lower surface side of the ceramic substrate and facing the upper divided groove, wherein an opening width and a depth of the lower divided groove are set larger than those of the upper divided groove, and the large-sized ceramic substrate A method for manufacturing a ceramic device is characterized in that, when a small piece is divided, a dividing stress is applied in a direction in which the large-sized ceramic substrate is bent so as to protrude toward the lower surface side. A large ceramic substrate having an internal electrode forming a predetermined electronic circuit in the inner layer portion; an upper dividing groove provided on the upper surface side of the large ceramic substrate for dividing the large ceramic substrate into small pieces; A lower divided groove provided on the lower surface side of the ceramic substrate and facing the upper divided groove, wherein an opening width and a depth of the lower divided groove are set larger than those of the upper divided groove, and the large-sized ceramic substrate Is a ceramic device formed by dividing the large-sized ceramic substrate into small pieces by applying a dividing stress in a direction to bend so as to protrude toward the lower surface side, the lower surface and the side surface of the ceramic device being The lower ridge line portion to be formed is formed with a lower notch portion by a cut surface forming the lower dividing groove, and the upper surface of the ceramic device and the front The upper ridge portion formed at the side surface to form the upper notch in the cut surface forming the upper dividing groove, ceramic devices, characterized in that the lower cut-out portion larger than the upper cut only out portion.

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