JP2003249755A - Method for producing ceramic multilayer printed wiring board and ceramic multilayer printed wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for producing a ceramic multilayer printed wiring board in which occurrence of dimensional shift of a wiring circuit layer due to deformation of a substrate in the vicinity of side end face is prevented at the time of producing a multilayer printed wiring board using a restriction sheet, and a ceramic multilayer printed wiring board having excellent dimensional accuracy. <P>SOLUTION: The method for producing a ceramic multilayer printed wiring board comprises a step for forming a wiring circuit layer 13 in the region of 3 mm or more inside from the circumferential edge part of a ceramic green sheet 11, a step for laying a plurality of green sheets 11 on which the wiring circuit layer 13 is formed in layers, a step for making a cut 14 of 0.01-1 mm in depth in the peripheral part of at least one surface of a multilayer 15 not to traverse the wiring circuit layer 13 in the plan view, a step for laying a ceramic sheet 16 not shrinking at the time of firing in layer on the surface of the multilayer 15 in which the cut 14 is made and then firing it while controlling shrinkage in the planar direction, a step for removing the fired ceramic sheet 16, and a step for cutting and removing at least the peripheral part of the fired multilayer 15 along the cut 14. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a manufacturing method for manufacturing a ceramic multilayer wiring board having excellent dimensional accuracy and a ceramic multilayer wiring board.

[0002]

2. Description of the Related Art As a method of reducing deformation and warpage of a glass-ceramic multilayer wiring board and obtaining a board having a high dimensional accuracy, a ceramic sheet (hereinafter, simply referred to as a binding sheet) which does not substantially shrink by firing on both sides of a green sheet laminate. .) Is laminated, and the binding sheet is fired while suppressing firing shrinkage in the plane direction by the binding sheet, and then the binding sheet is removed.

Further, when a conductor layer is formed on a metal foil by a photolithography / etching method in order to form a wiring with high dimensional accuracy in a co-fired multilayer wiring board, the metal foil does not shrink due to firing, so that the plane direction Since it is necessary to suppress the shrinkage of the entire substrate as much as possible, a method of laminating constraining sheets on both surfaces of the green sheet laminate and removing the constraining sheets after firing to produce a multilayer wiring board is described in the same manner as described above.
000-281450, JP 2001-60767.
No. 2001-291955.

[0004]

However, when a multilayer wiring board is manufactured by these methods, the side end surface of the wiring board is not provided with a restraining force for restraining the shrinkage in the plane direction by the restraining sheet. Since the sintering shrinkage inside the wiring board progresses more than the surface portion of the board, and the sintering shrinkage occurs not only in the thickness direction but also in the plane direction,
As a result, as shown in FIG. 5, the side end face 21 of the multilayer wiring board 20 has a shape in which the central portion in the thickness direction of the side end face 21 is dented and the protrusion a is formed on the front surface side and / or the back surface side. As a result, there is a problem in that, when a shock is applied to the protrusion a during a process such as a plating process on the electrode surface, the protrusion a tends to be chipped. Further, such deformation of the wiring board becomes particularly remarkable when the board thickness is 0.3 mm or more.

When the wiring circuit layer 22 is formed in the vicinity of the side end surface 21 of the multilayer wiring board 20, the wiring circuit layer 22 is displaced due to the above-mentioned deformation, and the side end surface is caused by the stress due to complicated firing shrinkage. In No. 21, there was a problem that peeling between layers was likely to occur.

Therefore, the present invention relates to a method for manufacturing a ceramic multilayer wiring board, which prevents the occurrence of dimensional deviation of the wiring circuit layer due to the deformation near the side end surface of the board when the multilayer wiring board is manufactured using the constraining sheet. It is an object of the present invention to provide a ceramic multilayer wiring board having excellent dimensional accuracy.

[0007]

According to a first method of manufacturing a ceramic multilayer wiring board of the present invention, a step of forming a wiring circuit layer in a region 3 mm or more inward from the peripheral portion of the ceramic green sheet, and the wiring A step of laminating a plurality of green sheets having a circuit layer formed thereon, and a notch having a depth of 0.01 to 1 mm in a peripheral portion of at least one surface of the laminate so as not to cross the wiring circuit layer in plan view. And a step of laminating a ceramic sheet that does not shrink during firing on the surface of the laminated body in which the notches have been formed, firing and firing while suppressing firing shrinkage in the planar direction, and a ceramic sheet after firing. And a step of cutting and removing at least the peripheral portion of the laminated body after firing along the cut.

Further, according to the second manufacturing method, a step of forming a wiring circuit layer in an area 3 mm or more inside from the peripheral edge of the ceramic green sheet, and a plurality of green sheets having the wiring circuit layer formed thereon are laminated. A step of laminating a ceramic sheet that does not shrink during firing on the surface of the laminate, firing while suppressing firing shrinkage in the planar direction, and removing the ceramic sheet after firing; A step of cutting and removing at least a peripheral portion of a subsequent laminated body so as not to cross the wiring circuit layer.

Based on the first manufacturing method, the thickness is 0.3 mm or more, and at least the central portion in the thickness direction of at least four side end faces among the side end faces is formed by a fracture surface or a cut surface, It is possible to obtain a ceramic multilayer wiring substrate in which the front surface side and / or the back surface side of the central portion has a burnt surface over 0.01 to 1 mm.

Further, according to the second manufacturing method, it is possible to obtain a ceramic multilayer wiring board having a thickness of 0.3 mm or more and at least four side end faces of the side end faces being cut surfaces by a grindstone.

According to the multilayer wiring board of the present invention, it is desirable that the side end surface does not have an electrode for connecting to the outside.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described below with reference to the drawings. FIG. 1 is a schematic sectional view showing an example of a ceramic multilayer wiring board of the present invention. According to the multilayer wiring board 1 of FIG. 1, the insulating substrate 2 is composed of a plurality of ceramic insulating layers 2.
and a wiring circuit layer 3 between the surfaces of the ceramic insulating layers 2a or between the insulating layers.
Has been formed. In addition, the insulating layers 2a to 2c include
The diameter formed to penetrate the thickness direction is 80-200μ
m via hole conductors 4 are formed to electrically connect the wiring circuit layers 3 to each other.

The wiring circuit layer 3 has a thickness of 30 μm.
In the following, a high-purity metal foil with a thickness of 5 to 20 μm is particularly preferable in order to form a wiring circuit with high dimensional accuracy, but there is no problem even if it is formed using a paste containing metal powder as a main component. An electronic component 5 such as a semiconductor element is mounted and mounted on the surface of the wiring circuit layer 3.

In the present invention, the ceramic insulating layers 2a to 2c are used.
The insulating substrate 2 made of is a ceramic that can be fired at a low temperature of 800 to 1050 ° C. (hereinafter, simply referred to as low temperature fired ceramics), such as a glass ceramic obtained by firing a glass component or a mixture of a glass component and a ceramic filler component. It is desirable that it is formed by.

Particularly, as glass ceramics, a glass component of 10 to 70% by mass and a ceramic filler component of 30 are used.
It is desirable that the composition composed of ˜90% by mass is fired. Such glass-ceramics
Since the firing temperature is as low as 800 to 1050 ° C., it is advantageous in that it can be fired at the same time with a low resistance conductor such as Cu and Ag which will be described later. Further, since the permittivity is low in general, high frequency signals such as Transmission loss can be reduced.

Here, as the glass component used,
At least SiO₂Including, Al₂O ₃, B₂O₃, Zn
O, PbO, alkaline earth metal oxides, alkali metal acids
Containing at least one of the following compounds:
For example, SiO₂-B₂O₃System, SiO₂-B₂O₃-Al₂
O₃System-MO system (M is Ca, Sr, Mg, Ba or
Or Zn), etc., borosilicate glass, alkali silicic acid
Glass, Ba-based glass, Pb-based glass, Bi-based glass
At least one selected from the group can be mentioned.

These glass components are amorphous glasses which remain amorphous even by firing treatment, and by the firing treatment, lithium silicate, quartz, cristobalite, cordierite, mullite, anorthite, sergian, spinel. , Glassite, willemite, dolomite, petalite, or any crystallized glass that precipitates at least one crystal of a derivative thereof.

As the ceramic filler component,
SiO ₂ , such as quartz and cristobalite, and Al
_At least one selected from the group consisting of ₂ O ₃ , ZrO ₂ , mullite, forsterite, enstatite, spinel, magnesia, calcium zirconate, strontium silicate, calcium titanate, and barium titanate is preferably used.

The wiring circuit layer 3 is made of Cu, Ag, Al, A.
A metal foil made of 99% by mass or more of a high-purity metal containing at least one selected from the group consisting of u, Ni, Pt, and Pd, or a paste containing these metal powders and ceramics or glass powders as main components. . Further, it is desirable that the via-hole conductor 4 be filled with a conductor having the same component as that of the wiring circuit layer 3.

Further, in the multilayer wiring board 1 of the present invention,
The wiring circuit layer 3 on the surface is used as a pad for mounting various electronic components 5 such as an IC chip, as a conductor film for shielding, and as a terminal electrode to be connected to an external circuit. It is joined to the circuit layer 3 via solder or a conductive adhesive. Although not shown, a thick film resistor film such as tantalum silicide or molybdenum silicide or a wiring protection film may be further formed on the surface of the wiring substrate, if necessary.

According to the present invention, a first method for manufacturing the above-mentioned ceramic multilayer wiring board will be described.
First, for example, a crystallized glass component or an amorphous glass component as described above is mixed with the ceramic filler component to prepare a ceramic composition, and an organic binder or the like is added to the mixture, and then a doctor blade method and rolling are performed. Thickness of about 50 ~ 500
A green sheet 11 of μm is produced (FIG. 2A).

Then, the diameter of the green sheet 11 is reduced to 80 by laser, microdrill, punching or the like.
A through hole having a thickness of up to 200 μm is formed, and a conductor paste is filled in the through hole to form a via hole conductor 12 (FIG. 2).
(B)). In the conductor paste, in addition to metal components such as Cu and Ag, an organic binder such as an acrylic resin and an organic solvent such as toluene, isopropyl alcohol, acetone, and terpineol are homogeneously mixed and formed.
The organic binder is based on 100 parts by mass of the metal component.
It is desirable that 0.5 to 15.0 parts by mass of the organic solvent be mixed in a ratio of 5 to 100 parts by mass with respect to 100 parts by mass of the solid component and the organic binder. A slight amount of glass component or the like may be added to this conductor paste.

Next, as a method of forming the wiring circuit layer 3,
There are various methods, but the transfer method of the metal foil will be described here. A metal foil having a thickness of 3 to 30 μm is adhered onto a transfer film made of a polymer material or the like, a resist is applied in a circuit pattern on the surface of the metal foil, and then etching is performed with hydrochloric acid or ferric chloride to eliminate unnecessary use. The metal foil in the portion is removed by dissolution, the resist is removed and the resist removing solution is washed to obtain a mirror-imaged wiring circuit layer 13.

Next, the transfer film on which the wiring circuit layer 13 is formed is aligned with the surface of the green sheet 11 on which the via-hole conductor 12 is formed, laminated and pressure-bonded, and then the transfer film is peeled off to form the wiring circuit layer 13. It can be formed on the surface of the green sheet 11 (FIG. 2C).

At this time, in order to improve the transferability of the wiring circuit layer 13 made of metal foil, the wiring circuit layer 13 made of metal foil is used.
Of the surface roughness Rz of the side that contacts the green sheet 11 of 3
By setting the thickness to 6 μm, the adhesion of the wiring circuit layer 13 to the green sheet 11 can be improved.

Next, a plurality of green sheets 11 produced in the same manner as described above are laminated and pressure-bonded to form a laminate 15 (FIG. 2 (d)). For stacking the green sheets 11, a method of applying heat and pressure to the stacked green sheets 11 to perform thermocompression bonding, a method of applying an adhesive composed of an organic binder, a plasticizer, a solvent, etc. between the sheets and performing thermocompression bonding, etc. Can be adopted.

Further, it is important that the wiring circuit layer 13 formed on the surface or inside of the laminated body 15 is formed in an area 3 mm or more, particularly 5 mm or more inward from the peripheral portion of the green sheet 11. In other words, it means that the distance w in FIG. 2D is 3 mm or more, particularly 5 mm or more. This is because when the wiring circuit layer 13 is formed up to a region less than 3 mm from the peripheral edge of the green sheet 11, the wiring circuit layer 13 is displaced due to the deformation of this portion at the time of firing which will be described later, and the reliability of the circuit is deteriorated. This is because

Next, a notch 14 is formed at a predetermined position on the substrate so as to have a depth m of 0.01 to 1 mm after firing from one side or both sides (FIG. 2 (e)). At this time, the position where the cut 14 is formed is within a range of the distance w from the peripheral edge of the green sheet 11, that is, the distance v of the cut 14 from the peripheral edge of the laminated body 7 satisfies v <w, In particular, v is 1 mm or more, particularly 3 mm or more, and further 5 m
It is preferably m or more. As a result, it is possible to completely remove a portion having a shape in which the central portion in the thickness direction of the side end surface as shown in FIG. 5 is dented and the front surface side and / or the back surface side is projected.

The depth m of the notch 14 needs to be 1 mm or less. If this depth is deeper than 1 mm, the notch 14 may serve as a starting point during firing, and an unexpected crack or the like may occur on the substrate. Note that the depth m of the notch 14 is 0.1 in consideration of the subsequent cutting property.
It is desirable that it is mm or more.

Further, the cuts 14 are formed on both sides of the laminate 15 in the drawing, but the cuts 14 may be formed on either the front surface side or the back surface side of the laminate 15.

The formation of the notches 14 is also applied to the case of forming a plurality of wiring boards from the laminated body 15, for example. For example, as shown in the plan view of FIG. 3, the cuts 14 can be formed in a matrix shape in the laminated body 15. Even in that case,
As described above, v is 1 mm or more, particularly 3 mm or more, in the peripheral portion of the laminated body 15, where the notch 14 is formed.
Further, it is desirable that the depth is 5 mm or more, and the cutting depth m is also required to be 0.01 to 1 mm.

Next, a ceramic sheet 16 (hereinafter sometimes referred to as a constraining sheet) that does not substantially shrink by firing is laminated on at least one side, preferably both sides, of the laminate 15 (FIG. 2 (e)). As for the lamination method, it is possible to use thermocompression bonding as in the lamination of the green sheets 16, or a method of applying an adhesive composed of an organic binder, a plasticizer, a solvent and the like and thermocompression bonding.

The constraining sheet 16 is obtained by forming a slurry in which a ceramic component containing a hardly-sinterable ceramic material as a main component, an organic binder, a plasticizer, a solvent, etc., is formed into a sheet. The non-sinterable ceramic material is specifically composed of a ceramic composition that does not shrink due to the progress of firing at a temperature of 1100 ° C. or lower, and specifically, Al
Powders of at least one of ₂ O ₃ , SiO ₂ , MgO, ZrO ₂ , BN, and TiO ₂ or a compound thereof (mullite, spinel, forsterite, enstatite, etc.) can be mentioned. Further, as the organic binder, the plasticizer and the solvent, the same materials as those used for the glass ceramic green sheet 11 can be used.

Further, by adding 0.5 to 15% by volume of the glass component in the constraining sheet 16, the adhesion with the laminate 7 is enhanced and the effect of suppressing shrinkage is increased, and the laminate is also 7 has the advantage that the generation of voids due to the diffusion of the glass component on the surface can be suppressed.

Next, the laminated body 15 thus obtained
800-110 after the organic component in the green sheet 11 or the via-hole conductor paste is decomposed and removed by heat treatment in a nitrogen atmosphere of 0-850 ° C., particularly 400-750 ° C.
Bake in a nitrogen atmosphere at 0 ° C. In addition, the wiring circuit layer 13
When an Ag conductor is used as, the firing atmosphere can be performed in the air.

Thereafter, the restraint sheet 16 is appropriately removed by ultrasonic cleaning, polishing, water jet, chemical blast, sand blast, wet blast, etc. (FIG. 2 (f)).

Then, the laminate 15 is broken along the notches 14 formed in the laminate 15 or cut with a grindstone. As a result, a ceramic multilayer wiring board can be obtained.

The ceramic multilayer wiring board manufactured in this manner has at least four main side end surfaces in the thickness direction in the side end surfaces of the multilayer wiring board, as shown in the cross-sectional view of the main part of FIG. At least the central portion a is formed by a fractured surface or a cut surface.
The front surface side b1 and / or the back surface side b2 of the
It consists of a structure formed by a burnt surface over 1 mm. The widths of the front surface side b1 and the back surface side b2 formed of the burnt surface are the same as the depth m of the cut 14 in FIG. 2 (e).

In such a structure, as shown in FIG. 4, since the side end surface of the multilayer wiring board is convex outward, cracking or chipping of the multilayer wiring board can be prevented.

On the other hand, in the second manufacturing method, as described with reference to the manufacturing process diagram of FIG. 2, the formation position of the wiring circuit layer 3 is located within 3 mm or more, particularly 5 mm or more from the peripheral edge of the laminate 7. Form. Then, FIG.
The constraining sheet 16 is laminated and baked without forming the notches 14 as described above, and then the constraining sheet 16 is removed. After that, the fired laminated body 15 is cut and removed at a desired portion with a grindstone such as a cutter. In that case,
The cutting point may be cut from the peripheral portion of the laminated body of FIG. 2 to a distance w. In this case, at least four side end faces of the side end faces of the multilayer wiring board do not have a burnt surface, and are all cut faces by a grindstone.

Further, in the present invention, it is desirable that the side end surface of the multilayer wiring board does not have an electrode for connecting to the outside. This is because the electrode may be peeled off from the ceramic when the portion where the electrode portion is formed is cut.
Particularly, when the electrodes are formed of a soft metal such as Cu or Ag, the peeling of the electrodes becomes remarkable because the adhesion strength between the electrodes and the porcelain is low. In other words, it is desirable that the side end faces of the multilayer wiring board are all made of ceramics.

[0042]

EXAMPLES SiO ₂ : 37% by mass, Al ₂ O ₃ : 27% by mass, CaO: 11% by mass, ZnO: 12% by mass, B
₂ O ₃ : Glass-ceramic raw material powder composed of 13% by mass of crystallized glass powder having an average particle size of 3 μm (softening point 850 ° C.) and 27% by mass of silica having an average particle size of 2 μm as a ceramic filler. 10 parts by mass of isobutyl methacrylate resin as an organic binder and 4 parts by mass of dibutyl phthalate as a plasticizer were added to 100 parts by mass of an organic binder, and toluene was mixed as an organic solvent for 36 hours by a ball mill to prepare a slurry. . The obtained slurry is 0.2 mm thick by the doctor blade method.
Formed a green sheet of.

Next, a copper foil having a thickness of 0.02 mm was laminated on the resin film, and a conductor pattern to be a mirror image of a predetermined wiring circuit layer was prepared by photoetching. The conductor pattern formed on this resin film was thermocompression bonded to the green sheet, and the resin film was peeled off to transfer the conductor pattern to the surface of the green sheet. The 10 green sheets were aligned and laminated. Stacking at 80 ℃, 10
It was performed at MPa.

In forming the conductor pattern, the distance w from the peripheral portion of the green sheet was set as shown in Table 1.

Further, if necessary, a depth m may be formed on the upper surface and / or the lower surface near the distance v from the peripheral portion of the laminate.
The notch was made with a rotary circular cutter blade.

Next, with respect to 100 parts by mass of alumina powder, 10 parts by mass of isobutyl methacrylate resin as an organic binder and 6 parts of dibutyl phthalate as a plasticizer as an organic binder.
A part of the constraining sheet was added by adding a mass part, formed to a thickness of 0.3 mm by the doctor blade method, and did not substantially shrink during firing. Then, this constraining sheet was thermocompression-bonded to both surfaces of the previous laminate at 80 ° C. and 10 MPa.

Thereafter, in order to decompose and remove the organic components (binder, plasticizer, etc.) in the laminate, heat treatment is carried out at 750 ° C. for 3 hours in a nitrogen atmosphere containing water vapor to reduce the residual carbon amount to 300 ppm or less. After soaking, firing was performed at 930 ° C. for 1 hour, and then wet blasting was performed to remove the restraint sheet.

After that, if necessary, a multi-layer wiring board was obtained by cutting with a rotary circular cutter blade, or by breaking along the cuts (breaking) or cutting with a grinding stone. . In addition, all the pieces that did not have the cuts were cut with a grindstone.
After that, nickel plating with a thickness of 3 μm and thickness of 1 μm was applied to the wiring circuit layer on the surface of the obtained multilayer wiring board.
A multilayer wiring board was obtained by carrying out the gold plating. (Evaluation) Table 1 shows the number of occurrences of chipping and delamination at the peripheral portion of the substrate after plating the electrode surface with respect to 100 manufactured multilayer wiring substrates.

Further, the 100 wiring boards thus prepared were cut with a grindstone so as to cross the wiring circuit layer near the peripheral edge, and the positional deviation of the internal wiring circuit layer from the exposed wiring circuit layer was observed to design. Table 1 shows the number of the wiring circuit layers having a deviation of 0.1 mm or more from the values. The results are summarized in Table 1.

[0050]

[Table 1]

According to the results shown in Table 1, conventionally, when firing is performed while restraining firing shrinkage by the restraint sheet, protrusions a as shown in FIG. 5 are formed on the peripheral portion of the fired wiring board. However, chipping and delamination were observed everywhere. Moreover, the wiring circuit layer formation portion w is 3 mm
Within the range, many dimensional deviations occurred in the wiring circuit layer located in the central portion in the thickness direction of the wiring board.
Sample No. with a wiring circuit layer formation location w of 5 mm or less In No. 3, the deviation of the wiring circuit layer was resolved, but a large number of chips were generated. Further, when the cutting depth was more than 1 mm, the sheet was partially broken during firing and the deformation at the peripheral portion was large.

On the other hand, in each of the products of the present invention, chipping and delamination were remarkably suppressed, and the occurrence of dimensional deviation of the wiring circuit layer in the vicinity of the peripheral portion could be suppressed.

[0053]

As described above in detail, according to the present invention, when a ceramic sheet that does not shrink during firing is fired while suppressing firing shrinkage, a multilayer circuit board with high dimensional accuracy can be obtained in order to obtain a wiring circuit layer. Is formed on a predetermined inner side of the peripheral portion of the laminated body before firing, and by cutting the peripheral portion of the laminated body, deviation of dimensions of the wiring circuit layer after firing and occurrence of a side end surface of the wiring board It is possible to prevent the occurrence of chips and cracks.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view of a ceramic multilayer wiring board.

FIG. 2 is a process drawing for explaining the method for manufacturing a multilayer wiring board according to the present invention.

FIG. 3 is a plan view for explaining a cut forming portion when a large number of wiring boards are manufactured in the method for manufacturing a multilayer wiring board according to the present invention.

FIG. 4 is a schematic cross-sectional view for explaining a structure of a side end portion of the multilayer wiring board of the present invention.

FIG. 5 is a sectional view of a side end surface of a multilayer wiring board obtained by a conventional method.

[Explanation of symbols]

1 Multilayer wiring board 2 insulating substrate 3 wiring circuit layer 4 Via hole conductor 5 electronic components 11 green sheets 14 notches 15 laminate 16 Restraint sheet

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Tetsuya Kimura             Kyocera Co., Ltd. 1-4 Yamashita Town, Kokubun City, Kagoshima Prefecture             Shikisha Research Institute F term (reference) 5E338 AA03 AA18 BB47 BB66 CC01                       EE21                 5E346 AA12 AA15 AA24 AA38 BB01                       CC18 CC31 CC60 DD02 DD34                       EE24 EE29 GG03 GG08 GG09                       GG10 HH11 HH33

Claims (5)

[Claims] 1. A ceramic green sheet 3 from the peripheral portion.
mm, a step of forming a wiring circuit layer in the inner region, a step of stacking a plurality of green sheets on which the wiring circuit layer is formed, and a peripheral portion of at least one surface of the laminate in plan view. A step of forming a notch having a depth of 0.01 to 1 mm so as not to traverse the wiring circuit layer, and a ceramic sheet that does not shrink during firing is laminated on the surface of the laminate in which the notch is formed, and then fired to obtain a planar direction. Firing while suppressing firing shrinkage, a step of removing the fired ceramic sheet, and a step of cutting and removing at least the peripheral portion of the fired laminate along the notches. A method for manufacturing a characteristic ceramic multilayer wiring board. 2. A ceramic green sheet having a peripheral portion 3
a step of forming a wiring circuit layer in an area on the inside of mm or more, a step of laminating a plurality of ceramic green sheets having the wiring circuit layer formed thereon, and a step of laminating a ceramic sheet which does not shrink during firing on the surface of the laminated body, A step of firing and firing while suppressing firing shrinkage in the plane direction, a step of removing the fired ceramic sheet, and a cutting removal of at least the peripheral portion of the fired laminate so as not to cross the wiring circuit layer. The method for manufacturing a ceramic multilayer wiring board, comprising: 3. A ceramic green sheet laminate having a thickness of 0.3 mm or more obtained by laminating on both sides a ceramic sheet that does not substantially shrink at the firing temperature and firing, and then removing the non-shrinkable ceramic sheet. In the ceramic multilayer wiring board, of the side end surfaces of the multilayer wiring board,
A central portion in the thickness direction of at least four side end surfaces is formed by a fracture surface or a cut surface, and a portion from the central portion on the front surface side and / or the back surface side is formed by a burnt surface over 0.01 to 1 mm. Ceramic multilayer wiring board characterized by. 4. A ceramic green sheet laminate having a thickness of 0.3 mm or more, which is obtained by laminating a ceramic sheet that does not substantially shrink at a firing temperature on both sides and firing, and then removing the ceramic sheet that does not shrink. In the ceramic multilayer wiring board, of the side end surfaces of the multilayer wiring board,
A ceramic multilayer wiring board, wherein at least four side end surfaces are cut surfaces. 5. The side end surface is not provided with an electrode for connecting to the outside, and the side end surface is not provided with an electrode.
The described ceramic multilayer wiring board.